CN218298415U - A accredited testing organization for optical module test - Google Patents
A accredited testing organization for optical module test Download PDFInfo
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- CN218298415U CN218298415U CN202222744724.XU CN202222744724U CN218298415U CN 218298415 U CN218298415 U CN 218298415U CN 202222744724 U CN202222744724 U CN 202222744724U CN 218298415 U CN218298415 U CN 218298415U
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Abstract
The utility model discloses a accredited testing organization for optical module tests, include: the probe comprises a frame, a first PCB, a probe seat and a computing module. The probe seat is welded on a golden finger at the upper end of the first PCB and is positioned outside the accommodating cavity; the computing module is accommodated in the accommodating cavity; the calculation module comprises: the system comprises a second PCB, a high-speed connector, a plurality of M.2 connectors and a plurality of computing boards; the second PCB is connected with the golden finger at the lower end of the first PCB through a high-speed connector, and the computing board is connected with the second PCB through an M.2 connector; the plate surfaces of the plurality of computing plates are arranged in parallel, and a ventilation interval is formed between the plate surfaces of two adjacent computing plates; the accommodating cavity is provided with a linear ventilation channel, and the ventilation interval is positioned in the ventilation channel. The utility model discloses a accredited testing organization for optical module tests improves space utilization and improves the radiating efficiency.
Description
Technical Field
The utility model relates to a accredited testing organization especially relates to a accredited testing organization for optical module tests.
Background
Optical modules are widely used in the current market, including but not limited to the fields of mobile phones, toys, computers and autopilot, and are in great demand. The quality of the final product can be ensured only by testing the indexes of the wafer and the lens in the production process of the optical module. The traditional testing scheme is based on the imaging result of the optical module obtained by the special image data acquisition equipment of the PC + and analyzed, and has the defects of large volume and low heat dissipation efficiency.
How to design and develop a testing mechanism for testing an optical module to improve the space utilization rate and the heat dissipation efficiency is a technical problem to be solved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the weak point among the prior art, providing a accredited testing organization for optical module tests, improve space utilization and improve the radiating efficiency.
The purpose of the utility model is realized through the following technical scheme:
a test mechanism for testing an optical module, comprising: the probe comprises a frame, a first PCB, a probe seat and a computing module;
the frame is provided with an accommodating cavity, the first PCB is arranged at the top of the frame, and the probe seat is welded on a golden finger at the upper end of the first PCB and is positioned outside the accommodating cavity;
the computing module is accommodated in the accommodating cavity; the calculation module comprises: the system comprises a second PCB, a high-speed connector, a plurality of M.2 connectors and a plurality of computing boards which correspond to the M.2 connectors one to one; the high-speed connector and the M.2 connector are respectively arranged on two opposite surfaces of the second PCB; the second PCB is connected with the golden finger at the lower end of the first PCB through the high-speed connector, and the computing board is connected with the second PCB through the M.2 connector;
the plate surfaces of the plurality of computing plates are arranged in parallel, and a ventilation interval is formed between the plate surfaces of two adjacent computing plates; the accommodating cavity is provided with a linear ventilation channel, and the ventilation interval is positioned in the ventilation channel;
the testing mechanism for testing the optical module further comprises a heat dissipation structure which is arranged on the frame and located outside the accommodating cavity.
In one embodiment, the frame comprises a base and a top plate mounted on the base;
the first PCB is fixed on the top plate.
In one embodiment, the heat dissipation structure is a fan.
In one embodiment, the fans are two groups, and the two groups of fans are respectively located at two ports of the ventilation air duct.
In one embodiment, the base is provided with a network port window and a data port window;
a network port module and a data port module are respectively welded at two ends of the second PCB;
the network port module is located in the network port window, and the data port module is located in the data port window.
In one embodiment, the number of the computing modules is two.
In one embodiment, the testing mechanism for testing the optical module further comprises a hub module; the concentrator module comprises a support plate and a concentrator structure arranged on the support plate;
the supporting plate is connected with the frame and is positioned outside the accommodating cavity.
In one embodiment, the supporting plate is an elastic plate structure with elasticity.
In one embodiment, the m.2 connector is soldered to a second PCB, the computing board is plugged to the m.2 connector, and the computing board is fixed to the second PCB by a fixing structure.
The utility model discloses a accredited testing organization for optical module tests has following characteristics:
1. the computing module is accommodated in the accommodating cavity, on one hand, the frame protects the computing module, and on the other hand, the computing module is integrated in the frame to improve the space utilization rate; specifically, the board surfaces of the plurality of calculation boards are arranged in parallel, and each calculation board is welded on the second PCB board through an M.2 connector, so that a plurality of calculation boards can be placed in a limited space, and the space utilization rate is improved;
2. the plate surfaces of a plurality of computing plates in the computing module are arranged in parallel, a ventilation interval is formed between the plate surfaces of two adjacent computing plates, and the ventilation interval is positioned in a ventilation channel, so that ventilation can be realized more smoothly and unimpededly under the action of a heat dissipation structure, and heat generated by the computing plates in the working process can be better dissipated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is an assembly diagram of a testing mechanism for testing an optical module according to an embodiment of the present invention;
FIG. 2 is an exploded view of the testing mechanism for testing the optical module shown in FIG. 1;
FIG. 3 is a block diagram (one) of the compute module shown in FIG. 2;
FIG. 4 is a block diagram (two) of the compute module shown in FIG. 2;
FIG. 5 is a partial diagram of the compute module shown in FIG. 4;
fig. 6 is a structural view of a base of the frame shown in fig. 2.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are illustrated in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, the utility model discloses a accredited testing organization 10 for optical module test, it includes: frame 100, first PCB board 200, probe seat 300, calculation module 400.
The frame 100 has a receiving cavity 101 (as shown in fig. 2), the first PCB 200 is disposed on the top of the frame 100, and the probe socket 300 is soldered to the gold finger on the upper end of the first PCB 200 and located outside the receiving cavity 101.
As shown in fig. 1, the computing module 400 is accommodated in the accommodating chamber 101. As shown in fig. 3 and 4, the calculating module 400 includes: a second PCB board 410, a high-speed connector 420, a plurality of m.2 connectors 430 (shown in fig. 5), and a plurality of computing boards 440 in one-to-one correspondence with the plurality of m.2 connectors 430. The high-speed connector 420 and the m.2 connector 430 are respectively disposed on two opposite surfaces of the second PCB 410. The second PCB410 is connected to the gold finger at the lower end of the first PCB 200 by a high-speed connector 420 (as shown in fig. 3 and 4), and the computer board 440 is connected to the second PCB410 by an m.2 connector 430 (as shown in fig. 5). Specifically, the m.2 connector 430 is soldered to the second PCB410, the computing board 440 is plugged to the m.2 connector 430, and the computing board 440 is fixed to the second PCB410 by a fixing structure 450 (shown in fig. 5). The computing board 440 forms a pluggable connection with the m.2 connector 430, and when the computing board 440 needs to be replaced, the computing board 440 can be removed from the m.2 connector 430 by simply pressing the fixing structure 450.
The plate surfaces of the plurality of computing plates 440 are arranged in parallel, and a ventilation space 441 (shown in fig. 3) is formed between the plate surfaces of two adjacent computing plates 440; the receiving chamber 101 has a linear ventilation channel (indicated by the line segment with arrows in fig. 2) in which a ventilation space 441 is located.
The testing mechanism 10 for testing the optical module further includes a heat dissipation structure 500 (as shown in fig. 1 and 2) mounted on the frame 100 and located outside the accommodating cavity 101.
The heat dissipation structure 500 is used for ventilating and dissipating heat of the ventilation channel, and the heat generated by the computing board 440 in the working process is discharged to the outside of the frame 100 through the ventilation channel, so that the computing board 440 is prevented from being failed due to accumulation of heat inside the frame 100. Because the ventilation space 441 is formed between the plate surfaces of the two adjacent computing boards 440, and the ventilation space 441 is located in the ventilation channel, that is, the ventilation space 441 and the ventilation channel are mutually communicated, in this way, the heat dissipation structure 500 can quickly and effectively take away the heat generated inside, and the heat dissipation efficiency is improved.
The utility model discloses a accredited testing organization 10 for optical module test has following characteristics:
1. the computing module 400 is accommodated in the accommodating cavity 101, on one hand, the frame 100 protects the computing module 400, and on the other hand, the computing module 400 is integrated in the frame 100 to improve the space utilization rate; specifically, the board surfaces of the plurality of computation boards 440 are arranged in parallel, and each computation board 440 is welded to the second PCB410 through one m.2 connector 430, so that a plurality of computation boards 440 can be placed in a limited space, and the space utilization rate is improved;
2. the board surfaces of the plurality of computing boards 440 in the computing module 400 are arranged in parallel, a ventilation interval 441 is formed between the board surfaces of two adjacent computing boards 440, and the ventilation interval 441 is located in a ventilation channel, so that ventilation can be realized more smoothly and unimpededly under the action of the heat dissipation structure 500, and heat generated by the computing boards 440 in the working process can be better dissipated.
As shown in fig. 2, in the present embodiment, the frame 100 includes a base 110 and a top plate 120 mounted on the base 110; the first PCB board 200 is fixed to the top plate 120. The top plate 120 is detachably mounted on the base 110, so that the top plate 120 can be easily detached from the base 110 to place the computing module 400 in the receiving chamber 101 or take it out of the receiving chamber 101.
As shown in fig. 2, in the present embodiment, the heat dissipation structure 500 is a fan. Specifically, the number of the fans is two, and the two groups of fans are respectively located at two ports of the ventilation air duct. It should be noted that the two sets of fans can blow air in the same direction along the air duct direction of the ventilation air duct, so that the heat generated by the computing board 440 during operation can be quickly dissipated along the ventilation air duct. Certainly, the two sets of fans can also blow air in opposite directions along the air duct direction of the ventilation air duct, and the two sets of fans are equivalent to exhaust fans and extract heat in the accommodating cavity 101.
As shown in fig. 6, a network port window 111 and a data port window 112 are further formed on the base 110; a network port module 411 and a data port module 412 are respectively welded at two ends of the second PCB410, the network port module 411 is located in the network port window 111, and the data port module 412 is located in the data port window 112. By opening the network port window 111 and the data port window 112 on the base 110, the network connection and the data connection can be conveniently plugged into the network port module 411 and the data port module 412 respectively through the network port window 111 and the data port window 112.
In the present invention, the number of the calculation modules 400 is preferably two. That is, in a testing mechanism 10 for testing an optical module, two sets of computing modules 400 can be simultaneously disposed, which can significantly improve the testing efficiency. Of course, the number of the computing modules 400 can also be multiple groups, which are specifically selected according to actual situations.
As shown in fig. 2, further, the testing mechanism 10 for testing optical modules further includes a hub module 600. The hub module 600 includes a supporting plate 610 and a hub structure 620 disposed on the supporting plate 610. The supporting plate 610 is connected to the frame 100 and is located outside the receiving cavity 101. By arranging the hub module 600 outside the accommodating cavity 101, a plurality of signal lines connected with the computing module 400 can be uniformly inserted into the hub structure 620, and then a line is led out from the hub structure 620 to be connected with other equipment, so that the wiring regularity can be improved.
The utility model discloses in, backup pad 610 is for having elastic plate structure, and like this, backup pad 610 is difficult to take place to break when bumping with other objects, has improved holistic structural performance.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (9)
1. A test mechanism for testing an optical module, comprising: the probe comprises a frame, a first PCB, a probe seat and a computing module;
the frame is provided with an accommodating cavity, the first PCB is arranged at the top of the frame, and the probe seat is welded on a golden finger at the upper end of the first PCB and is positioned outside the accommodating cavity;
the computing module is accommodated in the accommodating cavity; the calculation module comprises: the system comprises a second PCB, a high-speed connector, a plurality of M.2 connectors and a plurality of computing boards which correspond to the M.2 connectors one to one; the high-speed connector and the M.2 connector are respectively arranged on two opposite surfaces of the second PCB; the second PCB is connected with the golden finger at the lower end of the first PCB through the high-speed connector, and the computing board is connected with the second PCB through the M.2 connector;
the plate surfaces of the plurality of computing plates are arranged in parallel, and a ventilation interval is formed between the plate surfaces of two adjacent computing plates; the accommodating cavity is provided with a linear ventilation channel, and the ventilation interval is positioned in the ventilation channel;
the testing mechanism for testing the optical module further comprises a heat dissipation structure which is arranged on the frame and located outside the accommodating cavity.
2. The test mechanism of claim 1, wherein the frame comprises a base and a top plate mounted on the base;
the first PCB is fixed on the top plate.
3. The test mechanism as claimed in claim 2, wherein the heat dissipation structure is a fan.
4. The test mechanism as claimed in claim 3, wherein the fans are two sets, and the two sets of fans are respectively located at two ports of the ventilation channel.
5. The test mechanism as claimed in claim 2, wherein the base defines a network port window and a data port window;
a network port module and a data port module are respectively welded at two ends of the second PCB;
the network port module is located in the network port window, and the data port module is located in the data port window.
6. The test mechanism of claim 1, wherein the number of computing modules is two.
7. The test mechanism for optical module testing of claim 1, wherein the test mechanism for optical module testing further comprises a hub module; the concentrator module comprises a support plate and a concentrator structure arranged on the support plate;
the supporting plate is connected with the frame and is positioned outside the accommodating cavity.
8. The test mechanism as claimed in claim 7, wherein the supporting plate is a resilient elastic plate.
9. The test mechanism as claimed in claim 1, wherein the m.2 connector is soldered to the second PCB, the computer board is plugged into the m.2 connector, and the computer board is fixed to the second PCB by a fixing structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222744724.XU CN218298415U (en) | 2022-10-18 | 2022-10-18 | A accredited testing organization for optical module test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222744724.XU CN218298415U (en) | 2022-10-18 | 2022-10-18 | A accredited testing organization for optical module test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218298415U true CN218298415U (en) | 2023-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222744724.XU Active CN218298415U (en) | 2022-10-18 | 2022-10-18 | A accredited testing organization for optical module test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218298415U (en) |
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2022
- 2022-10-18 CN CN202222744724.XU patent/CN218298415U/en active Active
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