CN218385261U

CN218385261U - Light source module

Info

Publication number: CN218385261U
Application number: CN202221567098.5U
Authority: CN
Inventors: 朱增龙; 高丰
Original assignee: Suzhou Op Lighting Co Ltd
Current assignee: Suzhou Op Lighting Co Ltd
Priority date: 2022-06-22
Filing date: 2022-06-22
Publication date: 2023-01-24
Anticipated expiration: 2032-06-22

Abstract

The application provides a light source module. The light source module includes: the substrate is provided with an upper surface and a lower surface opposite to the upper surface, the substrate is provided with a plurality of light-emitting units, and the surface where the light-emitting units are located is the upper surface of the substrate; the optical module comprises lens units which are in one-to-one correspondence with the light-emitting units, a covering part which covers the upper surface of the substrate, and a connecting part which is used for fixedly connecting the optical module and the substrate, wherein the lens units, the covering part and the connecting part are integrally formed into a whole by the same material. The light source module is formed by silica gel injection molding, the process is simple, and manual assembly is not needed. All light sources are filled and covered by silica gel and isolated from air, so that the light efficiency, the heat dissipation and the weather resistance can be improved. The light source plate back surface hole chamfer forms the back-off with the silica gel packing and increases the reliability, connects reliably.

Description

Light source module

Technical Field

The utility model relates to a light source module for illumination.

Background

In the field of lighting, LED light sources have gradually replaced traditional light sources as an energy-saving light source. At present, the application of LED light sources is very wide, and the market requirements on LED light source modules in the aspects of lighting effect, heat dissipation, weather resistance and the like are continuously improved. Since the light emitting angle of the LED chip is small, when the LED chip is used as a light source, light distribution is generally performed by an optical element such as a lens, and therefore, when the light source is mounted, it is generally necessary to mount the light source first and then mount the light distribution element, which is cumbersome. Moreover, whether the LED chip can be accurately aligned with the focus of the light distribution element significantly affects the light emitting efficiency and the light emitting effect, and the LED chip and the light distribution element are mounted step by step to form a deviation. In order to solve the above problems, a light source module product in which an optical element and a light source plate are integrally assembled has been developed in the market, and such a product facilitates the overall replacement of a light source. However, most of the current light source modules are assembled with lens elements on a light source board, special connection structures are required to be arranged, the light source modules are assembled manually, and gaps exist between the lenses and the LED chips after the assembly is completed, so that the light source modules are not beneficial to heat dissipation and dust prevention.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the above problems, finding a light source module for improving light efficiency, heat dissipation and weather resistance and manufacturing the light source module.

The utility model discloses a realize above-mentioned function, the technical scheme who adopts provides a light source module, a serial communication port, include:

the substrate is provided with a plurality of light-emitting units, and the surface of each light-emitting unit is the upper surface of the substrate;

an optical module including lens units corresponding to the light emitting units one by one, a covering part covering the upper surface of the substrate, and a connecting part for fixedly connecting the optical module and the substrate,

the lens unit, the covering part and the connecting part are integrally formed into a whole by the same material.

Furthermore, the substrate is provided with a connecting through hole, and the connecting part is completely filled in the connecting through hole.

Further, the connecting through hole has a smaller aperture at the upper surface of the substrate than at the lower surface of the substrate.

Furthermore, the connecting through hole comprises a straight pipe section and a chamfer section which are communicated with each other, the straight pipe section is connected with the upper surface of the substrate and is of a columnar structure, the chamfer section is connected with the lower surface of the substrate, and the aperture of the chamfer section is increased and reduced along the distance from the chamfer section to the lower surface of the substrate.

Furthermore, the light emitting unit is an LED chip, and the optical module is made of silica gel.

Furthermore, an electric connecting terminal is further arranged on the substrate, and a corresponding notch is formed in the position of the electric connecting terminal of the covering part.

Further, the light source module further comprises a mounting hole, and the mounting hole penetrates through the optical module and the substrate.

The utility model provides a light source module passes through silica gel injection moulding, and simple process need not artifical equipment. All light sources are filled and covered by silica gel and isolated from air, so that the light efficiency, the heat dissipation and the weather resistance can be improved. The light source plate back surface hole chamfer forms the back-off with the silica gel packing and increases the reliability, connects reliably.

Drawings

Fig. 1 is an exploded schematic view of a light source module according to a preferred embodiment of the present invention;

fig. 2 is a front view of a light source module according to a preferred embodiment of the present invention;

FIG. 3 isbase:Sub>A sectional view taken along line A-A of FIG. 2;

FIG. 4 is a partial cross-sectional view of the substrate of the embodiment of FIG. 1;

FIG. 5 is an exploded view of a light source module and a mold according to a preferred embodiment of the present invention;

FIG. 6 is a cross-sectional view of a light source module disposed in a mold according to a preferred embodiment of the present invention;

fig. 7 is a schematic flow chart illustrating a method for manufacturing a light source module according to a preferred embodiment of the present invention;

fig. 8 is a schematic structural diagram illustrating a connection of a plurality of light source modules according to a preferred embodiment of the present invention.

Detailed Description

The light source module provided by the present application is further described in detail with reference to the accompanying drawings and the specific embodiments.

The light source module according to a preferred embodiment of the present application is shown in fig. 2 in a front view and fig. 3 in a cross-sectional view, and includes a substrate 1 and an optical module 2. In order to illustrate the details of the structure of the optical module 2, the present application further provides an exploded structure schematic diagram of the light source module in the embodiment, as shown in fig. 1, wherein a plurality of light emitting units 101 are disposed on the substrate 1, in this application, the surface of the substrate 1 on which the light emitting units 101 are disposed is referred to as an upper surface, and a surface first opposite to the upper surface is referred to as a lower surface. The light emitting unit 101 is an LED Chip, and the LED Chip (LED Chip) includes a positive mounting or a reverse mounting, and a single LED Chip or a plurality of LED chips are connected together in series, in parallel, or in series-parallel.

The optical module 2 includes lens units 201 corresponding to the light emitting units 101 one by one, a covering portion 202 covering the upper surface of the substrate 1, and a connecting portion 203 for fixedly connecting the optical module 2 and the substrate 1. The lens unit 201, the covering part 202 and the connecting part 203 are integrally formed by injection molding of a silicone material.

The substrate 1 is provided with a connecting through hole 103, as shown in fig. 4, the connecting portion 203 is formed in the connecting through hole 103 during the injection molding process, and the connecting through hole 103 is completely filled after the molding process, as shown in fig. 3. The connection through hole 103 includes a straight tube section 1031 and a chamfered section 1032 which penetrate each other, the straight tube section 1031 connects the upper surface 106 of the substrate 1 and has a columnar structure, the chamfered section 1032 connects the lower surface 107 of the substrate 1, and the chamfered section 1032 has a frustum shape whose hole diameter is reduced along with an increase in distance from the lower surface 107 of the substrate 1. Thus, the connecting portion 203 is formed in the connecting through hole 103 to form an inverted buckle, so that the optical module 2 is prevented from being separated from the substrate 1, and the fixed connection between the two is realized.

In other preferred embodiments, the connecting through hole 103 may have no straight pipe section, and may be a frustum structure. An outward notch can also be formed in the straight tube section near the lower surface 107 of the base plate 1, and a protrusion is formed after the connecting portion 203 is formed to realize the buckling function. Overall, the diameter of the connecting through-hole 103 at the upper surface 106 of the substrate 1 is smaller than its diameter at the lower surface 107 of the substrate 1 to achieve such a snap-fit effect.

The manufacturing method of the light source module as shown in fig. 7 includes the following steps:

s1: substrate preparation, including disposing conductive traces on the substrate 1 according to design and fixing the light emitting cells 101. In this embodiment, the substrate 1 is a PCB, and the light emitting unit 101 is an LED chip fixed on the PCB by soldering. Meanwhile, when the substrate is prepared, a connection through hole 103 needs to be formed in the substrate 1, the connection through hole 103 comprises a straight pipe section 1031 and a chamfered section 1032 which are mutually communicated, the straight pipe section 1031 is connected with the upper surface 106 of the substrate 1 and is in a columnar structure, the chamfered section 1032 is connected with the lower surface 107 of the substrate 1, and the hole diameter of the chamfered section 1032 is reduced along the distance from the lower surface 107 of the substrate 1. During machining, a hole is punched, and then a chamfer is machined from the lower surface 107 of the substrate 1 at the end of the hole.

S2: and placing the mold, as shown in fig. 5, placing the substrate 1 processed in the step S1 into the fixed mold 5 through limiting, fastening the movable mold 6 to the upper surface 106 of the substrate 1, and after mold closing, as shown in fig. 6, forming an injection molding cavity 4 between the movable mold 6 and the upper surface 106 of the substrate 1.

S3: and (3) performing insert molding, namely injecting an insert material into the injection molding cavity 4, and forming the optical module 2 after the insert material is solidified. The insert injection material forms lens units 201 corresponding to the light emitting units one by one according to the shape of a mould in the injection cavity, meanwhile, a covering part 202 covering the upper surface 106 of the substrate 1 is formed at the position without the lens units 201, part of the insert injection material flows into the connecting through holes 103 on the substrate 1 to form a connecting part 203, and the optical module 2 and the substrate 1 are connected into an integrated embodiment light source module. In this embodiment, the embedding material is a silicon gel.

Through the method, the substrate 1 is embedded into the optical module 2, the optical module 2 and the substrate 1 are bonded into a whole, the light source is filled and covered by silica gel and isolated from air, and the silica gel lens is formed by the silica gel, so that the light efficiency, the heat dissipation and the weather resistance are improved.

In other preferred embodiments, the substrate 1 may not be provided with the through hole, but a notch is formed on the side portion of the substrate, and the connection portion 203 is formed by filling the notch with the embedding material, or the connection portion 203 is formed by only partially covering the lower surface 107 of the substrate 1 with the embedding material without performing other arrangements on the substrate 1. This is not a limitation of the present application.

In order to mount the light source module in the lamp, the light source module of the embodiment further includes a mounting hole 3, the mounting hole 3 penetrates through the optical module 2 and the substrate 1, and the connector penetrates through the mounting hole 3 to fix the light source module in the lamp. The forming process of the mounting hole comprises the steps of firstly punching the substrate 1, correspondingly arranging

ejector pins

602 and 501 on the movable mold 6 and the fixed mold 5, enabling the

ejector pins

602 and 501 to be mutually abutted and penetrate through the mounting hole 3 in the substrate 1 after mold closing, and forming a through hole at the ejector pin position after the optical module 2 is formed.

The light source module of the embodiment further includes an electrical connection terminal 102, wherein the electrical connection terminal 102 is electrically connected to the light emitting unit 101, and is disposed on the substrate 1 and is higher than the upper surface 106 of the substrate 1 by a certain distance, and when the optical module 2 is molded, the covering portion 202 forms a corresponding notch 204 at the position of the electrical connection terminal 102 to avoid the electrical connection terminal 102. The light source modules can be used alone, or a plurality of light source modules can be used in combination through the point connection terminal 102, as shown in fig. 8.

The foregoing description of the preferred embodiments of the present application has been presented for purposes of illustration and description and is not intended to be exhaustive or to limit the application to the precise forms disclosed, and it will be apparent that numerous modifications and variations, which may be apparent to those skilled in the art, are possible and are included within the scope of the invention as defined by the appended claims.

Claims

1. A light source module, comprising:

the substrate is provided with an upper surface and a lower surface opposite to the upper surface, the substrate is provided with a plurality of light-emitting units, and the surface where the light-emitting units are located is the upper surface of the substrate;

2. The light source module of claim 1, wherein the substrate has a connecting through hole, and the connecting portion completely fills the connecting through hole.

3. The light source module as claimed in claim 2, wherein the connecting through hole has a smaller aperture on the upper surface of the substrate than on the lower surface of the substrate.

4. The light source module as claimed in claim 3, wherein the connecting through hole comprises a straight tube section and a chamfered section, the straight tube section and the chamfered section are connected to each other, the straight tube section is connected to the upper surface of the substrate and has a cylindrical structure, the chamfered section is connected to the lower surface of the substrate, and the diameter of the chamfered section is reduced along with the increase of the distance from the lower surface of the substrate.

5. The light source module according to any one of claims 1-4, wherein the light emitting unit is an LED chip, and the optical module is made of silicone.

6. The light source module according to any one of claims 1-4, wherein the substrate is further provided with electrical connection terminals, and the covering portion has corresponding notches at the positions of the electrical connection terminals.

7. The light source module according to any of claims 1-4, wherein the light source module further comprises a mounting hole, and the mounting hole penetrates through the optical module and the substrate.