CN218387682U - High-definition image acquisition device - Google Patents

Abstract

The application provides a high-definition image acquisition device, which comprises an image acquisition unit, a baffle, a filter plate and a first outer frame, wherein the image acquisition unit comprises two imaging modules which are fixedly arranged at intervals along the X-axis direction, and each imaging module comprises a diaphragm, a magnifying lens and an imaging module which are sequentially arranged along the optical axis of the imaging module and are used for magnifying and imaging an image to be detected in a detection area and acquiring the image in the imaging area; the baffle is fixedly arranged between the two imaging modules in a light-tight manner; the light filter plate is fixedly arranged between the image acquisition unit and the image to be detected and is used for enabling light rays emitted from the image to be detected to enter the image acquisition unit through the light filtering slit; the first outer frame is used for fixedly accommodating the image acquisition unit, the baffle plate and the filter plate and blocking ambient light. The application provides a high definition image acquisition device can acquire the enlarged image of waiting to detect the image high definition, high resolution ground.

Description

High-definition image acquisition device

Technical Field

The application belongs to the technical field of optical imaging, and further relates to image amplification imaging and acquisition technologies, and particularly provides a high-definition image acquisition device.

Background

The image acquisition and detection technology is widely applied to the industrial production and manufacturing process, and the product quality is detected by acquiring and imaging the detailed characteristics of the surface and/or the internal structure, texture and the like of the product. Because the size of the product to be detected and the size of the image features to be identified are different over multiple orders of magnitude, image acquisition and detection schemes with different detection accuracies/resolutions need to be determined for different products to be detected and detection scenes. Particularly, when micron-scale image features \ defects on the surface of a product need to be detected, special design needs to be carried out on imaging and collecting equipment. For example, image acquisition and detection of micron-sized burrs existing between a positive and negative electrode sheet and a diaphragm in the manufacturing process of a lithium battery belong to a typical image acquisition and detection scene needing to acquire micron-sized features of a product.

Fig. 1 shows a schematic diagram of a cell membrane structure of a conventional lithium battery, and as shown in fig. 1, the cell membrane includes a core material 800 made of copper or aluminum, and coating layers 801 and 802 coated on both sides thereof. Typically, the thickness of core 800 and coatings 801 and 802 is on the order of tens of um. In the manufacturing and cutting process of the battery film, various burrs 803 are often generated on the surfaces of the core material and the coating, fine flaws exist on the surfaces of the battery film due to the burrs 803, and the probability of danger such as leakage and explosion of the lithium battery is greatly increased. Therefore, detecting the presence of the burrs 803 during the production of the battery film is an essential process. The statistical analysis of the size of the burrs 803 by using equipment such as a microscope and the like can determine that the size of the burrs 803 is about 20um generally, and the burrs 803 can appear at each position of the battery film, so that the real-time detection of micron-scale image characteristics in a range equivalent to the whole battery film width is determined to be realized under the condition of not influencing the normal operation of a production line.

The micron-sized Image features are collected and detected by using a Contact Image Sensor (Contact Image Sensor), but when a conventional Contact Image Sensor is used, the problem that high-resolution Image collection cannot be accurately realized due to low imaging resolution exists; in addition, the imaging chip of the contact image sensor is sensitive to the intensity of received light, and is easily interfered by various factors in the process of acquiring and imaging, so that the definition of an imaged image is influenced.

Disclosure of Invention

The purpose of the application is to solve the problems existing in the prior art, and provide a device which can amplify, image and collect the image characteristics of the surface of a product to be treated, effectively filter various interferences and realize high-resolution and high-definition image collection through a low-resolution chip.

The embodiment of the application can be realized by the following technical scheme:

a high definition image capturing device for capturing an enlarged image of an image to be detected located within a detection area, comprising:

the image acquisition unit comprises two imaging modules which are fixedly arranged at intervals along the X-axis direction, and each imaging module comprises a diaphragm, a magnifying lens and an imaging module which are sequentially arranged along the optical axis of the imaging module and is used for magnifying and imaging the image to be detected in the detection area and acquiring the image in the imaging area;

the baffle is fixedly arranged between the two imaging modules in a light-tight manner;

the light filter plate is fixedly arranged between the image acquisition unit and the image to be detected, the surface of the light filter plate is vertical to a Z axis and is provided with a through light filtering slit, the light filtering slit is used for enabling light rays emitted from the image to be detected to enter the image acquisition unit through the light filtering slit, and the Z axis is vertical to the X axis; and

the first outer frame is used for fixedly accommodating the image acquisition unit, the baffle plate and the filter plate and blocking ambient light.

Preferably, the included angle between the optical axes of the two imaging modules ranges from 8 degrees to 12 degrees, and the bisector of the included angle is parallel to the Z axis.

Preferably, the magnifying lens is a meniscus lens, the light incident surface of the magnifying lens is a concave surface, and the light emergent surface of the magnifying lens is a convex surface; the radius of the light incident surface is less than or equal to 15mm, the radius of the light emergent surface is less than or equal to 8mm, and the distance between the intersection points of the light incident surface and the light emergent surface and the optical axis of the light incident surface is less than or equal to 3mm.

Preferably, the distance from the detection area of each imaging module to the imaging area of the imaging module is less than or equal to 90mm, and the image magnification factor is 1-6 times.

Preferably, the heights of the detection areas of the two imaging modules in the Z-axis direction are the same.

Further, the imaging module comprises an imaging substrate and an imaging chip arranged on the surface of one side, facing the optical axis, of the imaging substrate; the imaging chip comprises a plurality of photosensitive elements which are arranged at intervals along a Y axis and used for converting optical signals received in an imaging area into electric signals, and the Y axis is respectively vertical to the X axis and the Z axis.

Preferably, the distance between the filter plate and the image to be detected in the Z-axis direction is 10-12 mm; the light filtering slit extends along the Y-axis direction, and the slit width is 2.5-3.5 mm.

Preferably, each imaging module comprises a plurality of diaphragms, magnifying lenses and imaging modules which correspond to one another one to one, and the plurality of diaphragms, the magnifying lenses and the imaging modules are arranged at intervals along the Y axis.

Preferably, the high-definition image acquisition device further comprises a light source module for generating light rays pointing to the detection area; the light source module comprises a light source substrate, a linear light source, a light-diffusing film and a light source frame, wherein the linear light source is arranged on the surface of the light source substrate facing one side of the detection area, the light source substrate is fixedly arranged in the light source frame, and the light-diffusing film is fixedly arranged on the opening of the light source frame facing one side of the detection area.

Preferably, the high-definition image capturing apparatus further includes: the data conversion module is used for converting the electric signal output by the imaging module into a digital signal; and the data processing module is used for generating an amplified image of the image to be detected based on the digital signal.

According to the high-definition image acquisition device, the diaphragm, the magnifying lens and the imaging module are sequentially arranged in each imaging module along the optical axis, so that the requirement that the low-resolution imaging chip is used for scanning a high-resolution object plane in a short distance is met;

meanwhile, the lightproof baffle plate is arranged between the two imaging modules, so that the mutual influence among the light paths of the imaging modules is eliminated, and the problems of image blurring and the like caused by acquiring light rays transmitted along different light paths are avoided;

in addition, light rays entering each imaging module are filtered through the filter plate, the problems of image blurring and the like caused by the fact that the light rays entering the imaging module are reflected to a photosensitive chip of the imaging module by the side wall of the baffle are avoided, and imaging definition is further improved.

Drawings

FIG. 1 is a schematic diagram of a lithium battery membrane;

FIG. 2 is a side cross-sectional view of a high definition image capture device according to an embodiment of the present application;

FIG. 3a is a schematic perspective view of a magnifying lens according to an embodiment of the present application;

FIG. 3b is a side cross-sectional view of the magnifying lens of FIG. 3 a;

FIG. 3c is a top view of the magnifying lens of FIG. 3 a;

FIG. 4 is a schematic structural diagram of a first imaging module according to an embodiment of the present application;

FIG. 5 is an enlarged image of an image to be detected collected without filtering ambient light;

FIG. 6 is a top view of a filter plate according to an embodiment of the present application;

FIG. 7 is an optical diagram of a high definition image capturing device for filtering stray light according to an embodiment of the present disclosure;

fig. 8 is an enlarged image of an image to be detected acquired by using the high-definition image acquisition device provided by the embodiment of the application.

Reference numerals in the figures

11: first magnifying lens, 12: first imaging module, 121: first imaging chip, 1210: first photosensitive element, 122: first imaging substrate, 13: first diaphragm, 14: first optical axis, 15: incident light, 15': reflected ray, 16 reflection point, 21: second magnifying lens, 22: second imaging module, 221: second imaging chip, 222: second imaging substrate, 23: second diaphragm, 24: second optical axis, 25: incident light, 25': reflected light, 26: reflection point, 30: filter, 31: filter slit, 41: first outer frame, 42: second outer frame, 43: heat dissipation plate, 44: baffle, 51: data conversion substrate, 52: data processing substrate, 61: first socket, 62: data processing chip, 63: serial circuit, 64: second socket, 7: light source module, 71: light source substrate, 72: linear light source, 73: light source frame, 74: light-diffusing film, 8: an image to be detected, 800: core material, 801: coating, 802: coating, 803: burrs are formed.

Detailed Description

Hereinafter, the present application will be further described based on preferred embodiments with reference to the accompanying drawings.

In addition, various components on the drawings are enlarged or reduced for convenience of understanding, but this is not intended to limit the scope of the present application.

Singular references also include plural references and vice versa.

In the description of the embodiments of the present application, it should be noted that, if the terms "upper", "lower", "inner", "outer", etc. are used to indicate an orientation or a positional relationship based on an orientation or a positional relationship shown in the drawings, or an orientation or a positional relationship which is usually placed when a product of the embodiments of the present application is used, it is only for convenience of description and simplification of the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the present application cannot be construed as being limited. Moreover, the terms first, second, etc. may be used in the description to distinguish between different elements, but these should not be limited by the order of manufacture or by importance to be understood as indicating or implying any particular importance, and their names may differ from their names in the detailed description of the application and the claims.

The terminology used in the description presented herein is for the purpose of describing embodiments of the application and is not intended to be limiting of the application. It should also be noted that unless otherwise explicitly stated or limited, the terms "disposed," "connected," and "connected" should be interpreted broadly, as if they were fixed or removable, or integrally connected; they may be mechanically coupled, directly coupled, indirectly coupled through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present application will be specifically understood by those skilled in the art.

The present application provides, by way of example, a high definition image capturing device for capturing an enlarged image of an image to be detected located within a detection area, fig. 2 shows a side cross-sectional view of the high definition image capturing device in some preferred embodiments, as shown in fig. 2, the high definition image capturing device comprising an image capturing unit, a shutter 44, a filter 30, and a first outer frame 41.

The first frame 41 is used for fixedly accommodating the image capturing unit, the barrier 44 and the filter 30. In some embodiments, the first outer frame 41 may be made of a metal aluminum material to further increase the structural stability. Can be fixed in the inside of first frame 41 according to respective light path parameter through modes such as bonding, grafting with each formation of image module in the image acquisition unit, the inner wall of first frame 41 adopts black oxidation coating to coat simultaneously, can effectually avoid stray ambient light to get into the influence of image acquisition unit to the image acquisition effect.

The following describes in detail embodiments of the image capturing unit, the shutter 44 and the filter plate 30 with reference to the accompanying drawings and preferred embodiments.

The image acquisition unit includes two imaging module that fix the setting along X axle direction interval ground, and every imaging module includes the diaphragm, magnifying lens and the imaging module who arranges in proper order along the optical axis of this imaging module for detect in the detection area wait that the image 8 enlargies the formation of image and gather in the imaging area. In some embodiments, as shown in fig. 2, the two imaging modules are represented by a first imaging module and a second imaging module, wherein the first imaging module includes a first diaphragm 13, a first magnifying lens 11 and a first imaging module 12 arranged in sequence along a first optical axis 14; the second imaging module includes a second diaphragm 23, a second magnifying lens 21, and a second imaging module 22 arranged in this order along a second optical axis 24.

Further, in some preferred embodiments, the first imaging module and the second imaging module may be completely the same, that is, the aperture, the magnifying lens and the imaging module with the same performance parameters may be selected, and the same optical path layout manner is adopted.

According to the enlarged imaging principle of the lens, the first magnifying lens 11 and the second magnifying lens 21 can magnify the object in the object plane to image in the image plane, in the embodiment of the application, the object plane of the magnifying lens corresponds to the detection area of the imaging module where the object plane is located, the image plane corresponds to the imaging area of the imaging module where the image plane is located, and further, the image 8 to be detected is placed in the detection area of the image 8 to be detected, and the imaging module is placed in the imaging area of the imaging module, so that the magnified image of the image 8 to be detected can be acquired by the imaging module. The optical imaging principle and the optical path layout of the magnifying lens are well known to those skilled in the art and will not be described herein.

Further, in some preferred embodiments, as shown in fig. 2, the first optical axis 14 and the second optical axis 24 form an angle θ ranging from 8 ° to 12 °, and a bisector of the angle θ is parallel to the Z-axis, wherein the Z-axis is perpendicular to the X-axis.

Further, in some preferred embodiments, the heights of the detection areas of the two imaging modules in the Z-axis direction are the same.

Fig. 3a to 3c show a perspective view, a side sectional view and a top view, respectively, of a first magnifying lens 11 comprised by the first imaging module in some preferred embodiments. As described above, fig. 3a to 3c can also be used for the description of the second magnifier lens 21.

As shown in fig. 3a, the first magnifying lens 11 is preferably made of a meniscus lens, wherein the side facing the object plane is a light incident plane 11A, which is a concave surface and plays a certain role in converging light; the light-emitting surface 11B facing the image surface is convex and has a certain light-dispersing effect.

Those skilled in the art know that the object distance, the image distance and the magnification of the lens can be determined by designing the radii of the light incident surface and the light emergent surface and the distance between the light incident surface and the light emergent surface. In some preferred embodiments, as shown in FIG. 3B, the radius R11A of the light incident surface 11A is less than or equal to 15mm, the radius R11B of the light emitting surface 11B is less than or equal to 8mm, and the distance H11 of the intersection point of the light incident surface 11A, the light emitting surface 11B and the first optical axis 14 is less than or equal to 3mm. By setting the preferable structural parameters, the image 8 to be detected can be amplified by 1-6 times under the condition that the distance between the detection area and the imaging area is less than or equal to 90mm, so that the amplified acquisition of the image to be detected is realized on the basis of meeting the requirement of equipment miniaturization.

In some preferred embodiments, the first magnifying lens 11 is made of glass or other material with good optical performance and high processability. Furthermore, the lens adopts the processes of coating and the like, so that the reflected light on the surface of the lens can be reduced, and the light transmittance can be increased. In addition, in order to facilitate the mounting of the lens and the miniaturization of the apparatus, the lens may be cut into a long shape with the optical axis of the lens as a center, and preferably, the cut first magnifier lens 11 has a length in the Y direction of 9-11mm and a width in the X direction of 2-6mm, as shown in fig. 3a and 3 c.

In some preferred embodiments, as shown in fig. 2, a first stop 13 is located between the detection area and the first magnifier lens 11, and a second stop 23 is located between the detection area and the second magnifier lens 21. The diaphragm can be used for shielding light rays deviating from the optical axis in the light beam, and the definition, the correctness, the brightness, the depth of field and the like of imaging are directly influenced.

Preferably, the first aperture 13 and the second aperture 23 are circular holes with an aperture of 1.4mm to 1.6mm, and can be formed by drilling holes in the middle of the light-shielding paper, or can be directly machined at the intersection point positions of the first frame 41 and the first optical axis 14 and the second optical axis 24 by drilling holes.

Preferably, the working distance from each diaphragm to the corresponding detection area is less than or equal to 25mm, so that the effect of short-distance scanning imaging can be realized, the miniaturization of equipment is facilitated, and the problem of equipment installation space is solved.

Fig. 4 shows a schematic view of the first imaging module 12 in some preferred embodiments.

As shown in fig. 2 and 4, in the embodiment of the present application, the first imaging module 12 includes a first imaging substrate 122 and a first imaging chip 121 disposed on a surface of the first imaging substrate 122 facing the first optical axis 14; further, the first imaging chip 121 includes a plurality of first photosensitive elements 1210 arranged at intervals along a Y-axis, wherein the Y-axis is perpendicular to the X-axis and the Z-axis, respectively (in an actual image scanning process, generally, the Y-axis direction is referred to as a scanning direction, and the X-axis direction is referred to as a scanning sub-direction).

In the present embodiment, the first imaging module 12 is disposed in the imaging area, and the optical signals received in the imaging area are converted into electrical signals by the plurality of first photosensitive elements 1210. Obviously, each first photosensitive element 1210 corresponds to one pixel after imaging, and the number of the first photosensitive elements 1210 included in the unit length is the resolution (in units of DPI) of the first imaging module 12.

In some preferred embodiments, the first imaging module 12 and the second imaging module 22 may be an existing Contact Image Sensor (CIS), for example, a CIS sensor with a resolution of 1200DPI, and the pixel size is 25.4mm/1200 ≈ 21um, that is, the minimum imaging size of the imaging plane is 21um. As described above, when the magnification of the first magnifying lens 11 is 1.67 times, the CIS sensor can be used to acquire the image 8 to be detected in the detection region with the minimum recognition size of 21um/1.67 ≈ 12.7um, and the corresponding resolution is 2000 DPI.

As shown in fig. 2, in the embodiment of the present application, the second imaging module 22 includes a second imaging substrate 222 and a second imaging chip 221 disposed on a surface of the second imaging substrate 222 facing the second optical axis 24. Similarly, in some embodiments of the present application, the second imaging module 22 may be a contact image sensor with the same specification parameters as the first imaging module 12, and the detailed description thereof is omitted here.

Because the first imaging module and the second imaging module are closer in the X-axis direction, the imaging light paths of the first imaging module and the second imaging module may influence each other. The reason is mainly that when light enters the magnifying lens on one side, although the light can irradiate the imaging modules on which the light is positioned under normal conditions, because the light-emitting surface of the magnifying lens is of a convex structure, the light can be emitted in a divergent mode at a certain angle, and meanwhile, the distance between the imaging modules on the two sides is small, the light on one side can enter the imaging module on the other side, so that the same imaging chip can possibly receive the light transmitted from different magnifying lenses, and the problems of imaging blurring and the like are further caused.

For this, as shown in fig. 2, the high definition image pickup device further includes a barrier 44. In some preferred embodiments, the baffle 44 is located between the first and second imaging modules, preferably made of black PC material or other opaque material that absorbs light more easily, and has a surface parallel to the Z-axis and extending along the Y-axis, and is fixedly connected to the first frame 41 by plugging, bonding, etc. to separate the magnifying lens and the imaging module on both sides. The light paths of the first imaging module and the second imaging module are mutually separated through the baffle 44, mutual interference between the light paths of different imaging modules can be remarkably reduced, and the definition of collected images is effectively improved.

However, even if the blocking plate 44 is made of black PC material or other opaque material that absorbs light more easily, some of the light far from the optical axis will be reflected by the blocking plate 44 onto the imaging chip, forming stray light, creating noise on the image, causing the image signal-to-noise ratio to decrease, thereby causing image blurring. For example, fig. 5 shows that the enlarged images of the image to be detected 8 collected by the two imaging modules after the baffle 44 is arranged, and the left and right parts of the enlarged images obviously have unclear parts.

In order to further eliminate the influence of the stray light reflected by the baffle 44, as shown in fig. 2, the high-definition image capturing device further comprises a filter 30, the filter 30 is fixedly disposed between the image capturing unit and the image 8 to be detected, and the surface of the filter 30 is perpendicular to the Z axis and has a penetrating filtering slit 31 for allowing the light emitted from the image 8 to be detected to enter the image capturing unit through the filtering slit 31. Specifically, the filter plate 30 may be manufactured separately and fixedly disposed at an opening of the first outer frame 41 facing the image 8 to be detected by means of inserting, bonding, and the like; in addition, the filter plate 30 may be integrally formed with the first frame 41.

In some preferred embodiments, the filter plate 30 is spaced from the image 8 to be detected by 10 to 12mm in the Z-axis direction. FIG. 6 further shows a top view of the filter plate 30. As shown in FIG. 6, the filter slits 31 have a rectangular shape with long sides extending in the Y-axis direction, a length of 48 to 52mm, and a slit width in the X-axis direction of 2.5 to 3.5mm.

Fig. 7 shows an optical path diagram of the high-definition image capturing device for filtering stray light after the filter plate 30 is disposed, as shown in fig. 7, an incident light 15 enters the first imaging module from the rightmost side of Δ L in the detected image through the rightmost side of the filtering slit 31, and is reflected by the baffle 44 at the reflection point 16, and the reflected light 15' can only irradiate beyond the left edge of the first imaging chip 121, so that the image capturing of the first imaging chip 121 cannot be affected. Further, even if the light emitted from the right half of Δ L in fig. 7 and having a smaller incident angle than the incident light 15 passes through the filtering slit 31 and is reflected by the baffle 44, the reflected light falls outside the left edge of the first imaging chip 121, and further cannot affect the image acquisition of the first imaging chip 121 in cooperation with the shielding of the first diaphragm 13; the light emitted from the right side of the right half Δ L in fig. 7 cannot pass through the filtering slit 31 and is reflected by the baffle 44, and therefore, the image capture of the first imaging chip 121 cannot be affected. Therefore, with this filter plate 30, the phenomenon of reflected light due to the provision of the baffle 44 and the resulting image blur can be significantly reduced.

Similarly, in fig. 7, the incident light ray 25 enters the second imaging module from the leftmost side of Δ L through the leftmost side of the filter slit 31 and is reflected by the baffle 44 at the reflection point 26, and the reflected light ray 25' can only irradiate to the outside of the right edge of the second imaging chip 221, so that the image acquisition of the second imaging chip 221 cannot be affected. The light path analysis of the remaining left half of Δ L is the same as that of the right half of Δ L, and is not described herein again.

Fig. 8 shows a magnified image of the image to be inspected 8 acquired by the image acquisition device after the filter plate 30 is disposed. As can be seen from fig. 8, the sharpness of the magnified image acquired after the filter plate 30 is attached is significantly improved compared to that acquired without the filter plate.

Note that the first imaging module and the second imaging module for capturing the enlarged images shown in fig. 5 and 8 are arranged in a staggered manner in the Y-axis direction. Further, in some preferred embodiments, each imaging module includes a plurality of diaphragms, magnifying lenses, and imaging modules in a one-to-one correspondence, and the plurality of diaphragms, magnifying lenses, and imaging modules are arranged at intervals along the Y axis. By using the plurality of first imaging modules 12 and the plurality of second imaging modules 22 and the staggered and spaced arrangement of the first imaging modules 12 and the second imaging modules 22, the imaging width along the scanning direction (Y-axis direction) can be effectively expanded, and full-coverage enlarged imaging and acquisition of the detection image can be realized.

In some embodiments of the present application, preferably, as shown in fig. 2, the high-definition image capturing device further includes a light source module 7, which emits light toward the detection area to increase the light emitted from the surface of the object in the detection area, so as to facilitate subsequent magnified imaging and capturing. Specifically, the light source module 7 is a linear light source 72, and includes a light source substrate 71 fixedly disposed in a light source frame 73, and a linear light source 72 mounted on a surface of the light source substrate 71 facing the detection area side, and an effective light emitting area thereof extends in the Y-axis direction and covers the entire width to be detected.

Preferably, as shown in fig. 2, the light source substrate 71 is made of an aluminum substrate material, and a light diffusion film 74 is further disposed at an opening of the light source frame 73 facing the detection area for increasing a heat dissipation effect and for providing a light uniformizing effect. In order to further increase the illumination effect, the number of the light source modules 7 may also be two or more, and a two-side light source illumination mode is adopted.

In some embodiments of the present application, it is preferable that the high-definition image capturing apparatus further includes a data conversion module to convert the electrical signals captured by the imaging chips in the respective imaging modules into digital signals. Specifically, as shown in fig. 3, the data conversion module includes a data conversion substrate 51, and a circuit (not shown in the figure) for data transmission and conversion mounted thereon. The data transmission between the data conversion substrate 51 and each imaging chip is realized through corresponding signal interfaces, that is, the pads of the data conversion substrate 51 and the back pads of the imaging chips are soldered together through processes such as pin insertion or reflow soldering, so as to realize the data transmission.

In this embodiment, it is preferable that the high-definition image capturing device further includes a data processing module, and specifically, as shown in fig. 3, the data processing module includes a data processing substrate 52 on which a data processing chip 62 and a serial port circuit 63 are mounted. The data processing chip 62 has an image preprocessing function, processes the digital signals received from the data conversion module to synthesize an amplified image of the image 8 to be detected, and sends the amplified image to an external display module PC (not shown in the figure) through a serial circuit 63, so as to complete the display of the whole image. Those skilled in the art can select a suitable data chip and serial circuit 63 according to specific needs, for example, select an FPGA chip and a CAMRALINK serial circuit substrate, or select other optional data chips and serial circuits.

In addition, the data processing chip 62 also controls the period of the time sequence through the setting of the internal register, so as to control the light source module 7, thereby achieving the purpose of synchronizing the light emitting frequency of the light source module 7 and the scanning frame rate of each imaging module in the scanning period.

Preferably, as shown in fig. 3, the high-definition image capturing device further includes a second outer frame 42, the data conversion module is fixedly accommodated inside the first outer frame 41, the data processing module is fixedly accommodated inside the second outer frame 42, and the second outer frame 42 and the first outer frame 41 are fixedly connected by plugging, bonding, integral molding or any other suitable method. The digital signal output by the data conversion module is connected with the second socket 64 of the data processing module through the first socket 61 to realize the conversion and transmission of the signal.

Preferably, the second frame 42 is further provided with a heat dissipation plate 43 on the side facing away from the first frame 41, and the heat dissipation plate 43 is preferably made of a material such as metal with excellent heat dissipation performance so as to dissipate heat generated during operation of the data processing chip 62.

While the present invention has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope thereof as defined in the appended claims.

Claims (10)

1. The utility model provides a high definition image acquisition device for gather the enlarged image that is located waiting to detect the image in the detection area, its characterized in that includes:

the image acquisition unit comprises two imaging modules which are fixedly arranged at intervals along the X-axis direction, and each imaging module comprises a diaphragm, a magnifying lens and an imaging module which are sequentially arranged along the optical axis of the imaging module and is used for magnifying and imaging the image to be detected in the detection area and acquiring the image in the imaging area;

the baffle is fixedly arranged between the two imaging modules in a light-tight manner;

the light filter plate is fixedly arranged between the image acquisition unit and the image to be detected, the surface of the light filter plate is vertical to a Z axis and is provided with a through light filtering slit, the light filtering slit is used for enabling light rays emitted from the image to be detected to enter the image acquisition unit through the light filtering slit, and the Z axis is vertical to the X axis; and

the first outer frame is used for fixedly accommodating the image acquisition unit, the baffle and the filter plate and blocking ambient light.

2. The high definition image capturing device as set forth in claim 1, wherein:

the included angle range between the optical axes of the two imaging modules is 8-12 degrees, and the bisector of the included angle is parallel to the Z axis.

3. A high definition image capturing apparatus as defined in claim 1, wherein:

the magnifying lens is a meniscus lens, the light incident surface of the magnifying lens is a concave surface, and the light emergent surface of the magnifying lens is a convex surface;

the radius of the light incident surface is less than or equal to 15mm, the radius of the light emergent surface is less than or equal to 8mm, and the distance between the intersection points of the light incident surface and the light emergent surface and the optical axis of the light incident surface is less than or equal to 3mm.

4. The high definition image capturing device as set forth in claim 1, wherein:

the distance from the detection area of each imaging module to the imaging area of the imaging module is less than or equal to 90mm, and the image magnification is 1-6 times.

5. The high definition image capturing device as set forth in claim 1, wherein:

the height of the detection areas of the two imaging modules in the Z-axis direction is the same.

6. The high definition image capturing device as set forth in claim 1, wherein:

the imaging module comprises an imaging substrate and an imaging chip arranged on the surface of one side, facing the optical axis, of the imaging substrate;

the imaging chip comprises a plurality of photosensitive elements which are arranged at intervals along a Y axis and used for converting optical signals received in an imaging area into electric signals, wherein the Y axis is respectively vertical to the X axis and the Z axis.

7. The high definition image capturing device as set forth in claim 6, wherein:

the distance between the filter plate and the image to be detected in the Z-axis direction is 10-12 mm;

the light filtering slit extends along the Y-axis direction, and the slit width is 2.5-3.5 mm.

8. The high definition image capturing device as defined in claim 6, wherein:

each imaging module comprises a plurality of diaphragms, magnifying lenses and imaging modules which correspond to one another one by one, and the diaphragms, the magnifying lenses and the imaging modules are arranged at intervals along the Y axis.

9. The high definition image capturing apparatus as defined in claim 1, further comprising:

the light source module is used for generating light rays pointing to the detection area;

the light source module comprises a light source substrate, a linear light source, a light-diffusing film and a light source frame, wherein the linear light source is arranged on the surface of the light source substrate facing one side of the detection area, the light source substrate is fixedly arranged in the light source frame, and the light-diffusing film is fixedly arranged on the opening of the light source frame facing one side of the detection area.

10. The high definition image capturing device as set forth in claim 1, further comprising:

the data conversion module is used for converting the electric signal output by the imaging module into a digital signal;

and the data processing module is used for generating an amplified image of the image to be detected based on the digital signal.

Images