CN218299762U - Composite loading equipment for chip packaging - Google Patents
Composite loading equipment for chip packaging Download PDFInfo
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- CN218299762U CN218299762U CN202222421363.5U CN202222421363U CN218299762U CN 218299762 U CN218299762 U CN 218299762U CN 202222421363 U CN202222421363 U CN 202222421363U CN 218299762 U CN218299762 U CN 218299762U
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Abstract
The utility model discloses a compound loading equipment for chip package, this compound loading equipment need artifical corresponding mould of adoption to fix and guarantee the complete shaping of injection moulding material in the chip outside when aiming at solving present chip adoption encapsulation of moulding plastics, and the base plate is influenced by the mould with the chip and is placed the difficulty, technical problem that the packaging efficiency is low. The composite loading equipment comprises a loading platform, a vertical lifting mechanism arranged at the front end of the loading platform, a feeding mechanism arranged at the front end of the vertical lifting mechanism, and a shaping frame horizontally arranged on the upper side of the loading platform. This compound loading device adopts the constant head tank to lock the base plate material, avoids the base plate to take place to remove and leads to the chip to break away from the operating position who moulds plastics the encapsulation when the encapsulation of moulding plastics, guarantees the encapsulation quality, and the design frame through the motor drive upset can be at the outside formation die structure of chip when the encapsulation of moulding plastics, guarantees the shaping of the material of moulding plastics, avoids the installation of mould, makes placing of base plate and chip not disturbed of taking one's place.
Description
Technical Field
The utility model belongs to the encapsulation equipment field, concretely relates to compound loading apparatus for chip package.
Background
In the packaging industry of semiconductors in recent years, various packaging methods are developed, and higher-level packaging integration is realized, so that the package has the advantages of higher density, stronger functions, better performance, smaller volume, lower power consumption, higher speed, smaller delay, lower cost and the like.
When the chip is packaged by injection molding, a mold matched with the chip is placed on the substrate, the chip is enclosed, the injection molding material extrudes the material to the chip on the surface of the substrate, the mold can be better formed after being cooled, and in the Chinese utility model with the bulletin number of CN111128760B, the chip packaging method and the chip packaging structure based on the fan-out type packaging process are disclosed; in addition, the isolation layer made of special materials is additionally arranged between the substrate and the dielectric layer, so that the subsequent separation of the substrate from a solidified chip structure is facilitated, meanwhile, because the bonding force between the dielectric layer and the isolation layer is not high, the chip packaging structure above the dielectric layer and the dielectric layer can be flexibly solidified and packaged during packaging and solidification, the phenomenon of uneven internal stress is avoided, the internal stress of the chip packaging structure can be reduced, the phenomenon of warping is avoided, the packaging efficiency and the quality of the chip packaging structure are improved, the chip is packaged through the injection molding material layer, but when the chip and the substrate are packaged, the chip and the substrate need to be locked by using a positioning device, the movement during packaging is avoided, and in the packaging mode, the mounting of a mold can greatly influence the quick positioning of the substrate and the chip, and the packaging efficiency is low.
Therefore, the installation of the die can influence the situation that the substrate and the chip are placed in place quickly when the chip is subjected to injection molding and packaging, novel packaging equipment is developed, the shaping frame which is automatically separated from a packaging working position is utilized, the feeding and the placing mechanism of the substrate are matched, and the working efficiency of chip packaging is greatly improved.
SUMMERY OF THE UTILITY MODEL
(1) Technical problem to be solved
Not enough to prior art, the utility model aims to provide a compound loading equipment for chip package, this compound loading equipment need the manual work to adopt corresponding mould to fix and guarantee the complete shaping of the material of moulding plastics in the chip outside when aiming at solving present chip adoption encapsulation of moulding plastics, and the base plate receives the mould influence with the chip to place the difficulty, technical problem that the encapsulation efficiency is low.
(2) Technical scheme
In order to solve the technical problem, the utility model provides a compound loading device for chip package like this, this compound loading device including load the platform, install in load the vertical lift mechanism of platform front end, install in the feeding mechanism, the level of vertical lift mechanism front end set up in the design frame of load the platform upside, the constant head tank that the front end was opened wide is seted up to the load platform upper end, the constant head tank shape and base plate shape looks adaptation, the support is installed to the load platform right-hand member, install the parting bead in the middle of the design frame, the parting bead sets up between the chip, the equipment platform is installed to the load platform rear end.
When the composite loading device for chip packaging of the technical scheme is used, a user starts the vertical lifting mechanism, vertically pushes the supporting platform loaded with the substrates which are stacked, the supporting platform moves vertically along the guide frame, the uppermost substrate is sent to the horizontal plane which is parallel to the positioning grooves, then the feeding mechanism is started, the horizontal oil cylinder drives the pushing plate to generate pushing force which moves towards one side of the loading platform to the uppermost substrate, the substrate is pushed into the positioning grooves, then the horizontal oil cylinder withdraws the pushing plate, then the second vertical oil cylinder is started, the enclosing plate is lifted, the opening at the front end of the positioning grooves is sealed, the positioning grooves lock the substrate inside, then a plurality of chips are installed on the substrate, according to the distribution positions of the chips, installing a plurality of separation strips in the shaping frame, starting a rotary motor, enabling the movable shaft and the linkage frame to turn left, enabling the vertical shaping frame to be in a state of being parallel to the loading table and to be enclosed outside the chips, enabling the separation strips to be located between the chips, then starting a linear motor on an encapsulating machine, enabling the encapsulating machine to move from the rear end of the guide rail to the front end and be located above the loading table, extruding an injection molding material into the shaping frame, after the injection molding is completed, driving the encapsulating machine to reset by the linear motor, after the cooling forming, driving the shaping frame to turn right to leave the surface of the loading table by the rotary motor, taking out the substrate and the chips after the encapsulation is completed, sequentially starting the mechanisms again according to the mode, and encapsulating the substrate and the chips of the next layer.
Furthermore, the vertical lifting mechanism comprises a vertical oil cylinder and a bearing platform arranged at the top end of a hydraulic shaft rod of the vertical oil cylinder, guide frames are symmetrically arranged at the left end and the right end of the vertical lifting mechanism, and the left end and the right end of the bearing platform are movably connected to the inner side of the guide frames. The first vertical oil cylinder continuously lifts the supporting platform upwards through continuously extending the hydraulic shaft rod upwards, the lifting distance is one substrate thickness each time, and after feeding of the uppermost substrate is completed, the next substrate is lifted to be in place immediately.
Furthermore, the feeding mechanism comprises a horizontal oil cylinder, a pushing plate is arranged on one side of the horizontal oil cylinder, which faces the vertical lifting mechanism, and is fixedly connected to the top end of a hydraulic shaft rod of the horizontal oil cylinder, and the pushing plate is arranged on the front side of the positioning groove. The horizontal oil cylinder controls the hydraulic shaft rod to horizontally stretch out and draw back, so that the pushing plate is close to or far away from one side of the loading platform, and the pushing plate is retracted and reset after the uppermost substrate is pushed into the positioning groove.
Further, the loading platform front end be provided with the receipts of constant head tank intercommunication are folded the groove, receive and fold the groove bottom and install No. two perpendicular hydro-cylinders, enclose the plywood at the hydraulic shaft pole top of No. two perpendicular hydro-cylinders, enclose the plywood set up in the constant head tank front side. No. two perpendicular hydro-cylinders control through vertical flexible hydraulic shaft and enclose the board and reciprocate, send into before the base plate, enclose and close the board and move down and open the front end of constant head tank is uncovered, send into after the base plate, enclose and close the board and shift up and seal the front end of constant head tank is uncovered.
Furthermore, the support upper end is provided with the gyration groove, the gyration inslot side is provided with the linkage frame, the design frame right-hand member with be fixed connection between the linkage frame, rotating electrical machines is installed to the support front end, the inboard swing joint of support has the loose axle, the linkage frame with the loose axle is fixed connection, the loose axle front end install in on rotating electrical machines's the output shaft. The rotary motor drives the movable shaft to rotate in the support, and drives the linkage frame and the shaping frame to turn left and right to enable the linkage frame and the shaping frame to be close to or far away from the substrate in the positioning groove.
Further, a guide rail is installed at the upper end of the equipment platform, an encapsulating machine is arranged above the loading platform, a linear motor which moves along the axial direction of the guide rail is fixedly installed at the lower end of the encapsulating machine, and the shaping frame is arranged between the encapsulating machine and the loading platform. The shaping frame is in the upset in-process, and linear motor drive packaging machine moves backward along the guide rail, keeps away from the loading platform top, avoids causing the interference to shaping frame's upset action.
(3) Advantageous effects
Compared with the prior art, the beneficial effects of the utility model reside in that: the utility model discloses a compound loading apparatus for chip package adopts the constant head tank to lock substrate material, avoid the base plate to take place to remove when the encapsulation of moulding plastics and lead to the chip to break away from the operating position of the encapsulation of moulding plastics, guarantee the encapsulation quality, vertical lift mechanism cooperation feeding mechanism can be quick send the substrate material to the constant head tank by the successive layer, accelerate encapsulation work efficiency, the design frame through the motor drive upset can be at the outside forming die structure of chip when the encapsulation of moulding plastics, guarantee the shaping of injection material, avoid the installation of mould, it is undisturbed to make placing of base plate and chip take one's place.
Drawings
Fig. 1 is a schematic assembly structure diagram of an embodiment of the composite loading apparatus for chip packaging according to the present invention;
FIG. 2 is a schematic view of another assembly structure of the composite loading apparatus for chip packaging according to the embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a loading platform of an embodiment of the composite loading apparatus for chip packaging according to the present invention;
FIG. 4 is a schematic structural view of a vertical lift mechanism of an embodiment of the composite loading apparatus for chip packaging according to the present invention;
fig. 5 is a schematic diagram of a shaping frame structure of an embodiment of the composite loading apparatus for chip packaging according to the present invention.
The labels in the figures are: 1. a loading table; 2. positioning a groove; 3. a vertical lifting mechanism; 4. a feeding mechanism; 5. a support; 6. shaping a frame; 7. a dividing strip; 8. an equipment table; 9. a first vertical oil cylinder; 10. a support platform; 11. a guide frame; 12. a horizontal oil cylinder; 13. a push plate; 14. folding grooves; 15. a second vertical oil cylinder; 16. a surrounding plywood; 17. a rotary trough; 18. a linkage frame; 19. a rotary motor; 20. a movable shaft; 21. a guide rail; 22. and (4) a packaging machine.
Detailed Description
The present embodiment is a composite loading device for chip packaging, an assembly structure schematic diagram of which is shown in fig. 1, another state assembly structure schematic diagram of which is shown in fig. 2, a structure schematic diagram of a loading platform 1 is shown in fig. 3, a structure schematic diagram of a vertical lifting mechanism 3 is shown in fig. 4, and a structure schematic diagram of a shaping frame 6 is shown in fig. 5, the composite loading device includes a loading platform 1, a vertical lifting mechanism 3 installed at the front end of the loading platform 1, a feeding mechanism 4 installed at the front end of the vertical lifting mechanism 3, and a shaping frame 6 horizontally arranged on the upper side of the loading platform 1, the upper end of the loading platform 1 is provided with a positioning groove 2 with an open front end, the shape of the positioning groove 2 is matched with that of a substrate, the right end of the loading platform 1 is provided with a support 5, a separation strip 7 is installed in the middle of the shaping frame 6, the separation strip 7 is installed between chips, and the rear end of the loading platform 1 is provided with a device platform 8.
For the present embodiment, the packaging machine 22 is an injection molding device, which extrudes an injection molding material onto the surface of a chip on a substrate, fills the injection molding material in the molding frame 6, and packages the chip in the molding frame by cooling and solidification, and is connected to the guide rail 21 through a linear motor, the linear motor directly converts electrical energy into linear motion mechanical energy, the guide rail 21 is a magnetic rail fixed with a magnet, a mover of the linear motor includes a coil winding, a hall element circuit board, a thermistor and an electronic interface, the position of the mover in a magnetic field generated by the magnetic rail is maintained through the guide rail 21, the position of the linear motor is fed back through a linear encoder, and the packaging machine 22 is pushed by magnetic force to move axially along the guide rail 21, and is close to or far away from the upper side of the loading platform 1.
Wherein, vertical lift mechanism 3 includes a vertical oil cylinder 9, install in the bearing platform 10 on a vertical oil cylinder 9's hydraulic shaft pole top, leading truck 11 is installed to vertical lift mechanism 3 left and right sides both ends symmetry, both ends swing joint is inboard in leading truck 11 about bearing platform 10, feeding mechanism 4 includes horizontal hydro-cylinder 12, horizontal hydro-cylinder 12 is provided with push plate 13 towards vertical lift mechanism 3 one side, push plate 13 fixed connection is on the hydraulic shaft pole top of horizontal hydro-cylinder 12, push plate 13 sets up in 2 front sides of constant head tank. The first vertical oil cylinder 9 continuously lifts the bearing platform 10 upwards through continuously extending the hydraulic shaft rod upwards, the lifting distance is one substrate thickness each time, after the feeding of the uppermost substrate is completed, the next substrate is lifted to be in place immediately, the horizontal oil cylinder 12 controls the hydraulic shaft rod to horizontally stretch and retract, the pushing plate 13 is enabled to be close to or far away from one side of the loading platform 1, the uppermost substrate is pushed into the positioning groove 2, and then the pushing plate 13 is retracted and reset.
Meanwhile, the front end of the loading platform 1 is provided with a folding groove 14 communicated with the positioning groove 2, the bottom end of the folding groove 14 is provided with a second vertical oil cylinder 15, the top end of a hydraulic shaft rod of the second vertical oil cylinder 15 is provided with a surrounding plate 16, and the surrounding plate 16 is arranged on the front side of the positioning groove 2. No. two perpendicular hydro-cylinders 15 control through vertical flexible hydraulic shaft and enclose plywood 16 and reciprocate, send into before the base plate, enclose plywood 16 and move down and open the front end of constant head tank 2, send into after the base plate, enclose plywood 16 and shift up and seal the front end of constant head tank 2 is uncovered.
In addition, a revolving groove 17 is arranged at the upper end of the support 5, a linkage frame 18 is arranged inside the revolving groove 17, the right end of the sizing frame 6 is fixedly connected with the linkage frame 18, a revolving motor 19 is arranged at the front end of the support 5, a movable shaft 20 is movably connected inside the support 5, the linkage frame 18 is fixedly connected with the movable shaft 20, the front end of the movable shaft 20 is arranged on an output shaft of the revolving motor 19, a guide rail 21 is arranged at the upper end of the equipment table 8, a packaging machine 22 is arranged above the loading table 1, a linear motor which moves along the axial direction of the guide rail 21 is fixedly arranged at the lower end of the packaging machine 22, and the sizing frame 6 is arranged between the packaging machine 22 and the loading table 1. The rotary motor 19 drives the movable shaft 20 to rotate in the support 5, the linkage frame 18 and the sizing frame 6 are driven to turn left and right to enable the linkage frame and the sizing frame 6 to be close to or far away from the substrate in the positioning groove 2, and the linear motor drives the packaging machine 22 to move backwards along the guide rail 21 in the turning process of the sizing frame 6 and far away from the upper part of the loading table 1, so that interference on the turning action of the sizing frame 6 is avoided.
When the composite loading device for chip packaging in the technical scheme is used, a user starts the vertical lifting mechanism 3, vertically pushes the supporting platform 10 loaded with the substrates which are stacked, by using the first vertical oil cylinder 9, the supporting platform 10 vertically moves along the guide frame 11, the uppermost substrate is sent to a horizontal plane which is parallel to the positioning groove 2, then the feeding mechanism 4 is started, the horizontal oil cylinder 12 drives the pushing plate 13 to generate pushing force for moving the uppermost substrate to one side of the loading platform 1, the substrate is pushed into the positioning groove 2, then the horizontal oil cylinder 12 withdraws the pushing plate 13, then the second vertical oil cylinder 15 is started, the enclosing plate 16 is lifted, the opening at the front end of the positioning groove 2 is sealed, the positioning groove 2 locks the substrate in, then a plurality of chips are installed on the substrate, a plurality of separating strips 7 are installed in the shaping frame 6 according to the distribution positions of the chips, the rotary motor 19 is started, the movable shaft 20 and the linkage frame 18 are turned left, the vertical frame 6 is in a state parallel to the loading platform 1 and is enclosed outside the chips, then the separating strips 7 are installed between the chips, the linear encapsulating machine 22 on the shaping frame, the linear guide rail 22 is started, the encapsulating machine is sequentially driven to move the encapsulating machine to the lower end of the encapsulating platform, the encapsulating machine, the encapsulating mechanism 22, the encapsulating mechanism and the encapsulating mechanism is taken out, the encapsulating mechanism after the encapsulating mechanism is sequentially, the encapsulating mechanism, and the encapsulating mechanism is taken out, and the encapsulating mechanism.
Claims (6)
1. The composite loading equipment for packaging the chip comprises a loading platform, a vertical lifting mechanism arranged at the front end of the loading platform, a feeding mechanism arranged at the front end of the vertical lifting mechanism, and a shaping frame horizontally arranged on the upper side of the loading platform; the device is characterized in that the upper end of the loading platform is provided with a positioning groove with an open front end, the shape of the positioning groove is matched with that of the substrate, the right end of the loading platform is provided with a support, a separation strip is arranged in the middle of the shaping frame and is arranged between the chips, and the rear end of the loading platform is provided with a device platform.
2. The composite loading device for chip packaging according to claim 1, wherein the vertical lifting mechanism comprises a first vertical oil cylinder and a bearing platform installed at the top end of a hydraulic shaft rod of the first vertical oil cylinder, guide frames are symmetrically installed at the left end and the right end of the vertical lifting mechanism, and the left end and the right end of the bearing platform are movably connected to the inner side of the guide frames.
3. The composite loading device for chip packaging according to claim 1, wherein the feeding mechanism comprises a horizontal oil cylinder, a pushing plate is arranged on one side of the horizontal oil cylinder facing the vertical lifting mechanism, the pushing plate is fixedly connected to the top end of a hydraulic shaft rod of the horizontal oil cylinder, and the pushing plate is arranged on the front side of the positioning groove.
4. The composite loading device for chip packaging according to claim 1, wherein a folding groove communicated with the positioning groove is formed in the front end of the loading platform, a second vertical oil cylinder is installed at the bottom end of the folding groove, a surrounding plate is installed at the top end of a hydraulic shaft rod of the second vertical oil cylinder, and the surrounding plate is arranged on the front side of the positioning groove.
5. The composite loading device for chip packaging according to claim 1, wherein a rotary groove is formed in the upper end of the support, a linkage frame is arranged inside the rotary groove, the right end of the sizing frame is fixedly connected with the linkage frame, a rotary motor is installed at the front end of the support, a movable shaft is movably connected inside the support, the linkage frame is fixedly connected with the movable shaft, and the front end of the movable shaft is installed on an output shaft of the rotary motor.
6. The composite loading device for chip packaging according to claim 1, wherein a guide rail is installed at the upper end of the device platform, a packaging machine is arranged above the loading platform, a linear motor axially moving along the guide rail is fixedly installed at the lower end of the packaging machine, and the shaping frame is arranged between the packaging machine and the loading platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222421363.5U CN218299762U (en) | 2022-09-13 | 2022-09-13 | Composite loading equipment for chip packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222421363.5U CN218299762U (en) | 2022-09-13 | 2022-09-13 | Composite loading equipment for chip packaging |
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| CN218299762U true CN218299762U (en) | 2023-01-13 |
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| CN202222421363.5U Active CN218299762U (en) | 2022-09-13 | 2022-09-13 | Composite loading equipment for chip packaging |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504702A (en) * | 2023-06-26 | 2023-07-28 | 山东联高智能科技有限公司 | Semiconductor element processing equipment |
| CN117139936A (en) * | 2023-10-25 | 2023-12-01 | 广州市弘锦科技有限公司 | Automatic welding device and welding method for seat fittings |
| CN117525694A (en) * | 2023-10-12 | 2024-02-06 | 惠州久久犇科技有限公司 | Automatic packaging equipment for fireproof heat-insulating sheet of battery |
-
2022
- 2022-09-13 CN CN202222421363.5U patent/CN218299762U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504702A (en) * | 2023-06-26 | 2023-07-28 | 山东联高智能科技有限公司 | Semiconductor element processing equipment |
| CN116504702B (en) * | 2023-06-26 | 2023-09-05 | 山东联高智能科技有限公司 | Semiconductor element processing equipment |
| CN117525694A (en) * | 2023-10-12 | 2024-02-06 | 惠州久久犇科技有限公司 | Automatic packaging equipment for fireproof heat-insulating sheet of battery |
| CN117139936A (en) * | 2023-10-25 | 2023-12-01 | 广州市弘锦科技有限公司 | Automatic welding device and welding method for seat fittings |
| CN117139936B (en) * | 2023-10-25 | 2024-01-19 | 广州市弘锦科技有限公司 | Automatic welding device and welding method for seat fittings |
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