CN218364064U - Auxiliary clamp for sample polishing - Google Patents

Auxiliary clamp for sample polishing Download PDF

Info

Publication number
CN218364064U
CN218364064U CN202222124427.5U CN202222124427U CN218364064U CN 218364064 U CN218364064 U CN 218364064U CN 202222124427 U CN202222124427 U CN 202222124427U CN 218364064 U CN218364064 U CN 218364064U
Authority
CN
China
Prior art keywords
sample
fixed block
polishing
fixing block
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202222124427.5U
Other languages
Chinese (zh)
Inventor
徐昶
金晓
吴思明
周江
项国东
夏咸喜
朱保印
赖云亭
左敦桂
马芹征
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guodian Zhejiang Beilun No3 Power Generation Co ltd
China General Nuclear Power Corp
CGN Power Co Ltd
Suzhou Nuclear Power Research Institute Co Ltd
Original Assignee
Guodian Zhejiang Beilun No3 Power Generation Co ltd
China General Nuclear Power Corp
CGN Power Co Ltd
Suzhou Nuclear Power Research Institute Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guodian Zhejiang Beilun No3 Power Generation Co ltd, China General Nuclear Power Corp, CGN Power Co Ltd, Suzhou Nuclear Power Research Institute Co Ltd filed Critical Guodian Zhejiang Beilun No3 Power Generation Co ltd
Priority to CN202222124427.5U priority Critical patent/CN218364064U/en
Application granted granted Critical
Publication of CN218364064U publication Critical patent/CN218364064U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model relates to an auxiliary clamp for sample polishing, which comprises a first fixed block and a second fixed block, wherein the first fixed block is provided with an upper surface, a lower surface and an annular side surface connected between the upper surface and the lower surface; the second fixing block is provided with a through hole which is communicated up and down; in a using state, a sample to be polished is bonded on the upper surface or the lower surface of the first fixed block, at least part of the first fixed block is positioned in the through hole of the second fixed block, at least part of the sample to be polished extends out of the through hole and faces towards a polishing part for polishing the sample, and a gap is formed between the annular side surface of the first fixed block and the inner side wall of the second fixed block. The utility model provides an auxiliary fixture for sample polishing cooperatees through first fixed block and second fixed block, can keep treating polishing sample and throw the even attenuate of attenuate in-process at the essence, avoids appearing phenomenons such as corner collapse, edge collapse, improves the preparation yields of sample, promotes sample preparation efficiency.

Description

Auxiliary clamp for sample polishing
Technical Field
The utility model relates to an auxiliary clamp for sample polishing.
Background
In a thermal power supercritical unit, due to the fact that due to ultrahigh temperature and pressure, novel heat-resistant steel materials such as HR3C need to be used to meet the service requirements of the thermal power supercritical unit, but the microstructure of the heat-resistant steel can obviously change after long-term service to influence the mechanical property of the materials and further influence the safety of the unit, particularly, in the austenitic heat-resistant steel such as HR3C, the key to the change of the performance in the later stage of long-term service is that a large number of nanoscale second phases are precipitated inside the materials, and in order to quantitatively research the second phases and fundamentally understand the change of the mechanical property, the nanoscale second phases must be analyzed through a transmission electron microscope (transmission electron microscope for short) to master the property change rule of the HR3C heat-resistant steel.
The preparation process of a conventional transmission electron microscope sample suitable for HR3C comprises the steps of linear cutting sampling, rough polishing, fine polishing (thinning), hole corrosion and the like, wherein the linear cutting sampling is to cut a slice with the size of about 10mm multiplied by 1mm on an HR3C pipe in a spark-erosion wire cutting mode; then, carrying out double-sided rough polishing work on the slices cut and sliced by the linear cutting through 400#, 800#, 1200# and 2000# sandpaper respectively, aiming at removing oxide scales, linear cutting scratches, impurities and the like on the surfaces of two sides of the sample, so that the surface of the sample is glossy, the scratch depth is uniform, and the thickness of the sample can be reduced from 1mm to 0.3-0.5mm at this stage; and the next step is a fine polishing stage of the sample, wherein the sample is polished to about 60-80 μm, so that holes are easy to be uniform in the electrolytic double-spraying or ion reduction protection process, wafers with the diameter of 3mm are obtained on the sample with a certain size (10 mm multiplied by 10 mm) as much as possible, and then the phenomenon of 'corner collapse' or 'edge collapse' of the sample wafer (10 mm multiplied by 10 mm) is easy to occur in the process, which is caused by uneven stress of the wafer, particularly easily occurs in the preparation process of a laboratory technician with less skilled technology, so that the fine polishing process of the sample fails, the rough polishing work needs to be repeated instead of the sample, and the sample is wasted while the workload is increased.
At present, a glass cover plate or a wood plug is used when double-sided rough polishing work is carried out on a slice cut and cut by line cutting through 400#, 800#, 1200# and 2000# sandpaper respectively, for example, when the glass cover plate is used, a sample is bonded on the glass cover plate, the sample faces to the sandpaper, the glass cover plate is pressed to polish the sample, and in the form, the sample is inclined due to the inclination of manpower, so that the polishing is not uniform, and the polishing efficiency is low; if use the wooden plug, place the sample on abrasive paper, the wooden plug is placed on the sample, presses down the wooden plug again and promotes the sample and move on abrasive paper and polish the sample, under this kind of form, the sample is difficult for gluing on the wooden plug, removes the in-process sample that polishes and easily comes off the wooden plug, and the manpower can incline and lead to the sample slope for polish unevenly, these two kinds of modes can all make the sample can not evenly attenuate, appear phenomenons such as "corner collapse", "edge collapse".
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an auxiliary fixture for sample polishing to solve present sample essence and throw attenuate in-process sample evenly attenuate, phenomenons such as "corner collapse", "edge collapse" easily appear, and the equal low problem of sample preparation efficiency and yields.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
an auxiliary clamp for sample polishing comprises a first fixed block and a second fixed block, wherein the first fixed block is provided with an upper surface, a lower surface and an annular side surface connected between the upper surface and the lower surface; the second fixing block is provided with a through hole which is communicated up and down; in a using state, a sample to be polished is adhered to the upper surface or the lower surface of the first fixed block, the first fixed block is at least partially positioned in the through hole of the second fixed block, the sample to be polished at least partially extends out of the through hole and faces a polishing part for polishing the sample, and a gap is formed between the annular side surface of the first fixed block and the inner side wall of the second fixed block and is less than or equal to 0.5mm.
Preferably, the upper surface and/or the lower surface of the first fixed block are horizontal planes.
Preferably, the contour of the through hole of the second fixed block is consistent with the contour of the first fixed block.
Preferably, the cross section of the first fixed block and the through hole of the second fixed block are circular, polygonal, pentagonal or heart-shaped.
Preferably, the height of the first fixed block is greater than or equal to the height of the second fixed block.
Preferably, in a use state, a sample to be polished is adhered to the lower surface of the first fixed block, and the lower surface of the first fixed block is flush with the lower surface of the second fixed block.
Preferably, when the cross sections of the through hole of the first fixed block and the second fixed block are both circular, the difference between the diameter of the through hole of the second fixed block and the diameter of the first fixed block is 0.5-1mm.
Preferably, the wall thickness of the second fixed block is 2-5mm.
Preferably, the first fixing block and the second fixing block are made of metal.
Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the utility model provides an auxiliary fixture for sample polishing, through first fixed block and second fixed block cooperation, can keep treating polishing the sample and throw the even attenuate in the attenuate process, avoid appearing phenomenon such as "corner collapse", "edge collapse", improve the sample and throw the attenuate effect, greatly improve the preparation yields of sample, shorten sample preparation time, promote sample preparation efficiency; the sample processing operation is simple.
Drawings
Fig. 1 is a schematic structural diagram of a first fixing block of an auxiliary fixture for sample polishing provided by the present invention;
fig. 2 is a schematic structural diagram of a sample adhered to a first fixing block of the auxiliary fixture for sample polishing provided by the present invention;
fig. 3 is a schematic structural diagram of a second fixing block of the auxiliary fixture for sample polishing provided by the present invention;
fig. 4 is a schematic structural diagram of a use state of the auxiliary fixture for sample polishing according to the present invention.
In the above drawings: 1-first fixed block, 11-upper surface, 12-lower surface, 13-annular side surface, 2-second fixed block, 21-through hole, and 3-sample to be polished.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Referring to the auxiliary fixture for polishing the sample 3 shown in fig. 1, the auxiliary fixture for polishing can be used in the fine polishing stage of the sample 3 of the thermal power generating unit heated surface pipe HR3C heat-resistant steel transmission electron microscope, the sample 3 to be polished is connected to the auxiliary fixture, and then the sample 3 is polished on a polishing part through the auxiliary fixture, wherein the polishing part is sand paper.
The method for obtaining the HR3C heat-resistant steel transmission electron microscope sample 3 for the heated surface tube of the thermal power generating unit comprises the following steps: a test sample with a certain size is taken from an HR3C metal tube by a wire cut electrical discharge machining technology, and after a sample 3 is cut by the wire cut electrical discharge machining technology, an obvious cutting influence layer is left on the surface of the sample 3, so that double-sided rough polishing work needs to be carried out on the cut thin slices by wire cutting by using abrasive paper with different specifications respectively, the aim is to remove oxide skins, linear cutting scratches, impurities and the like on the surfaces of two sides of the sample 3, so that the surface of the sample 3 is glossy, the scratch depth is uniform, the thickness of the sample 3 can be reduced at the stage, and the sample 3 is the sample 3 to be polished in the embodiment.
In this example, the auxiliary jig for polishing the sample 3 includes a first fixed block 1 and a second fixed block 2, specifically:
the first fixing block 1 has an upper surface 11, a lower surface 12 and an annular side surface 13 connecting between the upper surface 11 and the lower surface 12, the upper surface 11 is located above the lower surface 12, the upper surface 11, the annular side surface 13 and the lower surface 12 enclose to form a columnar structure, and the cross section of the columnar structure is circular, polygonal (triangular, quadrilateral, pentagonal, rhombic and the like), pentagonal or heart-shaped, such as a cylinder or a square column.
When the sample 3 to be polished is polished, the sample 3 to be polished is fixed on the upper surface 11 or the lower surface 12 of the first fixed block 1, the sample 3 to be polished can be bonded on the upper surface 11 or the lower surface 12 of the first fixed block 1 in a bonding manner, for example, a hot melt adhesive (with a temperature of about 150 ℃) is uniformly applied on the plane of the first fixed block 1.
The second fixing block 2 is provided with a through hole 21 which is vertically through, namely a hollow space for accommodating the first fixing block 1 is formed, the outer contour and the through hole 21 of the second fixing block 2 are circular, polygonal (triangular, quadrilateral, pentagonal, rhombic and the like), pentagram-shaped or heart-shaped, and the second fixing block 2 can be a cylinder or a square column.
In a using state, a to-be-polished sample 3 is bonded on the upper surface 11 or the lower surface 12 of the first fixed block 1, the first fixed block 1 needs to be placed into the second fixed block 2 in the using process, the size of the through hole 21 of the second fixed block 2 needs to be larger than that of the first fixed block 1, when the first fixed block 1 is placed in the through hole 21 of the second fixed block 2, at least part of the first fixed block 1 is positioned in the through hole 21 of the second fixed block 2, at least part of the to-be-polished sample 3 extends out of the through hole 21 and faces a polishing part, namely, the to-be-polished surface of the to-be-polished sample 3 can be contacted with the polishing part after extending out of the through hole 21.
When the first fixed block 1 is at least partially positioned in the through hole 21 of the second fixed block 2, a small gap (see a in fig. 4) is formed between the annular side surface 13 of the first fixed block 1 and the inner side wall of the second fixed block 2, so that the first fixed block 1 can be conveniently placed in the through hole 21 of the second fixed block 2, and the first fixed block 1 cannot be separated from the second fixed block 2 in the moving process of the first fixed block 1 and the second fixed block 2 during grinding and polishing. The gap between the annular side surface 13 of the first fixing block 1 and the inner side wall of the second fixing block 2 is less than or equal to 0.5mm, such as 0.1mm, 0.2mm, 0.3mm, 0.4mm or 0.5mm.
When the auxiliary clamp is used for grinding and polishing the sample 3 to be polished on the polishing part, the specific implementation mode is as follows: the polishing part is placed on the workbench, a roughly polished sample 3 is bonded on the lower surface 12 of the first fixing block 1, the second fixing block 2 is sleeved outside the first fixing block 1, the surface of the first fixing block 1, on which the sample 3 is bonded, faces the polishing part, then the second fixing block 2 is pushed to drive the first fixing block 1 to horizontally move back and forth (move left and right) on the polishing part, the upper surface 11 of the first fixing block 1 needs to be pressed by hands during movement, and the sample 3 to be polished is fully and finely polished and thinned under the action of the gravity of the first fixing block 1 until the thickness of the sample 3 is thinned to the required size. In the moving process, the first fixing block 1 and the second fixing block 2 move in the left and right directions at the same time, the first fixing block 1 slightly moves in the up and down directions relative to the second fixing block 2, and the first fixing block 1 does not move relative to the second fixing block 2 in the left and right directions.
The second fixing block 2 is arranged to fix the verticality of the first fixing block 1, in the polishing process, the first fixing block 1 cannot be stressed in the inclined direction, namely the first fixing block 1 cannot tilt, the stress uniformity in the left-right direction movement in the polishing process of a sample 3 on the first fixing block 1 can be guaranteed, the thinning of each position of the sample 3 in the fine polishing thinning process is uniform, the phenomena of 'corner collapse' and the like are not prone to occurring, the polishing failure caused by human factors is eliminated, the yield of the HR3C fine polishing thinning process can be effectively improved, and the fixture can accelerate the sample 3 preparation process.
In this example, the contour of the through hole 21 of the second fixing block 2 is consistent with the contour of the first fixing block 1, so that the second fixing block 2 can be conveniently sleeved outside the first fixing block 1, and the second fixing block 2 can be conveniently separated from the first fixing block 1.
In this example, the upper surface 11 and/or the lower surface 12 of the first fixed block 1 are horizontal surfaces, and if the sample 3 to be polished is adhered to the upper surface 11 of the first fixed block 1, the upper surface 11 is a horizontal surface; if the sample 3 to be polished is bonded on the lower surface 12 of the first fixing block 1, the lower surface 12 is a horizontal plane, usually, the polishing part is horizontally placed, when the sample 3 is polished, the polishing sample 3 is horizontally placed, and when the clamp is moved, the polishing sample 3 also horizontally moves, so that the sample 3 is uniformly thinned at each position in the fine polishing and thinning process.
The height of the first fixed block 1 is greater than or equal to that of the second fixed block 2, and in a use state, the surface of the first fixed block 1, on which the sample 3 to be polished is bonded, can be flush with the lower surface 12 of the second fixed block 2.
In one embodiment, in a using state, the sample 3 to be polished is adhered to the lower surface 12 of the first fixed block 1, the upper surface 11 of the first fixed block 1 is flush (located on the same horizontal plane) with the upper surface 11 of the second fixed block 2, the lower surface 12 of the first fixed block 1 is flush (located on the same horizontal plane) with the lower surface 12 of the second fixed block 2, at this time, the height of the first fixed block 1 is equal to the height of the second fixed block 2, at this time, the sample 3 to be polished completely extends out of the through hole 21 of the second fixed block 2, and the sample 3 to be polished is conveniently polished.
In this example, the surfaces of the first fixed block 1 and the second fixed block 2 are smooth, so that the sample 3 to be polished is prevented from being damaged by rough surfaces such as sharp or sawtooth surfaces.
When the first fixing block 1 and the second fixing block 2 are both of a cylindrical structure, the through hole 21 of the first fixing block 1 is circular, and the diameter of the through hole 21 of the second fixing block 2 needs to be 0.5-1mm larger than the outer diameter of the first fixing block 1. Referring to fig. 1 and 2, the first fixing block 1 has a cylindrical structure and has a size of
Figure BDA0003795696430000051
The second fixing block 2 has a circular ring structure with a through hole 21, see fig. 3, and has a size of
Figure BDA0003795696430000052
The diameter of the through hole 21 is larger than the diameter of the outer circle of the second fixing block 2The diameter of the through hole 21 is 2-5mm, and the wall thickness is preferably 3 mm.
The first fixing block 1 and the second fixing block 2 are made of metal, preferably stainless steel, and are firm and durable.
The specific embodiment of polishing the sample 3 using the auxiliary jig of the present application is as follows:
1) Taking a sample with the size of 10mm + 1mm in an HR3C metal tube by using a wire cut electrical discharge machining technology, reserving an obvious cutting influence layer on the surface of the sample 3 after the wire cut electrical discharge machining of the sample 3, alternately polishing the sample 3 by using 400#, 800#, 1200# and 2000# abrasive paper until the cutting influence layer on the surface of the sample 3 completely disappears, and then placing the sample 3 in alcohol for cleaning and drying the sample 3 for later use by using a hot air blower;
2) Heating a hot melt adhesive (the temperature is about 150 ℃) on a heating table, uniformly coating the hot melt adhesive on the plane of the first fixing block 1, as shown in fig. 2, lightly pressing a sample 3 by using tools such as tweezers and the like, discharging redundant hot melt adhesive from the joint surface of the sample 3 and the first fixing block 1, washing the sample 3 by using room-temperature deionized water, cooling the hot melt adhesive, and ensuring that the sample 3 is firmly bonded with the first fixing block 1;
3) The surface of the first fixing block 1, on which the sample 3 is adhered, faces to the sand paper, the recommended size of the sand paper is 2000#, the second fixing block 2 is sleeved outside the first fixing block 1, as shown in fig. 4, the second fixing block 2 is moved by hand (the first fixing block 1 is pressed) in the fine polishing and thinning process to drive the first fixing block 1 to move, and the sample 3 is fully and finely polished and thinned under the action of the gravity of the first fixing block 1 until the thickness of the sample 3 is thinned to the required size.
After polishing, the second fixed block 2 is separated from the first fixed block 1, and then the first fixed block 1 and the sample 3 are placed into an acetone solution for ultrasonic treatment, so that the sample 3 can be separated from the first fixed block 1.
The utility model provides an auxiliary fixture for polishing of sample 3 cooperatees through first fixed block 1 and second fixed block 2, can keep treating polishing sample 3 and throw the even attenuate of attenuate in-process at the essence, avoids appearing phenomenons such as "corner collapse", "edge collapse", and sample 3 processing is simple simultaneously, and polishing speed is fast, is particularly suitable for the new hand of transmission electron microscope sample 3 preparation, very big improvement HR3C electron microscope sample 3's preparation yields, shorten sample 3 preparation time, raises the efficiency.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims (9)

1. An auxiliary clamp for sample polishing is characterized by comprising a first fixed block and a second fixed block, wherein the first fixed block is provided with an upper surface, a lower surface and an annular side surface connected between the upper surface and the lower surface; the second fixing block is provided with a through hole which is communicated up and down; in a using state, a sample to be polished is bonded on the upper surface or the lower surface of the first fixed block, at least part of the first fixed block is positioned in the through hole of the second fixed block, at least part of the sample to be polished extends out of the through hole and faces a polishing part for polishing the sample, and a gap is formed between the annular side surface of the first fixed block and the inner side wall of the second fixed block and is smaller than or equal to 0.5mm.
2. The auxiliary fixture for sample polishing as claimed in claim 1, wherein the upper surface and/or the lower surface of the first fixing block is a horizontal surface.
3. The auxiliary jig for sample polishing as claimed in claim 1 or 2, wherein the contour of the through hole of the second fixing block is maintained to be identical to the outer contour of the first fixing block.
4. The auxiliary fixture for sample polishing as claimed in claim 1 or 2, wherein the cross-section of the first fixing block and the through-hole of the second fixing block are circular, polygonal, pentagonal or heart-shaped.
5. The auxiliary fixture for sample polishing as claimed in claim 1, wherein the height of the first fixing block is equal to or greater than the height of the second fixing block.
6. The auxiliary fixture for sample polishing as claimed in claim 5, wherein in a use state, a sample to be polished is adhered to a lower surface of the first fixing block, and the lower surface of the first fixing block is flush with the lower surface of the second fixing block.
7. The auxiliary fixture for sample polishing as claimed in claim 1, wherein when the cross-sections of the through-hole of the first fixed block and the second fixed block are both circular, the difference between the diameter of the through-hole of the second fixed block and the diameter of the first fixed block is 0.5-1mm.
8. The auxiliary fixture for sample polishing as claimed in claim 1, wherein the wall thickness of the second fixing block is 2-5mm.
9. The auxiliary jig for sample polishing as claimed in claim 1, wherein the first fixing block and the second fixing block are made of metal.
CN202222124427.5U 2022-08-12 2022-08-12 Auxiliary clamp for sample polishing Active CN218364064U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222124427.5U CN218364064U (en) 2022-08-12 2022-08-12 Auxiliary clamp for sample polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222124427.5U CN218364064U (en) 2022-08-12 2022-08-12 Auxiliary clamp for sample polishing

Publications (1)

Publication Number Publication Date
CN218364064U true CN218364064U (en) 2023-01-24

Family

ID=84966499

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222124427.5U Active CN218364064U (en) 2022-08-12 2022-08-12 Auxiliary clamp for sample polishing

Country Status (1)

Country Link
CN (1) CN218364064U (en)

Similar Documents

Publication Publication Date Title
US4519168A (en) Liquid waxless fixturing of microsize wafers
JP5953645B2 (en) Semiconductor substrate cutting method and semiconductor substrate cutting apparatus
CN102357777A (en) Processing method for tiny thin-wall part
JP2012109358A (en) Cutting method and cutting device of semiconductor substrate
CN206230381U (en) A kind of glass board material fixture
CN218364064U (en) Auxiliary clamp for sample polishing
JP6703073B2 (en) Wafer processing method and wafer processing system
CN112834300B (en) Preparation method of metal material transmission electron microscope slice sample
CN112108960B (en) Plane optical part polishing tool assembly and operation method
JP6081006B2 (en) Wafer cleaving method and wafer cleaving apparatus
GB2058620A (en) A method and apparatus for effecting the lapping of wafers of semiconductive material
CN217859910U (en) Burr grinding device is used in processing of jaw breaker upper cover plate
CN211332558U (en) Clamp for grinding transmission electron microscope sample
JP6327490B2 (en) Wafer processing apparatus and wafer processing method
JP2019012848A (en) Wafer processing method and wafer processing system
CN205786026U (en) A kind of auxiliary clamp being applicable to small size wire rod and thin plate sample metallographic sample preparation
JP6593663B2 (en) Wafer processing method and wafer processing system
CN206536311U (en) Plate clamp on a kind of optical manufacturing of direct turn-over
CN217719553U (en) Clamping equipment for semiconductor processing
JP6249318B2 (en) Manufacturing system and manufacturing method of thin chip having high bending strength
CN106706401B (en) Slice class gold phase analysis sample fixture
KR20150026770A (en) Method of dividing semiconductor wafer
JP6081008B2 (en) Wafer processing apparatus and wafer processing method
JP2020080409A (en) Laser processing system and laser processing method
JP2019169719A (en) Laser processing system

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant