CN218274592U - Semiconductor structure with protection function - Google Patents
Semiconductor structure with protection function Download PDFInfo
- Publication number
- CN218274592U CN218274592U CN202222014477.8U CN202222014477U CN218274592U CN 218274592 U CN218274592 U CN 218274592U CN 202222014477 U CN202222014477 U CN 202222014477U CN 218274592 U CN218274592 U CN 218274592U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- packaging
- conductive copper
- semiconductor
- bottom shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor structure with safeguard function relates to semiconductor technology field. The packaging bottom shell is mounted on the packaging bottom shell, ear edges are arranged on the peripheries of the packaging top shell and the packaging bottom shell, the insulating layer is attached to the inner bottom of the packaging bottom shell, the conductive copper foil is located on the insulating layer, and two ends of the conductive copper foil extend out of the packaging bottom shell. The semiconductor structure with the protection function is internally provided with the conductive copper foil, so that the semiconductor has the characteristics of electromagnetic shielding, electrostatic prevention, radiation prevention and the like, and by means of the heat conductivity of the copper foil, the attached radiating fins radiate heat in a composite heat exchange mode, a point heat source is quickly converted into a surface heat source, the working temperature of the semiconductor can be reduced, meanwhile, the ear edges on the periphery of the packaging shell can also play a certain protection role, the semiconductor is protected, and the service life is prolonged.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically be a semiconductor structure with safeguard function.
Background
The semiconductor is a substance with conductivity between an insulator and a conductor, the conductivity of the substance is easy to control, and the substance can be used as a component material for information processing, the semiconductor is very important from the viewpoint of technological or economic development, the core unit of many electronic products, such as computers, mobile phones, digital recorders, utilizes the conductivity change of the semiconductor to process information, the common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential one of various semiconductor materials in commercial application.
The existing semiconductor packaging structure is single, the electrostatic protection effect on the semiconductor is poor, electromagnetic shielding on the semiconductor is inconvenient, the semiconductor is easy to be subjected to electrostatic breakdown or damage, and meanwhile, the heat dissipation performance of the semiconductor packaging structure is deviated after packaging.
SUMMERY OF THE UTILITY MODEL
The utility model provides a semiconductor structure with safeguard function to solve the problem in the background art.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a semiconductor structure with safeguard function, includes encapsulation drain pan, encapsulation top shell, insulating layer, conductive copper foil, fin, PPA plastic part, copper lead frame, solid brilliant glue film and chip, encapsulation top shell is installed on the encapsulation drain pan, and the periphery of encapsulation top shell and encapsulation drain pan all is equipped with the ear limit, the attached interior bottom in encapsulation drain pan of insulating layer, conductive copper foil is located the insulating layer, and conductive copper foil's both ends extend outside the encapsulation drain pan, the fin is attached at conductive copper foil's both ends, PPA plastic part is located conductive copper foil, copper lead frame is located PPA plastic part, the chip is glued on copper lead frame through solid brilliant glue film.
Furthermore, the packaging top shell and the packaging bottom shell are pressed together through ear edges, and hollow cavities are formed in the ear edges.
Furthermore, both ends of the conductive copper foil extend into the hollow-out cavity, and a heat-conducting adhesive layer is arranged between the radiating fin and the conductive copper foil.
Furthermore, pins are arranged at two ends of the copper lead frame and extend out of the packaging bottom shell.
Furthermore, the chip is connected with a bonding wire and is connected to the pin through the bonding wire.
Furthermore, two ends of the conductive copper foil are positioned above the pins, and the insulating layer is a polyimide film.
Compared with the prior art, the utility model provides a semiconductor structure with safeguard function possesses following beneficial effect:
the semiconductor structure with the protection function is internally provided with the conductive copper foil, so that the semiconductor has the characteristics of electromagnetic shielding, electrostatic prevention, radiation prevention and the like, and by means of the heat conductivity of the copper foil, the attached radiating fins radiate heat in a composite heat exchange mode, a point heat source is quickly converted into a surface heat source, the working temperature of the semiconductor can be reduced, meanwhile, the ear edges on the periphery of the packaging shell can also play a certain protection role, the semiconductor is protected, and the service life is prolonged.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is a bottom view of the present invention.
In the figure: 1. packaging a bottom shell; 2. packaging the top shell; 3. an insulating layer; 4. a conductive copper foil; 5. a heat sink; 6. PPA plastic parts; 7. a copper lead frame; 8. a die bonding glue layer; 9. a chip; 10. ear edges; 11. hollowing out the cavity; 12. a heat-conducting adhesive layer; 13. a pin; 14. and bonding wires.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-3, the utility model discloses a semiconductor structure with safeguard function, including encapsulation drain pan 1, encapsulation top shell 2, insulating layer 3, conductive copper foil 4, fin 5, PPA plastic part 6, copper lead frame 7, solid brilliant glue film 8 and chip 9, encapsulation top shell 2 installs on encapsulation drain pan 1, and encapsulates top shell 2 and encapsulates the periphery of drain pan 1 and all be equipped with ear 10, insulating layer 3 is attached in the interior bottom of encapsulation drain pan 1, conductive copper foil 4 is located on insulating layer 3, and conductive copper foil 4's both ends extend outside encapsulation drain pan 1, fin 5 is attached in conductive copper foil 4's both ends, PPA plastic part 6 is located conductive copper foil 4, copper lead frame 7 is located PPA plastic part 6, chip 9 passes through solid brilliant glue film 8 on copper lead frame 7, has built-in conductive copper foil 4 for this semiconductor has characteristics such as shielding electromagnetism, antistatic, and with the help of the thermal conductivity of attached fin 5 with the heat exchange mode of complex to dispel the heat, converts the point into the heat source work fast, can reduce this semiconductor heat source work temperature simultaneously, can reduce the peripheral protective heat source of this semiconductor and the use life that also can the radiation protection 10 is prolonged.
Specifically, the top packaging shell 2 and the bottom packaging shell 1 are pressed together through an ear edge 10, and a hollow-out cavity 11 is formed in the ear edge 10.
In this embodiment, the ear 10 plays a role in protecting, at least reducing the possibility of falling, and the hollow-out cavity 11 is designed to reduce weight, and is also convenient for installing the heat sink 5.
Specifically, two ends of the conductive copper foil 4 extend into the hollow-out cavity 11, and a heat conducting adhesive layer 12 is arranged between the radiating fin 5 and the conductive copper foil 4.
In this embodiment, the thermal adhesive layer 12 is used to firmly fix the heat sink 5 to the two ends of the conductive copper foil 4, and also has a heat transfer function.
Specifically, two ends of the copper lead frame 7 are provided with pins 13, and the pins 13 extend out of the package bottom case 1.
In this embodiment, the copper lead frame 7 is used as a carrier of the chip 9, and is a key structural member for forming an electrical circuit by electrically connecting the internal circuit terminals of the chip 9 with the external leads by means of a bonding material, and it functions as a bridge connected with an external wire.
Specifically, the chip 9 is connected to a bonding wire 14, and is connected to the lead 13 through the bonding wire 14.
In this embodiment, the bonding wire 14 is a core material for semiconductor packaging, and is a component for connecting the lead 13 and the chip 9 and transmitting an electrical signal.
Specifically, the two ends of the conductive copper foil 4 are located above the pins 13, and the insulating layer 3 is a polyimide film.
In the embodiment, the polyimide film has outstanding high-temperature resistance, radiation resistance, chemical corrosion resistance and electric insulation performance and is used for insulation protection.
When the semiconductor packaging shell is used, the conductive copper foil 4 is arranged in the semiconductor packaging shell, so that the semiconductor has the characteristics of electromagnetic shielding, static electricity prevention, radiation prevention and the like, the attached radiating fins 5 radiate heat in a composite heat exchange mode by means of the heat conductivity of the copper foil, a point heat source is quickly converted into a surface heat source, the working temperature of the semiconductor can be reduced, meanwhile, the ear edges 10 on the periphery of the packaging shell can also play a certain protection role, the semiconductor is protected, and the service life is prolonged.
In summary, the semiconductor structure with the protection function is internally provided with the conductive copper foil 4, so that the semiconductor has the characteristics of electromagnetic shielding, static electricity prevention, radiation protection and the like, and by means of the heat conductivity of the copper foil, the attached radiating fins 5 radiate heat in a composite heat exchange mode, a point heat source is quickly converted into a surface heat source, the working temperature of the semiconductor can be reduced, and meanwhile, the ear edges 10 on the periphery of the packaging shell can also play a certain protection role, protect the semiconductor and prolong the service life.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a semiconductor structure with safeguard function, includes encapsulation drain pan (1), encapsulation top shell (2), insulating layer (3), conductive copper foil (4), fin (5), PPA plastic part (6), copper lead frame (7), solid glue film (8) and chip (9), its characterized in that: the packaging top shell (2) is installed on the packaging bottom shell (1), the peripheries of the packaging top shell (2) and the packaging bottom shell (1) are provided with ear edges (10), the insulating layer (3) is attached to the inner bottom of the packaging bottom shell (1), the conductive copper foil (4) is located on the insulating layer (3), the two ends of the conductive copper foil (4) extend out of the packaging bottom shell (1), the radiating fins (5) are attached to the two ends of the conductive copper foil (4), the PPA plastic part (6) is located on the conductive copper foil (4), the copper lead frame (7) is located on the PPA plastic part (6), and the chip (9) is bonded on the copper lead frame (7) through the solid crystal glue layer (8).
2. The semiconductor structure with a protection function according to claim 1, wherein: the packaging top shell (2) and the packaging bottom shell (1) are pressed together through the ear edges (10), and the ear edges (10) are provided with hollow cavities (11).
3. The semiconductor structure with a protection function according to claim 2, wherein: the two ends of the conductive copper foil (4) extend into the hollow-out cavity (11), and a heat-conducting adhesive layer (12) is arranged between the radiating fin (5) and the conductive copper foil (4).
4. The semiconductor structure with a protection function according to claim 1, wherein: two ends of the copper lead frame (7) are provided with pins (13), and the pins (13) extend out of the packaging bottom shell (1).
5. The semiconductor structure with a protection function according to claim 4, wherein: the chip (9) is connected with a bonding wire (14) and is connected to the pin (13) through the bonding wire (14).
6. The semiconductor structure with a protection function according to claim 4, wherein: the two ends of the conductive copper foil (4) are located above the pins (13), and the insulating layer (3) is a polyimide film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222014477.8U CN218274592U (en) | 2022-08-01 | 2022-08-01 | Semiconductor structure with protection function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222014477.8U CN218274592U (en) | 2022-08-01 | 2022-08-01 | Semiconductor structure with protection function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218274592U true CN218274592U (en) | 2023-01-10 |
Family
ID=84763972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222014477.8U Active CN218274592U (en) | 2022-08-01 | 2022-08-01 | Semiconductor structure with protection function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218274592U (en) |
-
2022
- 2022-08-01 CN CN202222014477.8U patent/CN218274592U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9818625B2 (en) | Stacked semiconductor die assemblies with thermal spacers and associated systems and methods | |
| US5155579A (en) | Molded heat sink for integrated circuit package | |
| US5254500A (en) | Method for making an integrally molded semiconductor device heat sink | |
| US20050224957A1 (en) | Semiconductor package with heat dissipating structure and method of manufacturing the same | |
| US20150076670A1 (en) | Chip package structure and manufacturing method thereof | |
| KR100973722B1 (en) | Electronic module assembly with heat spreader | |
| KR20140130920A (en) | Package on package device and method of fabricating the device | |
| KR20120045777A (en) | Power package module and a fabricating mothod the same | |
| EP4207269A1 (en) | Semiconductor encapsulation structure and manufacturing method therefor, and semiconductor device | |
| US20030011053A1 (en) | Semiconductor device | |
| JP2003163314A (en) | Semiconductor device | |
| CN102339811A (en) | Circuit board with COB (Chip On Board) packaged power device | |
| CN218274592U (en) | Semiconductor structure with protection function | |
| US7763959B2 (en) | Heat slug for package structure | |
| JP2023505866A (en) | Electronic elements, circuit boards with electronic elements, and electronic devices | |
| US6437984B1 (en) | Thermally enhanced chip scale package | |
| JPS61144855A (en) | Package for semiconductor circuit | |
| US6949824B1 (en) | Internal package heat dissipator | |
| CN110676232B (en) | Semiconductor device packaging structure, manufacturing method thereof and electronic equipment | |
| TWI521654B (en) | Semiconductor device and method for manufacturing a semiconductor device | |
| CN103050454A (en) | Package on package structure | |
| US20190252285A1 (en) | Semiconductor device packages using a thermally enhanced conductive molding compound | |
| JPH03266456A (en) | Semiconductor chip heat dissipating member and semiconductor package | |
| CN220914222U (en) | TO247 insulating electronic element packaging structure and system thereof | |
| KR19980083733A (en) | Thin Film Ball Grid Array Package with Improved Thermal Dissipation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |