CN218299299U - Electronic device - Google Patents

Abstract

The application discloses electronic equipment includes: the flexible heat dissipation part, the first body, the second body and the folding part connected between the first body and the second body are arranged; the first body and the second body can be folded relatively to switch the electronic equipment between a folded state and an unfolded state; the flexible heat radiating piece is arranged on the folding part; the flexible heat dissipation piece comprises a flexible substrate and a graphene heat dissipation layer, a plurality of holes are formed in the portion, opposite to the folding portion, of the flexible substrate, and the graphene heat dissipation layer is arranged on the flexible substrate and covers the holes. The plurality of holes are formed in the positions, corresponding to the folding parts, of the flexible substrate, the yield hardness of different positions of the flexible substrate can be changed, the bending shape of the flexible heat dissipation part can be controlled, sudden bending caused by stress concentration is avoided, and damage to the graphene heat dissipation layer is reduced.

Description

Electronic device

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to electronic equipment.

Background

With the development of science and technology, people have higher and higher requirements on the performance of electronic equipment, and the folding screen becomes a new development direction of the electronic equipment. However, as the screen is enlarged, the heat generated by the electronic device is also increased, and the heat dissipation performance of the electronic device with the foldable screen directly affects the service performance of the electronic device.

In the related art, a foldable electronic device includes a first body, a second body, and a bending region connected between the first body and the second body, a heat dissipation film is disposed in the electronic device, and the heat generated by the electronic device is conducted through the heat dissipation film.

However, when the folding screen electronic device in the related art is unfolded, the heat dissipation film is bent and deformed at a position corresponding to the bending region, and the reinforcing layer is subjected to stress concentration in the bending process, so that the heat dissipation film is easily damaged due to uncontrollable sudden bending, and the heat dissipation performance of the heat dissipation film is affected.

SUMMERY OF THE UTILITY MODEL

The application aims at providing electronic equipment, and at least solves one of the problems that when folding screen electronic equipment in the related art is unfolded, a bent heat dissipation film is easily clamped in a folding gap of a bending area, and the heat dissipation film is damaged.

In order to solve the technical problem, the present application is implemented as follows:

an embodiment of the present application provides an electronic device, including: the flexible heat dissipation device comprises a flexible heat dissipation part, a first body, a second body and a folding part, wherein the folding part is connected between the first body and the second body;

the first body and the second body can be folded relatively to switch the electronic equipment between a folded state and an unfolded state;

the flexible heat dissipation piece is arranged on the folding portion and comprises a flexible substrate and a graphene heat dissipation layer, a plurality of holes are formed in the portion, opposite to the folding portion, of the flexible substrate, and the graphene heat dissipation layer is arranged on the flexible substrate and covers the holes.

In this application embodiment, electronic equipment includes first body and the second body that can fold relatively, and the folded part of connection between first body and second body, first body and second body can fold relatively, so that electronic equipment switches between fold condition and expansion state, set up flexible heat dissipation spare, make flexible heat dissipation spare correspond with the folded part, flexible heat dissipation spare includes flexible substrate and graphite alkene heat dissipation layer, the relative part of flexible substrate and folded part is provided with a plurality of trompils, graphite alkene heat dissipation layer sets up on flexible substrate and covers the trompil. Set up flexible substrate through the position that corresponds the folded part on graphite alkene heat dissipation layer, expand the in-process at electronic equipment, through the reinforcing effect of flexible substrate to graphite alkene heat dissipation layer, can promote the bending resistance on graphite alkene heat dissipation layer, the folding gap of the difficult folded part of messenger's flexible heat dissipation piece is cliied. And moreover, the part, opposite to the folding part, of the flexible substrate is provided with the plurality of holes, so that the yield hardness of different positions of the flexible substrate is changed, the bending shape of the flexible heat dissipation part is controlled, sudden bending caused by stress concentration is avoided, the damage to the graphene heat dissipation layer is reduced, and the heat dissipation performance of the graphene heat dissipation layer is improved.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic structural view of an electronic apparatus in the related art;

FIG. 3 is a schematic diagram of a partial structure of an electronic device according to an embodiment of the application;

fig. 4 is a schematic structural view of a flexible heat sink according to an embodiment of the present application;

fig. 5 is a schematic structural view of another flexible heat sink according to an embodiment of the present application;

fig. 6 is a schematic structural view of yet another flexible heat sink in accordance with an embodiment of the present application;

fig. 7 is a schematic view of a bent structure of the flexible heat sink according to fig. 6.

Reference numerals are as follows:

10. a first body; 11. a second body; 12. a folding section; 121. folding the gap; 122. a connecting shaft; 13. a flexible heat sink; 130. a graphene heat dissipation layer; 140. a flexible substrate; 1401. opening a hole; 141. a first hollowed-out area; 1411. a first opening; 142. a second hollowed-out area; 1421. and a second opening.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in this application will be understood to be a specific case for those of ordinary skill in the art.

The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings by way of specific embodiments and application scenarios thereof.

The electronic device in the embodiment of the present application may include: foldable electronic devices such as mobile phones, computers, game machines, smartwatches, and the like. The foldable electronic device generally includes a first body 10, a second body 11, and a folding portion 12 connected between the first body 10 and the second body 11, the first body 10 and the second body 11 being foldable and unfoldable with respect to each other, and in a case where the first body 10 and the second body 11 are unfolded with respect to each other, a folding slit 121 is formed at the folding portion 12.

Referring to fig. 2, there is shown a schematic structural diagram of an electronic device in the related art, in which heat generated by flexible screens disposed on the first body 10 and the second body 11 can be transferred to other heat dissipation areas by laying the flexible heat dissipation member 13 in the electronic device to utilize the heat conduction and heat dissipation effects of the flexible heat dissipation member 13, so as to implement the heat dissipation effect on the flexible screens. However, as shown in part a of fig. 2, when the electronic device is in an unfolded state, a large bending deformation may occur at a position of the flexible heat sink 13 corresponding to the folding portion 12, and since the flexible heat sink 13 is thin and relatively flexible, when the flexible heat sink 13 is bent, the bending R angle is small, and the bent flexible heat sink 13 is easily clamped in the folding gap 121 formed by the folding portion 12, so that the structure of the flexible heat sink 13 is damaged to damage the flexible heat sink 13, and the heat dissipation performance of the flexible heat sink 13 is seriously affected.

Referring to fig. 1, a schematic structural diagram of an electronic device according to an embodiment of the present application is shown, where the electronic device includes: the heat dissipation structure comprises a graphene heat dissipation layer 13, a first body 10, a second body 11 and a folding part 12 connected between the first body 10 and the second body 11; the first body 10 and the second body 11 are relatively foldable to switch the electronic apparatus between a folded state and an unfolded state; the flexible heat sink 13 is provided to the folded portion 12. Referring to fig. 4, the flexible heat sink 13 includes a flexible substrate 140 and a graphene heat dissipation layer 130, a portion of the flexible substrate 140 opposite to the folding portion 12 is provided with a plurality of openings 1401, and the graphene heat dissipation layer 130 is disposed on the flexible substrate 140 and covers the openings 1401.

In this embodiment of the application, the flexible substrate 140 is disposed at a position corresponding to the folding portion on the graphene heat dissipation layer 130, and in the unfolding process of the electronic device, the bending resistance of the graphene heat dissipation layer 130 can be improved by the enhancing effect of the flexible substrate 140 on the graphene heat dissipation layer 130, so that the R angle of the flexible heat dissipation member 13 is increased when the flexible heat dissipation member 13 is bent, and the folding portion of the flexible heat dissipation member 13 is not easily clamped by the folding gap 121 of the folding portion 12. Moreover, the plurality of openings 1401 are formed in the portion, opposite to the folding portion 12, of the flexible substrate 140, so that the yield hardness of the flexible substrate 140 at different positions is changed, the bending shape of the flexible heat dissipation member 13 is controlled, abrupt bending caused by stress concentration is avoided, damage to the flexible heat dissipation member 13 is reduced, and the heat dissipation performance of the flexible heat dissipation member 13 is improved.

Specifically, the electronic apparatus includes a first body 10 and a second body 11 that are relatively foldable, and a folded portion 12 connected between the first body 10 and the second body 11, and the first body 10 and the second body 11 are switchable between a folded state and an unfolded state by being connected with the folded portion 12.

It should be noted that, as the electronic device is switched between the folded state and the unfolded state, the included angle between the first body 10 and the second body 11 is changed. When the electronic device is in a folded state, an included angle between the first body 10 and the second body 11 is smaller than a preset included angle; when the electronic device is in the unfolded state, an included angle between the first body 10 and the second body 11 is greater than or equal to a preset included angle. Wherein, predetermine the contained angle and can set up according to actual need, for example, predetermine the contained angle and can set up to: any angle value between 30 degrees and 150 degrees. Of course, the specific angle of the preset included angle may be determined according to actual needs, and the embodiment of the present application does not limit this.

The flexible heat dissipation member 13 is arranged in the electronic device, at least part of the flexible heat dissipation member 13 corresponds to the folding part 12, the flexible heat dissipation member 13 comprises a flexible substrate 140 and a graphene heat dissipation layer 130, wherein the graphene heat dissipation layer 130 has heat conduction and heat dissipation effects and can be used for heat dissipation of the electronic device, and the flexible substrate 140 is arranged on the graphene heat dissipation layer 130 to reinforce the graphene heat dissipation layer 130. In a specific application, since the graphene heat dissipation layer 130 is generally flexible, the flexible substrate 140 is disposed on the surface of the graphene heat dissipation layer 130, so as to improve the bending resistance of the graphene heat dissipation layer 130 at a corresponding position.

In the electronic device in the embodiment of the present application, the flexible substrate 140 is disposed on the surface of the graphene heat dissipation layer 130, so that the bending resistance of the graphene heat dissipation layer 130 can be improved, and the graphene heat dissipation layer 130 can keep a relatively large bending R angle when being bent. The graphene heat dissipation layer 130 and the flexible substrate 140 correspond to the folding portion 12, and therefore, in the folding process of the folding portion 12, the flexible heat dissipation member 13 corresponding to the folding portion 12 is bent and deformed accordingly, and due to the reinforcing effect of the flexible substrate 140, the flexible heat dissipation member 13 can keep a large bending R angle when being bent and deformed, so that the flexible heat dissipation member is not easily clamped by the folding gap 121 in the folding portion 12, and damage to the graphene heat dissipation layer 13 is avoided.

Further, a plurality of openings 1401 are provided on the portion of the flexible substrate 140 opposite to the folded portion 12, the graphene heat dissipation layer 130 is provided on the flexible substrate 140, and the flexible substrate 140 covers the openings 1401 on the flexible substrate 140.

It can be understood that, in the process of bending the flexible substrate 140 along with the flexible heat sink 13, local stress concentration may exist on the flexible substrate 140, and abrupt bending that is not possible to be formed easily occurs, and such abrupt bending easily causes damage to the graphene heat sink layer 13, which affects the heat dissipation performance of the graphene heat sink layer 13.

In the embodiment of the present application, by providing a plurality of openings 1401 on the portion of the flexible substrate 140 corresponding to the folding portion 12, when the flexible substrate 140 is bent, the region of the flexible substrate 140 on which the openings 1401 are provided is more easily bent and deformed than the region without the openings 1401, so that the stress in the bending process can be effectively released, and the occurrence of abrupt bending can be avoided. Moreover, by setting the positions and the number of the holes 1401, the bending shape of the flexible heat sink 13 can be effectively controlled, and the bent portion of the flexible heat sink 13 is further prevented from being clamped by the folding slits 121 of the folding portion 12.

It should be noted that the shape of the opening 1401 formed on the flexible substrate 140 may include, but is not limited to: round holes, square holes, elliptical holes, strip-shaped holes, runway holes and the like. The arrangement position and the number of the holes 1401 can be determined according to actual needs.

In some embodiments, the graphene heat dissipation layer 130 may be a Pyrolytic Graphite (PGS) heat dissipation film, and the PGS heat dissipation film has characteristics of lightness, thinness, high strength, high thermal conductivity, and the like, and by disposing the PGS heat dissipation film in the electronic device, rapid thermal diffusion in the electronic device may be implemented, and the heat dissipation performance of the electronic device may be improved.

In some embodiments, the flexible substrate 140 may be made of a flexible material, for example, a flexible material such as Polyethylene terephthalate (PET) material, polyethylene (PE) material, polypropylene (PP) material, etc., so that the flexible substrate 140 has a certain flexible deformation capability and a certain bending strength, and can play a role in reinforcing the graphene heat dissipation layer 130.

In particular, the flexible substrate 140 may be a layer of PET material. Of course, the flexible substrate 140 may also be made of other flexible materials, which can be selected by those skilled in the art according to actual needs, and the present embodiment is not limited thereto.

It can be understood that the flexible substrate 140 is disposed on the surface of the graphene heat dissipation layer 130, so that the flexible substrate 140 can be attached to the surface of the graphene heat dissipation layer 130, when the flexible substrate 140 is bent and deformed, the flexible substrate 140 and the graphene heat dissipation layer 130 can be bent and deformed synchronously at a position corresponding to the position of the flexible substrate 140 on the graphene heat dissipation layer 130, and the bending shape and the bending angle of the flexible substrate 140 and the graphene heat dissipation layer 130 are kept consistent.

In some embodiments, the flexible substrate 140 may be attached to the surface of the graphene heat dissipation layer 130 by adhesion, so as to achieve the fixed connection between the flexible substrate 140 and the graphene heat dissipation layer 130. Specifically, a first positioning hole may be disposed at an edge position of the graphene heat dissipation layer 130, a second positioning hole may be disposed at a corresponding position on the flexible substrate 140, and when the flexible substrate 140 is connected to the graphene heat dissipation layer 130, the first positioning hole and the second positioning hole are matched to realize accurate positioning between the flexible substrate 140 and the graphene heat dissipation layer 130.

In some embodiments, the bending strength of the flexible substrate 140 is greater than that of the graphene heat dissipation layer 130, and thus, by attaching the flexible substrate 140 to the surface of the graphene heat dissipation layer 130, a local reinforcing effect on the graphene heat dissipation layer 130 can be achieved, so as to improve the bending resistance of the graphene heat dissipation layer 130. The bending strength of the flexible substrate 140 may be determined according to the bending strength of the selected graphene heat dissipation layer 130, which is not limited in this embodiment.

In some embodiments, the area and thickness of the flexible substrate 140 disposed on the surface of the graphene heat dissipation layer 130 may be determined according to the structure of the folding portion 12 and the size of the folding gap 121 in the electronic device. Illustratively, the flexible substrate 140 may be provided with a shape and size conforming to the graphene heat dissipation layer 130 to enhance the overall graphene heat dissipation layer 130 through the flexible substrate 140.

For example, the flexible substrate 140 may also be disposed on a part of the surface of the graphene heat dissipation layer 130, the surface area of the graphene heat dissipation layer 130 is larger than the surface area of the flexible substrate 140, and the flexible substrate 140 may be disposed on the graphene heat dissipation layer 130 near the middle. When the flexible substrate is mounted and used, the flexible substrate 140 corresponds to the folded portion 12, and the graphene heat dissipation layers 130 on the two sides of the flexible substrate 140 correspond to the first body 10 and the second body 11, respectively, so as to dissipate heat of the first body 10 and the second body 11. Therefore, the heat dissipation requirement of the electronic equipment can be met, the material loss of the flexible substrate 140 can be saved, and the production cost is reduced.

Optionally, referring to fig. 1 and 3, the electronic device further includes: a connecting shaft 122 provided in the folding portion 12; at least one of the first body 10 and the second body 11 is rotatably connected with the connecting shaft 122 to switch the electronic apparatus between a folded state and an unfolded state; one end of the flexible heat sink 13 is connected to the first body 10, and the other end of the flexible heat sink 13 is connected to the second body 11.

In this embodiment, the first body 10 and the second body 11 are connected by the connecting shaft 122 in a foldable manner, so that the electronic device can be switched between a folded state and an unfolded state, one end of the flexible heat dissipation member 13 is connected with the first body 10, and the other end of the flexible heat dissipation member 13 is connected with the second body 11, so that the flexible heat dissipation member 13 can cover the folded portion 12, the flexible heat dissipation member 13 has a reinforcing effect on the graphene heat dissipation layer 130 through the flexible substrate 140, so that the flexible heat dissipation member 13 is not easily clamped by the folding gap 121 in the folded portion 12 when being folded, and damage to the graphene heat dissipation layer 13 is reduced.

Specifically, a connecting shaft 122 is provided between the first body 10 and the second body 11, at least one of the first body 10 and the second body 11 is rotatably connected to the connecting shaft 122, and the first body 10 and the second body 11 are relatively foldable through the connecting shaft 122, so that the electronic apparatus can be switched between a folded state and an unfolded state. When the electronic device is in the unfolded state, a folding gap 121 is formed between the first body 10 and the connecting shaft 122, and/or between the second body 11 and the connecting shaft 122.

One end of the flexible heat dissipation member 13 is connected to the first body 10, and the other end of the flexible heat dissipation member 13 is connected to the second body 11, so that in the unfolding process of the electronic device, the flexible heat dissipation member 13 can cover the folding gap 121 formed between the connecting shaft 122 and the first body 10 and/or the second body 11, and due to the reinforcing effect of the flexible substrate 140, the flexible heat dissipation member 13 is not easily clamped by the folding gap 121 when being bent and deformed.

It can be understood that, the flexible heat dissipation member 13 includes the graphene heat dissipation layer 130 and the flexible substrate 140, the graphene heat dissipation layer 130 and the flexible substrate 140 can be bent and deformed synchronously, the two ends of the flexible heat dissipation member 13 are connected to the first body 10 and the second body 11 respectively, when the electronic device is in the unfolded state, the portion of the flexible heat dissipation member 13, where the bending deformation occurs, is provided with the flexible substrate 140, through the reinforcing effect of the flexible substrate 140, the bending resistance of the graphene heat dissipation layer 130 at the corresponding position can be increased, a large bending R angle can be maintained during bending, so as to avoid being clamped by the folding gap 121 in the folding portion 12, meanwhile, due to the plurality of openings 1401 formed in the flexible substrate 140, abrupt bending due to stress concentration can be avoided, and damage to the graphene heat dissipation layer 130 is reduced.

Alternatively, referring to fig. 1 and 4, the flexible substrate 140 includes a first hollow 141, the first hollow 141 corresponds to the connection shaft 122, and the opening 1401 includes a plurality of first openings 1411 disposed at intervals in the first hollow 141; along the radial direction of the connecting shaft 122, the first hollow area 141 has a first orthographic projection, the connecting shaft 122 has a second orthographic projection, and the first orthographic projection is located in the second orthographic projection.

In the embodiment of the present application, the first hollow-out area 141 is disposed on the flexible substrate 140, so that when the flexible substrate 140 is bent, the position of the first hollow-out area 141 is more easily bent and deformed due to the plurality of first openings 1411, and thus the bending deformation of the flexible substrate 140 mainly occurs in the first hollow-out area 141, and the position corresponds to the connecting shaft 122 and is staggered from the folding gap 121, so that the bending portion can be effectively prevented from being clamped by the folding gap 121.

Specifically, a plurality of first openings 1411 are disposed in the first hollow area 141 of the flexible substrate 140, the plurality of first openings 1411 are disposed at intervals, and the bending strength of the flexible substrate 140 at the corresponding position of the first hollow area 141 can be reduced by disposing the plurality of first openings 1411. When the flexible substrate 140 is bent, the position of the first hollow area 141 on the flexible substrate 140 is more easily bent and deformed than the position outside the first hollow area 141, so that the bending deformation is mainly concentrated at the position corresponding to the first hollow area 141, and the deformation amount generated in the area of the flexible substrate 140 corresponding to the outside of the first hollow area 141 is smaller.

Along the radial direction of the connecting shaft 122, the first hollow-out area has a first orthographic projection, the connecting shaft 122 has a second orthographic projection, the first orthographic projection is positioned in the second orthographic projection, the first hollow-out area 141 of the flexible substrate 140 corresponds to the connecting shaft 122, and the position of the flexible substrate 140 with larger deformation is just corresponding to the connecting shaft 122, so that the bent part is staggered with the folding gap 121, and the bent part is prevented from being clamped by the folding gap 121.

It should be noted that, in the unfolded state of the electronic device, the first body 10, the second body 11 and the connecting shaft 122 are oppositely unfolded to form a plane, and the radial direction along the connecting shaft 122 refers to a direction perpendicular to the plane.

Alternatively, referring to fig. 4, the plurality of first openings 1411 are arranged at intervals along a first direction, which is a direction parallel to the axis of the connecting shaft 122.

In the embodiment of the present application, the first holes 1411 arranged at intervals are disposed in the first hollow-out area 141 of the flexible substrate 140, so that the first holes 1411 are arranged at intervals along the axis direction parallel to the connecting shaft 122, and when the flexible substrate 140 is bent, the bending direction of the flexible substrate 140 is consistent with the axis direction of the connecting shaft 122, so that the folding gap 121 can be avoided, and the flexible substrate is prevented from being clamped by the folding gap 121.

Specifically, a plurality of first openings 1411 arranged at intervals in a first direction are arranged in the first hollow-out area 141 of the flexible substrate 140, and when the flexible substrate 140 is switched from a folded state to an unfolded state along with the electronic device, the first hollow-out area 141 of the flexible substrate 140 is squeezed by two sides and can be bent and deformed in the first direction, the first direction is parallel to the axis direction of the connecting shaft 122, so that the bending direction of the flexible substrate 140 is consistent with the axis direction of the connecting shaft 122, and the bending position of the flexible substrate 140 can be staggered with the folding gap 121.

It should be noted that, since the flexible substrate 140 and the graphene heat dissipation layer 130 can be bent and deformed synchronously, and the bending shape and the bending angle of the flexible substrate 140 and the graphene heat dissipation layer 130 are kept consistent, the bending situation of the graphene heat dissipation layer 130 in the embodiment of the present application is not described again.

In some embodiments, the first aperture 1411 includes, but is not limited to: round holes, square holes, elliptical holes, strip-shaped holes, runway holes and the like. The arrangement positions and the number of the first openings 1411 in the first hollow-out area 141 may be determined according to actual needs, which is not limited in the embodiment of the present application.

Alternatively, referring to fig. 4, the plurality of first apertures 1411 are distributed in an array. In this embodiment, a plurality of first openings 1411 may be disposed in the first hollow area 141 of the flexible substrate 140, so that the plurality of first openings 1411 are distributed in an array, and thus, in a process of switching the flexible substrate 140 from the folded state to the unfolded state along with the electronic device, a position corresponding to the first hollow area 141 is more easily bent and deformed, so that a region on the flexible substrate 140, which is largely deformed, is controlled at a position corresponding to the first hollow area 141, and further, a deformation amount of a portion of the flexible substrate 14 outside the position corresponding to the first hollow area 141 can be reduced.

It should be noted that the array distribution in the embodiment of the present application includes, but is not limited to: the array distribution forms such as circular array, annular array, square array, rhombic array, triangular array and the like can be adopted, of course, other arrangement forms can also be adopted, and the arrangement forms can be selected by those skilled in the art according to actual needs.

Alternatively, referring to fig. 5 and 6, the flexible substrate 140 includes a second hollow area 142, and the opening 1401 includes a plurality of second openings 1421 disposed at intervals in the second hollow area 142; the second hollow areas 142 are disposed on two sides of the first hollow area 141 along a second direction, which is perpendicular to the axis of the connecting shaft 122.

In the embodiment of the present application, the second hollow-out areas 142 are disposed on the flexible substrate 140, and the second hollow-out areas 142 are disposed on two sides of the first hollow-out area 141 along the axis direction perpendicular to the connecting shaft 122, so that when the flexible substrate 140 is bent, the positions of the first hollow-out area 141 and the second hollow-out area 142 are both bent and deformed, and thus the flexible substrate 140 is deformed more uniformly as a whole, and a local large deformation is avoided. Meanwhile, the bending deformation amount of the flexible substrate 140 at different positions can be controlled by setting the specific structures of the first hollow-out area 141 and the second hollow-out area 142, so that the deformation condition of the flexible substrate 140 can be effectively controlled, and sudden bending caused by overlarge local deformation can be avoided.

It should be noted that the first opening 1411 and the second opening 1421 may be configured in the same structure, or may be configured in different structures, and those skilled in the art may configure the first opening 1411 and the second opening 1421 according to actual needs, which is not limited in this embodiment of the application.

Alternatively, referring to fig. 5, the area of the first aperture 1411 and the area of the second aperture 1421 are distributed in a decreasing manner from the middle to the edge of the flexible substrate 140 along the second direction.

In the embodiment of the present application, the area of the first opening 1411 and the area of the second opening 1421 are distributed in a decreasing manner from the middle to the edge of the flexible substrate 140, and since the area of the first opening 1411 is larger, when the flexible substrate 140 is bent, the position of the first hollow area 141 on the flexible substrate 140 is more easily bent and deformed than the position of the second hollow area 142.

For example, the first opening 1411 and the second opening 1421 may be composed of a plurality of openings having the same shape and size, wherein an area of the first opening 1411 includes a sum of cross-sectional areas of the plurality of first openings 1411 disposed in the first hollow area 141, and an area of the second opening 1421 includes a sum of cross-sectional areas of the plurality of second openings 1421 disposed in the second hollow area 142.

Furthermore, the area of the first opening 1411 and the area of the second opening 1421 are distributed in a decreasing manner from the middle to the edge of the flexible substrate 140, that is, the openings arranged on the flexible substrate 140 are gradually distributed from dense to sparse from the middle to the edge of the flexible substrate 140, so that when the flexible substrate 140 is bent, the bending structure on the flexible substrate 140 is gradually transited from the edge to the middle, and the graphene heat dissipation layer 130 is prevented from being damaged due to abrupt bending.

In some embodiments, the number of the first openings 1411 and the number of the second openings 1421 are decreased in the case that the first openings 1411 and the second openings 1421 have the same structure. That is, the number of the openings 1401 disposed in the second hollow-out area 142 is less than the number of the openings 1401 disposed in the first hollow-out area 141, so that the number of the openings disposed decreases from the middle to the edge of the flexible substrate 140, and thus the bending structure on the flexible substrate 140 gradually transitions from the edge to the middle when the flexible substrate 140 is bent, thereby avoiding the graphene heat dissipation layer 130 from being damaged due to abrupt bending.

Alternatively, referring to fig. 6 and 7, a distance between two adjacent first openings 1411 is a first distance, a distance between two adjacent second openings 1421 is a second distance, and the first distance is smaller than the second distance.

In the embodiment, the second hollow area 142 has a plurality of second openings 1421, and the first hollow area 141 has a plurality of first openings 1411. By setting the distance between the second openings 1421 to be greater than the distance between the first openings 1411, when the flexible substrate 140 is bent, the first hollow area 141 is more easily deformed than the second hollow area 142, so that the area of the flexible substrate 140 that is bent and deformed at a large angle is concentrated at the position of the first hollow area 141. In this way, the bending deformation amount of the second hollow area 142 can be reduced, so as to avoid the flexible heat sink 130 corresponding to the second hollow area 142 from being clamped by the folding gap 121 when being deformed.

It should be noted that, a distance between two adjacent first openings 1411 is a first distance, a distance between two adjacent second openings 1421 is a second distance, and the first distance is smaller than the second distance. Illustratively, the range of the first pitch is: 0.55 to 1.0mm, specifically, the first pitch may be set as: 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, 0.85mm, 0.9mm, 0.95mm, 1.0mm, etc.

Illustratively, the second pitch may range from: 1.0 to 2.0mm, specifically, the first pitch may be set to: 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2.0mm, etc. The specific size of the first distance and the second distance may be determined according to actual needs, which is not limited in the embodiment of the present application.

Alternatively, referring to fig. 6 and 7, the second openings 1421 are bar-shaped holes, and the length direction of the bar-shaped holes is parallel to the second direction.

In this embodiment, the second opening 1421 may be set to be a strip-shaped hole, and the length direction of the strip-shaped hole is set along the axis direction perpendicular to the connecting shaft 122, so that the yield strength of the flexible substrate 140 at the position corresponding to the second hollow-out area 142 can be properly weakened, so that the second hollow-out area 142 is easier to deform, and meanwhile, the bending deformation amount of the second hollow-out area 142 is less than that of the first hollow-out area 141, so that the corresponding positions of the graphene heat dissipation layer 130 and the second hollow-out area 142 can also bend to some extent, and meanwhile, the bending deformation amount is not too large.

In some embodiments, the second opening 1421 may also include, but is not limited to: round holes, square holes, elliptical holes, raceway holes, and the like.

Alternatively, referring to fig. 1 and 4, the flexible substrate 140 is disposed on the graphene heat dissipation layer 130 toward one side of the folded part 12; and/or the flexible substrate 140 is disposed on a side of the graphene heat dissipation layer 130 facing away from the folded portion 12.

In this embodiment, by disposing the flexible substrate 140 on a single side of the graphene heat dissipation layer 130, or by disposing the flexible substrates 140 on both sides of the graphene heat dissipation layer 130, the heat dissipation performance of the graphene heat dissipation layer 130 is not affected, and the enhancement effect on the graphene heat dissipation layer 130 is satisfied, so that the bending resistance of the graphene heat dissipation layer 130 is improved, and the graphene heat dissipation layer 130 is not easily clamped by the folding gap 121 in the electronic device when being bent.

Here, the flexible substrate 140 may be attached to a surface of the graphene heat dissipation layer 130 facing the folded portion 12, or the flexible substrate 140 may be attached to a surface of the graphene heat dissipation layer 130 facing away from the folded portion 12. The flexible substrate 140 is arranged on the surface of the single side of the graphene heat dissipation layer 130, so that the graphene heat dissipation layer 130 is enhanced, the use amount of the flexible substrate 140 is reduced, and the production cost is reduced.

In a specific application, the flexible substrate 140 may be disposed on both the side of the graphene heat dissipation layer 130 facing the folded portion 12 and the side of the graphene heat dissipation layer 130 facing away from the folded portion 12, so as to effectively enhance the enhancement effect on the graphene heat dissipation layer 130.

In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An electronic device, comprising: the flexible heat dissipation device comprises a flexible heat dissipation part, a first body, a second body and a folding part, wherein the folding part is connected between the first body and the second body;

the first body and the second body can be folded relatively to switch the electronic equipment between a folded state and an unfolded state;

the flexible heat dissipation piece is arranged on the folding portion and comprises a flexible substrate and a graphene heat dissipation layer, a plurality of holes are formed in the portion, opposite to the folding portion, of the flexible substrate, and the graphene heat dissipation layer is arranged on the flexible substrate and covers the holes.

2. The electronic device of claim 1, further comprising: a connecting shaft provided to the folding portion;

at least one of the first body and the second body is rotatably connected with the connecting shaft so as to switch the electronic equipment between a folded state and an unfolded state;

one end of the flexible heat radiating piece is connected with the first body, and the other end of the flexible heat radiating piece is connected with the second body.

3. The electronic device according to claim 2, wherein the flexible substrate includes a first hollow area corresponding to the connection shaft, and the opening includes a plurality of first openings disposed at intervals in the first hollow area;

along the radial direction of connecting axle, first fretwork district has first orthographic projection, the connecting axle has the second orthographic projection, first orthographic projection is located in the second orthographic projection.

4. The electronic device according to claim 3, wherein the plurality of first openings are spaced along a first direction, and the first direction is parallel to an axial direction of the connecting shaft.

5. The electronic device of claim 4, wherein the plurality of first openings are distributed in an array.

6. The electronic device of claim 4, wherein the flexible substrate includes a second hollowed-out region, and the opening includes a plurality of second openings disposed at intervals in the second hollowed-out region;

and the second hollow areas are arranged on two sides of the first hollow area along a second direction, and the second direction is perpendicular to the axis direction of the connecting shaft.

7. The electronic device of claim 6, wherein along the second direction, from the middle to the edge of the flexible substrate, the area of the first opening and the area of the second opening are distributed in a decreasing manner; or,

under the condition that the first opening and the second opening are identical in structure, the number of the first openings and the number of the second openings are distributed in a descending mode.

8. The electronic device of claim 6, wherein a distance between two adjacent first openings is a first distance, a distance between two adjacent second openings is a second distance, and the first distance is smaller than the second distance.

9. The electronic device according to claim 8, wherein the second opening is a bar-shaped hole, and a length direction of the bar-shaped hole is arranged parallel to the second direction.

10. The electronic device of claim 1, wherein the flexible substrate is disposed on the graphene thermal dissipation layer on a side facing the fold; and/or the presence of a gas in the gas,

the flexible substrate is arranged on one side, deviating from the folding part, of the graphene heat dissipation layer.

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