CN218414285U

CN218414285U - Individual layer of easy to assemble capacitator element of energizing

Info

Publication number: CN218414285U
Application number: CN202222857232.1U
Authority: CN
Inventors: 李安琪; 郑义; 白志丹
Original assignee: Jinzhou Shijitongli Electricity Co ltd
Current assignee: Jinzhou Shijitongli Electricity Co ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2023-01-31
Anticipated expiration: 2032-10-27

Abstract

The utility model discloses a capacitor element is energized to individual layer easy to assemble, which comprises a housin, capacitor body has been placed to the inner chamber of casing, positioning mechanism has all been riveted to the both sides of casing, the constant head tank has all been seted up to the bottom of capacitor body both sides, capacitor body's front side has the heat dissipation case through bolted connection, the front side of heat dissipation case runs through and is provided with the semiconductor cooler, the refrigeration end of semiconductor cooler is located the inner chamber of heat dissipation case, the rear side of heat dissipation case runs through and is provided with the cold conduction piece, the rear side and the capacitor body of cold conduction piece contact, there is the controller on the right side of heat dissipation case through bolted connection. The utility model discloses a cooperation of heat dissipation case, semiconductor cooler and cold conducting plate possesses the advantage of heat dissipation function, can carry out cooling to capacitor body's surface, makes it can not take place long-pending hot phenomenon to increase capacitor body's life.

Description

Individual layer of easy to assemble capacitator element of energizing

Technical Field

The utility model relates to a condenser technical field specifically is an easy to assemble's individual layer capacitor element of energizing.

Background

The low-voltage capacitor generally refers to a power capacitor with a rated voltage of 400V-6 kV, and the low-voltage capacitor is used for improving power factors so as to reduce electricity consumption cost, and can lighten the load of equipment, prolong the service life of the equipment and reduce the line loss from a power supply end to a power consumption end.

The utility model discloses a patent application publication No. CN 213242266U's utility model discloses a self-healing low-voltage capacitor, including capacitor body, terminal interface and protection machanism, the terminal interface is installed at capacitor body top, capacitor body top and symmetry are located terminal interface both sides and are provided with the installation piece, and protection machanism is detachable installs on the installation piece and the cover is established and is located the terminal interface outside, and protection machanism includes transparent cover, connecting rod and compresses tightly the subassembly, the transparent cover is established and is located the terminal interface outside and the lower extreme is fixed with the rubber circle, and rubber circle extrusion contact capacitor body surface, the connecting rod is fixed perpendicularly in transparent cover both sides, and the free end is located the "U" type breach that the installation piece top set up, compress tightly the subassembly and rotate and install at the installation piece top; the utility model discloses a be provided with protection machanism, both can cover the protection to the terminal interface, can take off the translucent cover again when the terminal interface goes wrong and overhaul it, and reduce the trouble of taking off and reduce the probability that the translucent cover breaks away from the interface.

However, the above-mentioned device still has some shortcomings when in actual use, and it is obvious that the device does not have a heat dissipation function, and the surface of the capacitor cannot be subjected to forced heat dissipation treatment, so that the phenomenon of heat accumulation is easily generated in the interior of the capacitor when the capacitor is used for a long time, thereby causing potential safety hazards, and meanwhile, the device does not have a quick installation function, and when the capacitor is installed, a large number of bolts are required to be used for installing and fixing the capacitor, so that the method is time-consuming and labor-consuming, and subsequent overhaul work is inconvenient to be performed, and further the applicability of the capacitor element is reduced.

Therefore, there is a need to solve the above problems by creating a single layer energized capacitor element that is easy to install.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an easy to assemble's individual layer capacitor element of energizing possesses the advantage of being convenient for the installation and having the heat dissipation function, has solved current capacitor element in the use, can't force the heat dissipation to the surface of condenser and handle, does not have the problem of fast loading and unloading function simultaneously.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a capacitor element is energized to individual layer easy to assemble, includes the casing, the capacitor body has been placed to the inner chamber of casing, the both sides of casing are all riveted with positioning mechanism, the constant head tank has all been seted up to the bottom of capacitor body both sides, there is the heat dissipation case capacitor body's front side through bolted connection, the front side of heat dissipation case runs through and is provided with the semiconductor cooler, the refrigeration end of semiconductor cooler is located the inner chamber of heat dissipation case, the rear side of heat dissipation case runs through and is provided with the cold-conducting piece, the rear side of cold-conducting piece contacts with the capacitor body, there is the controller on the right side of heat dissipation case through bolted connection, the bottom fixedly connected with adhesive linkage of casing, the bottom swing joint of adhesive linkage has from the type membrane.

Preferably, positioning mechanism includes the fixed plate, one side that the fixed plate is close to the casing is riveted with the fixed plate, the both sides of fixed plate front side are all riveted with the extension board, one side that the casing was kept away from to the extension board runs through and is provided with the pull rod, the surface cover of pull rod is equipped with the spring, the one end riveting that the pull rod is close to the casing has the locating plate, one side riveting that the locating plate is close to the casing has the locating lever, the one end that the locating lever is close to the casing runs through extension board and casing in proper order and extends to the inner chamber of locating lever.

Preferably, the right side intercommunication at heat dissipation roof portion has the filler pipe, the surface cover of filler pipe is equipped with the pipe cap.

Preferably, the guide grooves are formed in the front side and the rear side of the two sides of the inner cavity of the shell, the guide plates are riveted to the front side and the rear side of the two sides of the capacitor body, and one side, far away from the capacitor body, of each guide plate extends to the inner cavity of each guide groove.

Preferably, the bottom on the right side of the heat dissipation box is provided with a temperature sensor in a penetrating mode, and the controller is electrically connected with the temperature sensor in a bidirectional mode.

Preferably, the number of the semiconductor refrigerators is three, and the output end of the controller is in one-way electric connection with the semiconductor refrigerators.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a cooperation of heat dissipation case, semiconductor cooler and cold conducting plate possesses the advantage of heat dissipation function, can cool off the surface of capacitor body, makes it can not take place long-pending hot phenomenon to increase capacitor body's life.

2. The utility model discloses a cooperation of positioning mechanism and constant head tank possesses the advantage of fast loading and unloading function, can install fast and dismantle the condenser body to increase the installation effectiveness, make things convenient for subsequent maintenance work simultaneously.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a perspective view of the capacitor body structure of the present invention;

FIG. 3 is a perspective view of the positioning mechanism of the present invention;

FIG. 4 is a perspective view of the housing structure of the present invention;

FIG. 5 is a perspective rear view of the heat dissipation box structure of the present invention;

fig. 6 is a schematic view of the partial structure of the present invention in a rear perspective sectional view.

In the figure: the device comprises a shell 1, a capacitor body 2, a positioning mechanism 3, a positioning groove 4, a heat dissipation box 5, a semiconductor refrigerator 6, a cold guide sheet 7, a controller 8, an adhesive layer 9, a release film 10, a fixing plate 11, a support plate 12, a pull rod 13, a spring 14, a positioning plate 15, a positioning rod 16, a water feeding pipe 17, a guide groove 18, a guide plate 19 and a temperature sensor 20.

Detailed Description

Referring to fig. 1-6, a single-layer energized capacitor element convenient for installation comprises a housing 1, a capacitor body 2 is placed in an inner cavity of the housing 1, positioning mechanisms 3 are riveted on both sides of the housing 1, positioning grooves 4 are formed in the bottoms of both sides of the capacitor body 2, the front side of the capacitor body 2 is connected with a heat dissipation box 5 through bolts, a semiconductor refrigerator 6 is arranged through the front side of the heat dissipation box 5, the semiconductor refrigerator 6 is a device for producing cold by utilizing the thermoelectric effect of semiconductors, also called a thermoelectric refrigerator, and is characterized in that two different metals are connected by conductors, when direct current is connected, the temperature of one junction is reduced, the temperature of the other junction is increased, the semiconductor refrigerator 6 has the characteristics of no noise, no vibration, no refrigerant, small volume, light weight and the like, the refrigeration end of the semiconductor refrigerator 6 is positioned in the inner cavity of the heat dissipation box 5, the rear side of the heat dissipation box 5 is provided with a cold conduction sheet 7 in a penetrating mode, the rear side of the cold conduction sheet 7 is in contact with the capacitor body 2, the right side of the heat dissipation box 5 is connected with a controller 8 through a bolt, the bottom of the shell 1 is fixedly connected with an adhesive layer 9, the bottom of the adhesive layer 9 is movably connected with a release film 10, the release film 10 refers to a film with a film surface energy distinguishing function, and the release film 10 does not have viscosity or slight viscosity after being connected with a specific material under limited conditions.

Positioning mechanism 3 includes fixed plate 11, one side that fixed plate 11 is close to casing 1 is riveted with fixed plate 11, the both sides of fixed plate 11 front side all are riveted with extension board 12, one side that casing 1 was kept away from to extension board 12 runs through and is provided with pull rod 13, the surface cover of pull rod 13 is equipped with spring 14, the one end riveting that pull rod 13 is close to casing 1 has locating plate 15, one side that locating plate 15 is close to casing 1 is riveted with locating lever 16, the one end that locating lever 16 is close to casing 1 runs through extension board 12 and casing 1 in proper order and extends to the inner chamber of constant head tank 4.

The right side intercommunication at 5 tops of heat dissipation case has filler pipe 17, and the surface cover of filler pipe 17 is equipped with the pipe cap, through setting up filler pipe 17, conveniently adds the coolant liquid to the inner chamber of heat dissipation case 5 to increase subsequent cold effect of leading.

Guide way 18 has all been seted up to the front side and the rear side of 1 inner chamber both sides of casing, and the front side and the rear side of 2 both sides of capacitor body all rivet has deflector 19, and one side that capacitor body 2 was kept away from to deflector 19 extends to the inner chamber of guide way 18, through setting up deflector 19 and guide way 18, can carry out spacing and direction to capacitor body 2 to the installation effectiveness has been promoted.

The bottom on the right side of the heat dissipation box 5 is provided with the temperature sensor 20 in a penetrating mode, the controller 8 is electrically connected with the temperature sensor 20 in a two-way mode, and the temperature of the cooling liquid can be monitored in real time through the temperature sensor 20, so that the temperature of the cooling liquid cannot exceed a threshold value preset by the controller 8.

The number of the semiconductor refrigerators 6 is three, and the output end of the controller 8 is in one-way electric connection with the semiconductor refrigerators 6.

During the use, tear from type membrane 10, then laminate adhesive linkage 9 at suitable position, adhesive linkage 9's material is the super glue, accomplish the installation work to capacitor body 2 this moment, when needs dispel the heat to capacitor body 2's surface, through controller 8 control semiconductor refrigerator 6 work, add appropriate amount cooling water to the inner chamber of radiating box 5 through filler pipe 17, semiconductor refrigerator 6's refrigerating end carries out cooling to water liquid, cold water cools down cold conduction piece 7, cold conduction piece 7 carries out the cooling treatment to capacitor body 2's surface, avoid taking place the heat accumulation, when needs dismantle the maintenance to capacitor body 2, pulling pull rod 13, pull rod 13 drives locating plate 15 and removes, locating plate 15 drives locating lever 16 and removes, locating lever 16's one end is kept away from constant head tank 4, remove spacing to capacitor body 2 this moment, then move capacitor body 2 upwards, thereby dismantle capacitor body 2.

In conclusion: this individual layer of easy to assemble enables condenser element through the cooperation of heat dissipation case 5, semiconductor cooler 6, lead cold piece 7, positioning mechanism 3 and constant head tank 4, has solved current condenser element in the use, can't carry out the forced heat dissipation processing to the surface of condenser, does not have the problem of fast loading and unloading function simultaneously.

Claims

1. An easy-to-install single-layer energized capacitor element comprising a housing (1), characterized in that: capacitor body (2) have been placed to the inner chamber of casing (1), the both sides of casing (1) are all riveted positioning mechanism (3), constant head tank (4) have all been seted up to the bottom of capacitor body (2) both sides, there is heat dissipation case (5) front side through bolted connection, the front side of heat dissipation case (5) is run through and is provided with semiconductor cooler (6), the refrigeration end of semiconductor cooler (6) is located the inner chamber of heat dissipation case (5), the rear side of heat dissipation case (5) is run through and is provided with leads cold fin (7), the rear side of leading cold fin (7) contacts with capacitor body (2), there is controller (8) on the right side of heat dissipation case (5) through bolted connection, the bottom fixedly connected with adhesive linkage (9) of casing (1), the bottom swing joint of adhesive linkage (9) has from type membrane (10).

2. A single layer energized capacitor element for easy installation according to claim 1 wherein: positioning mechanism (3) are including fixed plate (11), one side that fixed plate (11) are close to casing (1) is riveted with fixed plate (11), the both sides of fixed plate (11) front side all are riveted extension board (12), one side that casing (1) was kept away from in extension board (12) is run through and is provided with pull rod (13), the surface cover of pull rod (13) is equipped with spring (14), pull rod (13) are close to the one end riveting of casing (1) and are connected locating plate (15), one side that locating plate (15) are close to casing (1) is riveted locating lever (16), the one end that locating lever (16) are close to casing (1) runs through extension board (12) and casing (1) in proper order and extends to the inner chamber of constant head tank (4).

3. A single layer energized capacitor element for easy installation according to claim 1 wherein: the right side intercommunication at heat dissipation case (5) top has filler pipe (17), the surface cover of filler pipe (17) is equipped with the pipe cap.

4. A single layer energized capacitor element for easy installation according to claim 1 wherein: guide way (18) have all been seted up to the front side and the rear side of casing (1) inner chamber both sides, the front side and the rear side of condenser body (2) both sides all are riveted deflector (19), one side that condenser body (2) were kept away from in deflector (19) extends to the inner chamber of guide way (18).

5. A single layer energized capacitor element for easy installation according to claim 1 wherein: the bottom on the right side of the heat dissipation box (5) is provided with a temperature sensor (20) in a penetrating mode, and the controller (8) is electrically connected with the temperature sensor (20) in a bidirectional mode.

6. A single layer energized capacitor element for ease of installation according to claim 1 and further comprising: the number of the semiconductor refrigerators (6) is three, and the output end of the controller (8) is in one-way electric connection with the semiconductor refrigerators (6).