CN218404457U

CN218404457U - Electroplating diamond wire saw with controllable distribution of abrasive particles

Info

Publication number: CN218404457U
Application number: CN202221030765.6U
Authority: CN
Inventors: 徐斌; 卢保松
Original assignee: Xiamen Weidu New Material Co ltd
Current assignee: Xiamen Weidu New Material Co ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2023-01-31
Anticipated expiration: 2032-04-29

Abstract

The utility model discloses an electroplating diamond wire saw with controllable distribution of grit, including the generating line, possess grit district and no grit district, a plurality of possesses the grit district and equals or inequality, random distribution mode with rule or irregularity, interval and lie in the generating line, and adjacent two possess and form a no grit district between the grit district. The utility model has reasonable design, and the fretsaw has larger chip containing space due to the generation of the larger size of the non-abrasive particle area, the effect of conveying cooling liquid is greatly enhanced while the chip removal is facilitated, and the plurality of sections of the fretsaw have the abrasive particle area, so that higher cutting efficiency and cutting quality can be realized, the service life of a cutting material is prolonged, and further the comprehensive cutting cost is reduced; meanwhile, the consumption of abrasive particles and plating metal is reduced, and the production and manufacturing cost can be reduced.

Description

Electroplating diamond wire saw with controllable distribution of abrasive particles

Technical Field

The utility model relates to a diamond wire cutting technology, in particular to an electroplating diamond fretsaw with controllable distribution of abrasive particles.

Background

The diamond wire, or diamond wire saw,is a linear cutting material which is formed by solidifying single-layer or multi-layer diamond abrasive particles on the surface of a high-strength metal filament or thin rope by means of electroplating, resin, brazing and the like, and the typical length-diameter ratio or perimeter-diameter ratio of the linear cutting material is more than 10 ³ The diamond wire is mainly used for cutting hard and brittle materials such as single/polycrystalline silicon, sapphire, magnetic materials, jewels, glass and the like, and comprises a filament type diamond wire with two end points and a ring type diamond wire without end points in end-to-end connection according to different cutting applications and different cutting equipment; according to different structures, the diamond wire comprises a single-stranded diamond wire with a core wire made of a single-stranded metal wire material and a multi-strand diamond wire with a core wire made of a multi-strand metal wire material through stranding.

Although the diamond abrasive particles on the surface of the conventional diamond wire are randomly distributed on the surface of the core wire or the core rope, the abrasive particles basically and continuously cover the surface layer of the core wire or the core rope within the visual observation scale range, and chips generated during cutting can only be contained in the gap area of the abrasive particles without specially arranging a large chip containing space, so that the capacities of carrying cooling liquid and containing chips are limited. Therefore, an electroplated diamond wire saw with controllable distribution of abrasive particles is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the problems and provide an electroplating diamond wire saw with controllable distribution of abrasive particles.

The utility model discloses a following technical scheme realizes above-mentioned purpose, an electroplating diamond wire saw with controllable distribution of grit, including the generating line, utensil grit district and no grit district, a plurality of utensil grit district is with rule or irregularity, the interval equals or is inequality, the mode of random distribution is located the generating line, two adjacent utensil grit districts between form a no grit district, a plurality of does not have the grit district with rule or irregularity, the interval equals or inequality, the mode of random distribution is located the generating line, the generating line is the coping saw, rope saw or ring type coping saw base member, for electric conductivity high strength material.

Preferably, the distribution state of the plated abrasive grain group in the abrasive grain area is in a regular discontinuous mode, an irregular discontinuous mode, a regular spiral mode, an irregular spiral mode, a spiral and discontinuous combined mode, and a random distribution mode.

Preferably, the coated abrasive particles in the abrasive particle area are solidified single-layer or multi-layer abrasive particles, and the ratio of the maximum outer diameter of the coated layer in the abrasive particle area to the maximum outer diameter of the abrasive particle-free area is between 5.

Preferably, the ratio of the equivalent spherical diameter of the plated abrasive particles to the diameter of the core rope or wire is between 1.

Preferably, the coated abrasive particles include diamond, silicon carbide, cubic boron nitride, boron carbide, tungsten carbide, and corundum.

Compared with the prior art, the beneficial effects of the utility model are that: due to the fact that the large-size abrasive particle-free area is generated, the fretsaw has a large chip containing space, the effect of conveying cooling liquid is greatly enhanced while chip removal is facilitated, the abrasive particle areas are arranged in multiple sections, and therefore high cutting speed and high cutting quality can be achieved, the service life of a cutting material is prolonged, and comprehensive cutting cost is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1, 2 and 3 are schematic diagrams of the structure of the three kinds of electroplated diamond wire saws with controllable distribution of abrasive particles according to the present invention.

The following drawings: 1. a bus bar; 2. a region with abrasive particles; 3. a region free of abrasive particles.

Detailed Description

To make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention are clearly and completely described in the embodiments of the present invention with reference to the drawings, and obviously, the embodiments described below are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The technical solution of the present invention is further explained by the following embodiments with reference to the drawings.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1-3, an electroplated diamond wire saw with controllable distribution of abrasive particles includes a bus 1, regions with abrasive particles 2, and regions without abrasive particles 3, wherein a plurality of regions with abrasive particles 2 are located on the bus 1 in a regular or irregular, equal or unequal interval, and randomly distributed manner, a region without abrasive particles 3 is formed between two adjacent regions with abrasive particles 2, a plurality of regions without abrasive particles 3 are located on the bus 1 in a regular or irregular, equal or unequal interval, and randomly distributed manner, and the bus 1 is a wire saw, a string saw, or a ring wire saw base material, and is a conductive high-strength material.

Further, the distribution state of the plated abrasive grain group in the abrasive grain-containing area 2 is regular discontinuous, irregular discontinuous, regular spiral, irregular spiral, combination of spiral and discontinuous, and random distribution.

Furthermore, the coated abrasive particles in the abrasive particle-containing area 2 are consolidated single-layer or multi-layer abrasive particles, and the ratio of the maximum outer diameter of the coated layer in the abrasive particle-containing area 2 to the maximum outer diameter of the abrasive particle-free area is 5.

Further, the ratio of the equivalent spherical diameter of the coated abrasive particles to the diameter of the core rope or core wire is between 1.

Further, the plated abrasive particles include diamond, silicon carbide, cubic boron nitride, boron carbide, tungsten carbide, and corundum.

The electroplated diamond wire saw with the controllable distribution of the abrasive particles has the advantages that: due to the fact that the large-size abrasive particle-free area is generated, the fretsaw has a large chip containing space, the effect of conveying cooling liquid is greatly enhanced while chip removal is facilitated, the abrasive particle areas are arranged in multiple sections, and therefore high cutting speed and high cutting quality can be achieved, the service life of a cutting material is prolonged, and comprehensive cutting cost is reduced.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electroplated diamond wire saw with controllable distribution of abrasive particles is characterized in that: the wire saw comprises a bus (1), a plurality of abrasive particle areas (2) and non-abrasive particle areas (3), wherein the abrasive particle areas (2) are arranged on the bus (1) in a regular or irregular, equal or unequal interval and random distribution mode, one non-abrasive particle area (3) is formed between every two adjacent abrasive particle areas (2), the abrasive particle areas (3) are arranged on the bus (1) in a regular or irregular, equal or unequal interval and random distribution mode, and the bus (1) is a wire saw, a rope saw or a ring-shaped wire saw base material and is a conductive high-strength material.

2. The electroplated diamond wire saw with controlled distribution of abrasive particles of claim 1, wherein: the distribution state of the plating abrasive particle group in the abrasive particle area (2) is regular discontinuous, irregular discontinuous, regular spiral, irregular spiral, spiral and discontinuous combined type and random distribution.

3. The electroplated diamond wire saw with controlled distribution of abrasive particles of claim 1, wherein: the coating abrasive particles in the abrasive particle zone (2) are consolidated single-layer or multi-layer abrasive particles, and the ratio of the maximum outer diameter of the coating layer in the abrasive particle zone (2) to the maximum outer diameter of the abrasive particle-free zone is 5 to 1.1.

4. The electroplated diamond wire saw with controlled distribution of abrasive particles of claim 3, wherein: the ratio of the equivalent spherical diameter of the coated abrasive particles to the diameter of the core rope or core wire is between 1.

5. The electroplated diamond wire saw with controlled distribution of abrasive particles of claim 4, wherein: the coated abrasive particles include diamond, silicon carbide, cubic boron nitride, boron carbide, tungsten carbide, and corundum.