CN218388509U

CN218388509U - Packaging system for receiving different components

Info

Publication number: CN218388509U
Application number: CN202090001016.3U
Authority: CN
Inventors: 英戈·沃尔那; 克劳斯-米夏埃尔·巴特; 安德里亚斯·施拉德尔
Original assignee: Phoenix Contact GmbH and Co KG
Current assignee: Phoenix Contact GmbH and Co KG
Priority date: 2019-12-18
Filing date: 2020-12-08
Publication date: 2023-01-24
Anticipated expiration: 2030-12-08
Also published as: DE102019134894A1; WO2021122126A1

Abstract

The present invention relates to a packaging system (10) for receiving different components (40. The packaging system (10) is constructed as a blister packaging system and has a blister package (11. By fitting the different adapter element (30.

Description

Packaging system for receiving different components

Technical Field

The present invention relates to a packaging system for receiving different components, wherein the components are in particular electrical and/or electronic components. The packaging system is constructed as a blister packaging system and has a blister package formed from a strip of material having a plurality of cavities (blisters) formed therein.

Background

Blister packages in the form of blister strips are commonly used for packaging of, for example, small electronic devices or SMD devices. The blister strips are suitable for the protective packaging of the individual components and can in particular be integrated into an automated production, where they can be transported by means of a transport system for assembly. For example for automated assembly of printed circuit boards.

Such blister packs are usually formed from a flat strip of material in which a plurality of nests (blisters/cavities) are successively constructed to receive one device each. In the simplest case, these blister cavities are covered by a strip of a correspondingly suitable material. A blister cavity refers to a recess in the strip of material that matches the shape and size of the device to be received, thereby securely receiving and positioning the device in the blister. Accordingly, to package electrical and electronic components of different shapes and sizes, blister packages having differently shaped blister cavities are commonly used. This is difficult, wherein it is necessary to take into account that components, for example in the case of printed circuit board connection technology, can only be distinguished by different numbers of poles of the components. However, one matching blister cavity must be selected for each pole number to place the assembly in an exact fit.

In addition, however, the components may also have different structural dimensions, as is the case, for example, in hybrid connectors. Different pin spacing or grid spacing may also affect the shape and size of the appropriate blister cavity.

DE 38 29 249 C2 discloses a blister package in which the height of the blister cavity can be varied by inserting a cushioning pad, but such a cushioning pad is prone to fall out of the cavity and, in particular, its number of poles and grid cannot be taken into account except for the size differences of the components.

SUMMERY OF THE UTILITY MODEL

It is therefore an object of the present invention to provide a packaging system for receiving electrical and electronic components, which has a blister pack in which different components, for example with variable constructional dimensions, contact pin spacings and/or pole counts, can be reliably received and positioned.

The utility model discloses a solution for reaching above-mentioned purpose is according to the utility model discloses a packaging system. Advantageous developments of the packaging system are described in the description.

The utility model discloses a packaging system is used for receiving different subassemblies. The components include electrical and electronic components. These components are in particular of different size, shape, pole count, mesh and/or stylus count, but can also be distinguished by other parameters. Components are, for example, SMD components with weldable connecting surfaces and/or components for Through-Hole Technology (THT-Through Hole Technology).

The packaging system has a blister pack and at least two adapter elements. Blister packs are formed from a strip of material having a plurality of standard cavities formed therein. The material strips are for example films made of PC, PET, PP, PS or PVC. Standard cavities are recesses in the material strip, which are produced, for example, by deep drawing or by injection molding. The standard cavity formed in this manner has a bottom and a blister opening. The bottom is connected to the edge of the blister opening by a plurality of side walls, and the standard cavity has a depth H between the plane of the strip of material and this bottom. If the bottom is not flat, then different partitions have different depths H. Blister packs refer, for example, to elongate strips of blisters or flat boxes.

The packaging system also has adapter elements which differ in terms of shape and/or size. The adapter element is made of plastic, such as PC, PET, PP, PS or PVC. The adapter elements can each be inserted into a standard cavity in order to adapt this cavity to the component to be received. The component is positioned in the cavity by the adapter element. Thus, the packaging system provides a plurality of different adapter elements which can be selected according to the specific assembly and loaded into the cavity of the blister package.

According to the invention, the adapter element and the standard cavity are constructed such that the adapter element is received in the standard cavity with a tight fit. The adapter element is therefore inserted into the standard cavity in a manner that is not freely movable, and the close fit of the invention enables an exact positioning of the adapter element in the standard cavity. Thereby, the adapter element automatically assumes the preset position and orientation. In this case, the same is true for the loaded components that can be loaded in a precisely fitting manner.

The adapter elements each have a separating surface and, due to the tight fit, form an adapter cavity at least in one sub-area in the corresponding standard cavity by fitting the adapter elements. In this case, such a fitting cavity is formed at least between the fitting element and the blister opening of the standard cavity. The separating surface of the inserted adapter element forms a new base of this adapter cavity, wherein in this adapter cavity the depth H between the separating surface and the plane of the material web is smaller than the depth H of the corresponding standard cavity. Thus, by inserting the adapter element, the depth of the standard cavity in at least one partial area is reduced, thereby adapting to the size of the component to be inserted. The separating plane is preferably substantially parallel to the plane of the material web, but other orientations are also possible. Here and in the following, "substantially parallel" means that the invention also includes slight deviations from parallelism.

The adapter element preferably refers to a substantially flat plate, in which case the plate is also referred to as adapter plate. But an adapter element may also refer to an element of another shape. The plate element can in particular also have a projection projecting out of the plane of the plate element. In other embodiments, for example, a cube, a cylinder, a hollow body with open sides, etc.

The advantage of the utility model is that, only need the unified standard hole of shaping in the blister pack, these standard holes can be through the type phase-match of the corresponding adaptation component of packing into with the subassembly of waiting to pack in a flexible way. This allows, for example, the assembly of modules with different numbers of contacts and contact pin spacings, as well as hybrid connector base strips. The cost of the additional adapter element is lower relative to the additional blister pack size. This is an unconventional measure, in particular in blister packs, since the person skilled in the art is accustomed to using matching blister strips for different devices accordingly.

All standard cavities in a blister pack can be constructed exactly the same in shape and size. This is not mandatory, however, and the essence of the invention is that the standard cavity is not constructed for the targeted reception of different components. These standard cavities need only be matched in certain parameters in order to be able to fit the adapter element at least with a tight fit. Thus, in one embodiment of the invention, the standard cavity has a shape and a size capable of receiving the adapter element with a tight fit, and in the standard cavity at least this shape and size is the same.

Furthermore, in one embodiment of the invention, the standard cavity is at least suitable for receiving at least one component with an exact fit, even without the adapter element being inserted. In this case, the standard cavities have a shape and a size which are capable of receiving the component with an exact fit, and at least this shape and size is identical in these standard cavities. But in addition standard cavities may differ in shape and size not for the above purpose.

In one embodiment of the invention, the main extension of the adapter element, which is inserted into the standard cavity, extends parallel to the material web in the plane on the basis of the tight fit. In this case, the extension of the standard cavity in the plane of the material web is greater than its depth H, and the insertion of the adapter element reduces this depth at least in a partial region of the standard cavity.

The adaptation elements may be distinguished in different ways. In one embodiment of the invention, at least two adapter elements have, for example, bores, and the at least two adapter elements differ by the number, size and/or arrangement of these bores. The drilled holes are made, for example, by laser cutting. The contact pins of different components can be inserted into these bores so that they match the different components to be received. Especially with regard to the number and arrangement of the drill holes. In this way, the component can be positioned in the formed fitting cavity precisely and reliably, so that in particular removal by means of an automatic assembly machine is made easier.

In a further embodiment of the invention, at least two adapter elements differ by the edge contour of their separating surfaces. In the adapter plate, for example, a recess can be fitted into the edge of the plate. The recess is fitted into the edge of the adapter plate, for example by laser cutting. The elements of the assembly can be inserted into these recesses to position and securely hold the elements.

In a further embodiment of the invention, the at least two adapter elements differ by their thickness D. In this way, adaptation cavities with different depths h can be produced, in which components of different heights can be received.

The tight fit of the adapter element in the standard cavity can function in different ways. Preferably, the adapter element snaps into the standard cavity based on a tight fit. This is achieved by corresponding snap members on the standard cavity and/or the adapter element. The geometry of the adapter element can, for example, be adapted to engage with at least one snap flange in a standard cavity, or the adapter element has at least one snap flange which can engage with the geometry of a standard cavity. In particular, two opposing snap elements can be used.

In an alternative embodiment, at least one tongue that snaps into a groove or slit serves as a snap-in member, wherein the tongue and groove/slit are built on the adapter element or the standard cavity. Combinations of different snap mechanisms may also be employed.

The adapter element can be inserted into the standard cavity in such a way that it lies flat on the bottom of the standard cavity. In order to be able to reduce the height of the standard cavity to a sufficient extent also in the case of flat elements, such as adapter plates, support elements can also be built into the standard cavity, on which the adapter elements rest. The support elements for example adjoin the side walls of the cavity or are built separately at the bottom of the cavity. Here, for example, ribs, beads, platforms and/or knobs are provided. In one embodiment of the invention, therefore, at least one supporting element is formed in the standard cavity, which supporting element has a bearing surface which is closer to the plane of the material web than to the bottom of the standard cavity and on which the adapter element rests on the basis of a tight fit. In this case, the bearing surface is substantially parallel to the plane of the material web, but other orientations can also be selected.

The standard cavities can have different cross sections in the plane of the material web. These cross sections may be circular or elliptical, for example. Rectangular cross-sections or polygonal cross-sections with more than four corners may also be used. When the adapter element is inserted into the standard cavity, these cross sections can be completely or at least partially filled by the adapter element, so that the depth H of the standard cavity decreases over the entire standard cavity or only in one partial region. In the latter case, the adapter cavity is formed not only between the adapter element and the blister opening of the standard cavity, but also on the side of the adapter element between this adapter element and, for example, the side wall of the standard cavity. The assembly can be installed both between the adapter element and the blister opening of the standard cavity and between the adapter element and the side wall of the standard cavity.

The utility model discloses still include according to the utility model discloses an embodiment's a packaging system, wherein respectively have an adaptation component with a tight fit standard cavity of packing into the blister pack. Each of the thus formed fitting cavities receives one of the electrical components therein and the standard cavity is closed with a cover. The cover part is formed, for example, by a paper or plastic tape. When using blister strips, the packaging system thus formed can be transported to an automated assembly device, in which the cover is removed and the components are taken out automatically. To the application of other components, for the utility model discloses a packaging system assembles other adaptation components and corresponding subassembly.

Drawings

Further advantages, features and advantageous refinements of the invention are described in the following description of a preferred embodiment with reference to the figures.

Wherein

FIG. 1 is an embodiment of the packaging system of the present invention having a blister strip;

FIG. 2 is a top view of an embodiment of a blister strip pack having a first adapter panel;

FIG. 3 is a three-dimensional view of the blister strip package of FIG. 2;

FIG. 4 isbase:Sub>A section A-A of the blister strip pack of FIG. 2;

FIG. 5 is the adapter plate of FIG. 2;

FIG. 6 is a top view of an embodiment of a blister strip package having a second adapter board;

FIG. 7 is a three-dimensional view of the blister strip package of FIG. 6;

FIG. 8 is the adapter plate of FIG. 6;

FIG. 9 is a top view of an embodiment of a blister strip pack having a third adapter panel;

FIG. 10 is a three-dimensional view of the blister strip package of FIG. 9;

FIG. 11 is the adapter plate of FIG. 9;

FIG. 12 is a top view of an embodiment of a blister strip pack with a fourth adapter panel;

FIG. 13 is a three-dimensional view of the blister strip package of FIG. 12;

FIG. 14 is the adapter plate of FIG. 12; and

fig. 15 is an embodiment of the invention in the form of a flat cartridge.

Detailed Description

Fig. 1 shows possible components of a packaging system 10 of the present invention, wherein the blister package used is a blister strip. The packaging system 10 includes a blister strip 11 formed from a strip of material 21 having a plurality of cavities or blisters formed therein. In this embodiment, the blister strip 11 illustratively has three

voids

23, 24 and 25, but may be formed with more than three voids, thereby making the strip 21 longer. The

cavities

23, 24, 25 are identical in shape and size and are referred to as standard cavities in the present invention.

A row of a plurality of transport openings 22 is provided on each of the opposite long sides of the material web 21. The transport device can use these transport openings to transport the blister strip 11 to an automated assembly device.

The packaging system 10 further comprises at least two differently shaped adapter elements, of which four

adapter elements

30, 31, 32 and 33 are shown in the packaging system 10 of fig. 1. In conjunction with these four adapter elements, different possible shaping variants of the adapter elements are described by way of example. Other schemes may be used as well. The adapter element preferably refers to a plate, for example an adapter plate. The adapter plate differs, for example, in its thickness D. The thickness D of the adapter plate 32 is greater than the

other adapter plates

30, 31, 33. Several adapter plates also have bores, the number and arrangement of which can be varied. For example, the adapter plate 30 has three aligned bores 30'. The same is true for the adapter plate 32. While the adapter plate 31 has three drillings 31' arranged in a first row and three other drillings 31 "arranged in a second row, wherein this second row is arranged offset from the first row.

The edge profile of the adapter plate can likewise be varied. For example, the

adapter plates

30, 31 and 32 generally have rectangular edge profiles and slightly rounded corners. While the adapter plate 33 has an edge profile 39 with a plurality of recesses.

In order to use the

standard cavities

23, 25 of the blister strip 11 for reliably receiving different types of electrical components, adapter plates matched to the respective components are fitted into the standard cavities. The installation and use of the different adapter plates is explained below.

Fig. 2 to 5 show a first embodiment of a blister strip 11 with three

standard cavities

23, 24, 25. In this case, fig. 1 and 2 show a blister strip 11, the standard cavity 25 of which is empty. As can be seen from this empty standard cavity 25, it has a substantially rectangular cross-section. It therefore has a bottom 52 which is connected to the opening of the standard cavity 25 by four side walls. On both long sides of the standard cavity 25, a

support element

50, 51 in the form of a strip is formed. On the opposite short sides of the standard cavity 25, a catch element in the form of a catch lug is provided in each case. Which refers to snap elements with

reference numerals

53, 54, 55, 53', 54' and 55 '. An opening 56 is also provided in the bottom 52 of the standard cavity 25.

The adapter plate 30 has been loaded into the standard cavity 24. This adapter plate has three bores 30' (see fig. 5) arranged in a line and lies on the edge strips 50, 51. Wherein the adapter plate 30 is snapped under the snap flanges 54 and 54' to be placed in the standard cavity 24 with a tight fit. Thereby, the adapter plate takes up a preset position and is fixed against falling. To separate the adapter plate 30 from the standard cavity 24, for example, a tool may be pressed against the bottom side of the adapter plate 30 through a snap fit of the bottom 52.

In addition to the adapter plate 30, the standard cavity 23 also houses electrical components 40. As can be seen from the sectionbase:Sub>A-base:Sub>A of fig. 4, the depth H of the standard cavity is reduced to the depth H after the adapter plate 30 is fitted into the standard cavity 23. Thereby, an adapter cavity 26 is formed above the adapter plate 30, which can be accessed through the opening of the standard cavity 23 in the material strip 21. The component 40 is received in this mating cavity 26 and the three contact pins 44 of the component are inserted into the bores 30' of the adapter plate 30.

Fig. 6-8 illustrate a second embodiment of a blister strip 12 for use in the packaging system of the present invention. The blister strip 12 is again described in connection with three

standard cavities

23, 24, 25, which are shaped differently from the embodiment of figures 1 to 4. The openings of these standard cavities in the material web 21 are not rectangular but are polygonal with two steps and thus have more than four corners. A support element 51 in the form of a strip is again formed on one long side of the standard cavity. On one short side is provided another edge strip 50. Furthermore, a wide strip in the form of a platform 57 is formed on the other long side.

The adapter plate 33 has an edge profile 39 with a plurality of recesses. Such an adapter plate 30 lies in the standard cavity 24 on the edge strips 50 and 51, but does not completely fill the cross section of the standard cavity 24. Rather, the adapter plate covers only one section, so that the depth of the standard cavity 24 is reduced in only one section. Wherein the recessed edge profile 39 points in the direction of the platform 57. Thereby, the fitting cavity 26 is formed above the adapter plate 33, but at the same time a second fitting cavity 27 is formed at the side of the adapter plate 33. The side fitting cavity 27 accommodates the component 41, the component 41 lying on the platform 57. The contact pins of the component 41 snap into the recesses of the edge profile 39.

However, it is also possible, for example, to fit an adapter plate 33 with a recess in its edge contour into the standard cavity of the embodiment shown in fig. 1 to 4, so that a fitting cavity is formed there next to the adapter plate 33, into which the component can be fitted.

Fig. 9 to 11 show a third embodiment of a blister strip 13 with standard cavities again rectangular in cross-section. The adapter plate 34 for receiving the electrical components 42 has two rows of staggered arrangement formed by three bores 34' and 34", respectively. An elongated member 42 with six contact pins is received in the adapter cavity 26 above the adapter plate 34 and guided by bores 34', 34 "in the adapter plate 34.

Fig. 12 to 14 show a fourth embodiment of the blister strip 14, in which the adapter plate 35 is again provided with three bores 35'. The adapter plate 35 does not engage with the snap-in flanges in the

standard cavities

23, 24, 25, but has a projecting

tongue

37, 38 on its short side. The adapter plate 35 is snap-fitted by means of these

tongues

37, 38 on opposite short sides of the standard cavity with snap-in members in the form of slits. In fig. 12 and 13, these slits are designated by

reference numerals

53, 54, 55, 53', 54' and 55 '.

As shown in the adapter element 32 in fig. 1,

such tongues

37, 38 can also be provided on adapter elements with a greater thickness D. This further reduces the depth h of the mating cavity formed.

The

standard cavities

23, 24, 25 themselves may also be shaped so as to receive electrical components of a particular shape and size in a preset position and orientation. This reception without adapter elements is suitable for the largest assemblies. For example, the component can be received with a precise fit between a plurality of support elements.

Fig. 15 shows an embodiment of the packaging system of the present invention, wherein the blister package is a flat box 15 with a plurality of standard cavities.

Description of the reference numerals

Packaging system 10

Blister strips 11, 12, 13, 14

Flat box 15

Material strip 21

Transport opening 22

Standard cavities,

blister nests

23, 24, 25

Fitting

cavities

26, 27

Adapter element

30, 31, 32, 33, 34, 35, 36

Boreholes 30', 31', 32', 34', 35'

Snap-in elements,

tongues

37, 38

Edge profile 39

Assemblies

40, 41, 42, 43

Contact pin 44

Support elements

50, 51

Bottom 52

Snap element, snap flanges 53, 53', 54', 55'

Bore 56

Platform 57

Claims

1. -a packaging system (10) for receiving a blister pack (11) and at least two fitting elements (32), wherein the blister pack (11) is formed with a plurality of standard cavities (23, 36) and wherein the fitting elements (31, 36) are formed with a depth H between the plane of the strip (21) and the corresponding cavities (31, 32), the depth H between the separating surface and the plane of the strip of material (21) is less than the depth H of the respective standard cavity (23.

2. The packaging system as claimed in claim 1, characterized in that, on the basis of the tight fit, the main extensions of the adapter elements (30.

3. The packaging system according to claim 1 or 2, characterized in that at least two adapter elements have a bore and that the at least two adapter elements differ in the number, size and/or arrangement of the bores.

4. The packaging system according to claim 1, wherein at least two adapter elements differ by the edge profile of their separating surfaces.

5. The packaging system according to claim 1, wherein at least two of the adapter elements differ by their thickness D.

6. The packaging system according to claim 1, characterized in that the standard cavities (23.

7. The packaging system according to claim 1, characterized in that the standard cavities (23.

8. The packaging system according to claim 1, characterized in that, on the basis of the tight fit, the adapter element (30.

9. The packaging system according to claim 1, characterized in that at least one supporting element (50.

10. A packaging system as claimed in claim 1, characterized in that the standard cavity (23.

11. The packaging system according to claim 1, wherein each one of the adapter elements (30.