CN218416819U - Integral fixing structure for milling of miniature circuit board - Google Patents
Integral fixing structure for milling of miniature circuit board Download PDFInfo
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- CN218416819U CN218416819U CN202222250284.2U CN202222250284U CN218416819U CN 218416819 U CN218416819 U CN 218416819U CN 202222250284 U CN202222250284 U CN 202222250284U CN 218416819 U CN218416819 U CN 218416819U
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- circuit board
- milling
- miniature circuit
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Abstract
The application relates to a miniature circuit board mills and uses monolithic stationary structure includes: the basic part of setting on the at least one side of carrier board, the one side of basic part orientation carrier board is equipped with the butt joint position of a plurality of one-to-one matching circuit boards, every all be equipped with the interim fixed subassembly that is used for fixed circuit board on the butt joint position. The circuit board milling device has the advantages that the circuit board is fixed in the circuit board milling process, and therefore the milling quality is guaranteed.
Description
Technical Field
The application relates to the technical field of circuit board processing, in particular to an integral fixing structure for milling a miniature circuit board.
Background
The circuit board is a very key part in an electronic product, and the circuit is miniaturized and visualized due to the existence of the circuit board, so that the circuit board plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
At present, there is a miniature circuit board 200, which is 2-4mm long and 1-3mm wide, referring to fig. 1, the circuit board 200 is processed and concentrated on a carrier plate 100, specifically, a plurality of slots 101 for accommodating the circuit board 200 are opened on the carrier plate 100, a circuit board 200 is correspondingly arranged in each slot 101, and two sides of the circuit board 200 in the length direction have connecting edges 201 to connect with the inner side of the slot 101.
At present, the miniature circuit board 200 needs to be milled and cut out from the groove body 101, so that the miniature circuit board 200 is separated, when the connecting edge 201 on one side of the circuit board 200 is milled, because the connection exists between the residual connecting plate and the inner side of the groove body 101, the size precision can also be ensured, but when the residual connecting edge 201 is cut, because the size of the circuit board 200 is very small, along with the cutting, the residual adhesion part is less and less, the position of the circuit board 200 is very easy to shift, so that the displacement deviation of a cutting circuit is caused, and then the circuit board 200 finally cut out is caused to have the defects of multiple materials and the like, and the defective rate is higher, and the use requirement is difficult to meet.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the application provides a miniature circuit board mills and uses overall fixed knot structure, and it has the circuit board cutting in-process reliable and stable, can effectively improve the advantage of circuit board separation yields.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a miniature circuit board mills uses monolithic stationary structure which includes:
the basic part of setting on the at least one face of carrier board, the one side of basic part towards the carrier board is equipped with the butt joint position of a plurality of one-to-one matching lines way board, every all be equipped with the interim fixed subassembly that is used for fixed circuit board on the butt joint position.
Realize above-mentioned technical scheme, correspond every circuit board on the basis spare and all set up interim fixed subassembly to effectively fix the circuit board in the circuit board milling process, thereby the circuit board receives the fixed action of interim fixed subassembly all the time and can not take place the displacement deviation milling process, thereby can guarantee the quality of circuit board after the separation from the carrier board, greatly improve the yields.
As one preferable aspect of the present application, the temporary fixing member includes an adhesive layer having adhesive properties, and the adhesive layer is in contact with one side surface of the circuit board to temporarily fix the circuit board.
The technical scheme is realized, and the structure of the temporary fixing assembly is provided, wherein one side surface of the circuit board is fixed by using the adhesive layer, and the circuit board is taken down from the adhesive layer after the circuit board is completely separated from the carrier plate.
As one preferable aspect of the present application, the temporary fixing member includes an adsorption hole opened at the mating site and an air suction pipe communicated with the adsorption hole.
According to the technical scheme, the circuit board is fixed by using suction, and the condition that traces are left on the surface of the circuit board due to the bonding layer is avoided.
As one of the preferable schemes of the application, an adsorption cavity is arranged in the base piece and is communicated with the adsorption holes at the same time, and the exhaust tube is communicated with the adsorption cavity.
As one of the preferable schemes of the application, the device further comprises a pushing assembly, wherein the pushing assembly comprises a base, a guide column vertically arranged on the peripheral side of the surface of the base and a lower pressing plate arranged on the guide column in a sliding mode.
Realize above-mentioned technical scheme, after being in the same place basic part and carrier board laminating, in order to guarantee that the subassembly homoenergetic fixed temporarily is more comprehensive thorough forms fixedly to the circuit board, utilize the holding down plate further to be in the same place basic part and carrier board pressfitting to guarantee the contact of fixed subassembly temporarily to the circuit board, thereby improve fixed effect.
As one of the preferred scheme of this application, every guide post outside is located the below of holding down plate and all is equipped with buffer spring.
As one of the preferred scheme of this application, a pair of corresponding position of push down the clamp plate bottom surface is equipped with and pushes down the bump, the profile that pushes down the bump is less than the cell body profile.
According to the technical scheme, the circuit board can be accurately contacted with the temporary fixing component by pressing the salient points, and the fixing effect is further improved.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the temporary fixing component is arranged on at least one surface of the carrier plate, so that a fixing effect is formed in the processing process of each circuit board, the displacement error is reduced or avoided as much as possible in the milling process of the circuit board, and the milling and separating quality of the circuit board is ensured;
2. through setting up the subassembly that bulldozes, further make the fixed action of interim fixed subassembly to the circuit board, further guarantee to mill the separation quality, effectively improve the yields.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a background art diagram;
fig. 2 is an exploded view showing a temporary fixing module in embodiment 1;
FIG. 3 is a block diagram showing primarily the thrust assembly;
FIG. 4 is a schematic view mainly showing a temporary fixing assembly in embodiment 2;
fig. 5 is an exploded view showing a temporary fixing module in example 2.
Reference numerals are as follows: 1. a base member; 2. an adhesive layer; 31. an adsorption hole; 32. an air exhaust pipe; 4. an adsorption chamber; 5. a pushing assembly; 51. a base; 52. a guide post; 53. a lower pressing plate; 531. pressing the salient points downwards; 6. a buffer spring; 100. a carrier plate; 101. a tank body; 200. a circuit board; 201. and connecting the edges.
Detailed Description
The present application is described in further detail below with reference to figures 2-5.
Example 1
Referring to fig. 2, an integral fixing structure for milling a micro circuit board 200 disclosed in this embodiment of the present application includes a base 1, in this embodiment, the base 1 is a thin plate, and the thin plate is adhered to a back surface of a milled surface of a carrier board 100 when in use, a plurality of matching points corresponding to the circuit board 200 one by one are disposed on a surface of the base 1 facing the carrier board 100, each matching point is provided with a temporary fixing component for fixing the circuit board 200, in this embodiment, the temporary fixing component is an adhesive layer 2 having adhesive properties, specifically, in this embodiment, the temporary fixing component is formed by glue, or the adhesive layer 2 may be formed by double-sided glue or the like, and the adhesive layer 2 contacts with a side surface of the circuit board 200 to complete temporary fixing of the circuit board 200, thereby avoiding a displacement error of the circuit board 200 during a processing process and improving separation accuracy.
Referring to fig. 2 and 3, the pushing assembly 5 is further included, the pushing assembly 5 includes a horizontally arranged base 51, guide posts 52 vertically arranged at four corners of the surface of the base 51, and a lower pressing plate 53 slidably arranged on the guide posts 52, the guide posts 52 are arranged through the lower pressing plate 53, a buffer spring 6 is sleeved below the lower pressing plate 53 on the outer side of each guide post 52, a pair of corresponding matching points on the bottom surface of the lower pressing plate 53 are provided with a lower pressing bump 531, and the outline of the lower pressing bump 531 is smaller than the outline of the groove body 101. When the base member 1 is attached to the side surface of the carrier plate 100, the base member 1 and the carrier plate 100 are placed on the surface of the base 51, and the pressing plate 53 is pressed downwards, so that the pressing protrusions 531 finally contact downwards and slightly press the circuit boards 200 to finally contact with the adhesive layer 2, thereby ensuring that each circuit board 200 is stably fixed on the adhesive layer 2, ensuring the stability in the milling process and improving the quality of milling separation.
Example 2
Referring to fig. 4, compared to embodiment 1, it is sufficient to use a common tape as the base member 1, and then cover the tape on one surface of the carrier plate 100, and in order to improve the fixing effect, it is also possible to cover both surfaces of the carrier plate 100 with the common tape, cut off the tape on the milled surface at the same time during milling, and remove a part of the tape on the separated circuit board 200 at a later stage.
Example 3
Compared with embodiment 1, the difference of this embodiment is that the temporary fixing component includes the adsorption holes 31 opened at the mating positions and the air extraction pipes 32 communicated with the adsorption holes 31, specifically, the adsorption cavities 4 opened in the base member 1 are communicated with the adsorption holes 31 at the same time, and the air extraction pipes 32 are communicated with the adsorption cavities 4, in this embodiment, the circuit board 200 is temporarily fixed by using negative pressure, and no adhesive trace is generated on the surface of the circuit board 200. The pushing and pressing member 5 in this embodiment functions to make the suction hole 31 fit well on the circuit board 200, thereby ensuring the suction effect.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (7)
1. The utility model provides a miniature circuit board mills uses whole fixed knot structure which characterized in that includes:
the basic part (1) of setting on the at least one face of carrier board, basic part (1) is equipped with the butt joint position of a plurality of one-to-one matching circuit boards towards the one side of carrier board, every all be equipped with the interim fixed subassembly that is used for fixed line board on the butt joint position.
2. The integrated fixing structure for milling the miniature circuit board according to claim 1, wherein: the temporary fixing assembly comprises an adhesive layer (2) with adhesive property, and the adhesive layer (2) is in contact with one side face of the circuit board to complete temporary fixing of the circuit board.
3. The integrated fixing structure for milling the miniature circuit board according to claim 1, wherein: the temporary fixing component comprises an adsorption hole (31) formed in the matching point position and an air suction pipe (32) communicated with the adsorption hole (31).
4. The integrated fixing structure for milling the miniature circuit board according to claim 3, wherein: an adsorption cavity (4) is arranged in the base piece (1) and is communicated with the adsorption holes (31) at the same time, and the exhaust tube (32) is communicated with the adsorption cavity (4).
5. The integrated fixing structure for milling the miniature circuit board according to claim 1, wherein: the pressing device further comprises a pressing assembly (5), wherein the pressing assembly (5) comprises a base (51), a guide column (52) vertically arranged on the surface peripheral side of the base (51) and a lower pressing plate (53) arranged on the guide column (52) in a sliding mode.
6. The integrated fixing structure for milling the miniature circuit board according to claim 5, wherein: and a buffer spring (6) is sleeved below the lower pressure plate (53) on the outer side of each guide column (52).
7. The integrated fixing structure for milling the miniature circuit board according to claim 6, wherein: one-to-one corresponding matching point on the bottom surface of the lower pressing plate (53) is provided with a lower pressing salient point (531), and the outline of the lower pressing salient point (531) is smaller than the outline of the groove body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222250284.2U CN218416819U (en) | 2022-08-25 | 2022-08-25 | Integral fixing structure for milling of miniature circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222250284.2U CN218416819U (en) | 2022-08-25 | 2022-08-25 | Integral fixing structure for milling of miniature circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218416819U true CN218416819U (en) | 2023-01-31 |
Family
ID=85029035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222250284.2U Active CN218416819U (en) | 2022-08-25 | 2022-08-25 | Integral fixing structure for milling of miniature circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218416819U (en) |
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2022
- 2022-08-25 CN CN202222250284.2U patent/CN218416819U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 211304 No. 1 Gutan Avenue, economic development zone, Gaochun District, Nanjing, Jiangsu Province Patentee after: Nanjing Xindafei Technology Co.,Ltd. Address before: 211304 No. 1 Gutan Avenue, economic development zone, Gaochun District, Nanjing, Jiangsu Province Patentee before: NANJING HONGRUIPULIN MICROWAVE TECHNOLOGY CO.,LTD. |
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| CP01 | Change in the name or title of a patent holder |