CN218328778U - Ice making machine - Google Patents

Abstract

The utility model provides an ice maker, include: the refrigerator comprises a machine body shell, a fan, a radiator, a semiconductor refrigerator, a refrigerating body, an ice box and a control circuit board, wherein the radiator is positioned at the upper end of the semiconductor refrigerator and combined with the hot end face of the semiconductor refrigerator, the refrigerating body is positioned at the lower end of the semiconductor refrigerator and combined with the cold end face of the semiconductor refrigerator, and the control circuit board is electrically connected with the semiconductor refrigerator and the fan. The utility model discloses in, semiconductor cooler's hot junction is located to the radiator, and semiconductor cooler's cold junction is located to the refrigeration body, because the hot junction is located the top of cold junction, consequently, when ice machine during operation, under semiconductor cooler's effect, the heat upwards transmits, and cold volume downward transmission accords with cold and heat volume natural conduction law, is favorable to cold volume, heat conduction, has reduced semiconductor cooler cold junction cold volume, hot junction heat conduction thermal resistance, has improved conduction efficiency to improve system ice effect.

Description

Ice making machine

Technical Field

The utility model relates to an ice making equipment field especially relates to an ice maker.

Background

An ice maker is a common type of ice making device. Because the ice making process needs low-temperature refrigeration, the required refrigerating capacity is large, and the refrigerating temperature is low, the ice making machine mostly adopts a mechanical compression refrigerating mode at present, and the ice making machine has the advantages of high ice making speed, large ice making quantity and the like, but has the defects of large volume, high cost and the like.

Along with the continuous improvement of living standard of people, the personalized demand continuously emerges in the present society, and special requirements such as miniaturization, quick ice making, small volume, convenient and flexible use, low cost and the like are provided for the ice machine. An ice maker (semiconductor ice maker for short) adopting semiconductor refrigeration appears in the prior art, the semiconductor ice maker utilizes the Peltier effect of semiconductor materials to realize temperature difference refrigeration, and because the refrigerating capacity of the semiconductor ice maker is small and the structure of a refrigerating body has defects, the conventional semiconductor ice maker has long ice making time and poor ice forming effect.

Thus, the prior art is deficient and is subject to improvement and development.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned deficiencies of the prior art, the present invention provides an ice maker, which aims to solve the problems of long ice making time and poor ice forming effect of the semiconductor ice maker in the prior art.

The utility model provides a technical scheme that technical problem adopted as follows:

an ice making machine comprising: the refrigerator comprises a machine body shell, a fan, a radiator, a semiconductor refrigerator, a refrigerating body, an ice box and a control circuit board, and is characterized in that the radiator is positioned at the upper end of the semiconductor refrigerator and combined with the hot end face of the semiconductor refrigerator, the refrigerating body is positioned at the lower end of the semiconductor refrigerator and combined with the cold end face of the semiconductor refrigerator, and the control circuit board is electrically connected with the semiconductor refrigerator and the fan.

Further, the refrigerating body is composed of a substrate and a first protruding part.

Furthermore, a groove is formed in the side wall surface of the first protruding portion, the ice box is located below the refrigerating body, and the groove is closed after the ice box is buckled with the refrigerating body to form a hollow space.

Further, the average value of the transverse width of the groove is 10-25 mm.

Furthermore, a second bulge is arranged in the groove.

Further, the height ratio of the second convex portion to the first convex portion is 0.3 to 0.95.

Further, the ice box is characterized in that a protrusion is arranged on the ice box.

Furthermore, an exhaust groove is formed in the first protruding portion.

Further, the ice maker further includes: and the temperature sensor is arranged on the refrigerating body and is electrically connected with the control circuit board.

Furthermore, the refrigerating body is detachably connected with the semiconductor refrigerator.

According to the above technical scheme, the utility model discloses following advantage and positive effect have at least:

the utility model discloses in, there are a plurality of utility model points:

utility model discloses a little, semiconductor cooler's hot junction is located to the radiator, and semiconductor cooler's cold junction is located to the refrigeration body, because the hot junction is located the top of cold junction, consequently, when ice machine during operation, under semiconductor cooler's effect, the heat upwards transmits, and cold volume downward transmission accords with cold and heat volume natural conduction law, is favorable to cold volume, heat conduction, has reduced semiconductor cooler cold junction cold volume, hot junction heat conduction thermal resistance, has improved conduction efficiency to improve system ice effect.

Utility model point two through set up the second bellying in the recess of the refrigeration body, has not only increased the cold exchange area between the refrigeration body and the water, has also shortened cold conduction distance moreover to finally shorten the system ice time, accelerate system ice speed.

Drawings

Fig. 1 is a perspective view of an ice maker according to an embodiment of the present invention.

Fig. 2 is a sectional view of an ice maker according to an embodiment of the present invention.

Fig. 3 is a schematic view of a partial structure of an ice maker according to an embodiment of the present invention.

Fig. 4 is a schematic view of a structure of the ice maker for engaging the refrigerator with the ice box according to an embodiment of the present invention.

Fig. 5 is a schematic structural view illustrating a structure in which a refrigerating body of the ice maker is separated from the ice bank according to an embodiment of the present invention. Fig. 6 is a schematic structural diagram of a refrigerating body of an ice maker according to an embodiment of the present invention.

Fig. 7 is a schematic structural diagram of an ice box of an ice maker according to an embodiment of the present invention.

Description of the reference numerals:

100. an ice maker; 1. a semiconductor refrigerator; 11. a cold end; 12. a hot end; 2. a heat sink; 21. a heat dissipating fin; 3. a fan; 4. a refrigerating body; 41. a substrate; 42. a first boss; 43. a second boss portion; 44. a groove; 45. an exhaust groove; 5. an ice box; 51. a protrusion; 6. a body housing; 61. perforating; 62. an ice taking cabin door; 63. a mounting cavity; 64. an insulating layer.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.

Referring to fig. 1 to 3, an ice maker 100 is provided, in which the ice maker 100 includes a semiconductor refrigerator 1, a heat sink 2, a fan 3, a refrigerator 4, an ice box 5, and a control circuit board (not shown) electrically connected to the fan 3 and the semiconductor refrigerator 1. For convenience of description, the width direction herein is the direction of the X axis in fig. 2, and the vertical direction or height direction is the direction of the Y axis.

Specifically, the semiconductor Cooler 1 (also called TEC, thermo Electric Cooler) is a heat pump made by using the peltier effect of semiconductor materials. Semiconductor refrigerator 1 includes hot side 12 and cold side 11, and cold side 11 is located above hot side 12, and when semiconductor refrigerator 1 is powered on, cold side 11 temperature will decrease and hot side 12 temperature will increase.

Heat sink 2 is used to dissipate heat to hot side 12. Radiator 2 is located at hot side 12, i.e. radiator 2 is located above semiconductor cooler 1, so that heat at hot side 12 is transferred upwards through radiator 2, and heat is continuously transferred from cold side 11 to hot side 12 in a forward direction. Therefore, the heat sink 2 is arranged to dissipate heat of the hot end 12, so that the temperature of the cold end 11 can be further reduced, and the ice making of the ice maker 100 can be accelerated.

The heat sink 2 is disposed on the hot side 12, including but not limited to the heat sink 2 directly contacting the hot side 12, the heat sink 2 and the hot side 12 being spaced apart from each other, and the heat sink 2 and the hot side 12 being indirectly contacted by heat dissipation silicone, heat dissipation silicone grease, etc.

The refrigerating body 4 is provided at the cold end 11 of the semiconductor refrigerator 1, i.e. the refrigerating body 4 is located below the semiconductor refrigerator 1, and therefore, the cooling energy generated at the cold end 11 of the semiconductor refrigerator 1 is transmitted downward to the refrigerating body 4, thereby lowering the temperature of the refrigerating body 4.

The refrigeration body 4 is disposed at the cold end 11 including, but not limited to, the refrigeration body 4 being in direct contact with the cold end 11, the refrigeration body 4 being spaced from the cold end 11.

In another embodiment, the refrigerating body 4 and the semiconductor refrigerator 1 are detachably connected, the refrigerating body can be taken out of the semiconductor refrigerator 1, and a user can replace the refrigerating body 4 with different shapes according to own preference, so that the user experience is optimized.

The utility model discloses in, when ice machine 100 during operation, under semiconductor cooler 1's effect, the heat upwards transmits, and cold volume transmits downwards, accords with cold and hot volume natural conduction law, is favorable to cold volume, heat conduction, has reduced 11 cold volumes of semiconductor cooler 1 cold junction, the 12 heat conduction thermal resistances in hot junction, has improved conduction efficiency to improve ice making effect. Also, since the semiconductor refrigerator 1 has a smaller volume than the compressor, the ice maker 100 can be miniaturized and can be conveniently used at home or by a person.

Referring to fig. 4 to 7, the cooling body 4 includes a substrate 41 and a first protrusion 42.

Specifically, the side wall surface of the first protruding portion 42 forms a groove 44, the ice box 5 is arranged below the refrigerating body 4, and after the ice box is buckled with the refrigerating body 4, the groove 44 forms a closed hollow space for storing water, the temperature of the refrigerating body 4 is reduced under the action of the semiconductor refrigerator 1, and the water stored in the groove 44 becomes ice, so that ice making is realized.

Referring to fig. 6, the number of the grooves 44 is plural.

Specifically, the grooves 44 are spaced apart from each other in a direction toward the ice bank 5 from the cooling body 4, and thus, a plurality of ice cubes can be simultaneously made.

The shape of each groove 44 may be identical or the shape of each groove 44 may not be identical, i.e., there may be at least two grooves 44 that are not identical in shape.

The grooves 44 are shaped like ice cubes, the grooves 44 can be round, cylindrical, conical, square, trapezoidal or irregular, the number of the grooves 44 corresponds to the number of ice-making ice cubes, and the grooves 44 can be independent or connected with one another.

The complete ice making process is divided by cold conduction and can be subdivided into two processes, specifically, a first process: the cold is conducted by the refrigerating body 4 to the water in the recess 44 which is in contact with it (i.e. the water which is located outermost in the recess 44). The second process: the cold is conducted in the water in the groove 44. In order to make ice quickly, the semiconductor refrigerator 1 is required to generate enough cold on the refrigerating body 4, conduct the cold to the water in contact with the refrigerating body as soon as possible, and conduct the cold to the three-dimensional water body by taking the water as a cold conducting medium, so that the whole water body is lowered to below the freezing point temperature as soon as possible, and accordingly, quick freezing is completed. According to the above process, the water in the groove 44 gradually freezes from the sidewall of the first protrusion 42 facing inward.

For the first process, according to the cold conduction formula Q = hS Δ T, where Q, h, S, Δ T are the conduction cold, the surface heat exchange coefficient, the heat exchange area, and the temperature difference, respectively, in order to increase the conduction cold, the water in contact with the refrigeration body 4 is rapidly cooled and frozen (i.e., the temperature difference between the refrigeration body 4 and the water is reduced), and as can be known, increasing the contact area between the refrigeration body 4 and the water can rapidly reduce the temperature difference between the refrigeration body 4 and the water, thereby freezing the water in contact with the refrigeration body 4.

For the second process, the time of the second process can be reduced by reducing the conduction thermal resistance of cold in water. According to the calculation formula of conduction thermal resistance

L, S and kappa respectively have the cold conduction distance, the cold conduction cross-sectional area and the water-ice heat conduction coefficient ratio, so that the conduction thermal resistance of cold in water can be reduced by increasing the cold conduction cross-section S and reducing the cold conduction distance L, the time of the second process is shortened, and quick ice making is realized.

Referring to fig. 5 and 6, the groove 44 is provided with a second protrusion 43.

Specifically, the average size of the grooves 44 in a direction perpendicular to the direction (direction in which the X axis is located) of the refrigerant 4 toward the ice bank 5 is 10 mm to 25 mm, that is, the average size of the grooves 44 in the width direction is 10 mm to 25 mm. Since the larger the volume of ice cubes is, the longer the time required for making ice is, when the average size of the grooves 44 in the width direction is 10 mm to 25 mm, the ice cubes can be made to have a suitable volume and a relatively fast ice making speed can be obtained.

The second protrusion 43 is provided in the groove 44, so that the contact surface between the water in the groove 44 and the refrigerant 4 can be increased, the time required for the first process can be reduced, and the ice making speed can be increased. In addition, the second protruding part 43 is arranged in the groove 44, and cold energy is transmitted to the three-dimensional water body from the side wall surface of the second protruding part 43 and the side wall surface of the first protruding part 42 at the same time, so that compared with the prior art that cold energy is transmitted from the side wall surface of the first protruding part 42 of the refrigerating body 4 to the center of the groove 44, the cold conducting distance can be shortened, the heat conducting resistance of the cold energy in water can be further reduced, the time required by the second process can be reduced, and the ice making speed can be further increased. Since the provision of the second protrusions 43 in the grooves 44 has a positive promoting effect on both the first process and the second process, the provision of the second protrusions 43 in the grooves 44 can significantly increase the ice making speed to improve the ice making efficiency, as compared to the reduction of only the time required for the first process or only the time required for the second process, and also has an advantage of simple structure.

The shape of the second boss 43 includes, but is not limited to, a cylinder, a cone, a square, a trapezoid, or an irregular shape.

The height of the second protruding portion 43 is less than that of the first protruding portion 42, and the height ratio of the second protruding portion 42 to the first protruding portion 42 is 0.3-0.95, i.e. the size ratio of the second protruding portion 43 to the first protruding portion 42 along the height direction is 0.3-0.95, so as to obtain a better ice making effect.

The separation process of the ice blocks and the refrigerating body 4 is ice removal, the semiconductor refrigerator 1 can be directly powered off by the ice removal, at the moment, heat of the hot end 12 is reversely transferred to the cold end 11 and then transferred to the refrigerating body 4, the contact surface of the ice blocks and the refrigerating body 4 is melted, so that the ice blocks are separated from the refrigerating body 4, and the ice blocks separated from the refrigerating body 4 are supported by the ice box 5.

The direct current input of the semiconductor refrigerator 1 can be adopted for deicing, the positive polarity and the negative polarity are inverted, the semiconductor refrigerator 1 is changed from a refrigerating state to a heating state, heat is transferred from the semiconductor refrigerator 1 to the refrigerating body 4, the surface of ice blocks in contact with the refrigerating body 4 is melted, the ice blocks are separated from the refrigerating body 4, and the ice blocks separated from the refrigerating body 4 are supported by the ice box 5.

Based on the two ice-removing methods, after the ice cubes are separated from the refrigerating body, the ice cubes are supported by the ice box 5, and the ice can be taken out by taking down the ice box 5 from the refrigerating body 4.

Referring to fig. 6 and 7, the ice bin 5 is provided with a protrusion 51.

Specifically, in order to accelerate the ice cubes to fall off from the refrigerating body 4, the ice box 5 can be further provided with the protrusions 51, the protrusions 51 correspond to the grooves 44 one by one, namely one ice cube corresponds to one protrusion 51, the optimal scheme is that the protrusions 51 are arranged at the center of the ice cubes, the ice cubes are better integrated with the ice box 5 due to the arrangement of the protrusions 51, and after the ice making is completed, the ice box 5 can more easily separate the ice cubes from the refrigerating body 4.

The ice box 5 is made of rubber or plastic materials, and the materials are easier to deform, so that ice blocks can be quickly separated from the ice box 5.

Referring to fig. 6, the first protrusion 42 is further provided with an exhaust groove 45.

Specifically, because the bonding area of the ice cubes and the refrigerating body 4 is too large (mainly considering the ice making speed), although the bonding area of the ice cubes and the refrigerating body 4 is melted, the ice cubes and the peripheral wall surface of the refrigerating body 4 form a closing tension, so that the ice cubes are still difficult to separate from the refrigerating body 4.

Referring to fig. 2 and 3, the fan 3 is disposed at the end of the heat dissipation fin 21 of the heat sink 2.

Specifically, the wind direction of the fan 2 coincides with the direction of the semiconductor cooler 1 toward the radiator 2, and therefore, most of the heat near the radiator 2 is taken away by the fan 3 to contribute to the heat dissipation of the radiator 2.

The semiconductor ice maker 100 further comprises a temperature sensor (not shown) disposed on the cooling body 4, wherein the temperature sensor is used for sensing the temperature of the cooling body 4, or the ice cubes, or the ice box 5, and when the temperature sensor detects that the temperature of the cooling body 4, or the ice cubes, or the ice box 5 reaches a set temperature threshold value, the end of ice making can be prompted. The temperature sensor is electrically connected with the control circuit board, and the made ice block can be selectively separated from the refrigerating body 4 or enter a cold insulation state through program control to keep the ice block in a frozen state.

Referring to fig. 1 and 2, the ice maker 100 further includes a body housing 6.

Specifically, the body case 6 encloses to form an installation cavity 63, and the semiconductor refrigerator 1, the radiator 2, the fan 3, the refrigerating body 4, the ice box 5 and the control circuit board (not shown) are all arranged in the installation cavity 63. The top of the body case 6 is provided with a perforation 61 corresponding to the fan 3, so that the hot air output from the fan 3 can be discharged out of the body case 6 through the perforation 61.

The machine body shell 6 also comprises an ice-taking cabin door 62, after ice-making is finished, the cabin door is unscrewed, and then the ice box 5 is separated from the refrigerating body 4, so that ice blocks can be taken out.

To sum up, the utility model provides an ice maker 100, the utility model discloses in, semiconductor cooler 1's hot junction 12 is located to radiator 2, and semiconductor cooler 1's cold junction 11 is located to refrigeration body 3, because hot junction 12 is located the top of cold junction 11, consequently, when ice maker 100 during operation, under semiconductor cooler 1's effect, the heat upwards transmits, and cold volume downward transmission accords with cold and heat volume natural conduction law, is favorable to cold volume, heat conduction, has reduced 1 cold junction 11 cold volumes of semiconductor cooler, hot junction 12 heat conduction thermal resistances, has improved conduction efficiency to improve ice making effect.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.

Of course, the above embodiments of the present invention are described in detail, but the present invention can not be understood as being limited to the scope of the present invention, and the present invention can also have other various embodiments, and based on the present embodiments, other embodiments obtained by a person of ordinary skill in the art without any creative work belong to the scope protected by the present invention, and the scope protected by the present invention is subject to the appended claims.

Claims (10)

1. An ice making machine comprising: the refrigerator comprises a machine body shell, a fan, a radiator, a semiconductor refrigerator, a refrigerating body, an ice box and a control circuit board, and is characterized in that the radiator is positioned at the upper end of the semiconductor refrigerator and combined with the hot end face of the semiconductor refrigerator, the refrigerating body is positioned at the lower end of the semiconductor refrigerator and combined with the cold end face of the semiconductor refrigerator, and the control circuit board is electrically connected with the semiconductor refrigerator and the fan.

2. The ice-making machine of claim 1, wherein said refrigeration body is comprised of a base plate and a first protrusion.

3. The ice-making machine of claim 2, wherein a groove is formed on a side wall surface of the first protrusion part, the ice box is positioned below the refrigerating body, and the ice box is fastened with the refrigerating body and then closes the groove to form a hollow space.

4. The ice-making machine of claim 3, wherein said grooves have a transverse width average of 10-25 mm.

5. The ice-making machine of claim 3, wherein said recess has a second protrusion disposed therein.

6. The ice-making machine of claim 5, wherein a height ratio of said second protrusions to said first protrusions is 0.3-0.95.

7. The ice-making machine of claim 1, wherein said ice bin is provided with a protrusion.

8. The ice-making machine of claim 2, wherein said first boss is provided with a vent groove.

9. The ice-making machine of claim 1, further comprising:

and the temperature sensor is arranged on the refrigerating body and is electrically connected with the control circuit board.

10. The ice-making machine of claim 1, wherein said refrigeration body is removably connected to said semiconductor refrigerator.

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