CN218424254U - Wafer measuring and sorting device - Google Patents

Abstract

The utility model discloses a wafer measuring and sorting device, the on-line screen storage device comprises a base, the bottom of base is fixedly connected with landing leg respectively, the bottom of landing leg is provided with the backing plate, the lower surface of base is provided with certified products collecting box, separation box and defective products collecting box respectively, the communicating through-hole with certified products collecting box, separation box and defective products collecting box has been seted up respectively to the inside of base, the upper surface of base is provided with the measuring component who sets up between the through-hole respectively, fixedly connected with left side board and right side board are distinguished to the upper surface both sides of base, fixedly connected with guide bar between left side board and the right side board, the outside sliding connection of guide bar has the slide. The wafer measuring and sorting device is novel in structure and ingenious in conception, can automatically sort wafers after measurement, saves time and improves sorting efficiency.

Description

Wafer measuring and sorting device

Technical Field

The utility model relates to a wafer processing production technical field specifically is a wafer measurement sorting unit.

Background

Wafers are silicon wafers used for circuit fabrication, and are called wafers because they are circular in shape, and the wafers need to be subjected to thickness measurement after production is completed in order to sort the wafers according to the measurement results.

At the present stage, after the wafers are measured, the wafers after measurement cannot be automatically sorted, so that manual work is required to participate in wafer sorting, thereby causing time waste and being not beneficial to improving the sorting efficiency of the wafers.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned condition, for overcoming prior art's defect, the utility model provides a wafer measurement sorting unit, this wafer measurement sorting unit, novel structure thinks about ingeniously, can carry out automatic separation to the wafer after measuring, reaches save time, improves sorting efficiency's effect.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a wafer measuring and sorting device, includes the base, the bottom of base is fixedly connected with landing leg respectively, the bottom of landing leg is provided with the backing plate, the lower surface of base is provided with certified products collecting box, sorting box and defective products collecting box respectively, the communicating through-hole with certified products collecting box, sorting box and defective products collecting box is seted up respectively to the inside of base, the upper surface of base is provided with the measuring component who sets up between the through-hole respectively, the upper surface both sides of base are fixedly connected with left side board and right side board respectively, fixedly connected with guide bar between left side board and the right side board, the outside sliding connection of guide bar has the slide, the right side fixedly connected with of slide and right side board fixed connection's electric putter, the bottom of slide is provided with electric lifter, electric lifter's downside is provided with snatchs mechanism, the left side of left side board is provided with controller and display screen respectively.

Preferably, the lower surface of the backing plate is provided with a non-slip mat.

Preferably, the diameter of the through hole is larger than the size of the sorted wafer to be measured.

Preferably, snatch the mechanism including setting up the connecting plate in electric lift pole downside, the upper surface left side of connecting plate is provided with the air pump, the bottom of connecting plate is provided with the straw with the air pump intercommunication, the bottom intercommunication of straw has the sucking disc, the dashpot has been seted up to the upper surface of connecting plate, the inside fixedly connected with buffer spring of dashpot, buffer spring's last fixed surface is connected with and dashpot inner wall sliding connection's buffer board.

Preferably, the buffer plate is fixedly connected with the electric lifting rod.

The beneficial effects of the utility model are that:

1. when the wafer is contacted with a wafer inside the sorting box, air inside the suction pipe can be sucked out by the air pump, so that a negative pressure environment is formed inside the suction pipe, the suction pipe can adsorb and fix the wafer, the wafer is buffered and protected by the aid of the matching effect of a buffer spring in the process, the wafer is prevented from being damaged in the fixing process, after the fixing is finished, the suction pipe can be driven by the electric lifting rod to move upwards and reset, the wafer is moved upwards to the upper side of the measuring assembly, the thickness of the wafer is measured by the measuring assembly and the measuring result is fed back to the controller, the measuring result is judged by the controller, if the measuring result is qualified, the controller can control the electric push rod to drive the slide plate to move leftwards, the suction pipe can move to the position right above the qualified product collecting box, the suction pipe can move into the qualified product collecting box by the electric lifting rod, the negative pressure state inside the suction pipe is removed by the controller, the suction pipe, the wafer can fall into the qualified product collecting box, and the suction pipe can move to the collecting box.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the base structure assembly of the present invention;

FIG. 3 is a schematic view of the structural assembly of the connection plate of the present invention;

fig. 4 is an enlarged schematic view of a structure shown in fig. 3 according to the present invention.

Reference numbers in the figures: 1. a base; 2. a support leg; 3. a base plate; 4. a qualified product collecting box; 5. a sorting box; 6. a unqualified product collection box; 7. a through hole; 8. a measurement component; 9. a left side plate; 10. a right side plate; 11. a guide bar; 12. a slide plate; 13. an electric push rod; 14. an electric lifting rod; 15. a connecting plate; 16. an air pump; 17. a straw; 18. a suction cup; 19. a buffer tank; 20. a buffer spring; 21. a buffer plate; 22. a controller; 23. a display screen.

Detailed Description

The technical solution of the present invention will be clearly and completely described with reference to the accompanying drawings. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Moreover, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance.

Example one

The wafer measuring and sorting device shown in fig. 1-4 comprises a base 1, wherein the bottom of the base 1 is fixedly connected with supporting legs 2, the bottom of each supporting leg 2 is provided with a backing plate 3, the lower surface of the base 1 is provided with a qualified product collecting box 4, a sorting box 5 and an unqualified product collecting box 6, through holes 7 communicated with the qualified product collecting box 4, the sorting box 5 and the unqualified product collecting box 6 are respectively arranged in the base 1, the diameter of each through hole 7 is larger than the size of a to-be-measured sorted wafer, so that the wafer can pass through the through holes 7, the upper surface of the base 1 is provided with measuring components 8 arranged among the through holes 7 respectively, each measuring component 8 comprises a sensor for measuring the thickness of the wafer, the specific model is SI-F80R, two sides of the upper surface of the base 1 are fixedly connected with a left side plate 9 and a right side plate 10 respectively, a guide rod 11 is fixedly connected between the left side plate 9 and the right side plate 10, a sliding plate 12 is connected to the outer side of the guide rod 11 in a sliding manner, an electric push rod 13 fixedly connected with the right side plate 10 is fixedly connected to the right side of the sliding plate 12, an electric lifting rod 14 is arranged at the bottom of the sliding plate 12, a grabbing mechanism is arranged below the electric lifting rod 14 and comprises a connecting plate 15 arranged below the electric lifting rod 14, an air pump 16 is arranged on the left side of the upper surface of the connecting plate 15, a suction pipe 17 communicated with the air pump 16 is arranged at the bottom of the connecting plate 15, a suction cup 18 is communicated with the bottom of the suction pipe 17, a buffer groove 19 is arranged on the upper surface of the connecting plate 15, a buffer spring 20 is fixedly connected inside the buffer groove 19, a buffer plate 21 slidably connected with the inner wall of the buffer groove 19 is fixedly connected to the upper surface of the buffer spring 20, the buffer plate 21 is fixedly connected with the electric lifting rod 14, and a controller 22 and a display screen 23 are respectively arranged on the left side of the left side plate 9, the controller 22 is electrically connected to the measuring assembly 8, the electric push rod 13, the electric lift rod 14 and the air pump 16, and the controller 22 transmits the determination result to the display screen 23 in real time for displaying, so that the worker can review and check the determination result.

Initially, the suction cup 18 is arranged right above the sorting box 5, at this time, the suction cup 18 is driven by the electric lifting rod 14 to move downwards, so that the suction cup 18 passes through the through hole 7 and enters the sorting box 5, when the suction cup 18 is in contact with a wafer in the sorting box 5, air in the suction pipe 17 can be sucked out by the air pump 16, so that a negative pressure environment is formed in the suction pipe 17, the suction cup 18 can adsorb and fix the wafer, the wafer is buffered and protected by the cooperation of the buffer spring 20 in the process, the wafer is prevented from being damaged in the fixing process, after the fixing is finished, the suction cup 18 is driven by the electric lifting rod 14 to move upwards and reset, the wafer is moved upwards to the upper part of the measuring component 8, the thickness of the wafer is measured by the measuring component 8, and the measuring result is fed back to the controller 22, the measuring result is judged by the controller 22, if the measuring result is qualified, the controller 22 controls the electric push rod 13 to drive the sliding plate 12 to move left, so that the sucker 18 moves to the position right above the qualified product collecting box 4, the electric lifting rod 14 drives the sucker 18 to extend into the qualified product collecting box 4, the negative pressure state in the sucker 17 is relieved under the cooperation of the air pump 16, so that the wafer on the lower side of the sucker 18 falls into the qualified product collecting box 4, if the measurement result is unqualified, the controller 22 controls the electric push rod 13 to drive the sliding plate 12 to move right, so that the sucker 18 moves to the position right above the unqualified product collecting box 6, the sucker 18 is driven by the electric lifting rod 14 to extend into the unqualified product collecting box 6, the negative pressure state in the sucker 17 is relieved under the cooperation of the air pump 16, so that the wafer on the lower side of the sucker 18 falls into the unqualified product collecting box 6, and the effect of automatic sorting of the measured wafer is achieved, time can be saved, and sorting efficiency is improved.

Example two

Referring to fig. 1, as another preferred embodiment, the difference from the first embodiment is that the lower surface of the backing plate 3 is provided with a non-slip mat, and by providing the non-slip mat, the friction between the backing plate 3 and the ground can be increased, so as to achieve the non-slip function.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. The utility model provides a wafer measurement sorting unit, includes base (1), its characterized in that: the bottom of the base (1) is fixedly connected with supporting legs (2) respectively, the bottom of each supporting leg (2) is provided with a base plate (3), the lower surface of the base (1) is provided with a qualified product collecting box (4), a sorting box (5) and a unqualified product collecting box (6) respectively, through holes (7) communicated with the qualified product collecting box (4), the sorting box (5) and the unqualified product collecting box (6) are formed in the base (1), measuring assemblies (8) arranged among the through holes (7) are arranged on the upper surface of the base (1) respectively, two sides of the upper surface of the base (1) are fixedly connected with a left side plate (9) and a right side plate (10) respectively, a guide rod (11) is fixedly connected between the left side plate (9) and the right side plate (10), a sliding plate (12) is slidably connected with the outer side of the guide rod (11), an electric push rod (13) fixedly connected with the right side plate (10) is fixedly connected with the right side plate (12), the bottom of the sliding plate (12) is provided with an electric lifting rod (14), the lower side of the electric lifting rod (14) is provided with a grabbing mechanism, and a left side plate (9) and a left side display screen (23) and a display screen (23) are respectively arranged on the left side of the sliding plate (9).

2. The wafer measuring and sorting apparatus according to claim 1, wherein: the lower surface of the backing plate (3) is provided with an anti-skid pad.

3. The wafer measuring and sorting apparatus according to claim 1, wherein: the diameter of the through hole (7) is larger than the size of the sorted wafer to be measured.

4. The wafer measuring and sorting device according to claim 1, characterized in that: snatch mechanism is including setting up connecting plate (15) in electric lift pole (14) downside, the upper surface left side of connecting plate (15) is provided with air pump (16), the bottom of connecting plate (15) is provided with straw (17) with air pump (16) intercommunication, the bottom intercommunication of straw (17) has sucking disc (18), dashpot (19) have been seted up to the upper surface of connecting plate (15), inside fixedly connected with buffer spring (20) of dashpot (19), the last fixed surface of buffer spring (20) is connected with dashpot (19) inner wall sliding connection's buffer board (21).

5. The wafer measuring and sorting apparatus according to claim 4, wherein: the buffer plate (21) is fixedly connected with the electric lifting rod (14).

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