CN218314738U - Heat dissipation mechanism for die manufacturing - Google Patents
Heat dissipation mechanism for die manufacturing Download PDFInfo
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- CN218314738U CN218314738U CN202222495148.XU CN202222495148U CN218314738U CN 218314738 U CN218314738 U CN 218314738U CN 202222495148 U CN202222495148 U CN 202222495148U CN 218314738 U CN218314738 U CN 218314738U
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- fan
- base
- die holder
- semiconductor refrigeration
- upper die
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Abstract
The utility model discloses a heat dissipation mechanism is used in mould manufacturing, the on-line screen storage device comprises a base, the fixed die holder that is provided with in middle part on base top, the top block of die holder is provided with the upper die base, the equal fixed heat radiation structure that is provided with in both sides on base top, two heat radiation structure all include the mount pad, first fan, semiconductor refrigeration piece and second fan, the utility model relates to a heat dissipation mechanism is used in mould manufacturing, come the cold air that semiconductor refrigeration piece refrigeration face produced to carry the surface of upper die base and die holder through first fan, accelerate the cooling of upper die base and die holder, come the hot-air that semiconductor refrigeration piece cooling face produced to discharge fast through the second fan, accelerate radiating going on, through leading-in cold water in to a plurality of annular water pipe, come to carry out the heat exchange with upper die base and die holder, accelerate the scattering and disappearing of upper die base and die holder surface heat, and then improve the radiating efficiency, shorten the shaping time, improve production efficiency.
Description
Technical Field
The utility model relates to a mould field of making specifically is a mould is made and is used heat dissipation mechanism.
Background
The die is a precise tool, has a complex shape, bears the expansion force of a blank, and has high requirements on structural strength, rigidity, surface hardness, surface roughness and processing precision, the development level of die production is one of important marks of the mechanical manufacturing level, when a product is manufactured by using a forming die, firstly a molten material is introduced into a lower die holder, then the upper die holder is covered, and then the product is formed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mould is made and is used heat dissipation mechanism to the heat dissipation mechanism that the current mould that provides in solving above-mentioned background art used can appear that the radiating mode is single and the radiating effect is not good in the use, and then influences production efficiency's problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation mechanism for mould manufacturing, includes the base, the fixed die holder that is provided with in middle part on base top, the top block of die holder is provided with the upper die base, the both sides on base top are all fixed and are provided with heat radiation structure, two heat radiation structure all includes mount pad, first fan, semiconductor refrigeration piece and second fan, the inboard one end fixed mounting of mount pad has first fan, the inboard middle part fixed mounting of mount pad has the semiconductor refrigeration piece, the fixed radiating fin that is provided with a plurality of evenly distributed of radiating surface of semiconductor refrigeration piece, a plurality of one side fixed mounting who keeps away from the semiconductor refrigeration piece between the radiating fin has the second fan, carries the surface of upper die base and die holder through the cold air that first fan comes the semiconductor refrigeration piece refrigeration face to produce for the cooling of upper die base and die holder, comes the hot-air that the semiconductor refrigeration piece radiating surface produced to discharge fast through the second fan, radiating going on, the surface of die holder and the surface of upper die base are all fixed water-cooling structure that is provided with.
Preferably, two the water-cooling structure all includes a plurality of annular water pipe and a plurality of branch pipe, every adjacent two all fixed intercommunication has two branch pipes between the annular water pipe, through leading-in cold water in to a plurality of annular water pipe, comes to carry out the heat exchange with upper die base and die holder for scattering and disappearing of upper die base and die holder surface heat, and then improve the radiating efficiency, shorten the shaping time, improve production efficiency.
Preferably, one side of the annular water pipe positioned at the uppermost part is fixedly communicated with a water inlet pipe, one side of the annular water pipe positioned at the lowermost part is fixedly communicated with a water outlet pipe, and cold water is introduced into the annular water pipe through the water inlet pipe.
Preferably, a multi-control switch is fixedly mounted on the front face of one of the heat dissipation structures, the first fan, the two semiconductor refrigeration pieces and the two second fans are electrically connected with an external power supply through the multi-control switch, and the two first fans, the two semiconductor refrigeration pieces and the two second fans are controlled to be electrified through the multi-control switch to start working.
Preferably, two one ends of the inner sides of the mounting seats, which are far away from the first fan, are fixedly provided with protective nets, and the protective nets can play a dustproof role.
Preferably, the two first fans are respectively arranged corresponding to the refrigerating surfaces of the two semiconductor refrigerating pieces, and cold air generated by the refrigerating surfaces of the semiconductor refrigerating pieces is conveyed to the surfaces of the upper die base and the lower die base through the first fans to accelerate cooling of the upper die base and the lower die base.
Compared with the prior art, the beneficial effects of the utility model are that: carry the surface of upper die base and die holder through the cold air that first fan will semiconductor refrigeration piece refrigeration face produced, accelerate the cooling of upper die base and die holder, discharge the hot-air that semiconductor refrigeration piece cooling surface produced fast through the second fan, accelerate radiating going on, through leading-in cold water in to a plurality of annular water pipe, come to carry out the heat exchange with upper die base and die holder, accelerate scattering and disappearing of upper die base and die holder surface heat, and then improve the radiating efficiency, shorten the shaping time, and the production efficiency is improved.
Drawings
Fig. 1 is a perspective view of the present invention;
fig. 2 is a front sectional view of the present invention;
FIG. 3 is a structural diagram of the water cooling structure of the present invention;
fig. 4 is a structural diagram of the heat dissipation structure of the present invention.
In the figure: 1. a base; 2. a lower die holder; 3. an upper die holder; 4. a water-cooling structure; 41. an annular water pipe; 42. a branch pipe; 43. a water inlet pipe; 44. a water outlet pipe; 5. a heat dissipation structure; 51. a mounting base; 52. a first fan; 53. a semiconductor refrigeration sheet; 54. a heat dissipating fin; 55. a second fan; 56. a protective net; 6. a multi-control switch.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Please refer to fig. 1-4, the utility model provides a heat dissipation mechanism is used in mould manufacturing, including base 1, the fixed die holder 2 that is provided with in middle part on base 1 top, the top block of die holder 2 is provided with upper die base 3, the both sides on base 1 top are all fixed and are provided with heat radiation structure 5, two heat radiation structure 5 all include mount pad 51, first fan 52, semiconductor refrigeration piece 53 and second fan 55, the inboard one end fixed mounting of mount pad 51 has first fan 52, the inboard middle part fixed mounting of mount pad 51 has semiconductor refrigeration piece 53, the fixed radiating surface that is provided with a plurality of evenly distributed's radiating fin 54 of semiconductor refrigeration piece 53, one side fixed mounting who keeps away from semiconductor refrigeration piece 53 between a plurality of radiating fin 54 has second fan 55, carry the surface of upper die base 3 and die base 2 with the cold air that semiconductor refrigeration piece 53 refrigeration face produced through first fan 52, accelerate the cooling of upper die base 3 and lower die base 2, come the hot-air that semiconductor refrigeration piece 53 radiating surface produced through second fan 55 to discharge fast, accelerate the going on the surface of cooling, the surface of lower die base 2 and the surface fixed surface of upper die base 3 all are provided with water-cooling structure 4.
Two water-cooling structure 4 all include a plurality of annular water pipe 41 and a plurality of branch pipe 42, and it has two branch pipes 42 all to fix the intercommunication between every two adjacent annular water pipe 41, through leading-in cold water to in a plurality of annular water pipe 41, comes to carry out the heat exchange with upper die base 2 and die holder 3 for scattering and disappearing of upper die base 3 and 2 surperficial heats of die holder, and then improve the radiating efficiency, shorten the shaping time, improve production efficiency.
A water inlet pipe 43 is fixedly communicated with one side of the annular water pipe 41 positioned at the uppermost part, a water outlet pipe 44 is fixedly communicated with one side of the annular water pipe 41 positioned at the lowermost part, and cold water is introduced into the annular water pipe 41 through the water inlet pipe 43.
The front face of one of the heat dissipation structures 5 is fixedly provided with the multi-control switch 6, the two first fans 52, the two semiconductor refrigeration pieces 53 and the two second fans 55 are electrically connected with an external power supply through the multi-control switch 6, and the two first fans 52, the two semiconductor refrigeration pieces 53 and the two second fans 55 are controlled to be electrified through the multi-control switch 6 to start working.
The two first fans 52 are respectively arranged corresponding to the refrigerating surfaces of the two semiconductor refrigerating sheets 53, and cold air generated by the refrigerating surfaces of the semiconductor refrigerating sheets 53 is conveyed to the surfaces of the upper die base 3 and the lower die base 2 through the first fans 52, so that the cooling of the upper die base 3 and the lower die base 2 is accelerated.
When the embodiment of the application is used: an operator firstly guides a molten material to be molded into a molding hole in the lower die holder 2, then the upper die holder 3 is covered, the multi-control switch 6 controls the two first fans 52, the two semiconductor refrigerating sheets 53 and the two second fans 55 to be electrified to start working, cold air generated by refrigerating surfaces of the semiconductor refrigerating sheets 53 is conveyed to the surfaces of the upper die holder 3 and the lower die holder 2 through the first fans 52, cooling of the upper die holder 3 and the lower die holder 2 is accelerated, hot air generated by radiating surfaces of the semiconductor refrigerating sheets 53 is quickly discharged through the second fans 55, heat dissipation is accelerated, cold water is guided into the annular water pipes 41 during use to exchange heat with the upper die holder 2 and the lower die holder 3, heat dissipation of the surfaces of the upper die holder 3 and the lower die holder 2 is accelerated, heat dissipation efficiency is improved, molding time is shortened, and production efficiency is improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a mould is made and is used heat dissipation mechanism, includes base (1), its characterized in that: the fixed die holder (2) that is provided with in middle part on base (1) top, the top block of die holder (2) is provided with upper die base (3), the both sides on base (1) top are all fixed and are provided with heat radiation structure (5), two heat radiation structure (5) all include mount pad (51), first fan (52), semiconductor refrigeration piece (53) and second fan (55), the inboard one end fixed mounting of mount pad (51) has first fan (52), the inboard middle part fixed mounting of mount pad (51) has semiconductor refrigeration piece (53), the fixed radiating fin (54) that are provided with a plurality of evenly distributed of radiating surface of semiconductor refrigeration piece (53), a plurality of one side fixed mounting who keeps away from semiconductor refrigeration piece (53) between radiating fin (54) has second fan (55), the surface of die holder (2) and the surface of upper die base (3) are all fixed and are provided with water-cooling structure (4).
2. The heat dissipating mechanism for mold manufacturing according to claim 1, wherein: two water-cooling structure (4) all include a plurality of annular water pipe (41) and a plurality of branch pipe (42), every adjacent two equal fixed intercommunication has two branch pipes (42) between annular water pipe (41).
3. The heat dissipating mechanism for mold manufacturing according to claim 2, wherein: one side of the annular water pipe (41) positioned at the uppermost part is fixedly communicated with a water inlet pipe (43), and one side of the annular water pipe (41) positioned at the lowermost part is fixedly communicated with a water outlet pipe (44).
4. The heat dissipating mechanism for mold manufacturing according to claim 1, wherein: the front face of one of the heat dissipation structure (5) is fixedly provided with a multi-control switch (6), and the two first fans (52), the two semiconductor refrigeration sheets (53) and the two second fans (55) are electrically connected with an external power supply through the multi-control switch (6).
5. The heat dissipating mechanism for mold manufacturing according to claim 1, wherein: one ends of the inner sides of the two mounting seats (51) far away from the first fan (52) are fixedly provided with protective nets (56).
6. The heat dissipating mechanism for mold manufacturing according to claim 1, wherein: the two first fans (52) are respectively arranged corresponding to the refrigerating surfaces of the two semiconductor refrigerating pieces (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222495148.XU CN218314738U (en) | 2022-09-21 | 2022-09-21 | Heat dissipation mechanism for die manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222495148.XU CN218314738U (en) | 2022-09-21 | 2022-09-21 | Heat dissipation mechanism for die manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218314738U true CN218314738U (en) | 2023-01-17 |
Family
ID=84819080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222495148.XU Active CN218314738U (en) | 2022-09-21 | 2022-09-21 | Heat dissipation mechanism for die manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218314738U (en) |
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2022
- 2022-09-21 CN CN202222495148.XU patent/CN218314738U/en active Active
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