CN218315242U - Gold finger high temperature sticky tape pressing mechanism - Google Patents

Gold finger high temperature sticky tape pressing mechanism Download PDF

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Publication number
CN218315242U
CN218315242U CN202222648461.2U CN202222648461U CN218315242U CN 218315242 U CN218315242 U CN 218315242U CN 202222648461 U CN202222648461 U CN 202222648461U CN 218315242 U CN218315242 U CN 218315242U
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China
Prior art keywords
sliding
adhesive tape
rack
wheel
tape pressing
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CN202222648461.2U
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Chinese (zh)
Inventor
闫发奎
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Fuzhou Yulong Photoelectric Technology Co ltd
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Fuzhou Yulong Photoelectric Technology Co ltd
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Abstract

The utility model belongs to the technical field of PCB production, concretely relates to golden finger high temperature sticky tape pressing mechanism, including frame, step motor and the moulding pulley that is located the track of the platform of plugging into, step motor is used for driving the moulding pulley to rotate, moulding pulley rotation can order about the PCB board on the track of the platform of plugging into to move; the stepping motor and the rubber pressing belt wheel are both arranged on the frame. In this scheme, but change the power device of adhesive tape machine into speed governing's step motor by the cylinder, ensure that PCB board, carrier can be at the uniform velocity forward motion, and the forward speed becomes adjustable steerable to make the adhesion of high temperature sticky tape and PCB board inseparabler difficult for bounceing, improved the yields.

Description

Gold finger high temperature sticky tape pressing mechanism
Technical Field
The utility model belongs to the technical field of the PCB production, concretely relates to gold finger high temperature sticky tape pressing mechanism.
Background
In the production of PCB boards, in order to prevent the gold fingers on the PCB board from being contaminated or oxidized, a high temperature adhesive tape is usually attached to the gold fingers. In current production and processing process, generally utilize the adhesive tape machine to carry out the attached of high temperature sticky tape to placing the PCB board golden finger on the carrier, the high temperature sticky tape is tentatively attached behind the golden finger on the PCB board, and the last pressure sticky tape wheel of adhesive tape machine carries out the pressfitting to high temperature sticky tape, makes the comparatively firm adhesion of high temperature sticky tape ability on the PCB board. The existing adhesive tape adhering machine uses an air cylinder as power to push a carrier to move forwards from a gap between a connecting table rail and an adhesive tape pressing wheel, so that the adhesive tape pressing wheel presses a high-temperature adhesive tape on a PCB metal finger. However, because the speed of the air cylinder is not well controlled, the air cylinder with too small air pressure can not push the carrier, and the carrier is pushed too fast by too large air pressure, so that the high-temperature adhesive tape can not be firmly adhered to the PCB.
Disclosure of Invention
The utility model discloses it is anticipated that a gold finger high temperature sticky tape pressing mechanism is provided to solve the carrier velocity of motion wayward and lead to the not firm problem of high temperature sticky tape adhesion.
In order to achieve the above purpose, the utility model discloses a scheme does: a gold finger high-temperature adhesive tape pressing mechanism comprises a rack, a stepping motor and an adhesive tape pressing belt wheel positioned above a connection table rail, wherein the stepping motor is used for driving the adhesive tape pressing belt wheel to rotate, and the rotation of the adhesive tape pressing belt wheel can drive a PCB on the connection table rail to move; the stepping motor and the rubber pressing belt wheel are both arranged on the frame.
The working principle and the beneficial effects of the scheme are that: during operation, the PCB is placed on the carrier, and the carrier is positioned on the connection table track. The step motor drives the tape pressing wheel to rotate, the carrier between the connecting table rail and the tape pressing wheel and the PCB are driven to move forwards by the forward friction force generated by the rotation of the tape pressing wheel, and the tape pressing wheel can drive the PCB to move and can firmly attach the high-temperature tape to golden fingers of the PCB in the process. In this scheme, but with the power device of adhesive tape machine change the step motor of speed governing into by the cylinder, ensure that PCB board, carrier can be at the uniform velocity forward motion, and the forward velocity becomes adjustable steerable to make the adhesion of high temperature sticky tape and PCB board inseparabler difficult for bounceing, improved the yields.
Optionally, a dust removal roller with one side contacting the rubber pressing belt wheel is mounted on the frame. If foreign matters are possibly adhered to the tape pressing wheel on the PCB, the foreign matters are possibly adhered to the PCB on the same tape pressing wheel, and the dust removing roller is arranged to remove the foreign matters, dust and the like on the tape pressing wheel, so that the tape pressing wheel and the PCB are kept clean.
Optionally, both ends of the adhesive pressing belt wheel are connected with rotating shafts; sliding through grooves are formed in the left side and the right side of the rack, sliding blocks are connected to the sliding through grooves in a sliding mode, and rotating shafts at two ends of the adhesive tape pressing belt wheel are connected to different sliding blocks in a rotating mode; the rack is rotatably connected with a rotating rod, and the lower part of the rotating rod is in threaded connection with one of the sliding blocks; one of the slide blocks is connected with a mounting plate, and the stepping motor is mounted on the mounting plate. When the carrier is replaced to convey PCBs of different specifications, in order to ensure that the tape pressing wheel can keep in contact with the PCBs on the carrier, the rotating rod is screwed to adjust the position of the sliding block, so that the position of the tape pressing wheel is adjusted, and the tape pressing wheel is ensured to enable the high-temperature adhesive tape to be tightly attached to the golden finger of the PCB. So set up, enable the pressfitting mechanism of this scheme to be applicable to the PCB board of different specifications, increase its application scope.
Optionally, the rack is provided with a rotation hole and an annular groove communicated with the rotation hole, the rotation rod penetrates through the rotation hole, and the rotation rod is provided with an annular sheet rotatably connected in the annular groove. This arrangement ensures that the rotary rod can only rotate on the frame and cannot move.
Optionally, a protruding strip located in the sliding through groove is arranged on the rack, and a groove connected to the protruding strip in a sliding mode is formed in the sliding block.
Optionally, sliding rods are arranged on the left side and the right side of the rack, and moving blocks are connected to the sliding rods in a sliding manner; the two ends of the dust removal roller are connected with connecting shafts, and the connecting shafts at the two ends of the dust removal roller are respectively and rotatably connected to different moving blocks; and the moving block is connected with a threaded rod with one end capable of contacting with the sliding rod in a threaded manner. Set up like this, can adjust the position of dust removal gyro wheel through adjusting the position of movable block, changed when the position of moulding band pulley, the position of adjustable dust removal gyro wheel ensures that the dust removal gyro wheel can contact with moulding band pulley all the time.
Drawings
Fig. 1 is a top view of a gold finger high-temperature adhesive tape pressing mechanism according to an embodiment of the present invention;
fig. 2 is a top view of a gold finger high-temperature adhesive tape pressing mechanism according to a second embodiment of the present invention;
fig. 3 isbase:Sub>A sectional view taken alongbase:Sub>A-base:Sub>A in fig. 2.
Detailed Description
The following is further detailed by way of specific embodiments:
reference numerals in the drawings of the specification include: the device comprises a frame 10, convex strips 11, a sliding through groove 12, a connecting table track 20, a rubber belt pressing wheel 30, a dust removal roller 31, a stepping motor 40, a mounting plate 41, a sliding block 50, a rotating rod 60, an annular sheet 61, a sliding rod 70, a moving block 71, a threaded rod 72, a rotating shaft 80 and a connecting shaft 81.
Example one
This embodiment is substantially as shown in fig. 1: a gold finger high-temperature adhesive tape pressing mechanism comprises a rack 10, a dust removal roller 31, a stepping motor 40 and an adhesive tape pressing belt wheel 30 located above a connecting platform track 20, wherein the stepping motor 40 is fixedly installed on the rack 10, the adhesive tape pressing belt wheel 30 and the dust removal roller 31 are both rotatably connected onto the rack 10, the dust removal roller 31 is in contact with one side of the adhesive tape pressing belt wheel 30, the dust removal roller 31 is arranged to remove foreign matters, dust and the like on the adhesive tape pressing belt wheel 30, and the adhesive tape pressing belt wheel 30 and a PCB are kept clean. The stepping motor 40 is used to drive the tape wheel 30 to rotate, and in the present embodiment, the output shaft of the stepping motor 40 is welded at the rotation center of the tape wheel 30. During operation, the carrier is placed on the connecting table track 20, the PCB is placed on the carrier, when the carrier and the PCB are located below the adhesive tape pressing wheel 30, the PCB is in contact with the adhesive tape pressing wheel 30, the adhesive tape pressing wheel 30 rotates to drive the PCB on the connecting table track 20 and the carrier to move together, and the adhesive tape pressing wheel 30 enables the high-temperature adhesive tape to be firmly attached to golden fingers of the PCB in the process.
Example two
This embodiment is basically as shown in fig. 2 and 3: the utility model provides a gold finger high temperature sticky tape pressing mechanism, includes frame 10, dust removal gyro wheel 31, step motor 40 and is located the moulding belt wheel 30 of the platform track 20 top of plugging into, and the pivot 80 has all been welded at moulding belt wheel 30's both ends, and connecting axle 81 has all been welded at the both ends of dust removal gyro wheel 31. All open on the left and right sides of frame 10 and have the groove 12 that leads to that slides, sliding connection has slider 50 on the groove 12 that leads to that slides, and is specific, an organic whole is provided with the sand grip 11 that is located the groove 12 that leads to that slides on frame 10, and it has the recess of sliding connection on sand grip 11 to open on slider 50. The rotating shafts 80 at the two ends of the tape pressing wheel 30 are respectively and rotatably connected to different sliding blocks 50 through bearings. The rotating rod 60 is rotatably connected to the rack 10, specifically, a rotating hole and an annular groove communicated with the rotating hole are formed in the rack 10, the rotating rod 60 penetrates through the rotating hole, and an annular sheet 61 rotatably connected in the annular groove is integrally arranged on the rotating rod 60. The lower portion of the rotating rod 60 is screwed to one of the sliding blocks 50, and the sliding blocks 50 can slide along the sliding through grooves 12 by screwing the rotating rod 60. The slider 50 in threaded connection with the rotating rod 60 is connected with a mounting plate 41, the stepping motor 40 is fixedly mounted on the mounting plate 41, an output shaft of the stepping motor 40 is welded on a rotating shaft 80 of the adhesive tape pressing belt wheel 30, and the stepping motor 40 is started to drive the adhesive tape pressing belt wheel 30 to rotate. During operation, the carrier is placed on the connection table rail 20, the PCB is placed on the carrier, when the carrier and the PCB are located below the rubber belt pressing wheel 30, the PCB is in contact with the rubber belt pressing wheel 30, and the rubber belt pressing wheel 30 rotates to drive the PCB on the connection table rail 20 and the carrier to move together.
Slide bars 70 are welded on the left and right sides of the frame 10, and moving blocks 71 are slidably connected to the slide bars 70. The connecting shafts 81 at both ends of the dust removing roller 31 are rotatably connected to different moving blocks 71 through bearings, respectively. A threaded rod 72 having one end capable of contacting the slide rod 70 is threadedly coupled to the moving block 71. The position of the dust removal roller 31 can be adjusted by adjusting the position of the moving block 71, and when the position of the adhesive tape pressing wheel 30 is changed, the position of the dust removal roller 31 can be adjusted, so that the dust removal roller 31 can be always in contact with the adhesive tape pressing wheel 30.
The above description is only an example of the present invention, and the common general knowledge of the known specific structures and characteristics of the embodiments is not described herein. It should be pointed out that to those skilled in the art, without departing from the structure of the present invention, a plurality of modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the utility of the present invention.

Claims (6)

1. The utility model provides a gold finger high temperature sticky tape pressing mechanism which characterized in that: the PCB connection device comprises a rack (10), a stepping motor (40) and a rubber belt pressing wheel (30) positioned above a connection table track (20), wherein the stepping motor (40) is used for driving the rubber belt pressing wheel (30) to rotate, and the rotation of the rubber belt pressing wheel (30) can drive a PCB on the connection table track (20) to move; the stepping motor (40) and the rubber pressing belt wheel (30) are both arranged on the rack (10).
2. The gold finger high-temperature adhesive tape pressing mechanism according to claim 1, characterized in that: and a dust removal roller (31) with one side contacting with the rubber pressing belt wheel (30) is arranged on the frame (10).
3. The gold finger high-temperature adhesive tape pressing mechanism according to claim 2, characterized in that: both ends of the rubber pressing belt wheel (30) are connected with rotating shafts (80); sliding through grooves (12) are formed in the left side and the right side of the rack (10), sliding blocks (50) are connected to the sliding through grooves (12) in a sliding mode, and rotating shafts (80) at the two ends of the rubber belt pressing wheel (30) are connected to different sliding blocks (50) in a rotating mode respectively; a rotating rod (60) is rotatably connected to the rack (10), and the lower part of the rotating rod (60) is in threaded connection with one of the sliding blocks (50); one of the sliding blocks (50) is connected with a mounting plate (41), and the stepping motor (40) is mounted on the mounting plate (41).
4. The high-temperature adhesive tape laminating mechanism for gold fingers according to claim 3, wherein: the rotary type motor is characterized in that a rotary hole and an annular groove communicated with the rotary hole are formed in the rack (10), the rotary rod (60) penetrates through the rotary hole, and an annular sheet (61) which is connected in the annular groove in a rotary mode is arranged on the rotary rod (60).
5. The high-temperature adhesive tape laminating mechanism for gold fingers according to claim 3, wherein: the improved sliding machine is characterized in that a protruding strip (11) located in a sliding through groove (12) is arranged on the rack (10), and a groove in sliding connection with the protruding strip (11) is formed in the sliding block (50).
6. The gold finger high-temperature adhesive tape pressing mechanism according to any one of claims 2 to 5, wherein: the left side and the right side of the rack (10) are respectively provided with a sliding rod (70), and the sliding rods (70) are connected with a moving block (71) in a sliding manner; the two ends of the dust removing roller (31) are connected with connecting shafts (81), and the connecting shafts (81) at the two ends of the dust removing roller (31) are respectively and rotatably connected to different moving blocks (71); and a threaded rod (72) with one end capable of being in contact with the sliding rod (70) is connected to the moving block (71) in a threaded manner.
CN202222648461.2U 2022-09-30 2022-09-30 Gold finger high temperature sticky tape pressing mechanism Active CN218315242U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222648461.2U CN218315242U (en) 2022-09-30 2022-09-30 Gold finger high temperature sticky tape pressing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222648461.2U CN218315242U (en) 2022-09-30 2022-09-30 Gold finger high temperature sticky tape pressing mechanism

Publications (1)

Publication Number Publication Date
CN218315242U true CN218315242U (en) 2023-01-17

Family

ID=84824402

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222648461.2U Active CN218315242U (en) 2022-09-30 2022-09-30 Gold finger high temperature sticky tape pressing mechanism

Country Status (1)

Country Link
CN (1) CN218315242U (en)

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