CN218273248U - Consolidate mainboard with from heat dissipation function - Google Patents
Consolidate mainboard with from heat dissipation function Download PDFInfo
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- CN218273248U CN218273248U CN202222097449.7U CN202222097449U CN218273248U CN 218273248 U CN218273248 U CN 218273248U CN 202222097449 U CN202222097449 U CN 202222097449U CN 218273248 U CN218273248 U CN 218273248U
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- heat dissipation
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- heat
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Abstract
The utility model discloses a consolidate mainboard with from heat dissipation function, including computer motherboard embedding frame and fixture, the top of computer motherboard embedding frame is provided with mainboard heat dissipation protection casing, and installs all around on the top of mainboard heat dissipation protection casing and run through the bolt, run through the inboard of bolt and install the overhead guard, and the middle part of overhead guard is provided with the heat dissipation equipment frame, fixture installs around the outside of mainboard heat dissipation protection casing. This consolidate mainboard with from heat dissipation function, the user will run through the bolt screw thread and run through to install and carry out the centre gripping fixed with sleeve inside the positioning disk, effectually with mainboard heat dissipation protection casing, heat dissipation equipment frame and mainboard equipment end frame protection heat dissipation are installed on computer motherboard embedding frame, carry out the protection casing mode to consolidating mainboard heat dissipation air circulation nature, avoid long-time inside dust that dispels the heat too concentrated the main frame, naked reinforcement mainboard carries out the isolation circulation that dispels the heat.
Description
Technical Field
The utility model relates to a computer motherboard technical field specifically is a consolidate mainboard with from heat dissipation function.
Background
The computer mainboard is installed in a chassis, is one of the most basic and important components of a microcomputer, is generally a rectangular circuit board, is provided with main circuit systems forming the computer, and generally comprises a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator lamp plug-in connector, an expansion slot, elements such as a mainboard and a direct current power supply power connector of a plug-in card, and the like.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a consolidate mainboard with from heat dissipation function to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a consolidate mainboard with from heat dissipation function, includes computer motherboard embedding frame and fixture, the top of computer motherboard embedding frame is provided with mainboard heat dissipation protection casing, and installs all around on the top of mainboard heat dissipation protection casing and run through the bolt, the inboard of running through the bolt is installed the overhead guard, and the middle part of overhead guard is provided with the heat dissipation equipment frame, fixture installs around the outside of mainboard heat dissipation protection casing, the mainboard equipment connects the end frame is installed to fixture's inboard, fixture's inside is provided with the sleeve, and the positioning disk is installed to telescopic below.
Furthermore, be swing joint between computer mainboard embedding frame and the mainboard heat dissipation protection casing, and be threaded connection between mainboard heat dissipation protection casing and the through bolt.
Furthermore, the main board heat dissipation protective cover is fixedly connected with the top cover, and the top cover is in threaded connection with the heat dissipation equipment frame.
Furthermore, be swing joint between positioning disk and the sleeve, and the positioning disk passes through the sleeve and constitutes buckle structure with the through bolt.
Further, the heat dissipation equipment frame comprises a threaded cover and an extension heat dissipation cover, the threaded cover is arranged inside the heat dissipation equipment frame, and the extension heat dissipation cover is arranged below the threaded cover.
Furthermore, threaded connection is adopted between the threaded cover and the extension heat dissipation cover, and the threaded cover and the extension heat dissipation cover are threaded inside the top cover.
Further, computer motherboard embedding frame includes radiator-grid and embedding piece, the inner wall of computer motherboard embedding frame is provided with the radiator-grid, and the internally mounted of radiator-grid has the embedding piece.
Compared with the prior art, the beneficial effects of the utility model are that: this consolidate mainboard user with from heat dissipation function will run through the bolt screw thread and run through and install and carry out the centre gripping fixed with sleeve inside the positioning disk, effectually connect the end frame protection heat dissipation with mainboard heat dissipation protection casing, heat dissipation equipment frame and mainboard equipment and install on computer motherboard embedding frame, carry out the protection casing mode and to consolidating mainboard heat dissipation air circulation nature, avoid the inside dust of long-time heat dissipation too concentrated the main frame of computer, the exposed reinforcement mainboard keeps apart the circulation of dispelling the heat.
1. The utility model discloses, when heat dissipation equipment frame threaded connection installs when overhead guard and mainboard heat dissipation protection casing are inside, make threaded connection's extension heat dissipation cover embedding install inside overhead guard and mainboard heat dissipation protection casing, do benefit to computer motherboard embedding frame and rely on the heat dissipation wind that heat dissipation equipment frame brought to circulate, do benefit to and consolidate the mainboard heat dissipation and mainly rely on the heat dissipation fan to carry out outside heat dissipation circulation, utilize and consolidate mainboard self material and have the radiating effect, improve and consolidate mainboard heat dissipation air circulation nature.
2. The utility model discloses make the embedding piece embedding in computer motherboard embedding frame and radiator-grid install and connect the end frame protection heat dissipation at mainboard heat dissipation protection casing, heat dissipation equipment frame and mainboard equipment, the cooling air is dispelled the heat all around along computer motherboard embedding frame, relies on equipment heat dissipation wind-force to carry out the wind-force circulation of air simultaneously, and the prevention dust is remained on consolidating the mainboard.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
fig. 2 is a schematic view of the internal structure of the heat dissipation device rack of the present invention;
fig. 3 is the schematic diagram of the internal structure of the computer motherboard embedding rack of the present invention.
In the figure: 1. a computer motherboard embedding rack; 101. a heat-dissipating mesh; 102. embedding a block; 2. a heat dissipation shield of the mainboard; 3. a through bolt; 4. a top cover; 5. a heat dissipation device rack; 501. a screw thread cover; 502. an extended heat dissipation cover; 6. a clamping mechanism; 601. positioning a plate; 602. a sleeve; 7. mainboard equipment connects end frame.
Detailed Description
As shown in fig. 1, the utility model provides a technical solution: a reinforced mainboard with self-heat dissipation function comprises a computer mainboard embedding frame 1 and a clamping mechanism 6, wherein a mainboard heat dissipation protective cover 2 is arranged at the top end of the computer mainboard embedding frame 1, a through bolt 3 is arranged around the top end of the mainboard heat dissipation protective cover 2, a top cover 4 is arranged on the inner side of the through bolt 3, a heat dissipation equipment frame 5 is arranged in the middle of the top cover 4, the clamping mechanism 6 is arranged around the outer part of the mainboard heat dissipation protective cover 2, a mainboard equipment connecting frame 7 is arranged on the inner side of the clamping mechanism 6, a sleeve 602 is arranged inside the clamping mechanism 6, a positioning disc 601 is arranged below the sleeve 602, the computer mainboard embedding frame 1 is movably connected with the mainboard heat dissipation protective cover 2, the mainboard heat dissipation protective cover 2 is in threaded connection with the through bolt 3, and the mainboard heat dissipation protective cover 2 is movably arranged on the computer mainboard embedding frame 1, the through bolt 3 is installed around the main board heat dissipation shield 2 in a threaded penetrating manner, which is beneficial to reinforcing the external heat dissipation circulation of the main board heat dissipation by means of a heat dissipation fan, or reinforcing the heat dissipation equipment installation of the main board self material, the main board heat dissipation shield 2 is fixedly connected with the top cover 4, the top cover 4 is fixedly connected with the top end of the main board heat dissipation shield 2, so that the heat dissipation equipment frame 5 is installed inside the top cover 4 and the main board heat dissipation shield 2 in a threaded connection manner, when the main board heat dissipation shield 2 is movably installed on the computer main board embedding frame 1, the heat dissipation circulation is carried out by means of the heat dissipation equipment frame 5, the positioning disc 601 is movably connected with the sleeve 602, and the positioning disc 601 and the through bolt 3 form a buckle structure, the clamping mechanism 6 is installed around the outer part of the main board heat dissipation shield 2, so that the sleeve 602 is installed on the clamping mechanism 6, simultaneously with positioning disk 601 movable mounting in sleeve 602 below, the user will run through 3 screw threads of tying and install and carry out the centre gripping fixed in positioning disk 601 and sleeve 602 inside, effectually with mainboard heat dissipation protection casing 2, heat dissipation equipment frame 5 and mainboard equipment termination frame 7 protection heat dissipation and install on computer motherboard embedding frame 1, carry out the protection casing mode to consolidating mainboard heat dissipation air circulation nature, avoid long-time heat dissipation inside dust too concentrated the computer host computer, the exposed reinforcement mainboard carries out the heat dissipation and keeps apart the circulation.
As shown in fig. 2, the utility model provides a technical solution: the utility model provides a consolidate mainboard with from heat dissipation function, heat dissipation equipment frame 5 includes screw thread cover 501 and extends heat dissipation cover 502, the internally mounted of heat dissipation equipment frame 5 has screw thread cover 501, and screw thread cover 501's below is installed and is extended heat dissipation cover 502, be threaded connection between screw thread cover 501 and the extension heat dissipation cover 502, and screw thread cover 501 and the screw thread of extension heat dissipation cover 502 run through inside top shield 4, install screw thread cover 501 inside heat dissipation equipment frame 5, make extension heat dissipation cover 502 movable mounting in screw thread cover 501 below, when heat dissipation equipment frame 5 threaded connection installs inside top shield 4 and mainboard heat dissipation protection casing 2, make threaded connection's extension heat dissipation cover 502 embedding install inside top shield 4 and mainboard heat dissipation protection casing 2, do benefit to computer mainboard embedding frame 1 and rely on the cooling wind that heat dissipation equipment frame 5 brought and circulate, do benefit to consolidate the mainboard heat dissipation and mainly rely on the heat dissipation fan to carry out the outside circulation of dispelling the heat, utilize consolidate mainboard self material to have the radiating effect, it is circulated to improve and consolidate mainboard heat dissipation air circulation nature.
As shown in fig. 3, the utility model provides a technical solution: the utility model provides a consolidate mainboard with from heat dissipation function, computer motherboard embedding frame 1 includes radiator-grid 101 and embedding piece 102, computer motherboard embedding frame 1's inner wall is provided with radiator-grid 101, and the internally mounted of radiator-grid 101 has embedding piece 102, install radiator-grid 101 around computer motherboard embedding frame 1, make the embedding piece 102 embedding in computer motherboard embedding frame 1 and radiator-grid 101 install mainboard heat dissipation protection casing 2, the protection heat dissipation of radiator-equipment frame 5 and mainboard equipment termination frame 7, the heat dissipation air dispels the heat around computer motherboard embedding frame 1, rely on equipment heat dissipation wind-force to carry out the wind-force circulation simultaneously, the prevention dust remains on consolidating the mainboard.
In summary, the reinforced motherboard with self-heat dissipation function, when in use, the clamping mechanism 6 is installed around the outside of the motherboard heat dissipation shield 2, so that the sleeve 602 is installed on the clamping mechanism 6, and the positioning disk 601 is movably installed below the sleeve 602, a user can install the through bolt 3 in the positioning disk 601 and the sleeve 602 for clamping and fixing, effectively install the motherboard heat dissipation shield 2, the heat dissipation device rack 5 and the motherboard device connection rack 7 for protection and heat dissipation on the motherboard embedding rack 1, perform the shield mode for heat dissipation air circulation of the reinforced motherboard, avoid the long-time heat dissipation of internal dust from excessively concentrating on the computer mainframe, the exposed reinforced motherboard performs heat dissipation and isolation circulation, install the heat dissipation network 101 around the motherboard embedding rack 1, so that the embedded block 102 in the motherboard embedding rack 1 and the heat dissipation network 101 is embedded in the motherboard heat dissipation shield 2, the heat dissipation device rack 5 and the motherboard device connection rack 7 for protection and heat dissipation, the heat dissipation air dissipates heat around the embedding rack 1, and performs wind power circulation of the heat dissipation air around the motherboard embedding rack 1, prevent the dust from remaining on the reinforced motherboard, install the threaded shield 501 in the heat dissipation device rack 5, so that the heat dissipation device rack 2 extends inside the heat dissipation shield 502, and the heat dissipation hood 2 extends as to facilitate the heat dissipation hood 2 and the heat dissipation hood 2.
Claims (7)
1. A reinforced mainboard with self-heat dissipation function comprises a computer mainboard embedding frame (1) and a clamping mechanism (6), and is characterized in that the computer mainboard embedding frame is provided with a plurality of clamping mechanisms; the top of computer motherboard embedding frame (1) is provided with mainboard heat dissipation protection casing (2), and installs all around on the top of mainboard heat dissipation protection casing (2) and run through bolt (3), run through the inboard of bolt (3) and install top cap (4), and the middle part of top cap (4) is provided with heat dissipation equipment frame (5), fixture (6) are installed around the outside of mainboard heat dissipation protection casing (2), mainboard equipment connects end frame (7) are installed to the inboard of fixture (6), the inside of fixture (6) is provided with sleeve (602), and positioning disk (601) is installed to the below of sleeve (602).
2. The reinforced motherboard with a self-heat-dissipation function as recited in claim 1, wherein: the computer mainboard embedding frame (1) is movably connected with the mainboard heat dissipation protective cover (2), and the mainboard heat dissipation protective cover (2) is in threaded connection with the through bolt (3).
3. The reinforced main board with the self-heat-dissipation function according to claim 1, wherein: the main board heat dissipation protective cover (2) is fixedly connected with the top cover (4), and the top cover (4) is in threaded connection with the heat dissipation equipment frame (5).
4. The reinforced main board with the self-heat-dissipation function according to claim 1, wherein: be swing joint between positioning disk (601) and sleeve (602), and positioning disk (601) constitute buckle structure through sleeve (602) and run through bolt (3).
5. The reinforced main board with the self-heat-dissipation function according to claim 1, wherein: the heat dissipation equipment frame (5) comprises a threaded cover (501) and an extension heat dissipation cover (502), the threaded cover (501) is installed inside the heat dissipation equipment frame (5), and the extension heat dissipation cover (502) is installed below the threaded cover (501).
6. The reinforced main board with the self-heat-dissipation function according to claim 5, wherein: the threaded cover (501) is in threaded connection with the extension heat dissipation cover (502), and the threaded cover (501) and the extension heat dissipation cover (502) penetrate through the top cover (4) in a threaded mode.
7. The reinforced motherboard with a self-heat-dissipation function as recited in claim 1, wherein: computer motherboard embeds frame (1) includes radiator-grid (101) and embedded piece (102), the inner wall of computer motherboard embedding frame (1) is provided with radiator-grid (101), and the internally mounted of radiator-grid (101) has embedded piece (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222097449.7U CN218273248U (en) | 2022-08-10 | 2022-08-10 | Consolidate mainboard with from heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222097449.7U CN218273248U (en) | 2022-08-10 | 2022-08-10 | Consolidate mainboard with from heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218273248U true CN218273248U (en) | 2023-01-10 |
Family
ID=84766081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222097449.7U Active CN218273248U (en) | 2022-08-10 | 2022-08-10 | Consolidate mainboard with from heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218273248U (en) |
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2022
- 2022-08-10 CN CN202222097449.7U patent/CN218273248U/en active Active
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