CN218427873U - Semiconductor laser module routing clamp - Google Patents
Semiconductor laser module routing clamp Download PDFInfo
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- CN218427873U CN218427873U CN202222512599.XU CN202222512599U CN218427873U CN 218427873 U CN218427873 U CN 218427873U CN 202222512599 U CN202222512599 U CN 202222512599U CN 218427873 U CN218427873 U CN 218427873U
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Abstract
The utility model provides a semiconductor laser module routing clamp, which comprises a base, two split structures with the same structure and a pop-up structure; the upper surface of the base is provided with groove stations distributed along the central line of the base, and the two split structures are symmetrically arranged on the upper surface of the base through rotating shafts respectively by taking the central line of the upper surface of the base as a symmetric axis; the upper surface of the split structure is provided with a groove and an adsorption device, and the position of the groove corresponds to the groove station; the split structures can rotate through the rotating shaft, and can translate and be adsorbed together through the action of the adsorption device when rotating to the positions where the grooves on the two split structures face each other; the base upper surface sets up the pop-up hole, and inside the pop-up structure inserted the base from the side, can be through popping up the separation with two components of a whole that can function independently structures in the pop-up hole. The clamp can reduce time loss, improve working efficiency and ensure that products are not damaged in the production process.
Description
Technical Field
The utility model belongs to the technical field of a semiconductor routing anchor clamps, in particular to semiconductor laser module routing anchor clamps.
Background
The chip and the heat sink are welded through a patch to form an integrated structure, and the integrated structure is reflowed to the module through vacuum eutectic to form the semiconductor laser module. The module needs to be electrified in the using process, so that the electrodes on the module need to be connected with the chip by using wire bonder equipment to form a passage.
Conventional routing anchor clamps mainly carry out the routing operation on chip and heat sink, semiconductor laser module has different kind and shape to the demand of difference, routing anchor clamps to this type are few, current anchor clamps adopt the method of lock screw to fix on anchor clamps, perhaps adopt spring clamp to fix the product on routing equipment, the way of lock screw influences work efficiency, spring clamp can only fix a product at every turn, work efficiency is very low, and spring clamp presses the product firm inadequately, the shake can appear in the routing in-process product, influence the routing position, there is the risk of damaging the product. Therefore, the existing routing clamp has low working efficiency, consumes much time and is easy to damage products.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: in order to solve the defects of the prior art, the utility model provides a semiconductor laser module routing anchor clamps, this anchor clamps can reduce time loss, improve work efficiency, guarantee that the product does not receive the damage in process of production.
The technical scheme is as follows: the utility model provides a semiconductor laser module routing clamp, which comprises a base, two split structures with the same structure and a pop-up structure; the upper surface of the base is provided with groove stations distributed along the central line of the base, and the two split structures are symmetrically arranged on the upper surface of the base through rotating shafts respectively by taking the central line of the upper surface of the base as a symmetry axis; the upper surface of the split structure is provided with a groove and an adsorption device, and the position of the groove corresponds to the groove station; the split structures can rotate through the rotating shaft, and can translate and be adsorbed together through the action of the adsorption device when rotating to the positions where the grooves on the two split structures face each other; the base upper surface sets up the pop-up hole, and inside the pop-up structure inserted the base from the side, can be through popping up the separation with two components of a whole that can function independently structures in the pop-up hole.
As preferred or specific embodiments:
a plurality of groove stations are arranged and are uniformly distributed on the central line of the upper surface of the base; the size of the groove station is consistent with that of the semiconductor laser module, and the depth of the groove station is one third of the height of the semiconductor laser module.
The width of the groove is consistent with that of the semiconductor laser module, the height of the groove is two thirds of the height of the semiconductor laser module, and the depth of the groove is one half of the thickness of the semiconductor laser module (the state that the grooves on the two split structures face each other is taken as a standard).
The adsorption devices are arranged at two ends of the upper surface of the split structure; the absorption device is of a magnet structure; the base and the split structure are both made of heat-conducting metal materials.
Four angles of base upper surface set up a set of pivot seat and pivot respectively, and the both ends face of components of a whole that can function independently structure sets up respectively with the rotatory hole of components of a whole that can function independently structure upper surface vertically bar, through insert the pivot simultaneously in pivot seat and the rotatory hole of bar, will divide the body structure to install at the base upper surface.
Preferably, the two ends of the bar-shaped rotating hole are of semicircular structures, the middle of the bar-shaped rotating hole is of a rectangular structure, the width of the rectangular structure is consistent with the diameter of the head of the rotating shaft, and the length of the rectangular structure is twice the diameter of the head of the rotating shaft.
The pop-up structure comprises an elastic rod, a spring, a pop-up part and a fixed rod, wherein an accommodating groove is formed in the position, close to the front end, of the elastic rod, a strip-shaped jack perpendicular to the end surface of the elastic rod is formed in the position, close to the rear end, of the elastic rod, the pop-up part is placed in the accommodating groove, and the size of the pop-up part is consistent with that of the pop-up hole; the spring is in the front, and inside the elastic rod inserted the base in proper order from the side after, the dead lever followed the direction perpendicular with the elastic rod, inserted the base side and passed in the bar jack, fixes pop-up structure in the base, and the rear end of elastic rod exposes the base outside.
Further preferably, both ends of the strip-shaped jack are of semicircular structures, the middle of the strip-shaped jack is of a rectangular structure, the width of the rectangular structure is consistent with the diameter of the fixed rod, and the length of the strip-shaped jack is twice of the diameter of the fixed rod.
The two ejection holes are arranged and located on the central line of the upper surface of the base, and are symmetrically distributed on two sides of the central position groove station.
And with the state that the grooves on the two split structures face each other and are adsorbed together as reference, a containing opening of the popping part is arranged right above the popping hole on the split structure.
Has the advantages that: compared with the prior art, the utility model has the advantages of it is following:
1. the special mode that adopts anchor clamps to turn over is turned over, not only conveniently fixes the product, improves work efficiency, can make the product not shake at the routing in-process again, reduces the risk of product damage.
2. The mode of popping up is pressed to the adoption, and it is more convenient to take out the product, and the operation is also more convenient.
Drawings
Fig. 1 is a schematic structural diagram of the wire bonding clamp of the present invention (the state when the two split structures are separated).
Fig. 2 is an exploded view of the wire bonding fixture of the present invention.
Fig. 3 is a diagram of the usage status of the wire bonding clamp of the present invention.
In the figure:
1. the device comprises a base 11, a groove station 12, a pop-up hole 13, a rotating shaft seat 14 and a rotating shaft;
2. the ejection part comprises a split structure, 21, grooves, 22, an adsorption device, 23, strip-shaped rotating holes, 24 and ejection part accommodating ports;
3. the spring structure 31, the elastic rod 311, the accommodating groove 312, the strip-shaped jack 32, the spring 33, the spring part 34 and the fixing rod;
4. a semiconductor laser module.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
Examples
The "upper surface" described below is a description based on the position shown in fig. 1.
A semiconductor laser module routing clamp is shown in figures 1 and 2 and comprises a base 1, two split structures 2 with the same structure and a popup structure 3;
the upper surface of the base 1 is provided with a plurality of groove stations 11 distributed along the central line of the upper surface of the base 1, and the groove stations 11 are uniformly distributed on the central line of the upper surface of the base 1; the size of the groove station 11 is consistent with the size of the semiconductor laser module, and the depth is one third of the height of the semiconductor laser module. The upper surface of the base 1 is provided with an ejection hole 12, the ejection structure 3 is inserted into the base 1 from the side surface, and the two split structures 2 can be jacked up and separated through the ejection hole 12. The two ejection holes 12 are arranged on the central line of the upper surface of the base 1 and symmetrically distributed on two sides of the groove station 11 at the central position.
The two split structures 2 are symmetrically arranged on the upper surface of the base 1 through rotating shafts respectively by taking the central line of the upper surface of the base 1 as a symmetry axis; four corners of the upper surface of the base 1 are respectively provided with a group of rotating shaft seats 13 and a group of rotating shafts 14, two end faces of the split structure 2 are respectively provided with bar-shaped rotating holes 23 perpendicular to the upper surface of the split structure 2, and the split structure 2 is arranged on the upper surface of the base 1 by simultaneously inserting the rotating shafts 14 into the rotating shaft seats 13 and the bar-shaped rotating holes 23. The two ends of the strip-shaped rotating hole 23 are of semicircular structures, the middle of the strip-shaped rotating hole is of a rectangular structure, the width of the rectangular structure is consistent with the diameter of the head of the rotating shaft 14, and the length of the rectangular structure is twice of the diameter of the head of the rotating shaft 14.
The upper surface of the split structure 2 is provided with a groove 21 and an adsorption device 22, and the position of the groove 21 corresponds to the groove station 11; the split structures 2 can rotate through the rotating shaft 14, and due to the design of the strip-shaped rotating holes 23, when the split structures rotate to the positions where the grooves 21 on the two split structures face each other, the split structures can translate and are adsorbed together through the action of the adsorption device 22; the width of the groove 21 is consistent with that of the semiconductor laser module, the height is two thirds of the height of the semiconductor laser module, and the depth is one half of the thickness of the semiconductor laser module (the state that the grooves 21 on the two split structures face each other is taken as a standard). The adsorption devices 22 are of a magnet structure and are arranged at two ends of the upper surface of the split structure 2;
the base 1 and the split structure 2 are both made of heat-conducting metal materials.
The pop-up structure 3 comprises an elastic rod 31, a spring 32, a pop-up part 33 and a fixed rod 34, wherein an accommodating groove 311 is arranged on the elastic rod 31 near the front end, a strip-shaped jack 312 perpendicular to the end surface of the elastic rod 31 is arranged near the rear end, the pop-up part 33 is arranged in the accommodating groove 311, and the number and the size of the pop-up part 33 are consistent with those of the pop-up holes 12; the spring 32 is in front, the elastic rod 31 is in back, and is inserted into the base 1 from the side in sequence, the fixing rod 34 is inserted into the side of the base 1 from the direction perpendicular to the elastic rod 31 and passes through the strip-shaped insertion hole 312, the pop-up structure 3 is fixed in the base 1, and the back end of the elastic rod 31 is exposed out of the base 1. Bar jack 312 both ends are semi-circular structure, and the centre is the rectangle structure, and the width and the dead lever 34 diameter of rectangle structure are unanimous, and length is the twice of dead lever 34 diameter, and this design can conveniently press elastic rod 31, makes elastic rod 31 can the seesaw, pops out or hides pop-up portion 33.
By taking the state that the grooves 21 on the two split structures 2 face each other and are adsorbed together as reference, the pop-up part accommodating port 24 is arranged right above the pop-up hole 12 on the split structure 2 to avoid the pop-up part 33 from being misplaced to damage the semiconductor laser module.
The working principle and the method of the semiconductor laser module routing clamp are as follows:
the groove station 11 can be set to 5, places 5 groove station 11 positions above the base 1 with the semiconductor laser module 4 earlier during use, then inwards closes two components of a whole that can function independently structures 2 to parallel position from the vertical position respectively, and recess 21 on the components of a whole that can function independently structure 2 just in time laminates with semiconductor laser module 4, and the adsorption equipment 22 at both ends adsorbs each other on the components of a whole that can function independently structure 2, makes two better fixed semiconductor laser modules 4 of components of a whole that can function independently structure 2. So that the semiconductor laser module 4 does not shake during the wire bonding process. And after the operation is finished, placing the clamp in a wire bonding machine for wire bonding operation. After the routing is finished, the clamp is taken down, the pop-up structure 3 is pressed, and the pop-up part 33 can pop up and separate the two split structures 2 through the pop-up hole 12. The adsorption devices 22 at the two ends of the two split structures 2 are tightly adsorbed with each other, and are difficult to separate manually, so that the product is damaged. When the pop-up structure 3 is pressed, the pop-up portion 33 pops up the two split structures 2, so that the two split structures 2 can be easily separated. And then lifting the two split structures 2 to vertical positions and taking down the product to complete the routing process operation.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A semiconductor laser module routing clamp is characterized by comprising a base (1), two split structures (2) with the same structure and a pop-up structure (3); the upper surface of the base (1) is provided with groove stations (11) distributed along the central line of the base, and the two split structures (2) are symmetrically arranged on the upper surface of the base (1) through rotating shafts respectively by taking the central line of the upper surface of the base (1) as a symmetry axis; a groove (21) and an adsorption device (22) are arranged on the upper surface of the split structure (2), and the position of the groove (21) corresponds to the groove station (11); the split structures (2) can rotate through the rotating shaft, and can translate and be adsorbed together through the action of the adsorption device (22) when rotating to the position where the grooves (21) on the two split structures face each other; the ejection structure is characterized in that an ejection hole (12) is formed in the upper surface of the base (1), the ejection structure (3) is inserted into the base (1) from the side face, and the two split structures (2) can be jacked up and separated through the ejection hole (12).
2. The semiconductor laser module bonding clamp as claimed in claim 1, wherein the plurality of groove stations (11) are uniformly distributed on the central line of the upper surface of the base (1); the size of the groove station (11) is consistent with that of the semiconductor laser module, and the depth of the groove station is one third of the height of the semiconductor laser module.
3. The semiconductor laser module bonding clamp as claimed in claim 1, wherein the width of the groove (21) is the same as the width of the semiconductor laser module, the height is two thirds of the height of the semiconductor laser module, and the depth is one half of the thickness of the semiconductor laser module.
4. The semiconductor laser module bonding clamp as claimed in claim 1, wherein the adsorption devices (22) are disposed at two ends of the upper surface of the split structure (2); the adsorption device (22) is of a magnet structure; the base (1) and the split structure (2) are both made of heat-conducting metal materials.
5. The semiconductor laser module bonding jig as claimed in claim 1, wherein a set of rotating shaft seat (13) and rotating shaft (14) are respectively disposed at four corners of the upper surface of the base (1), bar-shaped rotating holes (23) perpendicular to the upper surface of the split structure (2) are respectively disposed at two end surfaces of the split structure (2), and the split structure (2) is mounted on the upper surface of the base (1) by inserting the rotating shaft (14) into the rotating shaft seat (13) and the bar-shaped rotating holes (23) simultaneously.
6. The semiconductor laser module bonding clamp as claimed in claim 5, wherein the bar-shaped rotation hole (23) has two semicircular ends and a rectangular middle end, the width of the rectangular structure is equal to the diameter of the head of the rotation shaft (14), and the length of the rectangular structure is twice the diameter of the head of the rotation shaft (14).
7. The semiconductor laser module wire bonding fixture as claimed in claim 1, wherein the ejecting structure (3) comprises an elastic rod (31), a spring (32), an ejecting portion (33) and a fixing rod (34), the elastic rod (31) is provided with a receiving groove (311) near the front end, a strip-shaped insertion hole (312) perpendicular to the end surface of the elastic rod (31) is provided near the rear end, the ejecting portion (33) is disposed in the receiving groove (311), and the size of the ejecting portion (33) is consistent with the size of the ejecting hole (12); the spring (32) is arranged in front, the elastic rod (31) is arranged behind and is sequentially inserted into the base (1) from the side, the fixing rod (34) is inserted into the side of the base (1) from the direction vertical to the elastic rod (31) and penetrates through the strip-shaped insertion hole (312), the pop-up structure (3) is fixed in the base (1), and the rear end of the elastic rod (31) is exposed out of the base (1).
8. The semiconductor laser module bonding jig as claimed in claim 7, wherein the bar-shaped insertion holes (312) have semicircular ends and rectangular middle portions, and the width of the rectangular middle portion is equal to the diameter of the fixing rod (34) and the length of the rectangular middle portion is twice the diameter of the fixing rod (34).
9. The semiconductor laser module bonding clamp as claimed in claim 1, wherein the number of the ejection holes (12) is two, and the ejection holes are located on the central line of the upper surface of the base (1) and symmetrically distributed on two sides of the centrally located groove station (11).
10. The semiconductor laser module bonding jig as defined in claim 1, wherein the ejecting portion receiving opening (24) is provided on the split structure (2) directly above the ejecting hole (12) with reference to the state when the grooves (21) of the two split structures (2) face each other and are attracted together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222512599.XU CN218427873U (en) | 2022-09-22 | 2022-09-22 | Semiconductor laser module routing clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222512599.XU CN218427873U (en) | 2022-09-22 | 2022-09-22 | Semiconductor laser module routing clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218427873U true CN218427873U (en) | 2023-02-03 |
Family
ID=85082336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222512599.XU Active CN218427873U (en) | 2022-09-22 | 2022-09-22 | Semiconductor laser module routing clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218427873U (en) |
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2022
- 2022-09-22 CN CN202222512599.XU patent/CN218427873U/en active Active
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