CN102346201B - Probe head of vertical probe card and method for manufacturing compound plate of probe head - Google Patents
Probe head of vertical probe card and method for manufacturing compound plate of probe head Download PDFInfo
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- CN102346201B CN102346201B CN201010239804.9A CN201010239804A CN102346201B CN 102346201 B CN102346201 B CN 102346201B CN 201010239804 A CN201010239804 A CN 201010239804A CN 102346201 B CN102346201 B CN 102346201B
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- laminate
- probe
- composite plate
- carb
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Abstract
The invention discloses a probe head of a vertical probe card and a method for manufacturing a compound plate of the probe head. The probe head comprises a guide plate, the compound plate and at least one probe, wherein the compound plate is stacked by a first layer plate and a second layer plate through fixing, and a plurality of punched holes passing through the first layer plate and the second layer plate are formed in the compound plate through drilling; the compound plate is arranged below the guide plate; the friction coefficient of the selected first layer plate is less than that of the second layer plate; the thermal expansion coefficient of the second layer plate is less than that of the first layer plate; and the probe passes through the punched holes in the compound plate. Due to the probe head, friction between the probe and the compound plate can be reduced; and an aim of stabilizing the position of the probe can be fulfilled.
Description
Technical field
The present invention relates to the probe of electrical detection, in more detail refer to a kind of probe of vertical probe carb and the method for making of composite plate thereof.
Background technology
Vertical probe carb is mainly used in chip package chip (Flip Chip) test, and multiple grain (Multi-DUT) parallel testing of weld pad (Pad) surrounding distribution, as shown in Figure 1, the probe (Probe Head) of vertical probe carb is the below being arranged on circuit board (figure does not illustrate), with electrically conduct respectively at the two ends up and down of probe electronics object to be measured and circuit board, on the whole probe structure comprises a upper guide plate 1, one bottom guide 2 and most root probe 3, described probe 3 is by obtaining supporting and location through upper guide plate 1 and bottom guide 2, and arrange in careful mode according to the electronics object to be measured gathered.In test use time, be aim at and contact measured electronics object 4 and for electrically conducting with the needle point 3a of probe 3.
The upper and lower guide plate of the probe of known a kind of vertical probe carb makes with plastic material, because its thermal expansivity to make the thermal expansivity of this electronics object 4 to be measured far above being main material with silicon, then in the electrical detection process of high temperature or low temperature, by different for the expanded by heating degree because of material, cause guide plate, especially the deflection of bottom guide is greater than the deflection of electronics object 4 to be measured, indirectly cause the pin position of probe 3 to produce skew, and have the situation of no longer aiming at contact measured electronics object 4 to occur.
Separately there is the upper of a kind of probe of vertical probe carb, bottom guide changes to be made with stupalith, although the thermal expansivity of stupalith is close to the thermal expansivity that should be with silicon the electronics object 4 to be measured of main material, and improve above-mentioned plastics guide plate be easy to high/low temperature test time, cause the biased disappearance of moving of probe 3 pin, but, the friction factor of pottery guide plate (espespecially bottom guide) is larger, carry out in the testing electrical property process of electronics object 4 to be measured in use probe, pottery guide plate and probe 3 come in contact friction, cause break flour produce and cause the not good and card pin problem of probe activity.So, with the guide plate of ceramic material, still have not attain and improve part.
Summary of the invention
Fundamental purpose of the present invention is the probe providing a kind of vertical probe carb, has stable probe location, guarantees probe activity and avoids the function of card pin.
Another object of the present invention is to the composite plate method for making of the probe that a kind of vertical probe carb is provided, there is handling ease, and the effect of simple installation.
For reaching above-mentioned purpose, technical solution of the present invention is:
A probe for vertical probe carb, it comprises:
One guide plate;
One composite plate, be arranged at below this guide plate, and include one first stacking laminate and one second laminate, and at least one perforation runs through this first laminate and this second laminate, wherein, the friction factor of the first laminate is less than the friction factor of the second laminate, and the thermal expansivity of the second laminate is less than the thermal expansivity of the first laminate; And
At least one probe, one end is that this guide plate supports, and the other end is through the perforation of this composite plate, and the external diameter of this probe is also less than the piercing aperture of this composite plate.
The probe of described vertical probe carb, the area of the first laminate of composite plate described in it is less than the area of this second laminate.
The probe of described vertical probe carb, the surface that the second laminate of composite plate described in it does not cover for this first laminate forms a shallow slot district.
The probe of described vertical probe carb, the thickness of the first laminate of composite plate described in it is not more than the thickness of this second laminate.
The probe of described vertical probe carb, the first laminate of composite plate described in it is that plastics are made, and this second laminate is that stupalith is made.
A composite plate method for making for the probe of vertical probe carb, it comprises the following step:
One first laminate is provided;
There is provided one second laminate, the friction factor of the first laminate is less than the friction factor of the second laminate, and the thermal expansivity of the second laminate is less than the thermal expansivity of the first laminate;
Impose an affixed operation, impel this first laminate and this second laminate stacking each other; And
Impose a bore operation, so as to obtained at least one perforation running through this first laminate and this second laminate.
The composite plate method for making of the probe of described vertical probe carb, affixed operation described in it establishes mode for it with lock.
The composite plate method for making of the probe of described vertical probe carb, affixed operation described in it in the mode of bonding for it.
A composite plate method for making for the probe of vertical probe carb, it comprises the following step:
One ceramic substrate is provided;
Be coated with a liquid plastic on this ceramic substrate, form a plastic layer after the solidification of this liquid plastic, foregoing plastics layer forms one first laminate, and ceramic substrate then forms one second laminate;
Impose a bore operation, so as to obtained at least one perforation running through this first laminate and this second laminate.
The composite plate method for making of the probe of described vertical probe carb, the friction factor of its first laminate is less than the friction factor of the second laminate, and the thermal expansivity of the second laminate is less than the thermal expansivity of the first laminate.
The probe of vertical probe carb of the present invention and the method for making of composite plate thereof, the probe location of its probe is stable, activity is good, and composite plate structure wherein overcomes the defect of prior art, handling ease, simple installation.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of existing vertical probe carb;
Fig. 2 is the schematic diagram of vertical probe carb of the present invention;
Fig. 3 is Fig. 2 roughly the same, discloses the first laminate and the second laminate is affixed with locking mode;
Fig. 4 is Fig. 2 roughly the same, discloses the first laminate and the second laminate is affixed in bonding mode;
Fig. 5 is the vertical view of another vertical probe carb of the present invention;
Fig. 6 is the 6-6 direction cut-open view of Fig. 5.
Main element symbol description
The probe of 100 probe
10 guide plates
Twelve punch
20 composite plates
22 first laminate 23 first laminate 23a blocks
Bore a hole in 24 second laminate 24a shallow slot districts 26
27 closure 28 viscoses
30 probes
32 needle points
A electronics object to be measured
Embodiment
For can the present invention be illustrated more clearly in, hereby lifts preferred embodiment and coordinate accompanying drawing to be described in detail as follows.Fig. 2 is probe 100 schematic diagram of the vertical probe carb of a preferred embodiment of the present invention, and the probe 100 of this probe includes guide plate 10, composite plate 20 and most root probe 30; Wherein:
Guide plate 10 has multiple perforation 12.
Composite plate 20 is arranged at below guide plate 10 in the mode of fixed range, it includes one first laminate 22 and one second laminate 24 of stacking setting, and the first laminate 22 is in the face of this guide plate 10, separately, composite plate 20 has more multiple perforation 26, and those perforation 26 run through the first laminate 22 and the second laminate 24.The method for making of aforementioned composite plate 20, in the present embodiment, be by the first laminate 22 and the second laminate 24 stacking each other, to be more firmly combined with the second laminate 24 to impel the first laminate 22 through an affixed operation, then, to impose a bore operation with those perforation 26 obtained.Aforementioned affixed operation utilizing closure 27 to stretch into the first laminate 22 and the second laminate 24 and be affixed as shown in Figure 3; Again as shown in Figure 4 utilize the bonding mode of viscose 28 for it; Or be coated on ceramic substrate with liquid plastic, after solidifying to form the engineering plastic bed of material, then carry out the planarizing process of plastic layer, described plastic layer is the first laminate; Aforementioned being only lifts row, but not as limit.
Probe 30 one end is through the perforation 12 of guide plate 10, and be electrically connected with the circuit board (not shown) of probe, the other end, namely 32, needle point is through the perforation 26 of composite plate 20, and in order to aim at and to contact the electronics object A to be measured that this take silicon as main material, should be noted that, probe 30 external diameter of the present embodiment is the aperture being slightly less than this perforation 26.
Above-mentioned is that the basic framework of the probe 100 of the present embodiment probe illustrates, then, then describes it in detail and reaches stable probe to guarantee that the structure of electrical detection accuracy is as rear:
In the present embodiment, first laminate 22 selects to make with plastics, second laminate 24 makes with stupalith, each laminate has physical property difference to produce because material properties is different, such as, the first laminate 22 that plastics are made, its friction factor makes the friction factor of the second laminate 24 with stupalith by being less than; And for example, the second laminate 24 made by stupalith, and its thermal expansivity makes the thermal expansivity of the first laminate 22 by being less than plastics.In addition, the thickness of the first laminate 22 is that the mode being less than or equal to the second laminate 24 thickness is made as good.
When the probe 100 of the probe of the present embodiment is for this electronics object A to be measured of electrical detection, pottery system the second laminate 24 is less than owing to using the friction factor of this plastics system first laminate 22, the break flour problem of probe 30 contact friction first laminate 22 can be improved, produce to avoid the not good and card pin problem of probe activity.Again, the impact of expanding with heat and contract with cold produced because of temperature variation in testing process, the i.e. probe 100 of probe and the expanded by heating situation of electronics object A to be measured, although this plastics system first laminate 22 has cause the biased anxiety of moving of probe 30 pin, but, probe 30 is subject to this at last and has pining down of pottery system second laminate 24 close with the thermal expansivity of electronics object A to be measured, be maintained pin position and make needle point 32 aim at electronics object A to be measured, in other words, probe 30 deviation range is subject to the aperture limitation of this perforation 26.So the probe 100 of the probe of the present embodiment, not only without break flour problem, more will guarantee the accuracy of electrical detection.
Separately, for reducing the impact that this pottery system second laminate suffers to cause plastics system first laminate to be out of shape because being heated, the present invention can select the area of the first laminate to make in the mode being less than the second laminate area, embodiment as shown in Figure 5,6, first laminate 23 is distinguished into several block 23a being bonded to the second laminate 24 surface, again, second laminate 24 then forms a shallow slot district 24a on the surface of not covering for those blocks 23a, whereby, when being minimized plastic deformation, the impact involving distortion is caused on the second laminate 24.
The foregoing is only the better possible embodiments of the present invention, such as apply equivalent structure and method for making change that instructions of the present invention and claim do, ought to be included in the protection domain of claims of the present invention.
Claims (9)
1. a probe for vertical probe carb, is characterized in that, comprises:
One guide plate, has at least one perforation;
One composite plate, be arranged at below this guide plate, and include one first stacking laminate and one second laminate, and at least one perforation runs through this first laminate and this second laminate, wherein, the friction factor of the first laminate is less than the friction factor of the second laminate, and the thermal expansivity of the second laminate is less than the thermal expansivity of the first laminate, this first laminate is in the face of this guide plate, second laminate of this composite plate is that stupalith is made, the thickness of this first laminate is not more than the thickness of this second laminate, this composite plate is by this first laminate and the stacking firm combination each other of this second laminate, and
At least one probe, one end through at least one perforation of this guide plate, and is electrically connected with the circuit board of probe, and the other end is through at least one perforation of this composite plate, in order to aim at and to contact an electronics object to be measured, the external diameter of this probe is less than the piercing aperture of this composite plate.
2. the probe of vertical probe carb as claimed in claim 1, it is characterized in that, the area of the first laminate of described composite plate is less than the area of this second laminate.
3. the probe of vertical probe carb as claimed in claim 2, it is characterized in that, the surface that the second laminate of described composite plate does not cover for this first laminate forms a shallow slot district.
4. the probe of vertical probe carb as claimed in claim 1, it is characterized in that, the first laminate of described composite plate is that plastics are made.
5. a composite plate method for making for the probe of vertical probe carb as claimed in claim 1, is characterized in that, comprise the following step:
One first laminate is provided;
There is provided one second laminate, the friction factor of the first laminate is less than the friction factor of the second laminate, and the thermal expansivity of the second laminate is less than the thermal expansivity of the first laminate;
Impose an affixed operation, impel this first laminate and this second laminate stacking each other; And
Impose a bore operation, so as to obtained at least one perforation running through this first laminate and this second laminate.
6. the composite plate method for making of the probe of vertical probe carb as claimed in claim 5, is characterized in that, described affixed operation establishes mode for it with lock.
7. the composite plate method for making of the probe of vertical probe carb as claimed in claim 5, it is characterized in that, described affixed operation in the mode of bonding for it.
8. a composite plate method for making for the probe of vertical probe carb as claimed in claim 1, is characterized in that, comprise the following step:
One ceramic substrate is provided;
Be coated with a liquid plastic on this ceramic substrate, form a plastic layer after the solidification of this liquid plastic, foregoing plastics layer forms one first laminate, and ceramic substrate then forms one second laminate;
Impose a bore operation, so as to obtained at least one perforation running through this first laminate and this second laminate.
9. the composite plate method for making of the probe of vertical probe carb as claimed in claim 8, it is characterized in that, the friction factor of the first laminate is less than the friction factor of the second laminate, and the thermal expansivity of the second laminate is less than the thermal expansivity of the first laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010239804.9A CN102346201B (en) | 2010-07-26 | 2010-07-26 | Probe head of vertical probe card and method for manufacturing compound plate of probe head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010239804.9A CN102346201B (en) | 2010-07-26 | 2010-07-26 | Probe head of vertical probe card and method for manufacturing compound plate of probe head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102346201A CN102346201A (en) | 2012-02-08 |
| CN102346201B true CN102346201B (en) | 2015-06-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010239804.9A Expired - Fee Related CN102346201B (en) | 2010-07-26 | 2010-07-26 | Probe head of vertical probe card and method for manufacturing compound plate of probe head |
Country Status (1)
| Country | Link |
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| CN (1) | CN102346201B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104749456B (en) * | 2013-12-31 | 2018-04-27 | 深圳麦逊电子有限公司 | PCB test tool with electromagnetic shielding and preparation method thereof |
| CN108572265A (en) * | 2017-03-14 | 2018-09-25 | 旺矽科技股份有限公司 | Micro-electromechanical probe, manufacturing method thereof and probe head with micro-electromechanical probe |
| CN109490588B (en) * | 2017-09-11 | 2023-04-07 | 无锡旺矽科技有限公司 | MVW structure of ceramic-based vertical micro probe card connector |
| CN110389241B (en) * | 2018-04-16 | 2021-07-20 | 中华精测科技股份有限公司 | Probe seat and rectangular probe thereof |
| TWI695173B (en) * | 2018-07-04 | 2020-06-01 | 旺矽科技股份有限公司 | Probe head with linear probe |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6297657B1 (en) * | 1999-01-11 | 2001-10-02 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
| CN1228641C (en) * | 2001-01-31 | 2005-11-23 | 文特沃思实验室公司 | Nickel alloy probe card frame laminate |
| CN101135701A (en) * | 2006-08-29 | 2008-03-05 | 旺矽科技股份有限公司 | Vertical type high frequency probe card |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000179616A (en) * | 1998-12-11 | 2000-06-27 | Daido Metal Co Ltd | Sliding member |
| US6661244B2 (en) * | 2000-03-06 | 2003-12-09 | Wentworth Laboratories, Inc. | Nickel alloy probe card frame laminate |
| JP3486841B2 (en) * | 2000-08-09 | 2004-01-13 | 日本電子材料株式会社 | Vertical probe card |
| JP2002231399A (en) * | 2001-02-02 | 2002-08-16 | Fujitsu Ltd | Semiconductor device testing contact and manufacturing method therefor |
| JP4732360B2 (en) * | 2003-11-14 | 2011-07-27 | ウエントワース ラボラトリーズ，インコーポレイテッド | Die design with assembly aids |
| DE202005006868U1 (en) * | 2005-04-29 | 2006-08-31 | Hühoco Metalloberflächenveredelung Gmbh | Antifriction composite system and bearing part with this system |
-
2010
- 2010-07-26 CN CN201010239804.9A patent/CN102346201B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6297657B1 (en) * | 1999-01-11 | 2001-10-02 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
| CN1228641C (en) * | 2001-01-31 | 2005-11-23 | 文特沃思实验室公司 | Nickel alloy probe card frame laminate |
| CN101135701A (en) * | 2006-08-29 | 2008-03-05 | 旺矽科技股份有限公司 | Vertical type high frequency probe card |
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| Publication number | Publication date |
|---|---|
| CN102346201A (en) | 2012-02-08 |
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