CN218312738U

CN218312738U - Quartz wafer polishing device

Info

Publication number: CN218312738U
Application number: CN202221567789.5U
Authority: CN
Inventors: 赵海峰
Original assignee: Shenyang Jingrun Semiconductor Material Co ltd
Current assignee: Shenyang Jingrun Semiconductor Material Co ltd
Priority date: 2022-06-22
Filing date: 2022-06-22
Publication date: 2023-01-17
Anticipated expiration: 2032-06-22

Abstract

The utility model discloses a quartz wafer burnishing device, including the bottom plate, its characterized in that: the upper side of the bottom plate is fixedly provided with an arched support, an upper side center bearing of the arched support is connected with a center shaft of a first bevel gear, a lower side center of the first bevel gear is fixedly connected with a sleeve, the first bevel gear is meshed with a second bevel gear, a second bevel gear bearing is connected with a vertical plate of an L-shaped plate, the vertical plate of the L-shaped plate is fixedly arranged on the upper side of the arched support, a transverse plate bearing of the L-shaped plate is connected with a center shaft of a third bevel gear, and the lower center end of the third bevel gear is fixedly arranged at the upper end of a rotating column. The utility model relates to a quartz wafer burnishing and polishing equipment field, concretely relates to quartz wafer burnishing device. The to-be-solved technical problem of the utility model is to provide quartz wafer burnishing device, the convenience is carried out burnishing and polishing to quartz wafer.

Description

Quartz wafer polishing device

Technical Field

The utility model relates to a quartz wafer burnishing and polishing equipment field, concretely relates to quartz wafer burnishing device.

Background

The chemical composition of the quartz wafer is SiO2, and the oxide mineral belonging to the trigonal system, i.e., low-temperature quartz (a-quartz), is one of the most widely distributed mineral species in the group of quartz minerals, and quartz has many varieties due to differences in particle size, color, inclusion, and the like. The colorless and transparent quartz is called crystal, the smoky brown to nearly black quartz is commonly called tea crystal or margarite, and the rose color quartz is commonly called hibiscus stone; the kidney-shaped and stalactite cryptocrystalline quartz is called pith, when the quartz crystal is used, polishing treatment needs to be carried out after cutting, the existing polishing technology is low in efficiency, the polishing device cannot fix wafers with different sizes before polishing, a bonding agent needs to be fixed on a support, and the polishing device is troublesome.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide quartz wafer burnishing device, the convenience is carried out burnishing and polishing to quartz wafer.

The utility model adopts the following technical scheme to realize the purpose of the invention:

quartz wafer burnishing device, including the bottom plate, its characterized in that: an arched support is fixed on the upper side of the bottom plate, an upper side center bearing of the arched support is connected with a center shaft of a first bevel gear, a lower side center of the first bevel gear is fixedly connected with a sleeve, the first bevel gear is meshed with a second bevel gear, a second bevel gear bearing is connected with a vertical plate of an L-shaped plate, the vertical plate of the L-shaped plate is fixed on the upper side of the arched support, a horizontal plate bearing of the L-shaped plate is connected with a center shaft of a third bevel gear, the lower end of the center of the third bevel gear is fixed at the upper end of a rotating column, the rotating column penetrates through the center shaft of the first bevel gear and the sleeve, the lower end of the rotating column is fixedly connected with the center of a circular plate, and a group of uniformly distributed circular grooves is formed in the circular plate;

the vertical plate of the L-shaped plate is fixed with a motor, and an output shaft of the motor is fixedly connected with a central shaft of the second bevel gear.

As a further limitation of the technical scheme, the bottom end of each circular groove is provided with a sliding groove, the sliding grooves are formed in the circular plate, symmetrical sliding blocks are arranged in each sliding groove, and the upper side of each sliding block is fixedly connected with a V-shaped clamping rod.

As a further limitation of the technical scheme, a second screw is arranged in each sliding groove, the second screw is connected with the circular plate through a bearing, each second screw is connected with the symmetrical sliding blocks through reverse threads, and one end of each second screw is fixed with a knob.

As a further limitation of the technical scheme, symmetrical edge strips are fixed on the cambered surface of the sleeve, the symmetrical edge strips are respectively matched with clamping grooves, the two clamping grooves are formed in the inner wall of the lantern ring, and the lantern ring is fixed in the central hole of the polishing disc.

As a further limitation of the technical scheme, the upper end bearing of the lantern ring is connected with one end of a moving rod, the other end bearing of the moving rod is connected with the lower end of a screw rod, the screw rod is in threaded connection with the upper side of the arched support, and a handle is fixed at the upper end of the screw rod.

Compared with the prior art, the utility model discloses an advantage is with positive effect:

(1) The device can support and polish a plurality of quartz wafers, is simple to operate and convenient to use, and the polishing disc at the upper side and the circular plate at the lower side rotate reversely to accelerate the polishing speed;

(2) The quartz crystal fixing device is provided with a V-shaped clamping rod, and the V-shaped clamping rod can move to perform auxiliary fixing on quartz wafers with different diameters;

(3) The height of the polishing disc can be adjusted, so that quartz wafers can be conveniently placed in the circular groove, and polishing can be performed on the quartz wafers with different thicknesses.

Drawings

Fig. 1 is a schematic view of a three-dimensional structure of the present invention.

Fig. 2 is a schematic view of a three-dimensional structure of the present invention.

Fig. 3 is a schematic three-dimensional structure diagram of the present invention.

Fig. 4 is a schematic view of a partial three-dimensional structure of the present invention.

Fig. 5 is a schematic diagram of a partial three-dimensional structure of the present invention.

In the figure: 1. the device comprises an arched support, 2, a polishing disc, 3, a bottom plate, 4, a knob, 5, an L-shaped plate, 6, a motor, 7, a bevel gear II, 8, a bevel gear I, 9, a moving rod, 10, a screw rod, 11, a handle, 12, a sleeve, 13, an edge strip, 15, a circular plate, 16, a circular groove, 17, a V-shaped clamping rod, 18, a sliding groove, 19, a screw rod II, 20, a sliding block, 22, a lantern ring, 23, a clamping groove, 24, a bevel gear III, 25 and a rotating column.

Detailed Description

The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms of orientation such as left, right, up, down, front, rear, etc. are only relative concepts to each other or are referred to a normal use state of the product, i.e., a traveling direction of the product, and should not be construed as limiting.

The first embodiment is as follows: the device comprises a bottom plate 3, an arch support 1 is fixed on the upper side of the bottom plate 3, an upper side center bearing of the arch support 1 is connected with a center shaft of a first bevel gear 8, a lower side center of the first bevel gear 8 is fixedly connected with a sleeve 12, the first bevel gear 8 is meshed with a second bevel gear 7, the second bevel gear 7 is connected with a vertical plate of an L-shaped plate 5 through a bearing, the vertical plate of the L-shaped plate 5 is fixed on the upper side of the arch support 1, a horizontal plate bearing of the L-shaped plate 5 is connected with a center shaft of a third bevel gear 24, the lower end of the center of the third bevel gear 24 is fixed at the upper end of a rotating column 25, the rotating column 25 penetrates through the center shaft of the first bevel gear 8 and the sleeve 12, the lower end of the rotating column 25 is fixedly connected with the center of a circular plate 15, and a group of circular grooves 16 which are uniformly distributed are arranged on the circular plate 15;

the vertical plate of the L-shaped plate 5 is fixed with a motor 6, and an output shaft of the motor 6 is fixedly connected with a central shaft of the second bevel gear 7.

Symmetrical strakes 13 are fixed to the cambered surface of the sleeve 12, the strakes 13 are symmetrical and are respectively matched with two clamping grooves 23, the clamping grooves 23 are formed in the inner wall of a lantern ring 22, and the lantern ring 22 is fixed in the center hole of the polishing disc 2.

The upper end bearing of the lantern ring 22 is connected with one end of the moving rod 9, the other end bearing of the moving rod 9 is connected with the lower end of the screw rod 10, the screw rod 10 is in threaded connection with the upper side of the arched support 1, and the handle 11 is fixed at the upper end of the screw rod 10.

Example two: in this embodiment, based on the first embodiment, a sliding groove 18 is respectively disposed at a bottom end of each circular groove 16, the sliding grooves 18 are disposed on the circular plate 15, symmetrical sliding blocks 20 are respectively disposed in each sliding groove 18, and an upper side of each sliding block 20 is fixedly connected to a V-shaped clamping rod 17.

A screw rod II 19 is arranged in each sliding groove 18, the screw rod II 19 is in bearing connection with the circular plate 15, each screw rod II 19 is in threaded connection with the symmetrical sliding blocks 20 through reverse threads, and one end of each screw rod II 19 is fixed with the knob 4.

The use mode of the device is as follows:

rotating a handle 11 to drive a screw rod 10 to rotate, moving the screw rod 10 to drive a moving rod 9 to move, driving a sleeve ring 22 to move by the moving rod 9, moving a clamping groove 23 of the sleeve ring 22 along an edge strip 13, driving a polishing disc 2 to move by the sleeve ring 22, placing a quartz wafer in a circular groove 16 after the polishing disc 2 moves upwards, then rotating the handle 11 to drive the screw rod 10 to rotate, driving the moving rod 9 to move downwards by the downward movement of the screw rod 10, driving the sleeve ring 22 and the polishing disc 2 to move downwards by the moving rod 9, adjusting the polishing disc 2 to press the quartz wafer, and stopping rotating the handle 11;

turning on a motor 6, enabling an output shaft of the motor 6 to rotate to drive a bevel gear II 7 to rotate, enabling the bevel gear II 7 to drive a bevel gear I8 and a bevel gear III 24 to rotate, enabling the bevel gear I8 to rotate to drive a sleeve 12 to rotate, enabling the sleeve 12 to drive an edge strip 13 and a lantern ring 22 to rotate, enabling the lantern ring 22 to drive a polishing disc 2 to rotate, enabling the bevel gear III 24 to drive a rotating column 25 to rotate, enabling the rotating column 25 to drive a circular plate 15 and a quartz wafer in a circular groove 16 to rotate, enabling the rotation directions of the circular plate 15 and the polishing disc 2 to be opposite, and improving polishing speed;

the rotary knob 4 is rotated to drive the second screw rod 19 to rotate, the second screw rod 19 drives the sliding block 20 in threaded connection with the second screw rod to move, the sliding block 20 drives the V-shaped clamping rod 17 to move, and the V-shaped clamping rod 17 can clamp quartz wafers with different diameters.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

Claims

1. Quartz wafer polishing device comprising a base plate (3), characterized in that: an arched support (1) is fixed on the upper side of the bottom plate (3), an upper side center bearing of the arched support (1) is connected with a center shaft of a first bevel gear (8), a lower side center of the first bevel gear (8) is fixedly connected with a sleeve (12), the first bevel gear (8) is meshed with a second bevel gear (7), the second bevel gear (7) is in bearing connection with a vertical plate of an L-shaped plate (5), the vertical plate of the L-shaped plate (5) is fixed on the upper side of the arched support (1), a horizontal plate bearing of the L-shaped plate (5) is connected with a center shaft of a third bevel gear (24), the lower end of the center of the third bevel gear (24) is fixed at the upper end of a rotating column (25), the rotating column (25) penetrates through the center shaft of the first bevel gear (8) and the sleeve (12), the lower end of the rotating column (25) is fixedly connected with the center of a circular plate (15), and a group of circular grooves (16) which are uniformly arranged is arranged on the circular plate (15);

a motor (6) is fixed on the vertical plate of the L-shaped plate (5), and an output shaft of the motor (6) is fixedly connected with a central shaft of the bevel gear II (7).

2. The quartz wafer polishing apparatus as set forth in claim 1, wherein: the bottom end of each circular groove (16) is provided with a sliding groove (18), each sliding groove (18) is arranged on the circular plate (15), each sliding groove (18) is internally provided with symmetrical sliding blocks (20), and the upper side of each sliding block (20) is fixedly connected with a V-shaped clamping rod (17).

3. The quartz wafer polishing apparatus as set forth in claim 2, wherein: a second screw rod (19) is arranged in each sliding groove (18) in a dividing mode, the second screw rods (19) are connected with the circular plate (15) in a bearing mode, each second screw rod (19) is connected with the symmetrical sliding blocks (20) through reverse threads, and one end of each second screw rod (19) is fixed with the knob (4) respectively.

4. The quartz wafer polishing apparatus as set forth in claim 1, wherein: strake (13) of the fixed symmetry of cambered surface of sleeve (12), the symmetry strake (13) match draw-in groove (23) respectively, two draw-in groove (23) all set up the inner wall at the lantern ring (22), the centre bore at the polishing dish (2) is fixed in lantern ring (22).

5. The quartz wafer polishing apparatus as set forth in claim 4, wherein: the upper end bearing of lantern ring (22) connects the one end of carriage release lever (9), the lower extreme of screw rod (10) is connected to the other end bearing of carriage release lever (9), screw rod (10) threaded connection the upside of arched bracket (1), fixed handle (11) in upper end of screw rod (10).