CN218317406U - Spacecraft thermal management system based on loop heat pipe - Google Patents

Spacecraft thermal management system based on loop heat pipe Download PDF

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Publication number
CN218317406U
CN218317406U CN202222029005.XU CN202222029005U CN218317406U CN 218317406 U CN218317406 U CN 218317406U CN 202222029005 U CN202222029005 U CN 202222029005U CN 218317406 U CN218317406 U CN 218317406U
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heat
cold
cold plate
heat exchanger
pipe
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Chinese (zh)
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谢龙
赵洁莲
牛雷
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Shanghai Geentropy Aerospace Technology Co ltd
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Shanghai Geentropy Aerospace Technology Co ltd
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Abstract

The utility model provides a spacecraft thermal management system based on loop heat pipe, take over, axial channel heat pipe and cooling surface are taken over to hot side including evaporimeter, reservoir, steam conduit, liquid pipeline, cold drawing, heat exchanger, cold side. Wherein the utility model has the advantages that: the heat management system is completely decoupled from the whole satellite design, and the design only needs to select the loop heat pipe type spectrum specification with enough heat transfer capacity, the size of the designed radiating surface and the pipeline layout, so that the design complexity and the development cost are greatly reduced; the assembly of the thermal management system only needs to thermally couple the single machine and the cold plate, and the assembly process is convenient and quick; the loop heat pipe has large heat quantity and long-distance heat transfer capacity, so that the heat management system has no special requirements on the layout of the cold plate, and the corresponding satellite platform has no special requirements on the layout of a single machine, thereby greatly improving the design flexibility of the satellite platform.

Description

Spacecraft thermal management system based on loop heat pipe
Technical Field
The utility model relates to a spacecraft thermal control technical field, in particular to spacecraft thermal management system based on loop heat pipe.
Background
The spacecraft usually needs to adopt different platforms, loads, layouts and orbits according to different tasks, so the thermal control system of the spacecraft usually adopts a task-oriented design mode. Each satellite is custom designed with the goal of high precision, versatility, long life, under the constraints of relevant standards, specifications, and regulations. The design, final assembly and test period of the thermal control system in the mode are long, the development cost is high, and the requirements of rapid development and low cost of commercial aerospace are difficult to adapt.
Patent CN 11139409A discloses a coupled phase-change material high-dispersion-ratio loop heat pipe device for a spacecraft, which comprises a capillary pump liquid reservoir, a capillary pump evaporator, a gas phase pipeline, a condenser, 1-n phase-change heat exchangers, 2n connecting pipelines and a liquid phase pipeline; the condenser comprises a condensation pipeline 1-a condensation pipeline n +1. The device additionally adds the drive consumption only need be greater than the maximum value of all heat source consumptions, can carry the heat of all heat sources, but uses the form of welding the condensation pipeline on the aluminum plate as the condenser, and the condensation pipeline that needs to arrange is very long, is unfavorable for whole star lightweight design.
Disclosure of Invention
In order to solve the technical problem, the utility model discloses a spacecraft thermal management system based on loop heat pipe, can solve whole star development cost height, design complexity big, design flexibility low grade technical problem, simultaneously, also can realize thermal management system's lightweight design. The technical scheme of the utility model is implemented like this:
a spacecraft thermal management system based on loop heat pipes comprises an evaporator, a liquid storage device, a steam pipeline, a liquid pipeline, a cold plate, a heat exchanger, a cold side connecting pipe, a hot side connecting pipe, an axial channel heat pipe and a heat radiating surface;
the evaporator is welded with the liquid storage device, the steam pipeline is connected with the evaporator, the liquid pipeline is connected with the liquid storage device, and the axial channel heat pipe is embedded in the heat dissipation surface;
the number of the heat exchanger, the cold side connecting pipes and the hot side connecting pipes is equal to the number of heat sources, the number of the heat exchanger, the cold side connecting pipes and the hot side connecting pipes is n, the number of the cold plates is n +1, and the number of the axial channel heat pipes pre-embedded in the heat radiating surface is not less than n + 1;
the cold side connecting pipe is connected with the heat exchanger and the cold plate, and the hot side connecting pipe is connected with the heat exchanger and the next cold plate;
the cold plate is superposed with the position of the condensation section of the embedded axial channel heat pipe;
the vapor pipeline is connected with the first cold plate, and the liquid pipeline is connected with the (n + 1) th cold plate.
Preferably, the heat exchanger comprises a heat exchange plate, a coil, a heat exchanger cold side interface, a heat exchanger hot side interface and a heat exchanger mounting hole;
the heat exchange plate is provided with an S-shaped plate groove, and the coil is embedded into the S-shaped plate groove and welded;
the heat exchanger cold side interface and the heat exchanger hot side interface are located on two sides of the coil pipe, and the heat exchanger mounting holes are formed in the heat exchange plates.
Preferably, the cold plate comprises a heat dissipation plate, a U-shaped pipe, a cold plate hot side interface, a cold plate cold side interface and a cold plate mounting hole;
the U-shaped plate groove is formed in the heat dissipation plate, the U-shaped pipe is embedded into the U-shaped plate groove and welded, the cold plate hot side interface and the cold plate cold side interface are located on two sides of the U-shaped pipe, and the cold plate and the heat dissipation surface are fixed through the cold plate mounting holes in a bolt fit mode.
Preferably, the evaporator comprises a capillary core, a tube shell, a bayonet tube, a steam connecting tube and a saddle;
the outer surface of the capillary core is provided with a steam channel, and a central hole of the capillary core is used as a liquid main channel;
the outer diameter of the capillary core is in interference fit with the inner diameter of the tube shell, the saddle is welded with the tube shell, and the steam connecting tube is arranged at the tail of the tube shell;
one end of the bayonet tube extends into the liquid main channel, and the other end of the bayonet tube penetrates through the liquid storage device to serve as a liquid pipeline interface.
Preferably, the evaporator is a cylindrical evaporator.
Preferably, the capillary wick is a porous material.
By implementing the technical scheme of the utility model, the technical problems of high whole satellite development cost, high design complexity and low design flexibility in the prior art can be solved; implement the technical scheme of the utility model, carry out the type of the spectrogram design through evaporimeter, reservoir, cold drawing, the heat exchanger to in the system, the condenser adopts the mode of the cooling surface coupling from the area with the celestial body, can realize reducing design complexity and development cost, realizes the technological effect of thermal management system's lightweight design.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only one embodiment of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "bottom" and "top," "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic cross-sectional view of a heat dissipating surface;
FIG. 3 is a schematic sectional view of the evaporator and the accumulator;
FIG. 4 is a schematic view of a cold plate configuration;
fig. 5 is a schematic diagram of the heat exchanger.
In the above drawings, the reference numerals denote:
1. evaporator with a heat exchanger
1-1, capillary core
1-1-1, steam channel
1-1-2, liquid trunk
1-2, pipe shell
1-3, bayonet tube
1-4, steam connecting pipe
1-5 saddle
2. Liquid storage device
3. Steam pipeline
4. Liquid pipeline
5. Cold plate
5-1, heat sink
5-2U-shaped tube
5-3 cold plate hot side interface
5-4 cold side interface of cold plate
5-5 cold plate mounting hole
6. Heat exchanger
6-1, heat exchange plate
6-2, coil pipe
6-3, cold side interface of heat exchanger
6-4 hot side interface of heat exchanger
6-5, heat exchanger mounting hole
7. Cold side adapter
8. Hot side connecting pipe
9. Heat source
10. Heat radiation surface
11. Axial slot heat pipe
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Examples
In a specific embodiment, as shown in fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, a loop heat pipe based spacecraft thermal management system comprises an evaporator 1, a reservoir 2, a vapor pipe 3, a liquid pipe 4, a cold plate 5, a heat exchanger 6, a cold side nozzle 7, a hot side nozzle 8, an axial channel heat pipe 11 and a heat dissipation surface 10.
The spacecraft of this embodiment has a total of 5 discrete heat sources 9 that require heat dissipation.
The number of heat exchangers 6 is equal to the number of heat sources 9, and 5 heat exchangers 6 are required.
The heat exchanger 6 comprises a heat exchange plate 6-1, a coil 6-2, a heat exchanger cold side interface 6-3, a heat exchanger hot side interface 6-4 and a heat exchanger mounting hole 6-5. An S-shaped plate groove is formed in the heat exchange plate 6-1, the groove depth is slightly larger than the diameter of the coil pipe 6-2, the whole coil pipe 6-2 is embedded into the plate groove and then welded, and the surface embedded with the coil pipe 6-2 is machined to be flat in a machining center. The cold side interface 6-3 and the hot side interface 6-4 of the heat exchanger are respectively positioned at two sides of the coil 6-2. The heat exchanger 6 and the heat source 9 are fixedly attached by bolts through the heat exchanger mounting holes 6-5;
the number of cold plates 5 is 1 more than the number of heat sources, requiring 6 cold plates 5 in total.
The cold plate 5 comprises a heat dissipation plate 5-1, a U-shaped pipe 5-2, a cold plate hot side interface 5-3, a cold plate cold side interface 5-4 and a cold plate mounting hole 5-5; a U-shaped plate groove is formed in the heat dissipation plate 5-1, the groove depth is half of the diameter of the U-shaped pipe 5-2, and the U-shaped pipe 5-2 is embedded into the plate groove and then welded. And a cold plate hot side interface 5-3 and a cold plate cold side interface 5-4 are respectively reserved on two sides of the U-shaped pipe 5-2. The cold plate 5 and the radiating surface 10 are fixedly attached through a cold plate mounting hole 5-5 by using a bolt, and the mounting position of the cold plate 5 is superposed with the condensation section of the axial channel heat pipe 11 pre-embedded in the radiating surface 10;
the number of the cold side connecting pipes 7 is equal to that of the heat exchangers 6, 5 cold side connecting pipes 7 are needed in total, and the cold side connecting pipes 7 are connected with cold side interfaces 5-4 of the cold plate and cold side interfaces 6-3 of the heat exchangers;
the number of the hot side connecting pipes 8 is equal to that of the heat exchangers 6, 5 hot side connecting pipes 8 are needed in total, and the hot side connecting pipes 8 are connected with a cold plate hot side interface 5-3 and a heat exchanger hot side interface 6-4;
the evaporator 1 is a cylindrical evaporator and comprises a capillary core 1-1, a tube shell 1-2, a bayonet tube 1-3, a steam connecting tube 1-4 and a saddle 1-5. The capillary core 1-1 is made of porous materials, the outer surface of the capillary core 1-1 is provided with a steam channel 1-1-1, and a central hole of the capillary core 1-1 is used as a liquid main channel 1-1-2. The outer diameter of the capillary core 1-1 is in interference fit with the inner diameter of the tube shell 1-2, the saddle 1-5 is connected with the tube shell 1-2 in a welding way, the tail part of the tube shell 1-2 is provided with a steam connecting tube 1-4, the liquid accumulator 2 is welded with the tube shell 1-2 of the evaporator 1 into a whole, one end of the bayonet tube 1-3 extends into the liquid main channel 1-1-2 of the capillary core 1-1, and the other end of the bayonet tube passes through the liquid accumulator 2 to be used as a liquid pipeline interface;
the liquid pipeline 3 is connected with steam connecting pipes 1-4 of the evaporator 1 and cold plate hot side interfaces 5-3 of the first cold plate 5, and the cold plates 5 of the 1 st to 5 th groups are sequentially connected with the heat exchanger 6 in series through cold side connecting pipes 7 and hot side connecting pipes 8. The cold side interface 5-4 of the 6 th cold plate 5 is connected with the bayonet tubes 1-3 extending out of the liquid reservoir 2 through the liquid pipeline 4.
The evaporator 1 is provided with thermal power Q, a working medium is evaporated on the outer surface of the capillary core 1-1 after being heated, steam is collected to the steam connecting pipe 1-4 through the steam channel 1-1-1 and enters the steam pipeline 3, the working medium sequentially enters the cold plate 5 and the heat exchanger 6 which are connected in series, the heat of the working medium at the cold plate 5 is quickly dissipated to the outside through the axial channel heat pipe 1 pre-embedded in the heat dissipation surface 10, the working medium is condensed into liquid, the working medium is evaporated into steam after receiving the heat of the heat source 9 at the heat exchanger 6, the working medium condensed into the liquid through the 6 th cold plate 5 enters the liquid main channel 1-1-2 of the capillary core 1-1 from the bayonet pipe 1-3 along the liquid pipeline 4 and is conveyed to the outer surface of the capillary core 1-1 under the action of capillary force, and therefore a self-circulation two-phase flow loop is formed.
The heat power Q provided by the evaporator 1 is required to be more than the maximum value of the heat power of 6 heat sources.
The embodiment is only one embodiment of the present invention.
When n scattered heat sources in the spacecraft need to dissipate heat, the number of the heat exchangers, the cold side connecting pipes and the hot side connecting pipes is n, the number of the cold plates is n +1, the number of the axial channel heat pipes pre-embedded in the heat dissipation surface is not less than n +1, and n is a positive integer greater than or equal to 1.
Providing heat power Q for an evaporator, evaporating a working medium after the working medium is heated, feeding steam into n +1 cold plates and n heat exchangers which are sequentially connected in series through a steam pipeline, quickly dissipating the heat of the working medium at the cold plates to the outside through axial channel heat pipes pre-embedded in a heat dissipation surface, and condensing the working medium into a liquid state; the heat of the heat source is received at the heat exchanger and evaporated into steam, and the working medium condensed into liquid by the (n + 1) th cold plate enters the liquid reservoir along the liquid pipeline, so that a self-circulation two-phase flow loop is formed.
The thermal power Q provided by the evaporator is required to be larger than the maximum value of the thermal power of the n heat sources, and the evaporator, the cold plate and the heat exchanger can be designed and selected according to the type spectrum.
Compared with the prior art, the beneficial effects of the utility model are that:
the thermal control product can be subjected to type spectrum design and standardized stock, so that the development cost can be greatly reduced;
the heat management system is completely decoupled from the whole satellite design, and only the type spectrum specification of the loop heat pipe with enough heat transfer capacity, the size of the designed radiating surface and the pipeline layout are required to be selected during design, so that the design complexity is greatly reduced;
the assembly of the thermal management system only needs to thermally couple the single machine and the cold plate, is not limited to an external sticking or pre-embedding mode, and is convenient and quick in the assembly process;
the loop heat pipe has large heat quantity and long-distance heat transfer capacity, so that the heat management system has no special requirements on the layout of the cold plate, and the corresponding satellite platform has no special requirements on the layout of a single machine, thereby greatly improving the design flexibility of the satellite platform.
It should be understood that the above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and that any modifications, equivalents, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (6)

1. A spacecraft thermal management system based on a loop heat pipe is characterized by comprising an evaporator, a liquid storage device, a steam pipeline, a liquid pipeline, a cold plate, a heat exchanger, a cold side connecting pipe, a hot side connecting pipe, an axial channel heat pipe and a radiating surface;
the evaporator is welded with the liquid storage device, the steam pipeline is connected with the evaporator, the liquid pipeline is connected with the liquid storage device, and the axial channel heat pipe is embedded in the heat dissipation surface;
the number of the heat exchanger, the number of the cold side connecting pipes and the number of the hot side connecting pipes are equal to the number of the heat sources and are all n, the number of the cold plates is n +1, and the number of the axial channel heat pipes pre-embedded in the heat radiating surface is not less than n + 1;
the cold side connecting pipe is connected with the heat exchanger and the cold plate, and the hot side connecting pipe is connected with the heat exchanger and the next cold plate;
the cold plate is superposed with the position of the condensation section of the embedded axial channel heat pipe;
the vapor pipeline is connected with the first cold plate, and the liquid pipeline is connected with the (n + 1) th cold plate.
2. The loop heat pipe based spacecraft thermal management system of claim 1, wherein the heat exchanger comprises heat exchange plates, a coil, a heat exchanger cold side interface, a heat exchanger hot side interface and heat exchanger mounting holes;
the heat exchange plate is provided with an S-shaped plate groove, and the coil is embedded into the S-shaped plate groove and welded;
the heat exchanger cold side interface and the heat exchanger hot side interface are located on two sides of the coil pipe, and the heat exchanger mounting holes are formed in the heat exchange plates.
3. A loop heat pipe based spacecraft thermal management system according to claim 2, wherein the cold plate comprises a heat spreader plate, U-tubes, a cold plate hot side interface, a cold plate cold side interface, and cold plate mounting holes;
the U-shaped plate groove is formed in the heat dissipation plate, the U-shaped pipe is embedded into the U-shaped plate groove and welded, the cold plate hot side interface and the cold plate cold side interface are located on two sides of the U-shaped pipe, and the cold plate and the heat dissipation surface are fixed through the cold plate mounting holes in a bolt fit mode.
4. A loop heat pipe based spacecraft thermal management system according to claim 3, wherein the evaporator comprises a capillary wick, a tube shell, a bayonet tube, a vapor connection tube and a saddle;
the outer surface of the capillary core is provided with a steam channel, and a central hole of the capillary core is used as a liquid main channel;
the outer diameter of the capillary core is in interference fit with the inner diameter of the tube shell, the saddle is welded with the tube shell, and the steam connecting tube is arranged at the tail of the tube shell;
one end of the bayonet tube extends into the liquid main channel, and the other end of the bayonet tube penetrates through the liquid storage device to serve as a liquid pipeline interface.
5. A loop heat pipe based spacecraft thermal management system according to claim 4, wherein the evaporator is a cylindrical evaporator.
6. A spacecraft thermal management system based on a loop heat pipe according to claim 5, wherein the capillary wick is a porous material.
CN202222029005.XU 2022-08-03 2022-08-03 Spacecraft thermal management system based on loop heat pipe Active CN218317406U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222029005.XU CN218317406U (en) 2022-08-03 2022-08-03 Spacecraft thermal management system based on loop heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222029005.XU CN218317406U (en) 2022-08-03 2022-08-03 Spacecraft thermal management system based on loop heat pipe

Publications (1)

Publication Number Publication Date
CN218317406U true CN218317406U (en) 2023-01-17

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Application Number Title Priority Date Filing Date
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Country Status (1)

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CN (1) CN218317406U (en)

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