CN218416800U - Integrated circuit board with good antistatic and pressure resistance - Google Patents
Integrated circuit board with good antistatic and pressure resistance Download PDFInfo
- Publication number
- CN218416800U CN218416800U CN202222804257.5U CN202222804257U CN218416800U CN 218416800 U CN218416800 U CN 218416800U CN 202222804257 U CN202222804257 U CN 202222804257U CN 218416800 U CN218416800 U CN 218416800U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- pressure
- antistatic
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000002791 soaking Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000002216 antistatic agent Substances 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 239000003063 flame retardant Substances 0.000 claims abstract description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920001684 low density polyethylene Polymers 0.000 claims description 8
- 239000004702 low-density polyethylene Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 3
- 239000011101 paper laminate Substances 0.000 claims 1
- 230000003068 static effect Effects 0.000 claims 1
- 238000004026 adhesive bonding Methods 0.000 abstract description 6
- 230000015556 catabolic process Effects 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses an integrated circuit board that antistatic pressure resistance is good, including the circuit board body, the mounting hole has been seted up on the surface of circuit board body, the circuit board body includes the substrate layer, the bottom of substrate layer has the resistance to pressure layer through adhesive bonding, the bottom of resistance to pressure layer has the heat dissipation layer through adhesive bonding, the surface of substrate layer has the antistatic layer through adhesive bonding, the substrate layer adopts fire-retardant copper foil-clad phenolic paper clamp plate to make, the heat dissipation layer adopts the VC soaking board to make, the antistatic layer adopts antistatic pet board to make, and has the antistatic agent at the surface coating of antistatic layer, the utility model discloses a cooperation of substrate layer, resistance to pressure layer, first resistance to pressure layer, second resistance to pressure layer, heat dissipation layer and antistatic layer is used, can make the circuit board body possess good antistatic performance and pressure resistance to can not take place the phenomenon of electrostatic breakdown and rupture easily in daily use, prolonged its life.
Description
Technical Field
The utility model relates to an integrated circuit board technical field specifically is an antistatic voltage resistance good integrated circuit board.
Background
The integrated circuit board is a carrier for loading the integrated circuit, but the integrated circuit board is usually also provided with the integrated circuit; the integrated circuit board is mainly composed of silica gel, so the integrated circuit board is generally green;
for example, the chinese patent discloses "an integrated circuit board with good voltage resistance", and the patent numbers are: CN216532270U, which is provided with a mounting assembly, the mounting assembly has the function of simplifying the working procedures of mounting and dismounting the integrated circuit board, thereby improving the working efficiency and the practicability of the integrated circuit board; the integrated circuit board can be protected by arranging the rubber pad, so that the integrated circuit board is prevented from being broken due to overlarge pressure of the clamping plate when the integrated circuit board is installed; through setting up the damping pad, the damping pad has the function of increasing frictional force between bolt and the mounting panel, can prevent effectively that the bolt is not hard up, leads to the mounting panel to drop, but this patent is only protected through simple setting up the rubber pad, can not make integrated circuit board itself possess good antistatic pressure resistance to its life has been reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a good integrated circuit board of antistatic resistance to pressure possesses the good advantage of antistatic pressure resistance, has solved the problem that above-mentioned background art provided.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an antistatic good integrated circuit board of resistance to pressure, includes circuit board body, the mounting hole has been seted up on the surface of circuit board body, circuit board body includes the substrate layer, the bottom of substrate layer has the resistance to pressure layer through adhesive bonding, the bottom of resistance to pressure layer has the heat dissipation layer through adhesive bonding, the surface of substrate layer has the antistatic layer through adhesive bonding.
Preferably, the substrate layer is made of a flame-retardant copper foil-clad phenolic paper laminated board, and the heat dissipation layer is made of a VC soaking plate.
Preferably, the antistatic layer adopts antistatic pet board to make, and has the antistatic agent at the surface spraying of antistatic layer.
Preferably, the pressure-resistant layer comprises a first pressure-resistant layer and a second pressure-resistant layer, the first pressure-resistant layer is made of an LDPE plate, and the second pressure-resistant layer is made of a glass fiber net.
Preferably, the top of the heat dissipation layer is integrally designed with a heat conduction column, and the top of the heat conduction column penetrates through the pressure-resistant layer and is in contact with the bottom of the base material layer.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a substrate layer, resistance to pressure layer, first resistance to pressure layer, second resistance to pressure layer, heat dissipation layer and antistatic layer's cooperation is used, can make the circuit board body possess good antistatic performance and voltage resistance to can not take place the phenomenon of electrostatic breakdown and rupture easily in daily use, prolonged its life.
2. The utility model discloses an adopt the first anti-voltage layer that the LDPE board was made and the second anti-voltage layer that adopts the glass fiber net to make, can make the circuit board body possess good use strength and compressive property, and it possesses good toughness, the cracked phenomenon of emergence that can not be easy, through the heat dissipation layer that adopts the VC soaking board to make, can make the circuit board body possess good heat dispersion, through the antistatic layer that adopts antistatic pet board to make, can make the circuit board body possess good antistatic backing.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal connection structure of the circuit board body of the present invention;
fig. 3 is a schematic view of the internal connection structure of the pressure-resistant layer of the present invention.
In the figure: 1. a circuit board body; 101. a substrate layer; 102. a pressure-resistant layer; 1021. a first pressure resistant layer; 1022. a second compressive layer; 103. a heat dissipation layer; 104. an antistatic layer; 2. and (7) mounting holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The components of the present invention are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known by the technical manual or by the conventional experimental method.
Referring to fig. 1-3, an integrated circuit board with good antistatic and voltage-resistant properties comprises a circuit board body 1, wherein a mounting hole 2 is formed in the surface of the circuit board body 1, the circuit board body 1 comprises a base material layer 101, a voltage-resistant layer 102 is bonded to the bottom of the base material layer 101 through an adhesive, a heat dissipation layer 103 is bonded to the bottom of the voltage-resistant layer 102 through an adhesive, an antistatic layer 104 is bonded to the surface of the base material layer 101 through an adhesive, and the circuit board body 1 can have good antistatic and voltage-resistant properties through the cooperation of the base material layer 101, the voltage-resistant layer 102, a first voltage-resistant layer 1021, a second voltage-resistant layer 1022, the heat dissipation layer 103 and the antistatic layer 104, so that the phenomena of electrostatic breakdown and breakage cannot easily occur in daily use, and the service life of the integrated circuit board is prolonged.
The substrate layer 101 is made of a flame-retardant copper foil-clad phenolic paper laminated board, the heat dissipation layer 103 is made of a VC soaking plate, and the heat dissipation layer 103 made of the VC soaking plate can enable the circuit board body 1 to have good heat dissipation performance.
The pressure-resistant layer 102 comprises a first pressure-resistant layer 1021 and a second pressure-resistant layer 1022, the first pressure-resistant layer 1021 is made of an LDPE (low-density polyethylene) plate, the second pressure-resistant layer 1022 is made of a glass fiber net, the first pressure-resistant layer 1021 made of the LDPE plate and the second pressure-resistant layer 1022 made of the glass fiber net can enable the circuit board body 1 to have good use strength and pressure-resistant performance, and the circuit board body has good toughness and cannot easily break.
The top of the heat dissipation layer 103 is integrally designed with a heat conduction column, and the top of the heat conduction column penetrates through the pressure-resistant layer 102 and contacts with the bottom of the substrate layer 101.
During the use, through the first resistance to compression layer 1021 that adopts the LDPE board to make and the second resistance to compression layer 1022 that adopts the glass fiber net to make, can make circuit board body 1 possess good service strength and compression resistance, and it possesses good toughness, the cracked phenomenon of emergence easily can not, through the heat dissipation layer 103 that adopts the VC soaking board to make, can make circuit board body 1 possess good heat dispersion, through the antistatic layer 104 that adopts antistatic pet board to make, can make circuit board body 1 possess good antistatic performance.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides an integrated circuit board that antistatic pressure resistance is good, includes circuit board body (1), its characterized in that: mounting hole (2) have been seted up on the surface of circuit board body (1), circuit board body (1) includes substrate layer (101), the bottom of substrate layer (101) bonds through the adhesive has pressure resistance layer (102), the bottom of pressure resistance layer (102) bonds through the adhesive has heat dissipation layer (103), the surface of substrate layer (101) bonds through the adhesive has antistatic layer (104).
2. The integrated circuit board of claim 1, wherein the integrated circuit board has the following characteristics: the substrate layer (101) adopts fire-retardant copper foil-clad phenolic paper laminate to make, heat dissipation layer (103) adopt the VC soaking board to make.
3. The integrated circuit board of claim 1, wherein the integrated circuit board has the characteristics of static resistance and good pressure resistance: antistatic layer (104) adopt antistatic pet board to make, and the surface spraying of antistatic layer (104) has antistatic agent.
4. The integrated circuit board of claim 1, wherein the integrated circuit board has the following characteristics: the pressure-resistant layer (102) comprises a first pressure-resistant layer (1021) and a second pressure-resistant layer (1022), wherein the first pressure-resistant layer (1021) is made of an LDPE (low-density polyethylene) plate, and the second pressure-resistant layer (1022) is made of a glass fiber web.
5. The integrated circuit board of claim 1, wherein the integrated circuit board has the following characteristics: the top of the heat dissipation layer (103) is integrally designed with a heat conduction column, and the top of the heat conduction column penetrates through the pressure-resistant layer (102) and is in contact with the bottom of the base material layer (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222804257.5U CN218416800U (en) | 2022-10-24 | 2022-10-24 | Integrated circuit board with good antistatic and pressure resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222804257.5U CN218416800U (en) | 2022-10-24 | 2022-10-24 | Integrated circuit board with good antistatic and pressure resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218416800U true CN218416800U (en) | 2023-01-31 |
Family
ID=85004499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222804257.5U Expired - Fee Related CN218416800U (en) | 2022-10-24 | 2022-10-24 | Integrated circuit board with good antistatic and pressure resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218416800U (en) |
-
2022
- 2022-10-24 CN CN202222804257.5U patent/CN218416800U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20230131 |