CN218368113U - Take encapsulating instrument structure of forced air cooling passageway - Google Patents

Take encapsulating instrument structure of forced air cooling passageway Download PDF

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Publication number
CN218368113U
CN218368113U CN202222511960.7U CN202222511960U CN218368113U CN 218368113 U CN218368113 U CN 218368113U CN 202222511960 U CN202222511960 U CN 202222511960U CN 218368113 U CN218368113 U CN 218368113U
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China
Prior art keywords
radiating
glue
heat dissipation
instrument structure
air
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Active
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CN202222511960.7U
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Chinese (zh)
Inventor
张芳勇
段雷雨
郭相程
游金涛
祝强
于林金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Luyuan Electric Vehicle Co Ltd
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Zhejiang Luyuan Electric Vehicle Co Ltd
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Priority to CN202222511960.7U priority Critical patent/CN218368113U/en
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Abstract

The utility model discloses a take encapsulating instrument structure of forced air cooling passageway, including upper cover, lower cover, light-passing board, circuit board, still include the fin, cover down and be provided with the louvre, the fin is fixed in the louvre. The arrangement of the radiating fins provides channels for radiating of each internal element, and timely radiating can enable the service time of each element to be longer.

Description

Take encapsulating instrument structure of forced air cooling passageway
Technical Field
The utility model relates to an electric motor car technical field especially relates to a take encapsulating instrument structure of forced air cooling passageway.
Background
The instruments present on the market are mainly divided into two main categories according to the screen material: one is an LED screen meter and the other is a liquid crystal screen meter. Due to the reasons of simple technology, strong temperature resistance, various colors and the like of the LED instrument, the market holding amount is more than that of a liquid crystal instrument. The LED instrument is mainly formed by combining a transparent upper cover, a sticker, a light-transmitting plate, a PCB (printed Circuit Board) plate and a bottom shell lower cover, and an internal outgoing line extends out of the bottom shell lower cover and is connected to a whole vehicle wire harness. At present, the electric vehicle instrument structure is only used as an appearance part, most of design ideas are considered from aspects of fashionable appearance and the like, but a power supply chip of the instrument generates a lot of heat along with the influence of long service time and road complexity, and if the heat is not dissipated in time, the service life of the chip is influenced, even the chip is burnt out. Therefore, a structure for dissipating heat inside the meter in time is urgently needed.
Disclosure of Invention
The utility model discloses the inside accumulated heat volume of instrument to existence among the prior art leads to the defect that the instrument damaged, provides a new encapsulating instrument structure of area forced air cooling passageway.
In order to solve the technical problem, the utility model discloses a following technical scheme realizes:
the utility model provides a take encapsulating instrument structure of forced air cooling passageway, includes upper cover, lower cover, light-passing board, circuit board, still includes the fin, cover down and be provided with the louvre, the fin is fixed in the louvre.
The arrangement of the radiating fins provides channels for radiating of each internal element, and timely radiating can enable the service time of each element to be longer.
Preferably, the glue-pouring instrument structure with the air cooling channel comprises an upper cover and a lower cover, wherein the upper cover is provided with an upper surrounding edge, the lower cover is provided with a lower surrounding edge, the upper surrounding edge and the lower surrounding edge surround to form a heat dissipation space, the heat dissipation holes are located in the heat dissipation space, the heat dissipation space is filled with heat dissipation glue, and the heat dissipation fins are in contact with the heat dissipation glue.
The filling of the heat-dissipating glue allows the heat generated by the components to be transferred more quickly to and ultimately from the heat sink.
Preferably, the glue-pouring instrument structure with the air cooling channel further comprises a sealing ring, and the sealing ring is connected with the light-transmitting plate and the circuit board.
The setting of sealing washer makes the heat dissipation glue can stay in the heat dissipation space when filling, can not influence the normal work of each component.
Preferably, in the glue-pouring instrument structure with the air-cooling channel, the upper surface of the heat dissipation plate is abutted to the circuit board.
The contact area between the radiating fins and the radiating glue is increased by the arrangement of the upper surfaces of the radiating fins and the butting of the circuit board, and the radiating efficiency can be improved.
Preferably, in the glue-pouring instrument structure with the air cooling channel, the heat dissipation fin is further provided with a lower heat dissipation vertical plate.
The arrangement of the lower radiating vertical plate increases the contact area between the radiating fins and the outside air, and the radiating efficiency can be improved.
Preferably, in the glue-pouring instrument structure with the air cooling channel, an air duct is formed between the lower heat dissipation vertical plates, and the air duct is longitudinally arranged.
The air duct is vertically arranged, and when the electric vehicle rides, air flows along the air duct, so that the heat dissipation efficiency is further improved.
Drawings
FIG. 1 is an exploded view of the present invention;
FIG. 2 is a schematic structural view of the middle and lower covers of the present invention;
fig. 3 is a schematic partial cross-sectional view of the present invention;
fig. 4 is a schematic structural diagram of the middle heat sink of the present invention.
Detailed Description
The invention will be described in further detail with reference to the accompanying drawings 1-4 and the detailed description, which are not intended to limit the invention:
example 1
The utility model provides a take encapsulating instrument structure of forced air cooling passageway, includes upper cover 1, lower cover 2, light-passing board 3, circuit board 4, still includes fin 5, be provided with louvre 21 on the lower cover 2, fin 5 is fixed in the louvre 21.
Preferably, the upper cover 1 is provided with an upper surrounding edge 11, the lower cover 2 is provided with a lower surrounding edge 22, the upper surrounding edge 11 and the lower surrounding edge 22 surround to form a heat dissipation space 6, the heat dissipation holes 21 are located in the heat dissipation space 6, the heat dissipation space 6 is filled with heat dissipation glue, and the heat dissipation fins 5 are in contact with the heat dissipation glue.
Preferably, the light-transmitting plate further comprises a sealing ring 7, and the sealing ring 7 is connected with the light-transmitting plate 3 and the circuit board 4.
Preferably, the upper surface of the heat sink 5 abuts against the circuit board 4.
Preferably, the heat sink 5 is further provided with a lower heat sink vertical plate 52.
Preferably, an air duct 53 is formed between the lower heat dissipating vertical plates 52, and the air duct 53 is longitudinally arranged.
In short, the above description is only a preferred embodiment of the present invention, and all the equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the present invention.

Claims (6)

1. The utility model provides a take encapsulating instrument structure of forced air cooling passageway, includes upper cover (1), lower cover (2), light-passing board (3), circuit board (4), its characterized in that: the heat dissipation structure is characterized by further comprising heat dissipation fins (5), heat dissipation holes (21) are formed in the lower cover (2), and the heat dissipation fins (5) are fixed in the heat dissipation holes (21).
2. The glue-pouring instrument structure with the air-cooling channel according to claim 1, characterized in that: the radiating structure is characterized in that an upper surrounding edge (11) is arranged on the upper cover (1), a lower surrounding edge (22) is arranged on the lower cover (2), the upper surrounding edge (11) and the lower surrounding edge (22) surround to form a radiating space (6), the radiating holes (21) are located in the radiating space (6), radiating glue is filled in the radiating space (6), and the radiating fins (5) are in contact with the radiating glue.
3. The glue-pouring instrument structure with the air-cooled channel according to claim 2, characterized in that: still include sealing washer (7), sealing washer (7) with light-passing board (3), circuit board (4) are connected.
4. The glue-pouring instrument structure with the air-cooled channel according to claim 2, characterized in that: the upper surface of the radiating fin (5) is abutted against the circuit board (4).
5. The glue-pouring instrument structure with the air-cooled channel according to claim 1, characterized in that: the radiating fins (5) are also provided with lower radiating vertical plates (52).
6. The glue-pouring instrument structure with the air-cooling channel according to claim 5, characterized in that: an air duct (53) is formed between the lower radiating vertical plates (52), and the air duct (53) is longitudinally arranged.
CN202222511960.7U 2022-09-21 2022-09-21 Take encapsulating instrument structure of forced air cooling passageway Active CN218368113U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222511960.7U CN218368113U (en) 2022-09-21 2022-09-21 Take encapsulating instrument structure of forced air cooling passageway

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222511960.7U CN218368113U (en) 2022-09-21 2022-09-21 Take encapsulating instrument structure of forced air cooling passageway

Publications (1)

Publication Number Publication Date
CN218368113U true CN218368113U (en) 2023-01-24

Family

ID=84953462

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222511960.7U Active CN218368113U (en) 2022-09-21 2022-09-21 Take encapsulating instrument structure of forced air cooling passageway

Country Status (1)

Country Link
CN (1) CN218368113U (en)

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