CN212471088U - Substrate surface positioning and polishing device - Google Patents
Substrate surface positioning and polishing device Download PDFInfo
- Publication number
- CN212471088U CN212471088U CN202020844923.6U CN202020844923U CN212471088U CN 212471088 U CN212471088 U CN 212471088U CN 202020844923 U CN202020844923 U CN 202020844923U CN 212471088 U CN212471088 U CN 212471088U
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- Prior art keywords
- wall
- motor
- polishing
- spout
- substrate
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- 238000005498 polishing Methods 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 title claims abstract description 36
- 238000003466 welding Methods 0.000 claims abstract description 8
- 230000001808 coupling Effects 0.000 claims abstract description 4
- 238000010168 coupling process Methods 0.000 claims abstract description 4
- 238000005859 coupling reaction Methods 0.000 claims abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 18
- 241000251468 Actinopterygii Species 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- 241000785686 Sander Species 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Abstract
The utility model discloses a substrate surface location grinding device, including the platform of polishing, the center department of the top portion outer wall of polishing has seted up first spout, and the platform of polishing installs first motor through the bolt on being close to the outer wall of first spout one end, and the output of first motor has the screw rod that extends to first spout inside through the coupling joint, and the other end that first motor was kept away from to the screw rod passes through bearing swing joint on the one end inner wall of first spout, and the screw rod is located equal threaded connection on the inside both ends outer wall of first spout has the slider, and the top welding of slider has splint. The utility model discloses the slider drives splint and carries out the centre gripping location to the substrate for more stable firm when polishing is being carried out to the substrate, and the board is held on the top and is promoted the top through the effect of limiting plate and spring and hold the board and hold the substrate on the top, makes the top hold the board more firm to the centre gripping of substrate, and the electric jar that pushes away can drive grinding motor and go up and down, the substrate of adaptable different thickness.
Description
Technical Field
The utility model relates to a substrate location technical field that polishes especially relates to a substrate surface location grinding device.
Background
The sander is a machine for sanding and processing a material to be processed by driving a millstone to rotate at a high speed through a power device, along with the development of social material civilization, the use requirements of people on each commodity are greatly improved, and in all aspects of life, if burrs are attached to the commodity, a user is easily pricked.
At present, most producers use artifical or solitary polisher to polish polishing and burring to lamps and lanterns substrate product, when processing polishing, if not treating processing lamps and lanterns substrate and fix, then cause the material skew when polishing easily, unable accurate by processing, influence the effect of polishing, have the measurement process of polishing nonstandard and the relatively poor scheduling problem of polisher job stabilization nature simultaneously, be unfavorable for polishing off-the-shelf quality improvement. Therefore, it is desirable to design a substrate surface positioning polishing device to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a substrate surface positioning and polishing device.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a substrate surface location grinding device, includes the platform of polishing, the center department of platform top outer wall of polishing has seted up first spout, and the platform of polishing installs first motor through the bolt on being close to the outer wall of first spout one end, the output of first motor has the screw rod that extends to first spout inside through the coupling joint, and the other end that first motor was kept away from to the screw rod passes through bearing swing joint on the one end inner wall of first spout, equal threaded connection has the slider on the screw rod is located the inside both ends outer wall of first spout, and the top welding of slider has splint.
Further, all install the bracing piece through the bolt on the top outer wall that the platform of polishing is close to first spout both ends, and the top welding of the adjacent one side outer wall of bracing piece has the crossbeam that bottom outer wall center department offered the second spout, one of them the second motor is installed through the bolt to one side of bracing piece top outer wall, and the output parallel key of second motor is connected with the lead screw that extends to the inside of second spout, the other end that the second motor was kept away from to the lead screw passes through bearing swing joint on the inner wall of second spout one end.
Furthermore, the outer wall of the lead screw is in threaded connection with a moving block, the outer wall of the bottom of the moving block is provided with an electric pushing cylinder through a bolt, the output end of the electric pushing cylinder is provided with a polishing motor through a bolt, the output end of the polishing motor is in flat key connection with a polishing disc, and the polishing disc is located right above the first sliding groove.
Further, the rectangular channel has been seted up to the center department of the adjacent one side outer wall of splint, and pegs graft in the inside of rectangular channel and have the top to hold the board, the top is held the board and is located the welding of the inside one side of rectangular channel and has the limiting plate, and the limiting plate keeps away from the welding of the opposite side outer wall that the top held the board and has the spring that the equidistance was upper and lower structural distribution, it has the rubber pad to bond on the opposite side outer wall that the limiting plate was kept away from to.
Furthermore, the centers of the inner walls of the two sides of the first sliding groove and the second sliding groove are respectively provided with a limiting groove, the outer walls of the two sides of the moving block and the sliding block are respectively movably connected with a roller through a rotating shaft, and the rollers are slidably connected inside the limiting grooves.
The utility model has the advantages that:
1. through the first motor that sets up, first motor passes through the screw rod and drives the slider and draw close in the inside of first spout, and the slider drives splint and carries out the centre gripping location to the substrate for substrate stability when polishing more is firm, compact structure, and stability is high, reasonable in design, the practicality is strong.
2. Through the splint that set up, when splint draw close and carry out the centre gripping to the substrate, the effect that the board was held on the top through limiting plate and spring promotes the board that holds on the top to the substrate for the board is held on the top more firm to the centre gripping of substrate, and the rubber pad can prevent effectively that the condition of fish tail from appearing in the substrate.
3. Through the second motor that sets up, when the second motor passed through the lead screw and drives the movable block and remove, the movable block can be timely will polish set and remove to polishing the substrate directly over to polish the substrate, and the electric propulsion jar can drive polishing motor and go up and down, adaptable different thickness's substrate, convenient operation, novel structure.
Drawings
Fig. 1 is a schematic structural view of a substrate surface positioning and polishing device provided by the present invention;
FIG. 2 is a schematic view of a clamping plate structure of the substrate surface positioning and polishing device provided by the present invention;
fig. 3 is a schematic view of a first sliding groove structure of the substrate surface positioning and polishing device provided by the present invention.
In the figure: the grinding machine comprises a grinding table 1, a first sliding groove 2, a first motor 3, a supporting rod 4, a second motor 5, a cross beam 6, a second sliding groove 7, a moving block 8, an electric pushing cylinder 9, a grinding motor 10, a grinding disc 11, a sliding block 12, a screw rod 13, a lead screw 14, a clamping plate 15, a rectangular groove 16, a supporting plate 17, a rubber pad 18, a limiting plate 19, a spring 20, a limiting groove 21 and a roller 22.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 3, a substrate surface positioning and polishing device includes a polishing table 1, a first chute 2 is disposed at the center of the outer wall of the top of the polishing table 1, and the outer wall of the polishing platform 1 close to one end of the first chute 2 is provided with a first motor 3 through a bolt, the model of the first motor 3 is YE2, the output end of the first motor 3 is connected with a screw 13 extending to the inside of the first chute 2 through a coupling, the other end of the screw 13 far away from the first motor 3 is movably connected on the inner wall of one end of the first chute 2 through a bearing, the outer walls of the two ends of the screw 13 positioned in the first chute 2 are both connected with a slide block 12 in a threaded manner, and the top of the sliding block 12 is welded with a clamping plate 15, the first motor 3 drives the sliding block 12 to approach in the first sliding chute 2 through a screw 13, and the slide block 12 drives the clamping plate 15 to clamp and position the base material, so that the base material is more stable and firm when being polished.
Furthermore, the supporting rods 4 are mounted on the outer walls of the tops, close to two ends of the first sliding groove 2, of the polishing table 1 through bolts, the top end of the outer wall of one side, adjacent to the supporting rods 4, of each supporting rod is welded with the beam 6, the center of the outer wall of the bottom of each supporting rod is provided with the corresponding second sliding groove 7, the second motor 5 is mounted on one side of the outer wall of the top of one supporting rod 4 through bolts, the model of the second motor 5 is iHSS86-80-70, the output end of the second motor 5 is connected with the lead screw 14 extending into the corresponding second sliding groove 7 in a flat key mode, the other end, far away from the second motor 5, of the lead screw 14 is movably connected to the inner wall of one end of the second sliding groove 7 through the bearing, when the second motor 5 drives the moving block 8 to move through.
Furthermore, the outer wall of the lead screw 14 is in threaded connection with a moving block 8, the outer wall of the bottom of the moving block 8 is provided with an electric pushing cylinder 9 through a bolt, the electric pushing cylinder 9 is CDQMB32-20 in model, the output end of the electric pushing cylinder 9 is provided with a grinding motor 10 through a bolt, the grinding motor 10 is BLDC-38SRZ-S in model, the output end of the grinding motor 10 is in flat key connection with a grinding disc 11, the grinding disc 11 is located right above the first sliding groove 2, and the electric pushing cylinder 9 can drive the grinding motor 11 to lift and lower, so that the electric pushing cylinder is adaptable to base materials with different thicknesses.
Further, the rectangular channel 16 has been seted up to the center department of the adjacent one side outer wall of splint 15, and the inside grafting of rectangular channel 16 has a top to hold board 17, top is held board 17 and is located the welding of the inside one side of rectangular channel 16 and has limiting plate 19, and limiting plate 19 keeps away from the welding on the opposite side outer wall that top held board 17 has spring 20 that the equidistance is structural distribution from top to bottom, it has rubber pad 18 to bond on the opposite side outer wall that top held board 17 kept away from limiting plate 19, top held board 17 promotes top held board 17 through limiting plate 19 and spring 20's effect and carries out the top to the substrate, make top held board 17 more firm to the centre gripping of substrate, and rubber pad 18 can prevent effectively that the condition of fish tail from appearing.
Further, spacing groove 21 has all been seted up in the center department of first spout 2 and 7 both sides inner walls of second spout, and all has running roller 22 through pivot swing joint on the both sides outer wall of movable block 8 and slider 12, running roller 22 sliding connection is in the inside of spacing groove 21, and running roller 22 slides in the inside of spacing groove 21 for movable block 8 and slider 12 are more stable when removing, and then have promoted the precision that the substrate was polished.
The working principle is as follows: when the base material surface positioning and polishing device is used, an operator firstly places a base material to be polished on a polishing table 1, then a first motor 3 drives a sliding block 12 to draw close in a first sliding groove 2 through a screw 13, the sliding block 12 drives a clamping plate 15 to clamp and position the base material, so that the base material is more stable and firm when being polished, when the clamping plate 15 draws close to clamp the base material, a jacking plate 17 pushes the jacking plate 17 to jack the base material through the action of a limiting plate 19 and a spring 20, so that the jacking plate 17 clamps the base material more firmly, a rubber pad 18 can effectively prevent the base material from being scratched, after the base material is fixed, when a second motor 5 drives a moving block 8 to move through a lead screw 14, the moving block 8 can timely move the polishing disc 11 to be right above the polished base material to polish the base material, an electric pushing cylinder 9 can drive the polishing motor 11 to go up and down, can be adapted to base materials with different thicknesses.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The utility model provides a substrate surface location grinding device, includes grinding table (1), its characterized in that, first spout (2) have been seted up to the center department of grinding table (1) top outer wall, and install first motor (3) through the bolt on grinding table (1) is close to the outer wall of first spout (2) one end, the output of first motor (3) has screw rod (13) that extend to first spout (2) inside through the coupling joint, and screw rod (13) keep away from the other end of first motor (3) and pass through bearing swing joint on the one end inner wall of first spout (2), equal threaded connection has slider (12) on screw rod (13) are located the both ends outer wall of first spout (2) inside, and the top welding of slider (12) has splint (15).
2. The substrate surface positioning and polishing device according to claim 1, characterized in that the top outer walls of the polishing table (1) close to the two ends of the first sliding groove (2) are respectively provided with a support rod (4) through a bolt, the top end of the outer wall of one side adjacent to the support rod (4) is welded with a cross beam (6) with a second sliding groove (7) at the center of the outer wall of the bottom, one side of the outer wall of the top of the support rod (4) is provided with a second motor (5) through a bolt, the output end of the second motor (5) is in flat key connection with a lead screw (14) extending into the second sliding groove (7), and the other end of the lead screw (14) far away from the second motor (5) is movably connected onto the inner wall of one end of the second sliding groove (7) through.
3. The substrate surface positioning and polishing device according to claim 2, characterized in that a moving block (8) is connected to the outer wall of the lead screw (14) in a threaded manner, an electric pushing cylinder (9) is installed on the outer wall of the bottom of the moving block (8) through a bolt, a polishing motor (10) is installed at the output end of the electric pushing cylinder (9) through a bolt, a polishing disk (11) is connected to the output end of the polishing motor (10) in a flat key manner, and the polishing disk (11) is located right above the first sliding groove (2).
4. The substrate surface positioning and polishing device according to claim 1, characterized in that a rectangular groove (16) is formed in the center of the outer wall of one adjacent side of the clamping plate (15), a supporting plate (17) is inserted into the rectangular groove (16), a limiting plate (19) is welded on one side of the supporting plate (17) located inside the rectangular groove (16), springs (20) with equal distances distributed in an up-and-down structure are welded on the outer wall of the other side of the limiting plate (19) far away from the supporting plate (17), and a rubber pad (18) is bonded on the outer wall of the other side of the supporting plate (17) far away from the limiting plate (19).
5. The substrate surface positioning and polishing device according to claim 1, wherein the centers of the inner walls of the first chute (2) and the second chute (7) are respectively provided with a limiting groove (21), the outer walls of the two sides of the moving block (8) and the sliding block (12) are respectively movably connected with a roller (22) through a rotating shaft, and the roller (22) is slidably connected inside the limiting groove (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020844923.6U CN212471088U (en) | 2020-05-20 | 2020-05-20 | Substrate surface positioning and polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020844923.6U CN212471088U (en) | 2020-05-20 | 2020-05-20 | Substrate surface positioning and polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212471088U true CN212471088U (en) | 2021-02-05 |
Family
ID=74460089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020844923.6U Active CN212471088U (en) | 2020-05-20 | 2020-05-20 | Substrate surface positioning and polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212471088U (en) |
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2020
- 2020-05-20 CN CN202020844923.6U patent/CN212471088U/en active Active
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