CN218388047U - Low impedance multi-layer circuit board - Google Patents
Low impedance multi-layer circuit board Download PDFInfo
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- CN218388047U CN218388047U CN202222685662.XU CN202222685662U CN218388047U CN 218388047 U CN218388047 U CN 218388047U CN 202222685662 U CN202222685662 U CN 202222685662U CN 218388047 U CN218388047 U CN 218388047U
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- circuit board
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- low impedance
- mounting panel
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Abstract
The utility model discloses a low impedance multilayer circuit board, its technical scheme is: including the main part, the mounting hole has been seted up at the main part edge, the main part edge is provided with the mounting panel, mounting panel perpendicular to main part, the inside cavity that sets up of mounting panel, the mounting panel lateral wall is provided with the trompil, mounting panel lateral wall fixedly connected with fan, the air intake and the trompil position of fan correspond, mounting panel bottom edge fixedly connected with aviation baffle, the wind-guiding channel has been seted up to the aviation baffle bottom surface, and low impedance multilayer circuit board beneficial effect is: through setting up heat-conducting layer and the aviation baffle of pasting with the circuit board surface and setting up mounting panel and the fan at the circuit board edge, can initiatively dispel the heat to the high hot region on circuit board surface when starting the fan to this has improved the radiating effect, sets up mounting panel and fan at the circuit board edge more rationally, has avoided the installation and the maintenance work of circuit element on the influence circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to low impedance multilayer circuit board.
Background
The existing multilayer printed circuit board mostly improves the stability and the integration level by increasing the number of layers so as to increase the application range, but the multilayer printed circuit board generates a large amount of heat in the circuit operation process to cause the overheating of the multilayer printed circuit board, which not only can cause the damage of the circuit board, but also can cause the whole impedance of the circuit board to be increased to influence the normal operation of the circuit board, and the performance of a product based on the multilayer printed circuit board is greatly influenced.
In order to solve the problem of heat dissipation of a multilayer printed circuit board in the prior art and reduce impedance, a metal base is usually added on the printed circuit board to realize heat dissipation, but the heat dissipation effect is not ideal when the heat dissipation is carried out by depending on the structure of a substrate.
Disclosure of Invention
Therefore, the utility model provides a low impedance multilayer circuit board, through setting up heat-conducting layer and aviation baffle and the mounting panel and the fan of setting at the circuit board edge with circuit board surface paste, can initiatively dispel the heat to the high fever region on circuit board surface during the start-up fan, with this heat dissipation effect has been improved, it is more reasonable with mounting panel and fan setting at the circuit board edge, the installation and the maintenance work of circuit element on the influence circuit board have been avoided, with the heat dissipation problem for solving multilayer printed wiring board among the solution prior art, with reduce impedance, it realizes the heat dissipation to adopt to increase the metal base on printed wiring board usually, but this kind relies on base plate self structure to carry out the radiating, the unsatisfactory problem of often the heat dissipation effect.
In order to achieve the above object, the present invention provides the following technical solutions: the low-impedance multilayer circuit board comprises a main body, wherein a mounting hole is formed in the edge of the main body, a mounting plate is arranged at the edge of the main body, the mounting plate is perpendicular to the main body, a cavity is formed in the mounting plate, an opening is formed in the side wall of the mounting plate, a fan is fixedly connected to the side wall of the mounting plate, the air inlet of the fan corresponds to the position of the opening, an air deflector is fixedly connected to the edge of the bottom of the mounting plate, an air guide channel is formed in the bottom surface of the air deflector, one end of the air guide channel is communicated with the cavity, the other end of the air guide channel extends to the edge of the air guide plate to form an air inlet hole, a heat-conducting layer is fixedly connected to the bottom of the air deflector, and the heat-conducting layer is fixedly bonded to the surface of the main body.
Preferably, the air deflector comprises a heat dissipation covering part and a heat conduction covering part which are integrally molded.
Preferably, the edge of the bottom of the mounting plate is fixedly connected with a supporting rod, the end part of the supporting rod is fixedly connected with a mounting ring, and the mounting ring corresponds to the position of the opening.
Preferably, the heat conduction layer is a graphene heat conduction film.
Preferably, one end, far away from the mounting plate, of the air deflector is provided with a slope-shaped protrusion, and the height of the air inlet hole is increased along with the slope-shaped protrusion.
Preferably, a filter screen is arranged at the air inlet, and the filter screen is fixedly connected with the air deflector.
Preferably, the fan is provided as a centrifugal fan.
The embodiment of the utility model provides a have following advantage:
1. by arranging the heat conduction layer and the air deflector which are adhered to the surface of the circuit board and the mounting plate and the fan which are arranged at the edge of the circuit board, the high-heat area on the surface of the circuit board can be actively radiated when the fan is started, so that the radiating effect is improved, the mounting plate and the fan are more reasonably arranged at the edge of the circuit board, and the influence on the mounting and maintenance work of circuit elements on the circuit board is avoided;
2. through setting up branch and collar, the accessible screw fixation circuit board simultaneously with the mounting panel together fixed, guaranteed stability, through set up the slope form at the aviation baffle tip and protruding and set up the filter screen, can avoid the dust to block up fresh air inlet and wind-guiding channel.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.
Fig. 1 is a schematic view of the overall structure provided by the present invention;
fig. 2 is an exploded view of the overall structure provided by the present invention;
fig. 3 is a schematic view of the structure of the air guide channel provided by the present invention.
In the figure: the heat dissipation structure comprises a main body 1, a mounting plate 2, a cavity 3, an opening 4, a fan 5, an air deflector 6, a heat dissipation covering part 61, a heat conduction covering part 62, an air guide channel 7, an air inlet hole 8, a heat conduction layer 9, a support rod 10, a mounting ring 11, a slope-shaped protrusion 12, a filter screen 13 and a mounting hole 14.
Detailed Description
The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to the attached drawings 1-3, the utility model provides a low impedance multilayer circuit board, including main part 1, main part 1 edge has seted up mounting hole 14, main part 1 edge is provided with mounting panel 2, mounting panel 2 is perpendicular to main part 1, mounting panel 2 inside sets up cavity 3, mounting panel 2 lateral wall is provided with trompil 4, mounting panel 2 lateral wall fixedly connected with fan 5, the air intake of fan 5 corresponds with trompil 4 position, mounting panel 2 bottom edge fixedly connected with aviation baffle 6, aviation baffle 6 bottom surface has seted up wind-guiding channel 7, wind-guiding channel 7 one end is communicated with cavity 3, the other end of wind-guiding channel 7 extends to aviation baffle 6 edge and forms inlet opening 8, aviation baffle 6 bottom fixedly connected with heat-conducting layer 9, heat-conducting layer 9 is fixed to bond on main part 1 surface;
in this embodiment, the quantity and the shape of the mounting plate 2 are set according to the surface heat dissipation position of the heat dissipation plate, the heat conduction layer 9 and the air deflector 6 which are adhered to the surface of the circuit board are arranged, and the mounting plate 2 and the fan 5 are arranged at the edge of the circuit board, so that the active heat dissipation can be performed on a high heat area on the surface of the circuit board when the fan 5 is started, the heat dissipation effect is improved, the mounting plate 2 and the fan 5 are arranged at the edge of the circuit board more reasonably, and the influence on the installation and maintenance work of circuit elements on the circuit board is avoided.
Wherein, in order to realize the purpose of reducing the volume, this device adopts the following technical scheme to realize: the air deflector 6 comprises a heat dissipation covering part 61 and a heat conduction covering part 62 which are integrally formed, the shape of the heat dissipation covering part 61 is matched with the shape of a region to be dissipated on the surface of the circuit board in practical application, the width of the heat conduction covering part 62 is narrow, and the shape is required to avoid circuit elements on the circuit board;
wherein, in order to realize the purpose of fixed mounting panel 2, this device adopts following technical scheme to realize: the edge of the bottom of the mounting plate 2 is fixedly connected with a supporting rod 10, the end part of the supporting rod 10 is fixedly connected with a mounting ring 11, and the mounting ring 11 corresponds to the position of the opening 4;
wherein, in order to realize the purpose that improves the heat conduction effect, this device adopts following technical scheme to realize: the heat conduction layer 9 is a graphene heat conduction film;
wherein, in order to realize the purpose of increase fresh air inlet 8, this device adopts following technical scheme to realize: one end of the air deflector 6, which is far away from the mounting plate 2, is provided with a slope-shaped protrusion 12, the height of the air inlet hole 8 is increased along with the slope-shaped protrusion 12, and the air inlet hole 8 can be prevented from being blocked by dust by enlarging the air inlet hole 8;
wherein, in order to realize avoiding the purpose that ash blocks up wind-guiding channel 7, this device adopts following technical scheme to realize: a filter screen 13 is arranged at the air inlet hole 8, and the filter screen 13 is fixedly connected with the air deflector 6;
wherein, in order to realize the purpose of improving the radiating efficiency, the device adopts the following technical scheme to realize: the fan 5 is provided as a centrifugal fan.
The utility model discloses a use as follows: use the utility model discloses the time, mounting panel 2's shape is predesigned according to the heat dissipation demand of circuit board, bonds heat-conducting layer 9 and realizes fixing in advance at 1 surface in main part, runs through collar 11 and mounting hole 14 through the screw when fixed circuit board, realizes further fixing, and the regional heat of heat-conducting layer 9 transferable circuit board surface high heat, and when fan 5 operates, the air current is through fresh air inlet 8 and wind-guiding channel 7 with higher speed to this heat dissipation of heat-conducting layer 9 with higher speed.
The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.
Claims (7)
1. Low impedance multilayer circuit board, including main part (1), mounting hole (14), its characterized in that have been seted up at main part (1) edge: the improved air-conditioning fan is characterized in that an installation plate (2) is arranged at the edge of the main body (1), the installation plate (2) is perpendicular to the main body (1), a cavity (3) is formed inside the installation plate (2), an opening (4) is formed in the side wall of the installation plate (2), a fan (5) is fixedly connected to the side wall of the installation plate (2), the air inlet of the fan (5) corresponds to the position of the opening (4), an air guide plate (6) is fixedly connected to the edge of the bottom of the installation plate (2), an air guide channel (7) is formed in the bottom surface of the air guide plate (6), one end of the air guide channel (7) is communicated with the cavity (3), the other end of the air guide channel (7) extends to the edge of the air guide plate (6) to form an air inlet hole (8), a heat conduction layer (9) is fixedly connected to the bottom of the air guide plate (6), and the heat conduction layer (9) is fixedly bonded to the surface of the main body (1).
2. The low impedance multilayer wiring board of claim 1, wherein: the air deflector (6) comprises a heat dissipation covering part (61) and a heat conduction covering part (62) which are integrally formed.
3. The low impedance multilayer wiring board of claim 1, wherein: mounting panel (2) bottom edge fixedly connected with branch (10), branch (10) tip fixedly connected with collar (11), collar (11) correspond with trompil (4) position.
4. The low impedance multilayer wiring board of claim 1, wherein: the heat conduction layer (9) is set to be a graphene heat conduction film.
5. The low impedance multilayer wiring board of claim 1, wherein: and a slope-shaped protrusion (12) is arranged at one end, away from the mounting plate (2), of the air deflector (6), and the height of the air inlet hole (8) is increased along with the slope-shaped protrusion (12).
6. The low impedance multilayer wiring board of claim 1 or 5, wherein: a filter screen (13) is arranged at the air inlet (8), and the filter screen (13) is fixedly connected with the air deflector (6).
7. The low impedance multilayer wiring board of claim 1, wherein: the fan (5) is arranged as a centrifugal fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222685662.XU CN218388047U (en) | 2022-10-12 | 2022-10-12 | Low impedance multi-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222685662.XU CN218388047U (en) | 2022-10-12 | 2022-10-12 | Low impedance multi-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218388047U true CN218388047U (en) | 2023-01-24 |
Family
ID=84929516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222685662.XU Active CN218388047U (en) | 2022-10-12 | 2022-10-12 | Low impedance multi-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218388047U (en) |
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2022
- 2022-10-12 CN CN202222685662.XU patent/CN218388047U/en active Active
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