CN218362564U - Chip dismounting device for PCBA - Google Patents

Abstract

The utility model discloses a chip disassembling equipment for PCBA. The chip detachment apparatus includes: frame, adjusting part, heating element and dismantlement subassembly, the frame is used for fixed PCBA, heating element passes through adjusting part with the frame is connected, adjusting part is used for adjusting heating element for the position of frame, heating element is used for the orientation PCBA blows hot-blastly, the dismantlement subassembly is located the frame, the dismantlement subassembly is used for pulling down PCBA's chip. According to the utility model discloses a chip disassembly equipment for PCBA, accessible adjusting part adjusts heating element's position to make heating element blow hot-blastly towards chip and PCB board junction, and pull down PCBA's chip through dismantling the subassembly, thereby be favorable to reducing PCBA's the chip and dismantle the degree of difficulty, reduce operation personnel's intensity of labour, promote PCBA's chip and dismantle efficiency.

Description

Chip dismounting device for PCBA

Technical Field

The utility model relates to a chip disassembly equipment technical field particularly, relates to a chip disassembly equipment for PCBA.

Background

In the correlation technique, PCBA is when the maintenance, the dismantlement of chip is generally manual operation, the operation personnel need handheld hot-blast rifle heating PCBA's chip, treat that the solder melts the back and take off the chip through tweezers, in this operation process, need control the distance of hot-blast rifle and chip, both prevent the overtemperature, the air current and the pressure of mastering hot-blast rifle again, still draw the pad of the fixed chip on the PCB board easily when the operation is improper, the dismantlement process of chip is comparatively complicated, the operation is wasted time and energy.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the above-mentioned technical problem among the prior art to a certain extent at least. Therefore, the utility model provides a chip disassembly equipment for PCBA, the degree of difficulty is dismantled to reducible PCBA's chip, promotes PCBA's chip and dismantles efficiency.

According to the utility model discloses a chip dismounting device for PCBA, include: the rack is used for fixing the PCBA; a conditioning assembly and a heating assembly, the heating assembly being connected to the rack through the conditioning assembly, the conditioning assembly for conditioning a position of the heating assembly relative to the rack, the heating assembly for blowing hot air toward the PCBA; the disassembly component is arranged on the rack and used for disassembling the chip of the PCBA.

According to the utility model discloses a chip disassembly equipment for PCBA, accessible adjusting part adjusts heating element's position to make heating element blow hot-blastly towards chip and PCB board junction, and pull down PCBA's chip through dismantling the subassembly, thereby be favorable to reducing PCBA's the chip and dismantle the degree of difficulty, reduce operation personnel's intensity of labour, promote PCBA's chip and dismantle efficiency.

According to some embodiments of the utility model, the frame has mounting platform, mounting platform is used for fixing PCBA, mounting platform be equipped with PCBA's the corresponding hole of dodging of chip, the dismantlement subassembly is including the dismantlement portion, the at least partial structure of dismantlement portion is located the mounting platform below, the dismantlement portion is suitable for passing dodge the hole will PCBA's chip is pulled down.

Further, the chip dismounting device for the PCBA further comprises a jig, wherein the jig is detachably arranged on the mounting platform, and the jig is provided with a mounting groove for fixing the PCBA.

Further, mounting platform is equipped with first magnetism and inhales connecting portion, the tool be equipped with first magnetism inhale connecting portion magnetism and inhale the connecting portion are inhaled to the complex second magnetism.

Further, the adjustment assembly includes: rotatory lift portion and installation department, the installation department passes through rotatory lift portion with the frame is connected, rotatory lift portion is used for adjusting the installation department for mounting platform's position, heating element with the installation department is connected.

Further, the rotation and elevation unit includes: the sliding rod is connected with the rack and extends along the height direction of the rack; the slider, the slider is rotatable and locate slidable the slide bar, just be equipped with on the slider be suitable for with slide bar locking complex locking knob, the installation department with the slider is connected.

Further, the slider still is equipped with lift knob and lifing arm, the lift knob is used for adjusting the height of lifing arm, the installation department with the lifing arm is connected.

Further, the installation department includes fixed mounting arm and first locating part, first locating part is suitable for fixedly heating element, the one end of fixed mounting arm with rotatory lift portion is connected, the other end and the first locating part of fixed mounting arm are connected.

Furthermore, the installation part further comprises a movable installation arm and a second limiting part, the second limiting part is suitable for fixing the heating assembly, one end of the movable installation arm is rotatably connected with the fixed installation arm, and the other end of the movable installation arm is rotatably connected with the second limiting part.

According to some embodiments of the present invention, the heating assembly comprises a hot air gun and a wind guiding gun head, wherein the wind guiding gun head is rotatably disposed at an air outlet of the hot air gun; the wind guide gun head is provided with a wind guide inlet and a wind guide outlet which are communicated, the wind guide inlet is suitable for being communicated with the air outlet, a wind shielding piece is arranged at the wind guide outlet, and an air outlet gap is formed between the wind shielding piece and the inner side wall of the wind guide outlet.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic diagram of a chip detachment apparatus according to an embodiment of the present invention;

fig. 2 is a schematic view of a mounting platform and a detachment assembly according to an embodiment of the present invention;

fig. 3 is a schematic view of an installation platform, a disassembly assembly, a fixture, and a PCBA according to an embodiment of the present invention;

fig. 4 is a schematic view of the air guide gun head at the air outlet according to the embodiment of the present invention.

Reference numerals:

the air guide gun comprises a rack 1, an installation platform 11, an avoidance hole 111, a first magnetic suction connecting part 112, a first limiting strip 1121, a second limiting strip 1122, a bottom plate 12, a support column 13, an adjusting component 2, a rotary lifting part 21, a slide rod 211, a slide block 212, a locking knob 213, a lifting knob 214, a lifting arm 215, an installation part 22, a fixed installation arm 221, a first limiting part 222, a movable installation arm 223, a second limiting part 224, a heating component 3, a hot air gun 31, an air guide gun head 32, a wind shielding part 321, an inner side wall 322, an air outlet gap 323, a dismounting component 4, a dismounting part 41, a handle part 42, a jig 5, chip dismounting equipment 10, a PCBA20, a chip 201 and a PCB 202.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

A chip detachment apparatus 10 for a PCBA20 in accordance with an embodiment of the present invention is described in detail below in conjunction with fig. 1-4.

Referring to FIG. 1, a chip detachment apparatus 10 for a PCBA20 includes: frame 1, adjusting part 2, heating element 3 and dismantlement subassembly 4, wherein:

the rack 1 is used for fixing a PCBA20 (Printed Circuit Board Assembly), the PCBA20 includes a PCB 202 and an electrical component fixed on the Circuit Board, the electrical component may be a chip 201, a capacitor, a resistor, etc., wherein the chip 201 may be an integrated module of BGA (ball grid array) or QFN (quad flat non-leaded package), and the PCBA20 may be placed in the rack 1 and fixed with the rack 1.

Heating element 3 passes through adjusting part 2 and is connected with frame 1, adjusting part 2 is used for adjusting the position of heating element 3 for frame 1, heating element 3 is used for blowing hot-blast towards PCBA20, that is to say, adjusting part 2 is connected with frame 1, heating element 3 is connected with adjusting part 2, adjusting part 2 can be the arm, devices such as lift slide rail, heating element 3 can be hot-blast rifle 31, the position of heating element 3 is adjusted to accessible adjusting part 2, thereby make heating element 3 blow hot-blast towards waiting to tear chip 201 and PCB board 202 junction on PCBA20 open, the hot-blast soldering tin that blows off of heating element 3 between chip 201 and PCB board 202 melts, so that demolish chip 201.

Frame 1 is located to dismantlement subassembly 4, and dismantlement subassembly 4 is used for dismantling chip 201 of PCBA20, and dismantlement subassembly 4 can be devices such as crowbar, electric lift subassembly, vacuum chuck, and dismantlement subassembly 4 can melt back chip 201 and PCB board 202 separation at soldering tin to realize the dismantlement of chip 201.

According to the utility model discloses a chip disassembly equipment 10 for PCBA20, accessible adjusting part 2 adjusts heating element 3's position to make heating element 3 blow hot-blastly towards chip 201 and PCB board 202 junction, and pull down PCBA 20's chip 201 through dismantling subassembly 4, thereby be favorable to reducing PCBA 20's chip 201 and dismantle the degree of difficulty, reduce operation personnel's intensity of labour, promote PCBA 20's chip 201 and dismantle efficiency.

In some embodiments of the present invention, as shown in fig. 1 to 3, the rack 1 has a mounting platform 11, the mounting platform 11 is used for fixing the PCBA20, so as to ensure the stability of the PCBA20 when the chip 201 is detached, the mounting platform 11 is provided with an avoiding hole 111 corresponding to the chip 201 of the PCBA20, the detaching assembly 4 includes a detaching portion 41, at least a part of the structure of the detaching portion 41 is disposed below the mounting platform 11, and the detaching portion 41 is suitable for passing the avoiding hole 111 to detach the chip 201 of the PCBA 20.

It should be noted that, the PCB 202 is provided with an opening at a position corresponding to the chip 201, the opening is a through hole, and meanwhile, the external contour dimension of the opening is smaller than the dimension of the chip 201, and the contact on the chip 201 and the corresponding contact outside the opening of the PCB 202 are fixed and electrically connected by soldering, and the opening of the PCB 202 can accommodate components on other PCBAs 20 when multiple PCBAs 20 are stacked, so as to facilitate the improvement of the space utilization rate when the PCBAs 20 are stacked, and thus, when the detaching portion 41 passes through the avoiding hole 111 and moves toward the chip 201 after the soldering tin between the chip 201 and the PCB 202 is melted, the detaching portion 41 also passes through the opening on the PCB 202 to jack up the chip 201 and separate the chip 201 from the PCB 202, thereby detaching the chip 201 of the PCBAs 20.

In some embodiments of the present invention, as shown in fig. 1-3, the detaching assembly 4 may be a pry bar, the pry bar may be an "L" shaped structure, the pry bar includes a handle portion 42 and a detaching portion 41 connected to each other, the handle portion 42 may extend out of the mounting platform 11 along the horizontal direction, the detaching portion 41 may extend along the gravity direction, the pry bar may be installed below the mounting platform 11 and hinged to the frame 1, after the solder between the chip 201 and the PCB 202 melts, the detachable portion 41 may be raised by pressing the handle portion 42 downward, so as to jack up the chip 201 and separate the chip 201 from the PCB 202.

Further, referring to fig. 1, the rack 1 further has a bottom plate 12 and a plurality of support columns 13 located below the mounting platform 11, the bottom plate 12 is connected to the mounting platform 11 through the plurality of support columns 13, the detaching assembly 4 can be disposed between the mounting platform 11 and the bottom plate 12, the number of the plurality of support columns 13 can be 4, and the height of the support columns 13 can be 4cm to 5cm, so as to ensure a movable space of the detaching assembly 4, and to make the force of the detaching portion 41 acting on the chip 201 moderate, which is safe and reliable, and prevents the pad on the PCB 202 from being damaged by pulling when the chip 201 is lifted up.

In other embodiments of the utility model, dismantlement subassembly 4 can be the electric lift subassembly, and dismantlement portion 41 is the push rod of the liftable of electric lift subassembly, and the below of mounting platform 11 is located to the electric lift subassembly, and after soldering tin between chip 201 and PCB board 202 melts, steerable electric lift subassembly drive push rod rises to make chip 201 and PCB board 202 separate, thereby realize pulling down PCBA 20's chip 201.

In some embodiments of the utility model, referring to fig. 1, chip disassembling device 10 still includes tool 5, and mounting platform 11 is located to tool 5 detachably, and tool 5 is equipped with the mounting groove that is used for fixed PCBA20, and the shape of mounting groove can follow shape with PCBA 20's border to it is spacing to make the mounting groove fix PCBA20, prevents that heating element 3 from blowing when hot-blast towards PCBA20 that PCBA20 takes place to rock. It can be understood that each kind of PCBA20 can be provided with the corresponding jig 5, and the chip detachment apparatus 10 can adapt to various PCBA20 by increasing the jig 5, so as to improve the universality of the chip detachment apparatus 10 and reduce the cost and the manufacturing cycle of the chip detachment apparatus 10. In addition, PCBA20 can be fixed in tool 5 earlier, then installs PCBA20 and tool 5 in step and mounting platform 11, that is to say, can divide into PCBA20 and mounting platform 11's fixed two stations, and one station is fixed PCBA20 and tool 5 outside mounting platform 11, and another station is installed the tool 5 that is fixed with PCBA20 in mounting platform 11 to the line production promotes chip dismounting device 10 and dismantles efficiency to chip 201.

The utility model discloses an in some embodiments, tool 5 is equipped with vertical spacing portion, vertical spacing portion has limit state and non-limit state, under limit state, vertical spacing portion at least part is located the top of mounting groove, so that vertical spacing portion compresses tightly the upper surface of PCB board 202, prevent that dismantlement portion 41 from upwards lifting PCB board 202 when dismantling chip 201, guarantee that chip 201 and PCB board 202 separate when dismantling, under non-limit state, the top of mounting groove can be avoided to vertical spacing portion, so that PCBA20 puts into or takes out the mounting groove.

In some embodiments of the present invention, the longitudinal limiting portion includes: spacing axle, pressure spring and gag lever post, the mounting groove outside of tool 5 is located to spacing axle, the gag lever post is worn to locate spacing axle and rotationally is connected with spacing axle, pressure spring wears to locate spacing axle, and the pressure spring upper end is only supported in the upper end of spacing axle, pressure spring's lower extreme is only supported in the gag lever post, when the state of vertical spacing portion is switched to needs, can upwards mention the gag lever post and rotate, the spring is compressed this moment, loosen behind the gag lever post, the gag lever post can be in the effect of spring reset force down motion and compress tightly the outside of mounting groove or at least part compress tightly the upper surface of PCB board 202.

The utility model discloses an in some embodiments, mounting platform 11, tool 5 and dismantlement portion 41 are all for preventing static material spare to prevent the static gathering, avoid damaging chip 201 and other electrical components at the dismantlement in-process static of chip 201, wherein, mounting platform 11 can adopt the bakelite board, and the bakelite board is insulating to prevent static, and has advantages such as stand wear and tear and indeformable, in order to guarantee its structural strength.

The utility model discloses an in some embodiments, refer to fig. 2 and show, mounting platform 11 is equipped with first magnetism and inhales connecting portion 112, tool 5 is equipped with and inhales connecting portion 112 magnetism and inhales the complex second magnetism and inhale connecting portion with first magnetism, inhale connecting portion 112 magnetism through first magnetism and inhale the magnetic force attraction of connecting portion to the second magnetism, can realize tool 5 accurately fast with mounting platform 11's installation and location, and simultaneously, the cooperation is inhaled to magnetism of connecting portion 112 second magnetism, still be convenient for pull down tool 5 on mounting platform 11, thereby owing to promote chip dismounting device 10's use experience and chip 201 dismantlement efficiency.

In some embodiments of the present invention, the first magnetic attraction connecting portion 112 includes: first spacing 1121, second spacing 1122 and a plurality of first permanent magnet, first spacing 1121 and second spacing 1122 separate and all fixed with mounting platform 11, and first spacing 1121 and second spacing 1122 all are equipped with along a plurality of first mounting holes of length direction interval arrangement, can fix at least one first permanent magnet in every first mounting hole.

When tool 5 and mounting platform 11 are fixed, tool 5 can be put into between first spacing 1121 and the spacing 1122 of second, connecting portion is inhaled to tool 5's second magnetism includes first spacing limit, spacing limit of second and a plurality of second permanent magnet, first spacing limit structure is the border of tool 5 towards first spacing 1121, the spacing limit of second structure is the border of tool 5 towards the spacing 1122 of second, first spacing limit and the spacing limit of second all are equipped with a plurality of second mounting holes of arranging along length direction interval, can fix at least one second permanent magnet in every second mounting hole, the second permanent magnet can attract each other with first permanent magnet, in order to realize tool 5 and mounting platform 11's location and fixed.

In some embodiments of the present invention, the mounting groove at least partially runs through the jig 5 in the thickness direction of the jig 5, when the first magnetic attraction connecting portion 112 and the second magnetic attraction connecting portion are magnetically attracted to be matched, the opening on the PCB 202 in the mounting groove is aligned with the detaching portion 41, so that when the PCBA20 is replaced each time, the repeated adjustment of the position of the PCBA20 or the detaching portion 41 can be avoided, and the detaching portion 41 can directly pass through the opening on the avoiding hole 111, the mounting groove and the PCB 202 when ascending to detach the chip 201.

In some embodiments of the present invention, referring to fig. 1, the adjusting assembly 2 comprises: rotatory lift portion 21 and installation department 22, installation department 22 is connected with frame 1 through rotatory lift portion 21, rotatory lift portion 21 is used for adjusting the position of installation department 22 for mounting platform 11, heating element 3 is connected with installation department 22, rotatory lift portion 21 accessible goes up and down, the spatial position of mode such as rotation adjustment installation department 22 for mounting platform 11, thereby make the air outlet of the heating element 3 who is connected with installation department 22 just to waiting to tear chip 201 on PCBA20 with appropriate height, and blow hot-blastly to the junction of chip 201 that waits to tear and PCB board 202, so that adjusting part 2 can carry out the dismantlement of chip 201 to different models, the PCBA20 that the chip 201 position is different.

In some embodiments of the present invention, referring to fig. 1, the rotary elevating unit 21 includes: the sliding device comprises a sliding rod 211 and a sliding block 212, the sliding rod 211 is connected with the frame 1, the sliding rod 211 extends along the height direction of the frame 1, the sliding block 212 is rotatably and slidably arranged on the sliding rod 211, a locking knob 213 suitable for being in locking fit with the sliding rod 211 is arranged on the sliding block 212, the mounting portion 22 is connected with the sliding block 212, the sliding block 212 can be sleeved on the sliding rod 211, the sliding block 212 can slide and ascend and descend along the extending direction of the sliding rod 211, the sliding block 212 can also rotate on the sliding rod 211, the locking knob 213 is provided with a screw rod in threaded fit with the sliding block 212, when the locking knob 213 is rotated to enable the screw rod to be abutted against the sliding rod 211, the sliding block 212 and the sliding rod 211 are locked and fixed, and when the locking knob 213 is rotated to enable the screw rod to be separated from the sliding rod 211, so that the positions of the mounting portion 22 and the heating assembly 3 can be adjusted. Optionally, the sliding rod 211 is made of a stainless steel pipe with a smooth surface, so as to reduce friction resistance as much as possible and facilitate lifting and rotating operation of the sliding block 212.

In some embodiments of the present invention, referring to fig. 1, the slider 212 is further provided with a lifting knob 214 and a lifting arm 215, the lifting knob 214 is used for adjusting the height of the lifting arm 215, the mounting portion 22 is connected with the lifting arm 215, the height of the lifting arm 215 relative to the mounting platform 11 can be accurately adjusted by the lifting knob 214, and when the height of the heating assembly 3 is adjusted, the slider 212 is prevented from rotating relative to the sliding rod 211, so as to realize accurate adjustment of the height of the heating assembly 3 on the mounting portion 22.

Alternatively, the lifting knob 214 and the lifting arm 215 may be engaged by a rack and pinion mechanism, and the gear may be driven to rotate by rotating the lifting knob 214, and the gear may drive the rack and the lifting arm 215 connected to the rack to be lifted, wherein the rack and pinion mechanism has a self-locking characteristic, and the lifting arm 215 may maintain its original height without rotating the lifting knob 214.

In some embodiments of the present invention, referring to fig. 1, the installation portion 22 includes a fixed installation arm 221 and a first limiting member 222, the first limiting member 222 is suitable for fixing the heating element 3, one end of the fixed installation arm 221 is connected to the rotating lifting portion 21, the other end of the fixed installation arm 221 is connected to the first limiting member 222, the first limiting member 222 may be an annular member, a first limiting installation hole is provided in the first limiting member 222, the heating element 3 may be disposed in the first limiting installation hole, the fixed installation arm 221 may separate the heating element 3 from the rotating lifting portion 21, so as to avoid interference between the heating element 3 and the rotating lifting portion 21.

In some embodiments of the present invention, the first locating member 222 may be provided with a second locking knob, and the second locking knob is adapted to cooperate with the heating assembly 3 in the first limiting installation hole in a locking manner, so as to prevent the heating assembly 3 from shaking and rotating. Specifically, the second locking knob is provided with a second screw rod in threaded fit with the first limiting member, when the second locking knob is rotated to make the second screw rod abut against the heating assembly 3, the heating assembly 3 is locked and fixed with the first limiting member 222, and when the second locking knob is rotated to make the second screw rod separate from the heating assembly 3, the heating assembly 3 can be detached from the first limiting member 222.

In some embodiments of the present invention, the fixed mounting arm 221 is a retractable structure, that is, the length of the fixed mounting arm 221 is adjustable, so as to improve the adjustable degree of freedom of the heating assembly 3 relative to the position of the frame 1, and improve the universality of the chip detachment apparatus 10. Alternatively, the fixed mounting arm 221 is configured as a telescoping rod.

In some embodiments of the present invention, as shown in fig. 1, the mounting portion 22 further includes a movable mounting arm 223 and a second limiting member 224, the second limiting member 224 is suitable for fixing the heating element 3, one end of the movable mounting arm 223 is rotatably connected to the fixed mounting arm 221, the other end of the movable mounting arm 223 is rotatably connected to the second limiting member 224, the second limiting member 224 may be an annular member, a second limiting mounting hole is disposed in the second limiting member 224, the movable mounting arm 223 and the second limiting member 224 can be rotated, so that the second limiting mounting hole of the second limiting member 224 is sleeved on the heating element 3, so as to increase the limitation of the mounting portion 22 on the heating element 3, and prevent the heating element 3 from shaking, and the second limiting member 224 can be separated from the heating element 3 by rotating the movable mounting arm 223 and the second limiting member 224, so as to detach the heating element 3 from the mounting portion 22. Optionally, one end of the movable mounting arm 223 is hinged to the fixed mounting arm 221, and the other end of the movable mounting arm 223 is hinged to the second limiting member 224.

It can be understood that, when the heating element 3 is fixed to the mounting portion 22, the heating element 3 may first penetrate into the first limiting mounting hole, and then the movable mounting arm 223 and the second limiting member 224 are rotated, so that the second limiting member 224 is sleeved on the outer side of the heating element 3 above the first limiting member 222, so as to ensure the reliability of the mounting portion 22 for fixing the heating element 3.

In some embodiments of the utility model, refer to fig. 1 and fig. 4, heating element 3 includes hot-blast rifle 31 and wind-guiding rifle head 32, wind-guiding rifle head 32 rotationally locates hot-blast rifle 31's air outlet, wind-guiding rifle head 32 is equipped with the wind-guiding import and the wind-guiding export of intercommunication, the wind-guiding import is suitable for and communicates with the air outlet, the wind-guiding exit is equipped with wind-shielding part 321, wind-shielding part 321 is formed with air-out clearance 323 with the inside wall 322 of wind-guiding export within a definite time, wind-shielding part 321 can block directly blowing to the hot-blast of chip 201 middle part, the hot-blast solder joint that chip 201 and PCB board 202 are connected that can be faced towards that air-out clearance 323 blows out, thereby be favorable to reducing the intensification of chip 201, and make the soldering tin that is located a plurality of solder joints at chip 201 border all around melt in step, and then be favorable to reducing the heat time to chip 201, avoid chip 201 overheat damage.

The utility model discloses an in some embodiments, wind-guiding rifle head 32 can be equipped with the clamp in the outer lane of wind-guiding import, and the air outlet of hot-blast rifle 31 can be located to the wind-guiding import cover to rotatable wind-guiding rifle head 32 makes air-out clearance 323 just right with chip 201 pad position all around, then can screw the screw on the clamp, with the relative position of fixed wind-guiding rifle head 32 and hot-blast rifle 31. The wind-guiding gun head 32 is a non-standard gun head, can be formed and prefabricated by a stainless steel plate, has the characteristic of no deformation when heated at high temperature, and can collect heat and disperse around the wind-shielding part 321 so that hot wind blown out from the wind-outlet gap 323 is just matched with welding points around the chip 201.

In some embodiments of the present invention, the method of using the chip detachment apparatus 10 includes the following steps:

step S1, the jig 5 corresponding to the PCBA20 of the chip 201 to be disassembled is positioned and placed on the mounting platform 11 in a magnetic attraction mode to be fixed.

Step S2, the PCBA20 of the chip 201 to be detached is embedded into the mounting groove of the fixture 5, and then the longitudinal limiting portion is rotated to be in a limiting state of pressing the upper surface of the PCB 202.

And S3, additionally installing an air guide gun head 32 at the air outlet of the hot air gun 31, rotating the air guide gun head 32 to adjust the air outlet direction, enabling the air outlet gap 323 to face the position of the bonding pad on the periphery of the chip 201, and screwing the screw on the clamp.

In step S4, the heat gun 31 is vertically locked and fixed with the first limiting member 222 and the second limiting member 224, and the second locking knob is screwed.

And S5, switching on a power supply of the hot air gun 31, and setting parameters (generally 380 +/-10 ℃) of the hot air gun 31 to prevent the electric elements from being damaged due to overhigh temperature.

In step S6, the locking knob 213 and the lifting knob 214 are adjusted to set the heat gun 31 at the optimum height.

And S7, melting solder on the welding spot on the PCBA20 for about 40S generally, pressing the handle part 42 of the pry bar after melting, so that the detaching part 41 is lifted, the chip 201 is separated from the PCBA20, and picking the chip 201.

And S8, rotating the longitudinal limiting part to enable the longitudinal limiting part to be in a non-limiting state, and taking out the PCBA20 with the chip 201 detached from the mounting groove of the jig 5.

If it is necessary to disassemble the chip 201 again on the same type of PCBA20, the above steps S2-S8 can be repeated. If the chips 201 on different types of PCBAs 20 need to be disassembled, the jig 5 can be replaced, and the air guide gun head 32 and the pry bar can be adjusted or replaced, and then the steps S1-S8 are repeated.

According to the utility model discloses a chip disassembly equipment 10 for PCBA20, accessible adjusting part 2 adjusts heating element 3's position, so that heating element 3 blows hot-blastly towards chip 201 and PCB board 202 junction, and pull down PCBA 20's chip 201 through dismantling subassembly 4, dismantle the in-process at chip 201, operating personnel easy operation, chip 201 location is accurate, heating temperature is controllable, the simple repetitive operation of accessible can accomplish the dismantlement of PCBA 20's in batches chip 201, thereby be favorable to reducing operating personnel's intensity of labour, and can ensure to tear reliability and the stability of chip 201 open, and simultaneously, chip disassembly equipment 10 low in cost of manufacture, moreover, the steam generator is simple in structure, and the operation of being convenient for.

In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims (10)

1. A chip detachment apparatus for a PCBA, comprising:

the rack is used for fixing the PCBA;

a conditioning assembly and a heating assembly, the heating assembly being connected to the frame by the conditioning assembly, the conditioning assembly for conditioning a position of the heating assembly relative to the frame, the heating assembly for blowing hot air toward the PCBA;

and the disassembly component is arranged on the rack and used for disassembling the chip of the PCBA.

2. A chip detachment apparatus for a PCBA as claimed in claim 1, wherein the frame has a mounting platform for securing the PCBA, the mounting platform being provided with an avoidance hole corresponding to a chip of the PCBA, the detachment assembly comprising a detachment portion, at least part of the structure of which is located below the mounting platform, the detachment portion being adapted to pass through the avoidance hole to detach the chip of the PCBA.

3. The chip disassembly device for the PCBA as recited in claim 2, further comprising a jig detachably disposed on the mounting platform, the jig being provided with a mounting groove for fixing the PCBA.

4. A chip disassembly apparatus for a PCBA as claimed in claim 3, wherein the mounting platform is provided with a first magnetically attractive connection portion, and the jig is provided with a second magnetically attractive connection portion for magnetically engaging with the first magnetically attractive connection portion.

5. A chip detachment apparatus for a PCBA as claimed in claim 2, wherein the adjustment component includes: rotatory lift portion and installation department, the installation department passes through rotatory lift portion with the frame is connected, rotatory lift portion is used for adjusting the installation department for mounting platform's position, heating element with the installation department is connected.

6. A chip detachment apparatus for a PCBA as claimed in claim 5, wherein the rotary lift portion comprises:

the sliding rod is connected with the rack and extends along the height direction of the rack;

the slider, the slider is rotatable and locate slidable the slide bar, just be equipped with on the slider be suitable for with slide bar locking complex locking knob, the installation department with the slider is connected.

7. A chip detachment apparatus for a PCBA as claimed in claim 6, wherein the slider is further provided with a lifting knob for adjusting the height of the lifting arm, and a lifting arm to which the mounting portion is connected.

8. The chip detachment apparatus for a PCBA as recited in claim 5, wherein the mounting portion includes a fixed mounting arm and a first retaining member, the first retaining member being adapted to secure the heating element, one end of the fixed mounting arm being connected to the rotating elevating portion, the other end of the fixed mounting arm being connected to the first retaining member.

9. The chip detachment apparatus for a PCBA as recited in claim 8, wherein the mounting portion further includes a movable mounting arm and a second retaining member, the second retaining member being adapted to secure the heating element, one end of the movable mounting arm being rotatably connected to the fixed mounting arm, and the other end of the movable mounting arm being rotatably connected to the second retaining member.

10. The chip dismounting device for the PCBA as recited in claim 1, wherein the heating assembly comprises a hot air gun and an air guide gun head, and the air guide gun head is rotatably arranged at an air outlet of the hot air gun;

the wind guide gun head is provided with a wind guide inlet and a wind guide outlet which are communicated, the wind guide inlet is suitable for being communicated with the air outlet, a wind shielding piece is arranged at the wind guide outlet, and an air outlet gap is formed between the wind shielding piece and the inner side wall of the wind guide outlet.

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