CN218283433U

CN218283433U - Molybdenum wafer hot-pressing die

Info

Publication number: CN218283433U
Application number: CN202222049099.7U
Authority: CN
Inventors: 史大成; 黄岩; 李云
Original assignee: Changzhou Sujiang Electronic Material Co ltd
Current assignee: Changzhou Sujiang Electronic Material Co ltd
Priority date: 2022-08-04
Filing date: 2022-08-04
Publication date: 2023-01-13
Anticipated expiration: 2032-08-04

Abstract

The utility model relates to a molybdenum disk hot pressing die belongs to the technical field of mould, and it includes moulding-die, middle mould and lower mould, it has the core on the moulding-die to go up, have on the lower mould with the die cavity of core looks adaptation, middle mould middle part has the groove of stepping down, it sets up to go up the moulding-die activity in the middle mould, the middle mould with be provided with the locating pin between the lower mould. This application is convenient for assemble, and it is convenient to get the material, can put into the molybdenum disk fast to assemble the hot pressing grinding apparatus, put into the heating furnace heating, can guarantee that the molybdenum disk accomplishes whole suppression flow at process temperature nearly unchangeable in-process.

Description

Molybdenum wafer hot-pressing die

The technical field is as follows:

the application relates to the technical field of dies, in particular to a molybdenum wafer hot-pressing die.

Background art:

at present, after a molybdenum wafer with the thickness of less than 1mm is heated, the temperature is not well controlled in the pressing process, and the molybdenum wafer is easy to scrap in pressing due to the fact that the thickness of the molybdenum wafer is thinner and the temperature is too fast.

In view of the above problems, the inventors have devised a hot press mold for molybdenum wafers having a thickness of 1mm or less.

The utility model has the following contents:

in order to solve the problem that the temperature of a thin molybdenum wafer is not well controlled in the pressing process, the application provides a hot-pressing die for the molybdenum wafer.

The application provides a molybdenum wafer hot pressing mould adopts following technical scheme:

the utility model provides a molybdenum disk hot pressing mold, includes last moulding-die, middle mould and lower mould, go up the moulding-die and go up the core, have on the lower mould with the die cavity of core looks adaptation, middle mould middle part has the groove of stepping down, it sets up to go up the moulding-die activity in the middle mould, the middle mould with be provided with the locating pin between the lower mould.

By adopting the technical scheme, the hot-pressing die is simple and convenient to assemble, can be quickly put into a molybdenum wafer, is assembled with a hot-pressing grinding tool, and is put into a heating furnace for heating.

Preferably, the middle die is an annular block, an annular bulge is arranged in the annular block, an abdicating groove is formed in the middle of the annular bulge, the abdicating groove is matched with the mold core, and the edge of the upper pressing die is matched with the annular bulge.

Through adopting above-mentioned technical scheme, annular protrusion can play the supporting role, when lifting up the middle mould, can lift up the moulding-die together.

Preferably, a plurality of limiting pins are arranged on the side wall of the middle die, and the limiting pins are connected to the upper pressing die.

By adopting the technical scheme, the limiting pin can support the upper pressing die, so that the upper pressing die is prevented from being pressed on a molybdenum wafer and can be taken down when being pressed.

Preferably, a demoulding groove is arranged at the joint of the middle mould and the lower mould.

By adopting the technical scheme, the demoulding groove is convenient to insert a tool, so that demoulding is convenient.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the molybdenum wafer is convenient to assemble and take, the molybdenum wafer can be quickly placed in the molybdenum wafer, the hot-pressing grinding tool is assembled, and the molybdenum wafer is placed in a heating furnace for heating;

2. the whole pressing process of the molybdenum wafer can be guaranteed to be completed in the process that the process temperature is almost unchanged;

3. the structure is small and compact, batch heating can be realized, the operation by a plurality of people or machines is convenient, and the production efficiency is high.

Description of the drawings:

fig. 1 is a schematic cross-sectional structure of an embodiment of the present application before pressing.

Fig. 2 is a schematic cross-sectional structure of the pressed product according to the embodiment of the present application.

Fig. 3 is a top view of an embodiment of the present application.

Description of reference numerals: 1. pressing the die; 11. a core; 2. an intermediate die; 21. an annular projection; 22. a yielding groove; 3. a lower die; 31. a cavity; 4. positioning pins; 5. a spacing pin; 6. demoulding groove; 7. a molybdenum wafer.

The specific implementation mode is as follows:

the present application is described in further detail below with reference to figures 1-3.

The embodiment of the application discloses molybdenum disk hot pressing die, refer to fig. 1-3, including last moulding-die 1, middle mould 2 and lower mould 3, it has core 11 to go up on the moulding-die 1, the die cavity 31 with core 11 looks adaptation has on the lower mould 3, middle mould 2 is the annular piece, annular piece inside has annular arch 21, annular arch 21 middle part forms the groove of stepping down 22, the groove of stepping down 22 and core 11 phase-match, it sets up in middle mould 2 to go up the activity of moulding-die 1, be provided with locating pin 4 between middle mould 2 and the lower mould 3, the through-hole has all been seted up with lower mould 3 to middle mould 2, locating pin 4 is inserted and is established in the both sides through-hole.

Referring to fig. 1, the upper die 1 has an edge matching with the annular protrusion 21, and the annular protrusion 21 may serve as a support to lift the upper die 1 together when the middle die 2 is lifted.

Referring to fig. 1, a plurality of limit pins 5 are arranged on the side wall of the middle die 2, the limit pins 5 are connected to the upper pressing die 1, when the pressing die is not carried out, the limit pins 5 can support the upper pressing die 1 to prevent the upper pressing die from pressing on the molybdenum wafer 7, and when the pressing die is to be pressed, the upper pressing die can be taken down.

Referring to fig. 1, notches are formed in the middle mold 2 and the lower mold 3 for easy demolding, and the notches at both sides form demolding grooves 6.

The implementation principle of the molybdenum wafer hot-pressing die in the embodiment of the application is as follows:

firstly, preparing a circular molybdenum plate and processing a positioning hole, secondly, installing a positioning pin 4 on a lower die 3, installing a molybdenum circular plate on the lower die 3 along the positioning hole, installing an intermediate die 2 on the lower die 3, and installing an upper pressing die 1 on the intermediate die 2, thirdly, placing the whole die with the circular molybdenum plate in a heating furnace to heat to a process temperature, fourthly, taking out the whole die and placing the die in a press for pressing, and finishing the whole pressing process of a molybdenum wafer 7 in the process that the process temperature is almost unchanged.

The above are preferred embodiments of the present application, and the scope of protection of the present application is not limited thereto, so: equivalent changes in structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A molybdenum wafer hot pressing die is characterized in that: including last moulding-die (1), middle mould (2) and lower mould (3), core (11) have on going up moulding-die (1), have on lower mould (3) with die cavity (31) of core (11) looks adaptation, middle mould (2) middle part has abdicating groove (22), it sets up to go up moulding-die (1) activity in middle mould (2), middle mould (2) with be provided with locating pin (4) between lower mould (3).

2. The molybdenum wafer hot pressing mold as claimed in claim 1, wherein: middle mould (2) are the annular piece, annular piece inside has annular protruding (21), annular protruding (21) middle part forms the groove of stepping down (22), the groove of stepping down (22) with core (11) phase-match.

3. The molybdenum wafer hot pressing die as claimed in claim 2, wherein: the edge of the upper die (1) is matched with the annular bulge (21).

4. The molybdenum wafer hot pressing mold as claimed in claim 1, wherein: the side wall of the middle die (2) is provided with a plurality of limiting pins (5), and the limiting pins (5) are connected to the upper pressing die (1).

5. The molybdenum disc hot pressing die as claimed in claim 1, wherein: and a demoulding groove (6) is arranged at the joint of the middle die (2) and the lower die (3).