CN218366554U

CN218366554U - Semiconductor plastic packaging press lower die structure convenient to adjust

Info

Publication number: CN218366554U
Application number: CN202221514790.1U
Authority: CN
Inventors: 孙贤业; 彭卢
Original assignee: Tongling Quanjuhe Semiconductor Co ltd
Current assignee: Tongling Quanjuhe Semiconductor Co ltd
Priority date: 2022-06-14
Filing date: 2022-06-14
Publication date: 2023-01-24
Anticipated expiration: 2032-06-14

Abstract

The utility model discloses a semiconductor plastic envelope press lower die structure convenient to adjust, relate to plastic envelope press technical field, which comprises a supporting pedestal and is characterized by further comprising, the lower surface of supporting the base is provided with adjusts the plastic envelope subassembly, the upper surface of supporting the base is provided with the centre gripping subassembly, the side of supporting the base is provided with the clearance subassembly, when needs are adjusted, accessible start electric putter A, electric putter A drives the movable block, the movable block drives plastic envelope press body and realizes the back-and-forth movement, and then can realize adjusting according to the position difference of needs plastic envelope, and the accessible starts rotating electrical machines, rotating electrical machines drives the connecting plate, the connecting plate drives plastic envelope press body and realizes rotary motion, through electric putter A, electric putter A drives plastic envelope press body motion, to setting up in different positions, and the not equidirectional position that realizes finely tuning plastic envelope press body, moreover, the steam generator is simple in structure, convenient to use reasonable design, and convenient to detach.

Description

Semiconductor plastic packaging press lower die structure convenient to adjust

Technical Field

The utility model relates to a plastic envelope press technical field specifically is a semiconductor plastic envelope press lower die structure convenient to adjust.

Background

The plastic package treatment is to coat the polyester film with hot melt adhesive, the sealed object is adhered in the plastic film by the processing of the gluing machine, the processing is carried out under certain pressure and high temperature, and the high-quality polyester film and the hot melt adhesive with good transparency are adopted. Therefore, the plastic packaged article can not be damaged at normal temperature, and the visual effect of the article is improved. The quality of the technical performance of the laminator in the process is an important factor for ensuring the quality of plastic package.

At present, when an existing plastic package press is used, position adjustment in different directions is difficult to achieve in a plastic package die assembly process, for large-area plastic package, in a semiconductor packaging process, before and after plastic package is conducted on semiconductor material sheets by the plastic package press, die faces of the plastic package press need to be cleaned, so that the plastic package quality is guaranteed, cleaning of the die faces of the plastic package press is usually achieved by cleaning upper and lower die faces of the plastic package press by manually holding an air gun, cleaning efficiency is low, and manual labor is wasted.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor plastic envelope press lower die structure convenient to adjust, easy location has, easy to assemble, simple structure's advantage, solved at present, current plastic envelope press is when using, be difficult to realize at plastic envelope compound die in-process, carry out not equidirectional position adjustment, to large tracts of land plastic envelope, and in the semiconductor packaging process, before carrying out the plastic envelope with the plastic envelope press to semiconductor tablet and after the plastic envelope, all need clean the die face of plastic envelope press, with guarantee the plastic envelope quality, nevertheless the current cleanness to the plastic envelope press die face is adopted artifical handheld air gun to clean the upper and lower die face of plastic envelope press usually, clean efficiency is lower, and comparatively extravagant hand labor's problem.

In order to achieve the above object, the utility model provides a following technical scheme: a lower die structure of a semiconductor plastic package press convenient to adjust comprises a supporting base, wherein an adjusting plastic package assembly is arranged on the lower surface of the supporting base, a clamping assembly is arranged on the upper surface of the supporting base, and a cleaning assembly is arranged on the side surface of the supporting base;

the support base upper surface seted up the perforation, the adjustment tank has been seted up to the both sides of supporting the base, and the inner wall bottom surface of adjustment tank is provided with electric telescopic handle A, and electric telescopic handle A's one end is provided with the regulating block.

Preferably, the adjusting block is connected with the adjusting groove in a sliding mode, the connecting rod is arranged on the outer surface of the adjusting block, the sliding groove is formed in one side of the adjusting groove, and the electric telescopic rod B is arranged on the bottom face of the inner wall of the sliding groove.

Preferably, electric telescopic handle B's one end is provided with the sliding block, sliding block and sliding tray sliding connection, and the upper surface of sliding block is provided with the pole setting.

Preferably, the adjusting plastic package assembly comprises a movable plate arranged at the lower end of the through hole, a connecting plate is arranged on the lower surface of the movable plate, a fixing screw is arranged inside the connecting plate, and the connecting plate is connected with the movable plate through the fixing screw.

Preferably, a movable groove is formed in one side of the connecting plate, a movable block is arranged inside the movable groove and is connected with the movable groove in a sliding mode, and an electric push rod A is arranged on the side face of the movable block.

Preferably, the lower surface of the electric push rod a is provided with a plastic package press body, one side of the upper end of the movable plate is provided with a rotating motor, the lower surface of the rotating motor is provided with a movable shaft, and the rotating motor penetrates through the support base through the movable shaft to be connected with the movable plate.

Preferably, the upper surface of the supporting base is provided with a plastic package mold, two ends of the inner wall of the plastic package mold are provided with electric push rods B, one end of each electric push rod B is provided with a clamping plate, two sides of the plastic package mold are provided with connecting long rods, and the plastic package mold is connected with the connecting rods through the connecting long rods.

Preferably, the clearance subassembly is including setting up the connection pole in the pole setting side, and the surface of connecting the pole cup joints and is provided with the loop bar, and the promotion groove has been seted up to the side of loop bar.

Preferably, the inner wall one end in promotion groove is provided with electric telescopic handle C, and electric telescopic handle C's one end is provided with the slider, slider and promotion groove sliding connection.

Preferably, the outer surface of the handle sliding block is provided with a connecting rod, and one end of the connecting rod is provided with a blowing fan.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. a semiconductor plastic package press lower die structure convenient to adjust can be adjusted by starting an electric push rod A when needed, the electric push rod A drives a movable block, the movable block drives a plastic package press body to move back and forth, and then adjustment can be achieved according to different positions needing plastic package, a rotating motor can be started, the rotating motor drives a connecting plate, the connecting plate drives the plastic package press body to achieve rotary movement, the electric push rod A drives the plastic package press body to move through the electric push rod A, the positions of the plastic package press body are finely adjusted in different positions and different directions, and the semiconductor plastic package press lower die structure is simple in structure, convenient to use, reasonable in design and convenient to disassemble;

2. a semiconductor plastic package press lower die structure convenient to adjust is characterized in that a semiconductor material sheet is placed inside a plastic package die when the semiconductor plastic package press lower die structure is used, an electric push rod B is started, the electric push rod B drives a clamping plate to clamp and fix two ends of the semiconductor material sheet, position deviation caused during plastic package is prevented, the position of the semiconductor material sheet is effectively aligned, after clamping is finished, an electric telescopic rod A can be started to drive an adjusting block, the adjusting block drives a connecting rod, the connecting rod drives a connecting long rod, and the connecting long rod drives the plastic package die to move close to the plastic package press body, so that plastic package is achieved;

3. the utility model provides a semiconductor plastic envelope press lower die structure convenient to adjust, before the use, the accessible starts electric telescopic handle C, electric telescopic handle C drives the slider, drive the fan of blowing to the slider, make the fan of blowing arrange plastic envelope mould in directly over, rethread starts electric telescopic handle B, electric telescopic handle B drives the sliding block, the sliding block drives the pole setting, the pole setting drives and connects the pole setting and realize reciprocating, blow the inside of fan to plastic envelope mould in the start, can realize the self-cleaning in the plastic envelope mould, not only can effectively improve cleaning efficiency and quality in the plastic envelope mould, and obviously reduced manufacturing cost and reduced occupation space.

Drawings

FIG. 1 is an overall structure diagram of the present invention;

FIG. 2 is a structural view of the support assembly of the present invention;

FIG. 3 is a structural diagram of the plastic package assembly;

FIG. 4 is a structural view of the clamping assembly of the present invention;

fig. 5 is a structural view of the cleaning assembly of the present invention.

In the figure: 1. a support base; 11. perforating; 12. an adjustment groove; 121. an electric telescopic rod A; 122. an adjusting block; 1221. a connecting rod; 13. a sliding groove; 131. an electric telescopic rod B; 132. a slider; 1321. erecting a rod; 2. adjusting the plastic package assembly; 21. a movable plate; 211. a connecting plate; 2111. a set screw; 212. a movable groove; 2121. a movable block; 2122. an electric push rod A; 2123. a plastic packaging press body; 213. a rotating electric machine; 2131. a movable shaft; 3. a clamping assembly; 31. plastic packaging the mold; 311. an electric push rod B; 3111. a clamping plate; 312. connecting a long rod; 4. cleaning the assembly; 41. a connecting round bar; 411. a loop bar; 4111. a push groove; 4112. an electric telescopic rod C; 4113. a sliding block is arranged; 4114. a connecting rod; 4115. an air blowing fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

For a further understanding of the present invention, reference is made to the following detailed description taken in conjunction with the accompanying drawings.

With reference to fig. 1, a semiconductor plastic package press lower die structure convenient to adjust comprises a supporting base 1, wherein an adjusting plastic package assembly 2 is arranged on the lower surface of the supporting base 1, a clamping assembly 3 is arranged on the upper surface of the supporting base 1, and a cleaning assembly 4 is arranged on the side surface of the supporting base 1.

The invention will be further described with reference to the following examples

The first embodiment is as follows:

referring to fig. 1 and 3, an adjustable lower die structure of a semiconductor plastic package press is provided, an adjustable plastic package assembly 2 includes a movable plate 21 disposed at a lower end of a through hole 11, a connecting plate 211 is disposed on a lower surface of the movable plate 21, a fixing screw 2111 is disposed inside the connecting plate 211, the connecting plate 211 is connected to the movable plate 21 by the fixing screw 2111, a movable groove 212 is disposed on one side of the connecting plate 211, a movable block 2121 is disposed inside the movable groove 212, the movable block 2121 is slidably connected to the movable groove 212, an electric push rod a2122 is disposed on a side surface of the movable block 2121, a plastic package press body 2123 is disposed on a lower surface of the electric push rod a2122, a rotating motor 213 is disposed on an upper end of the movable plate 21, a movable shaft 2131 is disposed on a lower surface of the rotating motor 213, the rotating motor 213 penetrates through the supporting base 1 and is connected to the movable plate 21 by the movable shaft 2131, when adjustment is required, the electric push rod a2122 can be activated, the rotating motor a2122 drives the movable block 2121, the rotating block 2123 to move forward and move in a direction, the plastic package press body 211 and the plastic package press is conveniently and the plastic package press is detached.

Example two:

referring to fig. 2 and 4, a lower die structure of a semiconductor plastic package press convenient to adjust, a through hole 11 is formed in the upper surface of a support base 1, adjustment grooves 12 are formed in two sides of the support base 1, an electric telescopic rod a121 is arranged on the bottom surface of the inner wall of each adjustment groove 12, an adjustment block 122 is arranged at one end of the electric telescopic rod a121, the adjustment block 122 is slidably connected with the adjustment grooves 12, a connecting rod 1221 is arranged on the outer surface of the adjustment block 122, a sliding groove 13 is formed in one side of each adjustment groove 12, a plastic package mold 31 is arranged on the upper surface of the support base 1, electric push rods B311 are arranged at two ends of the inner wall of the plastic package mold 31, a clamping plate 3111 is arranged at one end of each electric push rod B311, connecting rods 312 are arranged at two sides of the plastic package mold 31, the plastic package mold 31 is connected with the connecting rods 312 through the connecting rods 312, when the semiconductor plastic package press is used, the semiconductor plastic package press is aligned in the position of the mold 31 by placing the semiconductor plastic package, the electric push rods B311, the clamping plate 3111 drives the clamping plate 3111 to clamp the connecting rods 1221, and the connecting rods 1223 are driven by the electric telescopic rod a simple telescopic rod 122, and the telescopic rod 122 is moved towards the connecting rod 1223.

Example three:

please refer to fig. 5, a semiconductor plastic packaging press lower die structure convenient to adjust, inner wall bottom surface of sliding tray 13 is provided with electric telescopic handle B131, one end of electric telescopic handle B131 is provided with sliding block 132, sliding block 132 and sliding tray 13 sliding connection, the upper surface of sliding block 132 is provided with pole 1321, cleaning assembly 4 is including setting up the connection round bar 41 in pole 1321 side, the surface of connection round bar 41 is cup jointed and is provided with loop bar 411, push groove 4111 has been seted up to the side of loop bar 411, inner wall one end of push groove 4111 is provided with electric telescopic handle C4112, one end of electric telescopic handle C4112 is provided with slider 4113, slider 4113 and push groove 4111 sliding connection, the outer surface of slider 4113 is provided with joint rod 4114, one end of joint rod 4114 is provided with fan 4115 of blowing, before use, electric telescopic handle C4112 can be started, electric telescopic handle C4112 drives slider 4113, slider 4113 drives fan 4115 to blow, so that 4115 is placed directly over plastic packaging mold 31, after plastic packaging mold B131 is started, B131 drives pole 1321 to drive slider 1321 to blow and clean mold 13231, the inside plastic packaging mold 13231 can be realized by using electric telescopic handle.

In conclusion: a lower die structure of a semiconductor plastic package press convenient to adjust comprises a support base 1, an adjusting plastic package assembly 2 is arranged on the lower surface of the support base 1, a clamping assembly 3 is arranged on the upper surface of the support base 1, a cleaning assembly 4 is arranged on the side surface of the support base 1, when adjustment is needed, an electric push rod A2122 can be started, the electric push rod A2122 drives a movable block 2121, the movable block 2121 drives a plastic package press body 2123 to move back and forth, adjustment can be achieved according to different positions needing plastic package, a rotary motor 213 can be started, the rotary motor 213 drives a connecting plate 211, the connecting plate 211 drives the plastic package press body 2123 to rotate, the electric push rod A2122 drives the plastic package press body 2123 to move, the position of the plastic package press body 2123 can be finely adjusted at different positions and in different directions, the structure is simple, convenient to use reasonable in design, and convenient to detach, through placing the semiconductor tablet in the inside of plastic envelope mould 31 during the use, and then through starting electric putter B311, electric putter B311 drives grip block 3111 to carry out the centre gripping fixed to the both ends of semiconductor tablet, prevent to make the position skew that causes during the plastic envelope, and effectively aim at the position of semiconductor tablet, after the centre gripping finishes, through starting electric telescopic handle A121, drive regulating block 122, regulating block 122 drives connecting rod 1221, connecting rod 1221 drives connecting rod 312, connecting rod 312 then drives plastic envelope mould 31 and is close to the removal to plastic envelope press body 2123, thereby realize the plastic envelope, simple structure, high durability and convenient use, before the use, through starting electric telescopic handle C4112, electric telescopic handle C4112 drives slider 4113, slider 4113 drives fan 4115 to the slider 4113, make the fan 4115 of blowing arrange in directly over plastic envelope mould 31, and then, by starting the electric telescopic rod B131, the electric telescopic rod B131 drives the sliding block 132, the sliding block 132 drives the vertical rod 1321, the vertical rod 1321 drives the connecting round rod 41 to realize up-down movement, and the fan 4115 blows air to the inside of the plastic package mold 31 when being started, so that automatic cleaning in the plastic package mold 31 can be realized, the cleaning efficiency and quality in the plastic package mold 31 can be effectively improved, the production cost is obviously reduced, and the occupied space is reduced.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor plastic package press lower die structure convenient to adjust comprises a supporting base (1) and is characterized in that an adjusting plastic package assembly (2) is arranged on the lower surface of the supporting base (1), a clamping assembly (3) is arranged on the upper surface of the supporting base (1), and a cleaning assembly (4) is arranged on the side surface of the supporting base (1);

the upper surface of the supporting base (1) is provided with a through hole (11), two sides of the supporting base (1) are provided with adjusting grooves (12), the bottom surface of the inner wall of each adjusting groove (12) is provided with an electric telescopic rod A (121), and one end of each electric telescopic rod A (121) is provided with an adjusting block (122).

2. The semiconductor plastic packaging press lower die structure convenient to adjust of claim 1, characterized in that: adjusting block (122) and adjustment tank (12) sliding connection, the surface of adjusting block (122) is provided with connecting rod (1221), sliding tray (13) have been seted up to one side of adjustment tank (12), and the inner wall bottom surface of sliding tray (13) is provided with electric telescopic handle B (131).

3. The semiconductor plastic packaging press lower die structure convenient to adjust as claimed in claim 2, wherein: one end of the electric telescopic rod B (131) is provided with a sliding block (132), the sliding block (132) is in sliding connection with the sliding groove (13), and the upper surface of the sliding block (132) is provided with a vertical rod (1321).

4. The semiconductor plastic packaging press lower die structure convenient to adjust of claim 3, wherein: the adjusting plastic package assembly (2) comprises a movable plate (21) arranged at the lower end of the through hole (11), a connecting plate (211) is arranged on the lower surface of the movable plate (21), a fixing screw (2111) is arranged inside the connecting plate (211), and the connecting plate (211) is connected with the movable plate (21) through the fixing screw (2111).

5. The semiconductor plastic packaging press lower die structure convenient to adjust of claim 4, wherein: one side of the connecting plate (211) is provided with a movable groove (212), a movable block (2121) is arranged in the movable groove (212), the movable block (2121) is connected with the movable groove (212) in a sliding mode, and an electric push rod A (2122) is arranged on the side face of the movable block (2121).

6. The semiconductor plastic packaging press lower die structure convenient to adjust of claim 5, wherein: the plastic packaging press is characterized in that a plastic packaging press body (2123) is arranged on the lower surface of the electric push rod A (2122), a rotating motor (213) is arranged on one side of the upper end of the movable plate (21), a movable shaft (2131) is arranged on the lower surface of the rotating motor (213), and the rotating motor (213) penetrates through the support base (1) through the movable shaft (2131) and is connected with the movable plate (21).

7. The semiconductor plastic packaging press lower die structure convenient to adjust of claim 6, wherein: the plastic packaging device is characterized in that a plastic packaging mold (31) is arranged on the upper surface of the supporting base (1), electric push rods B (311) are arranged at two ends of the inner wall of the plastic packaging mold (31), a clamping plate (3111) is arranged at one end of each electric push rod B (311), connecting long rods (312) are arranged on two sides of the plastic packaging mold (31), and the plastic packaging mold (31) is connected with the connecting rods (1221) through the connecting long rods (312).

8. The semiconductor plastic packaging press lower die structure convenient to adjust of claim 3, wherein: clearance subassembly (4) are including setting up connection pole (41) in pole setting (1321) side, and the surface of connecting pole (41) cup joints and is provided with loop bar (411), and push groove (4111) have been seted up to the side of loop bar (411).

9. The semiconductor plastic packaging press lower die structure convenient to adjust of claim 8, wherein: inner wall one end that promotes groove (4111) is provided with electric telescopic handle C (4112), and the one end of electric telescopic handle C (4112) is provided with slider (4113), slider (4113) and promotion groove (4111) sliding connection.

10. The semiconductor plastic packaging press lower die structure convenient to adjust of claim 9, wherein: the outer surface of the slider (4113) is provided with a connecting rod (4114), and one end of the connecting rod (4114) is provided with a blowing fan (4115).