CN218443074U

CN218443074U - Electronic component baking device

Info

Publication number: CN218443074U
Application number: CN202222703137.6U
Authority: CN
Inventors: 智茂升; 赵雅静; 王云飞
Original assignee: Tianjin Nixing Electronics Co ltd
Current assignee: Tianjin Nixing Electronics Co ltd
Priority date: 2022-10-14
Filing date: 2022-10-14
Publication date: 2023-02-03
Anticipated expiration: 2032-10-14

Abstract

The utility model relates to an electronic components technical field discloses an electronic components baking equipment for electronic components, including box and diaphragm, the diaphragm is provided with two, and two diaphragms transversely arrange the inside top of box and below in, are parallel to each other between the diaphragm, and the surface middle part and the both sides of diaphragm all begin to have the socket, and the slot has all been seted up to the diaphragm inside of socket both sides, and the degree of depth of socket is less than the width of diaphragm, and the box inner wall surface mounting of socket below has temperature sensor. The utility model discloses technical scheme is through transversely being provided with two diaphragms inside the box, and its socket that evenly sets up and have the slot can make the PCB circuit board contain the one side orientation of chip and place, utilizes the electric heat silk heated air, toasts and evaporates the moisture to the PCB board under the effect of hot-air upflow, and toasts the in-process and can change the stoving temperature through the control to the heating wire power, can detect the phenomenon of whether having the rosin joint to the circuit board simultaneously, reduces process flow and reduce cost.

Description

Electronic component baking device

Technical Field

The utility model relates to an electronic components technical field specifically is an electronic components baking equipment for electronic components.

Background

Electronic components are components of electronic components and small machines and instruments, and are generally composed of a plurality of parts, and can be commonly used in similar products, including but not limited to resistors, capacitors, inductors, printed circuit boards, integrated circuits, various circuits and the like.

The baking device in the prior art sets a fixed temperature and baking time to bake and dehumidify electronic accessories, and is single in purpose, after a chip is welded on the surface of a PCB, the PCB is often subjected to cold solder joint, and the welding leg is separated or is not in contact with the PCB at high temperature, and the PCB needs to be detected independently to increase the process flow. Therefore, we propose an electronic component baking device for electronic components.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic components baking equipment, through transversely being provided with two diaphragms inside the box, its socket that has the slot is evenly seted up, can make the one side orientation that the PCB circuit board contains the chip placed, utilize the electric heat silk heated air, toast and evaporate the moisture to the PCB board under the effect of hot-air upflow, and toast the in-process and can change the baking temperature through the control to electric heat silk power, can detect the phenomenon of whether having the rosin joint to the circuit board simultaneously, reduce process flow and reduce cost, the problem of proposing in the background art has been solved.

In order to achieve the above object, the utility model provides a following technical scheme: an electronic part baking device for electronic components comprises a box body and two transverse plates, wherein the two transverse plates are transversely arranged above and below the interior of the box body and are parallel to each other; sockets are arranged in the middle of the surface of the transverse plate and on the two sides of the surface of the transverse plate, slots are formed in the transverse plate on the two sides of each socket, the depth of each socket is smaller than the width of the transverse plate, and a temperature sensor is arranged on the surface of the inner wall of the box body below each socket; clamping blocks are fixed on the inner walls of two sides of the box body below the temperature sensor, clamping grooves are transversely formed in the clamping blocks, and a fine steel mesh is transversely clamped in the clamping grooves between the clamping blocks on the two sides; the inside heating wire that transversely is fixed with of box of fine steel mesh below, the heating wire is provided with a plurality ofly, and the even distribution of a plurality of heating wires is inside the box of fine steel mesh below.

As an alternative of this application technical scheme, the opening has been seted up on the box rear end surface of diaphragm top, and the opening communicates with the outside of box.

As an alternative scheme of this application technical scheme, the bottom four corners of box all supports and is fixed with a piece, and a piece is provided with four.

As an alternative scheme of this application technical scheme, the inside all imbeds all around of box is fixed with thermal-insulated cotton, and thermal-insulated cotton encircles in the both sides of box and upper and lower surface.

As an alternative scheme of this application technical scheme, the chamber door is installed through the hinge that resets to the front end of box, and the hinge that resets is provided with a plurality ofly.

As an alternative of the technical solution of the present application, a handle is fixed to a side surface of the front end of the box door, and the handle is located on a surface of the box door on a side away from the reset hinge.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. this application technical scheme is through transversely being provided with two diaphragms in that the box is inside, its even socket of seting up and having the slot, can make the one side orientation that PCB circuit board contains the chip placed, utilize the electric heater wire heated air, toast the PCB board and evaporate the moisture under the effect of hot-air upcurrent, and toast the in-process and can change the stoving temperature through the control to electric heater wire power, can detect the phenomenon whether there is the rosin joint to the circuit board simultaneously, reduce process flow and reduce cost.

2. This application technical scheme has seted up the opening through the box rear end surface that makes diaphragm top, and the outside intercommunication of opening and box is when utilizing steam to toast the operation to PCB circuit board, and the hot-air upflow can carry the moisture of evaporation to discharge from the opening.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic view of the overall structure of the electronic component baking apparatus for electronic components of the present invention;

fig. 2 is the internal structure schematic diagram of the electronic component baking device for electronic components of the present invention.

In the figure: 1. a box body; 2. a transverse plate; 3. a socket; 4. inserting slots; 5. a clamping block; 6. a card slot; 7. a fine steel mesh; 8. an electric heating wire; 9. a port; 10. a temperature sensor; 11. heat insulation cotton; 12. supporting a block; 13. a box door; 14. and (4) a handle.

Detailed Description

Referring to fig. 1-2, the present invention provides a technical solution: an electronic component baking device for electronic components comprises a box body 1 and two transverse plates 2, wherein the two transverse plates 2 are arranged, the two transverse plates 2 are transversely arranged above and below the interior of the box body 1, and the transverse plates 2 are parallel to each other;

sockets 3 are arranged in the middle and two sides of the surface of the transverse plate 2, slots 4 are formed in the transverse plate 2 on two sides of each socket 3, the depth of each socket 3 is smaller than the width of the transverse plate 2, and a temperature sensor 10 is arranged on the surface of the inner wall of the box body 1 below each socket 3;

the inner walls of two sides of the box body 1 below the temperature sensor 10 are fixed with fixture blocks 5, the interior of each fixture block 5 is transversely provided with a clamping groove 6, and a fine steel mesh 7 is transversely clamped in the clamping groove 6 between the fixture blocks 5 at two sides;

the heating wire 8 is transversely fixed in the box 1 below the fine steel mesh 7, the heating wire 8 is provided with a plurality of heating wires, and the plurality of heating wires 8 are uniformly distributed in the box 1 below the fine steel mesh 7.

In this kind of technical scheme, through transversely being provided with two diaphragms 2 in box 1 inside, it evenly sets up the socket 3 that has slot 4, can make the one side orientation that the PCB circuit board contains the chip placed, utilize 8 heated air on the electric heater wire, toast and evaporate the moisture to the PCB board under the effect of hot air upflow, and toast the in-process and can change the stoving temperature through the control to 8 power on the electric heater wire, can detect the phenomenon of whether having the rosin joint to the circuit board simultaneously, reduce process flow and reduce cost.

In some technical schemes, a port 9 is arranged on the rear end surface of the box body 1 above the transverse plate 2, and the port 9 is communicated with the outside of the box body 1.

In this kind of technical scheme, through having seted up port 9 on the box 1 rear end surface above making diaphragm 2, port 9 communicates with the outside of box 1, when utilizing steam to toast the operation to the PCB circuit board, the hot-air upflow can carry the moisture of evaporation to discharge from port 9.

In some technical solutions, four corners of the bottom of the box body 1 are respectively supported and fixed with the supporting blocks 12, and the supporting blocks 12 are provided with four.

In this solution, when the box 1 is used for baking, the support block 12 can keep the bottom of the box 1 away from the support object below, so as to avoid heat transfer to the support object.

In some technical schemes, heat insulation cotton 11 is embedded and fixed in the periphery of the box body 1, and the heat insulation cotton 11 surrounds the two sides and the upper and lower surfaces of the box body 1.

In this kind of technical scheme, through thermal-insulated cotton 11 settings, can insulate against heat to the both sides of box 1 and upper and lower end surface, reduce thermal giveaway.

In some technical schemes, the front end of the box body 1 is provided with a box door 13 through a reset hinge, and the reset hinge is provided with a plurality of hinges.

In the technical scheme, the box door 13 at the front end of the box body 1 can seal the box body 1, and the reset hinge can ensure that the box door 13 is in a closed state when not pulled to act.

In some embodiments, a handle 14 is fixed to a front end side surface of the door 13, and the handle 14 is located on a surface of the door 13 away from the return hinge.

In this solution, the door 13 can be closed by pulling the handle 14 on the surface of the door 13.

When the PCB of the electronic accessory needs to be baked, the door 13 is pulled by the handle 14 to be opened around the reset hinge, then the side of the PCB containing the chip faces to be inserted into the slot 4 from the socket 3, and then the PCB is inversely arranged in the socket 3 to be locked, the PCB is continuously inserted into the slots 4 of other sockets 3 according to the amount to be baked until the PCB is completely arranged in the box body 1, then the pulling of the handle 14 is released, so that the door 13 is reset to be in a closed state under the reset action of the reset hinge, the heating wire 8 and the temperature sensor 10 are both connected to the control computer, then the heating wire 8 is controlled to be started to work to heat and bake the bottom of the PCB, the temperature in the baking process can be detected by the temperature sensor 10, in the baking process, moisture in the PCB board is evaporated and is discharged to the outside along with the hot gas flow from opening 9, can change the power of heating wire 8 at the in-process of toasting, and then change the stoving temperature, can detect the PCB board under the effect that receives the high temperature, its surface chip whether has the rosin joint phenomenon, can all take out after toasting and observe the detection, if chip rosin joint is serious and drop at the in-process of toasting, then can drop to thin steel mesh 7, avoid falling downwards or producing danger with heating wire 8 contact, after toasting, make heating wire 8 closed earlier, judge the inside temperature of box 1 through temperature sensor 10, after the temperature drops to the safety interval, rethread handle pulling makes chamber door 13 opened, then can take out the PCB board of toasting, later carry out subsequent inspection work again.

Claims

1. The utility model provides an electronic components baking equipment for electronic components, includes box (1) and diaphragm (2), its characterized in that: the two transverse plates (2) are arranged, the two transverse plates (2) are transversely arranged above and below the interior of the box body (1), and the transverse plates (2) are parallel to each other;

sockets (3) are arranged in the middle of the surface of the transverse plate (2) and on the two sides of the surface of the transverse plate, slots (4) are formed in the transverse plate (2) on the two sides of each socket (3), the depth of each socket (3) is smaller than the width of the transverse plate (2), and a temperature sensor (10) is arranged on the surface of the inner wall of the box body (1) below each socket (3);

clamping blocks (5) are fixed on the inner walls of two sides of the box body (1) below the temperature sensor (10), clamping grooves (6) are transversely formed in the clamping blocks (5), and a fine steel mesh (7) is transversely clamped in the clamping grooves (6) between the clamping blocks (5) on the two sides;

heating wires (8) are transversely fixed in the box body (1) below the fine steel mesh (7), the heating wires (8) are arranged in a plurality of numbers, and the heating wires (8) are uniformly distributed in the box body (1) below the fine steel mesh (7).

2. The baking apparatus of claim 1, wherein: opening (9) have been seted up on the box (1) rear end surface of diaphragm (2) top, and opening (9) and the outside intercommunication of box (1).

3. The baking apparatus of claim 1, wherein: the four corners of the bottom of the box body (1) are respectively fixedly supported with a supporting block (12), and the number of the supporting blocks (12) is four.

4. The baking apparatus of claim 1, wherein: the box body (1) is embedded and fixed with heat insulation cotton (11) in the periphery, and the heat insulation cotton (11) surrounds the two sides and the upper and lower surfaces of the box body (1).

5. The baking apparatus of claim 1, wherein: the front end of the box body (1) is provided with a box door (13) through a reset hinge, and the reset hinge is provided with a plurality of hinges.

6. The baking apparatus of claim 5, wherein: and a handle (14) is fixed on the side surface of the front end of the box door (13), and the handle (14) is positioned on the surface of the box door (13) far away from the reset hinge.