CN218385128U - Mould pressing device for diode processing - Google Patents
Mould pressing device for diode processing Download PDFInfo
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- CN218385128U CN218385128U CN202221994602.XU CN202221994602U CN218385128U CN 218385128 U CN218385128 U CN 218385128U CN 202221994602 U CN202221994602 U CN 202221994602U CN 218385128 U CN218385128 U CN 218385128U
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Abstract
The utility model provides a mould pressing device of diode processing, including the mould pressing frame, the mould pressing shelf location has annular electronic slide rail, slidable mounting has equidistant arrangement between a plurality of sliders and a plurality of sliders on the electronic slide rail of annular, install the lower mould on the slider, the mould pressing shelf location has a door type frame, install the hydraulic stem on the door type frame, install the mould on the output shaft of hydraulic stem. The utility model provides a mould pressing device of diode processing, through the mould pressing frame that sets up, electronic slide rail of annular, lower mould, go up mould, hydraulic stem, door type frame, injecting glue pipe, reservation material intercepting mechanism, when carrying out mould pressing to the diode with man-hour, can conveniently pour into more glue into, less glue appears in the reduction processing and influences processingquality, can glue that the feed inlet is stained with glutinous and influence the drawing of patterns of diode and carry with gluing of diode die cavity simultaneously, ensure the efficiency of processing.
Description
Technical Field
The utility model relates to a diode processing technology field especially relates to a mould pressing device of diode processing.
Background
A diode is an electronic device made of semiconductor material (silicon, selenium, germanium, etc.). It has one-way conducting performance, that is, when positive voltage is applied to the anode of the diode, the diode is conducted. The diode generally comprises a PN junction in the middle and electrode leads at two ends, the current diode mould pressing processing generally finishes the processing of one diode and can process the next diode after taking out the diode, and in the glue injection process, a reserved cavity is not arranged in a mould cavity, so that the local part can not be filled with glue, and the mould pressing quality is influenced.
SUMMERY OF THE UTILITY MODEL
Based on the technical problem who exists among the background art, the utility model provides a mould pressing device of diode processing.
The utility model provides a pair of mould pressing device of diode processing, including the mould pressing frame, the mould pressing shelf location has annular electronic slide rail, slidable mounting has equidistant arrangement between a plurality of sliders and a plurality of sliders on the electronic slide rail of annular, install the lower mould on the slider, the mould pressing shelf location has a door type frame, install the hydraulic stem on the door type frame, install the mould on the output shaft of hydraulic stem, the diode die cavity has been seted up between lower mould and the last mould, go up the mould and install the injecting glue pipe with diode die cavity intercommunication, be located go up the diode die cavity intracavity on the mould and install and reserve material and cut off the mechanism.
Preferably, the reserved material cutting mechanism comprises a cutting slide block, a driving extrusion block and an electric push rod; the utility model discloses a driving extrusion piece, including diode die cavity, drive extrusion piece, runner, stopper, slide block, storage chute, diode die cavity, drive extrusion piece, the inner wall of diode die cavity seted up with cut slider sliding fit's regulation spout and with drive extrusion piece sliding fit's the silo that stays, the discharge gate and the regulation spout intercommunication of injecting glue pipe, but cut the slider shutoff injecting glue pipe the discharge gate, stay silo and diode die cavity, adjust the spout intercommunication, it can slide in staying the silo to cut the slider, it sets up to the inclined plane with drive extrusion piece sliding fit to cut one side that the slider is close to and stays the silo, the width that stays the silo is the same with the width that cuts the slider, electric putter installs in staying the silo, and drives the extrusion piece and install on electric putter's output shaft.
Preferably, two preformed grooves communicated with the diode die cavity are formed in the lower die and the upper die, and the two preformed grooves are respectively located at two ends of the PN junction die cavity in the diode die cavity.
Preferably, still install two support frames on the moulding-die frame, and two support frames are located the both sides along lower mould direction of transfer respectively, install the cylinder on the support frame, rotate on the output shaft of cylinder and install the pinch roller, the pinch roller is located the top of lower mould, still rotate on the support frame and install a unreeling axle and drive a unreeling axle pivoted motor, still rotate on the moulding-die frame and install two sets of conveying roller sets that compress tightly, and two sets of conveying roller sets that compress tightly are located the both sides along lower mould direction of transfer respectively, it is located the low reaches of pinch roller to compress tightly conveying roller set.
Preferably, the die pressing frame is further rotatably provided with two unwinding shafts and a plurality of auxiliary rollers, and the two unwinding shafts are respectively located on two sides of the lower die in the transmission direction.
The utility model discloses following beneficial effect has: through the mould pressing frame, the electronic slide rail of annular, lower mould, go up mould, hydraulic stem, door type frame, injecting glue pipe, reservation material intercepting mechanism that set up, when carrying out mould pressing to the diode with man-hour, can conveniently pour into more glue into, reduce processing and appear less glue and influence processingquality, glue that simultaneously can the feed inlet is stained with gluing and influence the drawing of patterns of diode and carry, ensure the efficiency of processing.
Drawings
Fig. 1 is a schematic overall structure diagram of a molding device for diode processing according to the present invention;
fig. 2 is a cross-sectional view of an upper mold in the molding device for diode processing according to the present invention;
fig. 3 is a side view of the support frame, the cylinder, the pinch roller and the first unreeling shaft in the molding device for diode processing.
In the figure: 1. a molding frame; 2. a lower die; 3. a gantry frame; 4. a hydraulic lever; 5. an upper die; 6. a glue injection pipe; 7. cutting off the sliding block; 8. driving the extrusion block; 9. an electric push rod; 10. reserving a material groove; 11. reserving a groove; 12. a support frame; 13. a cylinder; 14. a pressure roller; 15. a first unreeling shaft; 16. compressing the conveying roller set; 17. and a second unreeling shaft.
Detailed Description
Referring to fig. 1-3, the utility model provides a mould pressing device for diode processing, including mould pressing frame 1, install annular electronic slide rail on the mould pressing frame 1, the last slidable mounting of annular electronic slide rail has a plurality of sliders and equidistant arrangement between a plurality of sliders, install lower mould 2 on the slider, install door type frame 3 on the mould pressing frame 1, install hydraulic stem 4 on door type frame 3, install upper mould 5 on the output shaft of hydraulic stem 4, set up the diode die cavity between lower mould 2 and upper mould 5, install the injecting glue pipe 6 that communicates with the diode die cavity on the upper mould 5, the diode die cavity that is located on upper mould 5 is installed and is reserved material and cut off the mechanism;
the diode die cavity formed between the lower die 2 and the upper die 5 is formed, half of the diode die cavity is formed on both the lower die 2 and the upper die 5, when the diode is subjected to die pressing, the diode can be placed in the diode die cavity of the lower die 2, then the annular electric slide rail works to drive the plurality of lower dies 2 to synchronously rotate in a circulating manner, when one lower die 2 with the diode reaches the position right below the upper die 5, the annular electric slide rail stops working, at the moment, the hydraulic rod 4 works to drive the upper die 5 to descend to be attached to the lower die 2, then a proper amount of glue is injected into the diode die cavity through the glue injection pipe 6, then the reserved material cutting mechanism is firstly provided with a cavity to facilitate the entry of the redundant glue, the redundant glue is extruded into a hollow part through the reserved material cutting mechanism, the redundant glue is simultaneously extruded and returned from the glue injection pipe 6, when the redundant glue is extruded, the discharge port of the glue injection pipe 6 is sealed, the demoulding of the diode can be convenient, the diode is reduced, the diode is adhered to the upper die 5 due to the connection of the die pressing port glue, the generation of waste edges can be reduced, and the quality of the diode is ensured.
In a specific embodiment, the reserved material cutting mechanism comprises a cutting slide block 7, a driving extrusion block 8 and an electric push rod 9; the inner wall of the diode die cavity is provided with an adjusting chute in sliding fit with a cut-off slider 7 and a material reserving groove 10 in sliding fit with a driving extrusion block 8, a discharge hole of a glue injection pipe 6 is communicated with the adjusting chute, the cut-off slider 7 can seal the discharge hole of the glue injection pipe 6, the material reserving groove 10 is communicated with the diode die cavity and the adjusting chute, the cut-off slider 7 can slide in the material reserving groove 10, one side, close to the material reserving groove 10, of the cut-off slider 7 is provided with an inclined surface in sliding fit with the driving extrusion block 8, the width of the material reserving groove 10 is the same as that of the cut-off slider 7, an electric push rod 9 is installed in the material reserving groove 10, and the driving extrusion block 8 is installed on an output shaft of the electric push rod 9;
when injecting glue, the electric push rod 9 drives the driving extrusion block 8 to retract into the remaining trough 10, the cut-off slider 7 does not slide in the adjusting chute under the extrusion action of the driving extrusion block 8, the discharge hole of the glue injection pipe 6 is opened, glue can normally enter the diode cavity, redundant glue can enter the remaining trough 10, after the glue with a proper amount is injected, the electric push rod 9 works to push the driving extrusion block 8 to slide in the remaining trough 10 and push the glue in the remaining trough 10 out to enter the diode cavity to be filled to a hollow part, the situation that the diode cavity is hollow can be reduced, the quality of mould pressing is ensured, the side face of the driving extrusion block 8 is in sliding fit with the inclined face of the cut-off slider 7 along with the continuous descending of the driving extrusion block 8, the cut-off slider 7 can be driven to slide in the adjusting chute, the driving extrusion block 8 moves to a proper position, the cut-off slider 7 seals the discharge hole of the glue injection pipe 6, the bottom face of the driving extrusion block 8, the bottom face of the cut-off slider 7 and the inner wall of the diode cavity, and the discharge hole with the waste edge can be reduced.
In a specific embodiment, two reserved grooves 11 communicated with a diode die cavity are formed in the lower die 2 and the upper die 5 respectively, and the two reserved grooves 11 are located at two ends of a PN junction die cavity in the diode die cavity respectively;
the diode die cavity comprises PN junction die cavity and electrode lead wire groove, and reserve groove 11 can conveniently pour into more glue into, can reduce the end in PN junction groove and appear the condition of few glues.
In a specific embodiment, the die pressing frame 1 is further provided with two support frames 12, the two support frames 12 are respectively located on two sides along the conveying direction of the lower die 2, the support frames 12 are provided with air cylinders 13, output shafts of the air cylinders 13 are rotatably provided with pressing rollers 14, the pressing rollers 14 are located above the lower die 2, the support frames 12 are further rotatably provided with a first unreeling shaft 15 and a first motor for driving the first unreeling shaft 15 to rotate, the die pressing frame 1 is further rotatably provided with two groups of pressing conveying roller sets 16, the two groups of pressing conveying roller sets 16 are respectively located on two sides along the conveying direction of the lower die 2, and the pressing conveying roller sets 16 are located on the downstream of the pressing rollers 14;
after the diode is molded, a film is sleeved on the first unwinding shaft 15, the adhesive tape is clamped by two conveying rollers in the pressing conveying roller set 16 for conveying, when the lower die 2 is provided with a diode passing through the lower part of the pressing roller 14, the pressing roller 14 is driven by the air cylinder 13 to press downwards, the pressing roller 14 pushes the adhesive tape to descend so as to adhere an electrode lead of the diode to the adhesive tape, and the subsequent electrode lead cutting processing of the diode can be facilitated.
In a specific embodiment, the die pressing frame 1 is also rotatably provided with two second unreeling shafts 17 and a plurality of auxiliary rollers, and the two second unreeling shafts 17 are respectively positioned at two sides along the transmission direction of the lower die 2;
another roll of adhesive tape can be sleeved on the second unreeling shaft 17 and then guided by the auxiliary roller, and the pressing conveying roller group 16 bonds the adhesive surfaces of the two adhesive tapes together, so that the inconvenience caused by bonding the adhesive tapes on other objects can be reduced.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The utility model provides a mould pressing device of diode processing, its characterized in that, includes moulding frame (1), install annular electronic slide rail on moulding frame (1), slidable mounting has equidistant arrangement between a plurality of sliders and a plurality of sliders on the electronic slide rail of annular, install lower mould (2) on the slider, install door type frame (3) on moulding frame (1), install hydraulic stem (4) on door type frame (3), install mould (5) on the output shaft of hydraulic stem (4), the diode die cavity has been seted up between lower mould (2) and last mould (5), go up and install injecting glue pipe (6) with diode die cavity intercommunication on mould (5), be located it installs in the diode die cavity on mould (5) and reserves material truncation mechanism.
2. The die pressing device for processing the diode as claimed in claim 1, wherein the preformed material cutting mechanism comprises a cutting slide block (7), a driving extrusion block (8) and an electric push rod (9); the utility model discloses a diode mould, including diode die cavity, the inner wall of diode die cavity seted up with cut slider (7) sliding fit's regulation spout and with drive extrusion piece (8) sliding fit stay silo (10), the discharge gate and the regulation spout intercommunication of injecting glue pipe (6), cut the discharge gate that slider (7) can shutoff injecting glue pipe (6), stay silo (10) and diode die cavity, regulation spout intercommunication, cut slider (7) and can slide in staying silo (10), it sets up to the inclined plane with drive extrusion piece (8) sliding fit to cut one side that slider (7) are close to and stay silo (10), the width that stays silo (10) is the same with the width that cuts slider (7), electric putter (9) are installed in staying silo (10), and drive extrusion piece (8) are installed on the output shaft of electric putter (9).
3. The die pressing device for processing the diode as claimed in claim 1, wherein the lower die (2) and the upper die (5) are respectively provided with two preformed grooves (11) communicated with the diode die cavity, and the two preformed grooves (11) are respectively positioned at two ends of a PN junction die cavity in the diode die cavity.
4. The die pressing device for processing the diode as claimed in claim 1, wherein the die pressing frame (1) is further provided with two support frames (12), the two support frames (12) are respectively positioned at two sides along the conveying direction of the lower die (2), the support frames (12) are provided with air cylinders (13), output shafts of the air cylinders (13) are rotatably provided with pressing rollers (14), the pressing rollers (14) are positioned above the lower die (2), the support frames (12) are further rotatably provided with a first unreeling shaft (15) and a first motor for driving the first unreeling shaft (15) to rotate, the die pressing frame (1) is further rotatably provided with two groups of pressing conveying roller sets (16), the two groups of pressing conveying roller sets (16) are respectively positioned at two sides along the conveying direction of the lower die (2), and the pressing conveying roller sets (16) are positioned at the downstream of the pressing rollers (14).
5. The die pressing device for processing the diode as claimed in claim 4, wherein two unwinding shafts II (17) and a plurality of auxiliary rollers are further rotatably mounted on the die pressing frame (1), and the two unwinding shafts II (17) are respectively positioned at two sides along the transmission direction of the lower die (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221994602.XU CN218385128U (en) | 2022-07-29 | 2022-07-29 | Mould pressing device for diode processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221994602.XU CN218385128U (en) | 2022-07-29 | 2022-07-29 | Mould pressing device for diode processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218385128U true CN218385128U (en) | 2023-01-24 |
Family
ID=84964916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221994602.XU Active CN218385128U (en) | 2022-07-29 | 2022-07-29 | Mould pressing device for diode processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218385128U (en) |
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2022
- 2022-07-29 CN CN202221994602.XU patent/CN218385128U/en active Active
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