CN218372575U - High current conducting structure of integrated circuit lead frame equipment - Google Patents
High current conducting structure of integrated circuit lead frame equipment Download PDFInfo
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- CN218372575U CN218372575U CN202222070712.3U CN202222070712U CN218372575U CN 218372575 U CN218372575 U CN 218372575U CN 202222070712 U CN202222070712 U CN 202222070712U CN 218372575 U CN218372575 U CN 218372575U
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Abstract
The utility model relates to a lead frame electrically conducts technical field, especially relates to the heavy current conducting structure of integrated circuit lead frame equipment, including the friction current conducting plate with one side plate edge frictional contact of lead frame, still include the electrode wheel with another side plate edge frictional contact, the friction current conducting plate has the friction groove of indent along the length direction shaping, the friction inslot shaping has the conducting surface, friction current conducting plate bottom is connected with elastic support piece; a guide groove is formed on the periphery of the outer ring surface of the electrode wheel; the conductive surface of the friction conductive plate is in friction line contact with the bottom plate edge of the lead frame which longitudinally passes through, and the electrode wheel is in rolling friction contact with the top plate edge of the lead frame, so that the large-particle impurities on the conductive wheel cannot be rolled and attached to the plate surface to scratch the plate surface while the conductivity is formed, and the quality of the lead frame is effectively protected; on the other hand, the line contact conductive structure can be used for a larger circuit to pass through, has a larger heat dissipation area when heating, has a good heat dissipation effect and is stable in conductivity, and the quality of the lead frame is further improved.
Description
Technical Field
The utility model relates to a lead frame electrically conducts technical field, especially relates to strong current conducting structure of integrated circuit lead frame equipment.
Background
The precise integrated circuit is an important core electronic material belt product in the modern electronic information industry and is formed by packaging a high-precision chip and a lead frame. The lead frame is a key material in the integrated circuit, and plays an important role in supporting the chip, protecting internal components and connecting external circuits. With the rapid development of high and new electronic information technology, the material belt product develops towards miniaturization, multiple functions and intellectualization. Therefore, the lead frame material is being developed to have a finer lead pitch and a higher density.
In continuous semiconductor lead frame surface treatment production line, need apply electric installation, chinese utility model CN202121236740.7 discloses a semiconductor lead frame rolls roll formula electric installation, has upper and lower parallel interval distribution's lower conducting rod and last conducting rod, be provided with two conducting wheels on conducting rod and the last conducting rod down respectively, two conducting wheels on the conducting rod down and two conducting wheel one-to-one on the conducting rod, but between two conducting wheels on the conducting rod down and two conducting wheels on the conducting rod the feed area product passes through, and the upper surface of material area product contacts with two conducting wheels on the last conducting rod, and the lower surface of material area product contacts with two conducting wheels on the conducting rod down.
Above-mentioned scheme adopts the conducting structure of compression roller formula to lead the frame through electrically conductive, and electrically conductive wheel can contact with the face, and the large granule impurity on the electrically conductive wheel can roll and paste the face, and easy fish tail face leads to the quality not good.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a strong current conducting structure of integrated circuit lead frame equipment to prior art's not enough.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the heavy current conductive structure of the integrated circuit lead frame equipment comprises a friction conductive plate in friction contact with one side plate edge of a lead frame which longitudinally passes through, and also comprises an electrode wheel in friction contact with the other side plate edge of the lead frame, wherein the friction conductive plate is formed with an inwards concave friction groove along the length direction, a conductive surface is formed in the friction groove, and the bottom of the friction conductive plate is connected with an elastic support piece; the periphery of the outer ring surface of the electrode wheel is provided with a guide groove which is aligned with the friction groove.
And further: the cross section of the friction conductive plate is V-shaped, and the friction groove is formed in the concave part of the friction conductive plate.
Further: the conductive surface is a fillet structure formed along the length direction of the friction groove.
Further: elastic support piece installs in the electrode drain pan, and friction current conducting plate liftable buffering is installed in the electrode drain pan.
And further: elastic support piece includes a plurality of reference columns of installing in the base, and the electrode drain pan is vertically passed at the reference column top, and the laminating of friction current conducting plate bottom surface has the electrode layer board, is connected with the spring part between electrode layer board and the reference column.
And further: the base is provided with the supporting component to the installation of electrode wheel, and the supporting component includes longitudinal arrangement's stand, and liftable sliding ground nestification has the regulating block on the stand, installs the installation component on the regulating block.
Further: the installation component comprises a shaft lever, a bearing seat is installed on the shaft lever, the electrode wheel is coaxially nested on the bearing seat, and the shaft lever is connected with a fixing plate.
And further: the mounting assembly further comprises a fixing shaft formed on the adjusting block, the fixing shaft is nested with the torsion wheel assembly, and one end of the fixing plate is nested with the torsion wheel assembly.
The utility model has the advantages that: the conductive surface of the friction conductive plate is in friction line contact with the bottom plate edge of the lead frame which longitudinally passes through, and the electrode wheel is in rolling friction contact with the top plate edge of the lead frame, so that the large-particle impurities on the conductive wheel can not roll and stick to the plate surface to scratch the plate surface while the conductivity is formed, and the quality of the lead frame is effectively protected; on the other hand, the line contact conductive structure can be used for a larger circuit to pass through, has a larger heat dissipation area when heating, has a good heat dissipation effect and is stable in conductivity, and the quality of the lead frame is further improved.
Drawings
Fig. 1 is a schematic structural diagram of a high current conductive structure.
Fig. 2 is another view-angle structure diagram of the high-current conductive structure.
Fig. 3 is a schematic structural view of the mounting assembly.
The reference numerals include:
1-friction conductive plate,
11-friction groove, 12-conductive surface, 13-electrode supporting plate, 14-spring part, 15-positioning column,
16-electrode bottom shell, 17-opening, 18-base,
2-mounting the component,
21-upright post, 22-adjusting block, 23-adjusting groove, 24-knob adjusting handle, 25-fixing shaft,
26-torsion wheel component, 27-shaft lever, 28-bearing seat, 29-electrode wheel, 30-guide groove,
31-fixing plate.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1-3, the high current conductive structure of the integrated circuit lead frame device includes a friction conductive plate 1 in friction contact with a bottom plate edge of a lead frame passing longitudinally, the friction conductive plate 1 is formed by processing 316 stainless steel, and has good corrosion resistance, a top plate edge of the lead frame is rolled and pressed by an electrode wheel 29, the friction conductive plate 1 is connected with the conductive device, the cross section of the friction conductive plate 1 is V-shaped, an inward concave friction groove 11 is formed along the length direction of the V-shaped structure, a conductive surface 12 is formed in the friction groove 11, the conductive surface 12 is a rounded structure formed along the length direction of the friction groove 11, the conductive surface 12 of the friction conductive plate 1 is in friction line contact with the bottom plate edge of the lead frame passing longitudinally, on one hand, large particle impurities on the conductive wheel cannot roll on the plate surface, which may scratch the plate surface, and effectively protect the quality of the lead frame; on the other hand, the line contact conductive structure can be used for a larger circuit to pass through, has a larger heat dissipation area when heating, has a good heat dissipation effect and is stable in conductivity, and the quality of the lead frame is further improved.
Specifically, the bottom of the friction current-conducting plate 1 is provided with a base 18, the top of the base 18 is provided with an electrode bottom shell 16 located on the periphery of the friction current-conducting plate 1, an opening 17 is formed in the top of the electrode bottom shell 16, the base 18 is provided with a plurality of upright positioning columns 15, the positioning columns 15 penetrate through the electrode bottom shell 16 to fixedly install the electrode bottom shell 16 on the top of the base 18, the friction current-conducting plate 1 is located in the electrode bottom shell 16, and therefore strong current generated when the friction current-conducting plate 1 is electrified can be prevented from outwards generating electric arcs, and certain safety is kept.
Be provided with the elastic support piece to the support of friction current conducting plate 1 in the electrode drain pan 16, elastic support piece is including laminating in the electrode layer board 13 of the 1 bottom surface of friction current conducting plate, be provided with spring part 14 between electrode layer board 13 and reference column 15, the support of a plurality of spring parts 14, make the opening 17 of electrode drain pan 16 is passed at 1 top of friction current conducting plate, spring part 14 can be to pressing on the friction current conducting plate 1, when passing through to the plate body of different width, can adjust the height adaptively, let the flange edge and the conductive surface 12 line contact of plate body bottom all the time, supply stronger electric current to lead electrically through producing.
The outer annular surface of electrode wheel 29 is along the shaping to have the guide way 30 with the vertical alignment of friction groove 11 all around, the cross-section of guide way 30 is the V font, this guide way 30 rolls the frictional contact with the top plate edge of lead frame, base 18 is provided with the supporting component to electrode wheel 29 installation, the supporting component includes longitudinal arrangement's stand 21, liftable sliding ground nestification has regulating block 22 on the stand 21, regulating block 22 shaping has the adjustment way 23 with stand 21 shape looks adaptation, knob adjustment handle 24 has been inserted on the knob on regulating block 22, through the elasticity of wrench movement knob adjustment handle 24, change the mounting height of regulating block 22 on stand 21, can supply the lead frame of different width to pass through.
The adjusting block 22 is provided with a mounting assembly 2, the mounting assembly 2 is provided with a fixing shaft 25 perpendicular to the upright post 21, the fixing shaft 25 is nested with a torsion wheel assembly 26, the torsion wheel assembly 26 is connected with a fixing plate 31, the fixing plate 31 is nested on the fixing shaft 25, the torsion wheel assembly comprises a knob block of an elastic knob, the knob block is provided with a shaft rod 27 extending forwards on the fixing plate 31, a bearing seat 28 is arranged on the shaft rod 27, and an electrode wheel 29 is coaxially nested on the bearing seat 28; the twisting knob block can drive the fixing plate 31 to swing around the fixing shaft 25 by rotating, so that the height of the electrode wheel 29 can be changed, the distance between the electrode wheel and the friction current-conducting plate 1 is changed, and lead frames with different widths can pass through the electrode wheel; by matching with the friction conductive plate 1 which can be elastically supported, the top plate edge and the bottom plate edge of the lead frame can be contacted, guided and positioned, and simultaneously can conduct electricity through strong current.
In conclusion, the present invention has the above-mentioned excellent characteristics, so that it can be used to enhance the effectiveness of the prior art and has practicability, and thus it is a product with practical value.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (8)
1. The strong current conducting structure of the integrated circuit lead frame equipment is characterized in that: the friction conductive plate is provided with an inwards concave friction groove formed along the length direction, a conductive surface is formed in the friction groove, and the bottom of the friction conductive plate is connected with an elastic support; the circumference of the outer ring surface of the electrode wheel is provided with a guide groove aligned with the friction groove.
2. A high current conductive structure for an integrated circuit lead frame apparatus as recited in claim 1, wherein: the cross section of the friction current-conducting plate is V-shaped, and the friction groove is formed in the concave part of the friction current-conducting plate.
3. A high current conductive structure for an integrated circuit lead frame apparatus as recited in claim 2, wherein: the conductive surface is a fillet structure formed along the length direction of the friction groove.
4. A high current conductive structure for an integrated circuit lead frame apparatus as recited in claim 1, wherein: elastic support piece installs in the electrode drain pan, and friction current conducting plate liftable buffering is installed in the electrode drain pan.
5. A high current conductive structure for an integrated circuit lead frame apparatus as recited in claim 4, wherein: the elastic supporting piece comprises a plurality of positioning columns installed on the base, the top of each positioning column longitudinally penetrates through the bottom shell of the electrode, the bottom surfaces of the friction conductive plates are attached to electrode supporting plates, and spring parts are connected between the electrode supporting plates and the positioning columns.
6. A high current conductive structure for an integrated circuit lead frame apparatus as recited in claim 4, wherein: the base is provided with the supporting component to the installation of electrode wheel, and the supporting component includes longitudinal arrangement's stand, and liftable sliding ground nestification has the regulating block on the stand, installs the installation component on the regulating block.
7. A high current conductive structure for an integrated circuit lead frame apparatus as recited in claim 6, wherein: the mounting assembly comprises a shaft rod, a bearing seat is mounted on the shaft rod, the electrode wheel is coaxially nested in the bearing seat, and the shaft rod is connected with a fixing plate.
8. A high current conductive structure for an integrated circuit lead frame apparatus as recited in claim 7, wherein: the mounting assembly further comprises a fixing shaft formed on the adjusting block, the fixing shaft is nested with the torsion wheel assembly, and one end of the fixing plate is nested with the torsion wheel assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222070712.3U CN218372575U (en) | 2022-08-03 | 2022-08-03 | High current conducting structure of integrated circuit lead frame equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222070712.3U CN218372575U (en) | 2022-08-03 | 2022-08-03 | High current conducting structure of integrated circuit lead frame equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218372575U true CN218372575U (en) | 2023-01-24 |
Family
ID=84965381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222070712.3U Active CN218372575U (en) | 2022-08-03 | 2022-08-03 | High current conducting structure of integrated circuit lead frame equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218372575U (en) |
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2022
- 2022-08-03 CN CN202222070712.3U patent/CN218372575U/en active Active
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