CN218351413U

CN218351413U - Chip preheating device and sorting test equipment

Info

Publication number: CN218351413U
Application number: CN202222856475.3U
Authority: CN
Inventors: 何松; 叶波; 邱国志
Original assignee: Hangzhou Changchuan Technology Co Ltd
Current assignee: Hangzhou Changchuan Technology Co Ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2023-01-20
Anticipated expiration: 2032-10-27

Abstract

The application relates to the technical field of production test of semiconductor devices, in particular to a chip preheating device and sorting test equipment, wherein the chip preheating device comprises: the preheating component is provided with a bearing surface for bearing the chip; a cooled refrigerant flows inside the preheating component, and can cool the preheating component and the chip on the preheating component to below the test temperature; the heating element is arranged on one side wall surface of the pre-heating component, which is opposite to the bearing surface, and can heat the pre-heating component and the refrigerant in the pre-heating component to a temperature higher than a test temperature. The chip preheating device provided by the embodiment of the application can preheat and heat a chip, ensures that a preheating component and the chip are uniformly heated in the heating process of the chip, intervenes the temperature of the chip through the temperature change of a refrigerant, reduces the thermal resistance in the heating or preheating process, improves the precision and efficiency of the chip temperature adjusting process, and further contributes to improving the testing efficiency of subsequent chips and the accuracy of testing results.

Description

Chip preheating device and sorting test equipment

Technical Field

The application relates to the technical field of production test of semiconductor devices, in particular to a chip preheating device and sorting test equipment.

Background

At present, a preheating function of an IC (Integrated Circuit) is involved in testing of a general sorting test device IC, generally, preheating is performed in advance in an IC carrying and parking process, and generally, the preheating function is performed in a preheating tray, so that a problem that a difference between an initial temperature of an IC surface and a production temperature during testing is large when the IC is tested, and the testing needs to be performed after the temperature reaches the production temperature during testing, so that the testing time is long, and the efficiency is low is solved. For example, when the device is used for producing an IC at-55 ℃, the IC to be tested usually enters the machine at normal temperature, and if the pre-heating process is not performed, the chip is placed in the test seat for testing, and the IC temperature is required to be reduced from normal temperature to-55 ℃ for testing, so that the testing time and the testing efficiency are remarkably prolonged.

SUMMERY OF THE UTILITY MODEL

An object of this application is to provide a chip device and sorting test equipment in advance to when solving to a certain extent and sorting test equipment and testing, need wait that the chip cooling is heating the test after certain temperature, influence efficiency of software testing's technical problem.

The application provides a chip device of warming in advance includes: a cavity for containing a refrigerant is arranged in the preheating component, and the refrigerant can cool the preheating component and the chip to a temperature below a test temperature;

the heating element is arranged on the pre-warming component and opposite to the other surface of the bearing surface, and the heating element can heat the pre-warming component and the refrigerant in the pre-warming component to a temperature higher than the test temperature.

In the above technical solution, further, the pre-heating member has a flat plate structure, the upper and lower surfaces of the flat plate structure are the bearing surface and the heat-conducting surface, respectively, and the heating member is disposed on the heat-conducting surface.

In any of the above technical solutions, further, the pre-temperature member is provided with a liquid inlet and a liquid outlet, the refrigerant passes through the liquid inlet into the cavity, the refrigerant passes through the liquid outlet in the cavity to flow out.

In any one of the above technical solutions, further, the heating element has a flat plate structure or a sheet structure, the heating element is attached to the heat conducting surface, and the heating surface of the heating element covers the heat conducting surface.

In any of the above technical solutions, further, the chip preheating device further includes a temperature measuring component, the temperature measuring component has a detection probe, and the temperature measuring component is at least provided with the detection probe inside the preheating component.

In any one of the above technical solutions, further, a fuse is disposed on the pre-heating member, the fuse is connected to a power supply circuit of the heating element, and the fuse is fused when the temperature of the pre-heating member exceeds a threshold value.

In any one of the above technical solutions, further, the chip preheating device further includes a heat insulation board, and the heat insulation board is disposed on a side wall surface of the heating element departing from the preheating member.

In any of the above technical solutions, further, the chip preheating device further includes a supporting seat, and the heat insulation board is disposed on the supporting seat.

In any of the above technical solutions, further, the supporting seat includes at least four supporting legs, and each of the supporting legs has an L-shaped structure.

The application also provides a sorting test device, which comprises the chip preheating device in any technical scheme, so that all beneficial technical effects of the chip preheating device are achieved, and the details are not repeated.

Compared with the prior art, the beneficial effect of this application is:

the application provides a chip preheating device includes: the preheating component is provided with a bearing surface for bearing the chip; a cooled refrigerant flows inside the preheating component, and can cool the preheating component and the chip on the preheating component to below the test temperature; the heating element is arranged on one side wall surface of the pre-heating component, which is opposite to the bearing surface, and can heat the pre-heating component and the refrigerant in the pre-heating component to a temperature higher than a test temperature.

The chip preheating device provided by the embodiment of the application can preheat and heat a chip, ensures that a preheating component and the chip are uniformly heated in the heating process of the chip, intervenes the temperature of the chip through the temperature change of a refrigerant, reduces the thermal resistance in the heating or preheating process, improves the precision and efficiency of the chip temperature adjusting process, and further contributes to improving the testing efficiency of subsequent chips and the accuracy of testing results.

The application provides a select separately test equipment, includes the aforesaid chip device that warms up in advance, therefore, through this chip device that warms up in advance the precision that improves chip temperature regulation and control, reduce the degree of difficulty of testing process, reduced the consuming time of testing process to show the accuracy that improves efficiency of software testing and test result, reduce impaired risk of chip and probability.

Drawings

In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is an exploded view of a chip preheating device provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a chip preheating device according to an embodiment of the present disclosure.

Reference numerals:

1-a pre-temperature component, 2-a liquid inlet, 3-a liquid outlet, 4-a temperature measuring component, 5-a fuse, 6-a heating component, 7-a supporting leg and 8-a heat insulation plate.

Detailed Description

The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments.

The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application.

All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it should be noted that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

A chip preheating device and a sorting test apparatus according to an embodiment of the present application are described below with reference to fig. 1 and 2.

Referring to fig. 1 and 2, an embodiment of the present application provides a chip warming apparatus, including: the chip preheating device is particularly suitable for preheating, heating and other operations on chips in the sorting test process, the chips in the embodiment can also be other electronic components, so that the temperature of the electronic components such as the chips can be adjusted to meet the test conditions.

The refrigerant with a lower temperature after being cooled flows in the preheating member 1, and the temperature of the refrigerant is lower, so that the preheating temperature can be reduced when the refrigerant flows in the preheating member 1, and further, after the chip is placed on the bearing surface, the preheating member 1 can preheat the chip so that the temperature of the chip is reduced from the normal temperature to below the test temperature, it should be noted that the test temperature in this embodiment is specifically the production temperature of the chip, for example, when the device is used for producing a chip test at-55 ℃, the test temperature in this embodiment may be-55 ℃, of course, the test temperature in this application is not limited to the case of-55 ℃, and the temperature of the refrigerant injected into the preheating member 1 can be adjusted according to the actual production temperature.

Can to add heat-insulating material 6 circular telegrams after making its temperature be less than the test temperature when warming in advance the chip for heat-insulating material 6 can heat the component 1 and the refrigerant in the component 1 that warms in advance, and the temperature of refrigerant bearing surface after being heated also risees, thereby heats the chip, so that the chip that is less than the test temperature after preheating heaies up to the test temperature, in order to satisfy the demand of temperature condition in the test procedure.

It is thus clear that the chip device of warming in advance that this application provided can carry out temperature regulation to the chip, at first preheats the chip, need not move or shift the chip after preheating, has reduced the chip and has shifted the in-process and cause the damage to the chip, risk such as fall, and importantly, intervenes the temperature of chip through the temperature variation of refrigerant, and loading end temperature variation is even for the piece that awaits measuring is heated evenly, thereby helps improving the precision of chip temperature regulation.

In one embodiment of the present application, it is preferable that the preheating member 1 has a flat plate structure having a maximum of two wall surfaces, which are a bearing surface and a heat transfer surface, respectively, and the heating member 6 is provided on the heat transfer surface.

In this embodiment, the preheating member 1 has a flat plate structure with a rectangular plate surface, in the state shown in fig. 1, the preheating member 1 has an upper plate surface, a lower plate surface and four side wall surfaces, the upper plate surface and the lower plate surface are both flat surfaces, the upper plate surface is used as a bearing surface for placing chips, the lower plate surface is used as a heat conduction surface, the heating element 6 is arranged below the preheating member 1, the heating element 6 acts on the heat conduction surface, heat generated by the heating element 6 is transferred to the heat conduction surface to heat the refrigerant in the preheating member 1, and the heat of the refrigerant is transferred to the bearing surface to heat the chips.

In one embodiment of the present application, preferably, the interior of the preheating member 1 is hollow, forming a chamber for containing a refrigerant;

the preheating component 1 is provided with a liquid inlet 2 and a liquid outlet 3, refrigerant enters the cavity through the liquid inlet 2, and the refrigerant in the cavity flows out through the liquid outlet 3.

In a general test process, the time consumption of the chip cooling and preheating process is long, in the application, because the introduced refrigerant is actually the low-temperature refrigerant after cooling, the temperature of the whole preheating component 1 can be reduced in a short time, so that the time consumption of the chip preheating process is shortened, the heating efficiency can be improved by increasing parameters such as the power of the heating element 6 in the subsequent heating process of the refrigerant in the preheating component 1, the heat absorption and temperature rise process of the refrigerant is rapid, and therefore the temperature regulation and control process of the chip can be shortened by the chip preheating device.

The side wall surface of the preheating member 1 is provided with a liquid inlet and a liquid outlet 3, preferably, the liquid inlet 2 and the liquid outlet 3 are arranged on the same one of two end surfaces of the preheating member 1, a cavity inside the preheating member 1 is filled with a refrigerant, or a flow channel for limiting the flow direction of the refrigerant is formed in the cavity, so that the refrigerant can flow in a directed manner, and the refrigerant continuously flows into the preheating member 1 through the liquid inlet 2 and continuously flows out from the liquid outlet 3, so that the refrigerant in the preheating member 1 can be kept in a low-temperature state all the time when the heating member 6 is not started, the temperature reduction speed of the preheating member 1 and a chip is accelerated, and the refrigerant can still continuously and circularly flow into and out after the heating member 6 is started, in this case, the refrigerant in the preheating member 1 and the preheating member 1 is heated by the heating member 6, dynamic temperature regulation and control can be realized, when the temperature of the preheating member 1 exceeds a predetermined range, the temperature of the preheating member 1 can be changed in a short time by appropriately reducing the power of the 6 or increasing the flow rate of the refrigerant, and the like, and the condition that the temperature of the heating member 1 is excessively high temperature is avoided.

In one embodiment of the present application, it is preferable that the heating member 6 has a flat plate structure or a sheet structure, the heating member 6 is attached to the heat conductive surface, and the heat generating surface of the heating member 6 covers the heat conductive surface.

In this embodiment, the heating member 6 is preferably a heating sheet, and the heating area of the heating member 6 is approximately equal to the area of the heat conduction surface, so that the heating surface of the heating member 6 can cover the heat conduction surface of the pre-heating member 1, thereby the pre-heating member 1 is heated uniformly, and the situation of local heating is avoided, and the difficulty and precision of temperature regulation and control are influenced.

In one embodiment of the present application, preferably, the chip warming device further comprises a temperature measuring component 4, and the detection probe of the temperature measuring component 4 is arranged inside the warming component 1.

In this embodiment, the temperature measuring component 4 has a detection probe, at least a part of the detection probe of the temperature measuring component 4 is located in the cavity of the pre-temperature component 1, preferably, the temperature measuring component 4 may specifically be a temperature sensor, and according to the type and the waterproof effect of the temperature sensor, the temperature sensor may be selectively placed in the cavity as a whole, and the temperature measuring component 4 is electrically connected or in communication with a display device or a control system, so as to transmit the detection result to an external receiving device, thereby enabling the working personnel to monitor the temperature of the refrigerant in real time, and adjusting the heating condition of the chip and the temperature of the chip by controlling and adjusting the temperature of the refrigerant in time.

In one embodiment of the present application, preferably, a fuse 5 is disposed on the preheating member 1, the fuse 5 is connected to a power supply circuit of the heating element 6, and the fuse 5 is fused when the temperature of the preheating member 1 exceeds a threshold value.

In the embodiment, the highest temperature of the pre-heating component 1 is determined by the target temperature to which the chip needs to be heated, the fusing temperature of the fuse 5 is selected according to the highest temperature of the pre-heating component 1, when the temperature of the pre-heating component 1 reaches or exceeds the fusing temperature of the fuse 5, the fuse 5 is fused, the power supply circuit of the heating component 6 is cut off at the moment, the heating component 6 does not heat the pre-heating component 1 any more, the heating of the pre-heating component 1 due to infinite heating can be effectively avoided through the arrangement of the fuse 5, and therefore the damage of the chip is effectively avoided, or safety accidents are caused by forgetting to close the heating component 6 due to errors and the like.

In one embodiment of the present application, preferably, the chip preheating device further includes a heat insulation plate 8, and the heat insulation plate 8 is disposed on a side wall surface of the heating element 6 facing away from the preheating member 1.

In this embodiment, under the state as shown in fig. 1, the heat insulating board 8 is disposed below the heating member 6, the heat insulating board 8 can be attached to the heating member 6, the heat insulating board 8 is made of a high temperature resistant material, and has good high temperature resistance and heat insulating performance, and can protect the heating member 6 to prevent the heating member 6 from being scratched or collided, etc., and also can reduce the heat loss of the heating member 6, and in addition, can prevent the high temperature of the heating member 6 from affecting the chip preheating device and other components of the following sorting test equipment.

In one embodiment of the present application, preferably, the chip preheating device further includes a supporting base, and the heat insulation board 8 is disposed on the supporting base.

Preferably, the support base comprises at least four legs 7, each leg 7 having an L-shaped configuration.

In this embodiment, the heating member 6 above the heat insulating board 8 and the heat insulating board 8, the preheating member 1 are all set up in the supporting seat, the supporting seat can stabilize the heat insulating board 8 and support, the supporting seat includes at least four landing legs 7, when the quantity of landing legs 7 is four, four landing legs 7 are distributed along four apex angles of rectangle, thereby stabilize the heat insulating board 8 and support, when the length of heat insulating board 8 is longer, the length of supporting seat also suitably prolongs along with the length of heat insulating board 8, increase the quantity of landing legs 7 simultaneously, ensure the stability of supporting seat.

Preferably, each leg 7 has an "L" shaped structure, and includes a leg portion extending in the vertical direction and a foot portion extending in the horizontal direction, and the cross-sectional area of the foot portion is larger than that of the leg portion, so as to increase the contact area of the leg 7 with the ground or other designated positions, and further enhance the stability of the support base.

Preferably, each leg 7 has a telescopic structure for levelling.

To sum up, the chip preheating device provided by the embodiment of the application can preheat and heat the chip, and in the heating process of the chip, the preheating component 1 and the chip are uniformly heated, the temperature of the chip is interfered by the temperature change of the refrigerant, the thermal resistance in the heating or preheating process is reduced, the precision and the efficiency of the chip temperature adjusting process are improved, and the chip preheating device is favorable for improving the testing efficiency of the subsequent chip and the accuracy of the testing result.

An embodiment of the present application further provides a sorting test apparatus, including the chip warming device according to any of the above embodiments, so that all the beneficial technical effects of the chip warming device are achieved, and details are not repeated herein.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip warming apparatus, comprising:

the preheating component is provided with a bearing surface for bearing the chip; a cavity for containing a refrigerant is arranged in the preheating component, and the refrigerant can cool the preheating component and the chip to a temperature below a test temperature;

the heating element is arranged on the other surface, opposite to the bearing surface, of the pre-warming member, and the heating element can heat the pre-warming member and the refrigerant in the pre-warming member to be higher than the testing temperature.

2. The apparatus according to claim 1, wherein the pre-heating member has a plate structure, upper and lower surfaces of which are the carrying surface and the heat-conducting surface, respectively, and the heating member is disposed on the heat-conducting surface.

3. The apparatus according to claim 1, wherein the pre-heating member is provided with a liquid inlet and a liquid outlet, the refrigerant enters the chamber through the liquid inlet, and the refrigerant in the chamber flows out through the liquid outlet.

4. The chip preheating device according to claim 2, wherein the heating member has a flat plate structure or a sheet structure, the heating member is attached to the heat conductive surface, and a heat generating surface of the heating member covers the heat conductive surface.

5. The chip warming apparatus according to any one of claims 1 to 4, further comprising a temperature measuring member having a detection probe, the temperature measuring member having at least the detection probe disposed inside the warming member.

6. The chip preheating device according to any one of claims 1 to 4, wherein a fuse is provided on the preheating member, the fuse is connected to a power supply circuit of the heating element, and the fuse is fused when the temperature of the preheating member exceeds a threshold value.

7. The chip preheating device according to any one of claims 1 to 4, further comprising a heat insulating plate disposed on a side wall surface of the heating element facing away from the preheating member.

8. The chip warming apparatus according to claim 7, further comprising a supporting base, wherein the thermal insulation board is disposed on the supporting base.

9. The apparatus of claim 8, wherein the support base comprises at least four legs, each leg having an L-shaped configuration.

10. A sorting test apparatus comprising the chip warming-up device according to any one of claims 1 to 9.