CN218255414U

CN218255414U - Hot cutter

Info

Publication number: CN218255414U
Application number: CN202221658482.6U
Authority: CN
Inventors: 陶为银
Original assignee: Henan General Intelligent Equipment Co Ltd
Current assignee: Jiangsu General Semiconductor Co.,Ltd.
Priority date: 2022-06-30
Filing date: 2022-06-30
Publication date: 2023-01-10
Anticipated expiration: 2032-06-30

Abstract

The utility model discloses a hot cutter, including fixing the ring cutter subassembly in rotatable swinging boom one end, the ring cutter subassembly rotates on fixing cutting blade holder, the cutting blade holder on the swinging boom and sets up the blade holder, fixed heating device on the blade holder, and heating device heats the ring cutter on the blade holder. Can heat the girdling sword through adopting heating device, cut the BG membrane, can avoid because the rotation of cutter, the fold appears in the BG membrane. The heated ring cutter has better BG film effect.

Description

Hot cutter

Technical Field

The utility model relates to a wafer pad pasting technical field especially relates to a hot knife.

Background

With the development of science and technology, intelligent wearing and the development of a smart phone and a tablet personal computer towards high speed and large capacity in the aspect of storage; the size of the chip is being thinned, the technological development direction requires the thinning of the flash memory and the memory controller, the area of the chip tends to be larger and smaller, and the thickness tends to be thinner and smaller, so that the problem of cracking during processing and cutting of the ultra-thin chip in the conventional process is more challenging.

The chip light weight requirement is met, and a processing method of cutting firstly and then thinning is adopted in the processing technology; the specific operation is that the wafer is subjected to forward recessive cutting to a proper depth, and then the front surface of the wafer is attached with the BG film, so that the BG film can effectively protect chips on the surface of the wafer from being damaged and simultaneously avoid being influenced by impurities in the thinning process.

The silicon carbide wafer is high in hardness and cannot be cracked in a film expanding mode, equipment needs to be suitable for being cracked one by one along a wafer cutting path, the surface of a chip is sensitive to chips, a layer of BG film is pasted on the surface of the wafer in the splitting process, a cleaver of a splitting mechanism is prevented from being in direct contact with the surface of the wafer, and the chips are also prevented from being polluted by the chips generated in the splitting process. After the BG film is attached to a wafer, the BG film needs to be cut into the BG film which is matched with the wafer in size, and when circular cutting is carried out, the surface of the BG film is wrinkled due to the rotation of a cutter.

SUMMERY OF THE UTILITY MODEL

For solving when the wafer protection film is cutting, because the rotation of cutter, the problem of fold appears in the BG membrane, the utility model provides a hot knife.

The specific scheme is as follows:

a hot cutter comprises a ring cutter assembly fixed at one end of a rotatable rotating arm, wherein the ring cutter assembly comprises a cutter holder fixed on the rotating arm and a cutter holder rotatably arranged on the cutter holder, a heating device is fixed on the cutter holder, and the heating device heats a ring cutter on the cutter holder.

The heating device sequentially comprises a heat insulation plate, an electric heating plate and a PTC heater which are fixed on the tool apron along the length direction of the rotating arm, and a ring cutter is fixed between the heat insulation plate and the PTC heater; the electric heating plate is heated by electric wires.

The electric wire is connected in series with a resistor.

The resistor is Pt100.

The PTC heater is fixed on the heat conducting plate through a fixing bolt and clamps the ring cutter.

The utility model discloses a hot knife can heat the girdling sword through adopting heating device, cuts the BG membrane, can avoid because the rotation of cutter, the fold appears in the BG membrane. The heated ring-cutting knife has better BG film effect.

Drawings

FIG. 1 is a schematic structural diagram of a full-automatic wafer laminator;

FIG. 2 is a schematic view of the die assembly;

FIG. 3 is a first schematic view of the angle-fixing component;

FIG. 4 is a first schematic structural view of the angle fixing assembly;

FIG. 5 is a schematic structural diagram of a wafer transfer device;

FIG. 6 is a schematic view of a wafer support mechanism;

FIG. 7 is a schematic view of the rotary cutting unit in operation;

FIG. 8 is a first schematic view of a rotary cutting unit;

FIG. 9 is a second schematic view of the rotary cutting unit;

FIG. 10 is a first schematic view of a ring cutter assembly;

FIG. 11 is a second schematic view of the ring cutter assembly;

FIG. 12 is a schematic structural view of a balancing assembly;

FIG. 13 is a diagram of the process of cutting BG film with a ring cutter.

In the figure: the device comprises a machine frame 1, a longitudinal plate 11, a film pasting platform 2, a ring cutting groove 21, a die assembly 3, a die servo moving module 31, a die support 32, a die roller 33, a die cylinder 34, a die bracket 35, a fixed angle assembly 4, a fixed angle linear motor 41, a fixed angle roller 42, a rotary cutting component 5, a ring cutter assembly 51, a cutting tool apron 511, a heating device 512, a tool apron 5121, a heat insulation plate 5122, an electric heating plate 5123, a PTC heater 5124, a tension spring 513, an angle adjusting bolt 514, a ring cutter 515, a balance assembly 52, a balance support 521, a balance spring 522, a roller support 523, a roller 524, a long bolt 525, a rotary cutting seat 53, a rotary driving motor 54, a rotary arm 55, a wafer receiving mechanism 6, a lifting support 61, a lifting plate 62, a lifting cylinder 63, a multifunctional manipulator 7, a transfer manipulator 71, a suction part 711, a bin 8, a wafer 9 and a BG film 10.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the implementations of the present invention, and not all implementations, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.

As shown in fig. 1-13, a full-automatic wafer film laminating machine is disclosed, which comprises a machine frame 1 with a longitudinal plate 11 on the upper surface, a wafer film laminating system, a multifunctional robot system with a multifunctional machine 7 and a stock bin 8, wherein the wafer film laminating system comprises a film laminating platform 2 arranged on the machine frame 1, a pressing die assembly 3 positioned above the film laminating platform 2 and a fixed angle assembly 4 arranged on the longitudinal plate 11, and the fixed angle assembly 4 ensures that an angle between a BG film 10 between a film pressing roller 33 and a fixed angle roller 42 and a horizontal plane where the film laminating platform 2 is positioned is unchanged when the pressing die assembly 3 carries out film laminating; the multifunction robot 7 is provided with a ring cutter unit 51 for hot cutting the BG film 10. Through the matching between the pressing die assembly 3 and the fixed angle assembly 4, the whole BG film 10 is controlled to be in a flat state before film pasting, the angle between the BG film 10 between the pressing die roller 33 and the fixed angle roller 42 and the film pasting platform 2 is kept unchanged, the pressing die roller 33 can exhaust air below the BG film 10, and wrinkles are avoided; when the BG film 10 is cut, the hot-cutting ring cutter assembly 51 is adopted, the BG film 10 can be cut by the heated ring cutter 515, and the BG film 10 is prevented from being wrinkled by a blade in the cutting process.

Moulding-die subassembly 3 includes moulding-die servo and removes module 31, sliding connection has moulding-die support 32 on moulding-die servo removes module 41, it is provided with height-adjustable's press mold roller 33 to rotate on moulding-die support 32, move down when press mold roller 33, and when contacting with BG membrane 10, move the pad pasting in the direction of BG membrane 10 operation through mould servo removes module 31 control moulding-die support 32, press mold roller 33 is when the pad pasting, can keep synchronous motion through guaranteeing between fixed angle roller 42 and the press mold roller 33, reach the unchangeable purpose of the angle between BG membrane 10 between keeping press mold roller 33 and the fixed angle roller 42 and the pad pasting platform 2, press mold roller 33 can be through the linear motor control reciprocating motion of fixed angle, also through the overhanging board that sets up on moulding-die support 32, the length direction of overhanging board is unanimous with the traffic direction in membrane area, it sets up press mold roller 33 to rotate on the overhanging board.

In order to ensure that the angle between the BG film 10 and the film sticking platform 2 between the die pressing roller 33 and the fixed angle roller 42 is not changed, the running direction of the fixed angle roller 42 can be the direction vertical to the film sticking platform 2, and the fixed angle roller 42 is rotatably arranged on the fixed angle linear motor 41.

In order to ensure that the BG film 10 is uniformly stressed when the die pressing roller 33 performs die pressing on the BG film 10, the arranged die pressing support 32 is a door-shaped frame, and the film sticking platform 2 is positioned in the door-shaped frame; both sides of the top of the portal frame are provided with a die pressing cylinder 34, an expansion rod of the die pressing cylinder 34 penetrates through the top of the portal frame, the tail end of the expansion rod of the die pressing cylinder 34 is connected with a die pressing bracket 35, and the die pressing roller 33 is rotatably connected onto the die pressing bracket 35.

The multifunctional manipulator 7 is provided with a rotary cutting part 5, the rotary cutting part 5 comprises a rotary cutting seat 53 fixed on the multifunctional manipulator 7, a rotary driving motor 54 is fixed on the rotary cutting seat 53, an output shaft of the rotary driving motor 54 is connected with a rotary arm 55, one end of the rotary arm 55 is provided with a circular cutting knife assembly 51, and the other end of the rotary arm is provided with a balance assembly 52; when the cutting knife assembly 51 performs cutting, the annular cutting groove 21 is required to be arranged on the corresponding working surface. The working surface is referred to as the film application platform 2. Set up the adsorption zone on the pad pasting platform 2, set up the negative pressure chamber in the adsorption zone, set up the negative pressure source in the negative pressure chamber, the negative pressure source produces the negative pressure and sets up the negative pressure pore pair wafer 9 through the adsorption zone and adsorb, treat that the wafer 9 of pad pasting places inside circular cutting groove 21, and the negative pressure source can adsorb wafer 9 through the negative pressure pore pair, avoids when cutting, and the skew takes place for the position of wafer 9. The width of the annular cutting groove 21 is 5mm, the depth of the annular cutting groove 21 is 0.2mm, the material of the film sticking platform 2 is ceramic, and the inner diameter of the annular cutting groove 21 is 2mm smaller than the outer diameter of the wafer 9.

The ring cutter assembly 51 includes: a U-shaped cutting knife seat 511 arranged at the end part of the rotating arm 55, a circular cutting knife 515 arranged at the U-shaped opening, a heating device 512 arranged adjacent to the circular cutting knife 515, wherein the heating device 512 heats the circular cutting knife 515; the heating device 512 comprises a cutter holder 5121 arranged at the U-shaped opening, a heat insulation plate 5122, an electric heating plate 5123 and a PTC heater 5124 are sequentially fixed outside the cutter holder 5121 along the length direction of the rotating arm 55, and a cutter 515 is fixed between the electric heating plate 5123 and the PTC heater 5124; the electric heating plate 5123 is heated by an electric wire.

In order to protect the circuit, a resistor is connected in series on the wire, and the used resistor is Pt1000. The heating device 512 can heat the ring cutter 515, and the heated ring cutter 515 is used for cutting the BG film 10, so that the BG film 10 is prevented from being wrinkled by a blade in the cutting process.

Knife holder 5121 rotates and connects on cutting knife holder 511, and ring cutter subassembly 51 still includes angle adjustment mechanism and canceling release mechanical system, and angle adjustment mechanism makes ring cutter subassembly 51 rotate for swinging boom 55, and canceling release mechanical system makes ring cutter subassembly 51 fix ring cutter 515 subassembly after rotating. The angle adjusting mechanism comprises a convex block arranged at the bottom of the cutter seat 511, and an angle adjusting bolt 514 is connected in the convex block in a threaded manner; the movement of the end of the angle adjusting bolt 514 adjusts the angle of the ring cutter 515;

the reset mechanism is a tension spring 513, and two ends of the tension spring 513 are respectively connected with the bottom of the cutting knife holder 511 and the knife holder 5121. The two ends of the tension spring are connected with the bottom of the cutting knife holder and the knife holder respectively, and the connection point of the tension spring and the knife holder 5121 is located on the same side of the hinge point between the circular cutting knife component 51 and the cutting knife holder 511.

The reset mechanism is a pressure spring, two ends of the pressure spring are respectively connected with the bottom of the cutting knife seat 511 and the knife seat 5121, and a connection point of the pressure spring and the knife seat 5121 is positioned on different sides of a hinge point between the circular cutting knife assembly 51 and the cutting knife seat 511.

The tip of angle adjusting bolt 514 is provided with ball nut, can carry out a protection to knife rest 5121, and the angle adjustment mechanism and the canceling release mechanical system that set up can be adjusted the angle of ring-cutting knife 515, can carry out a protection to the tool bit of ring-cutting knife 515.

The rotating arm 55 is provided with a long round hole, the length direction of the long round hole is consistent with that of the rotating arm 55, the balance assembly 52 is fixed in the long round hole through a positioning bolt, and the balance during circular cutting is ensured by adjusting the distance between the positioning bolt and the rotating center line; the balance assembly 52 includes a balance base 521, the balance base 521 is connected to a roller base 523 through a balance spring 522, and a roller 524 is rotatably disposed on the roller base 523. The balance support 523 is provided with a long bolt, and the end of the long bolt is abutted against the roller support 523. The maximum distance that the roller support 523 moves up can be limited, avoiding breaking the overall balance of the rotary cutting member 5.

The multifunctional manipulator 7 is provided with a transferring manipulator 71; the film pasting platform 2 is provided with a wafer receiving mechanism 6 for receiving the wafer 9 conveyed by the multifunctional manipulator 7, the wafer receiving mechanism 6 comprises at least three lifting support posts 61 and the film pasting platform 2,

the whole pad pasting platform 2 is an adsorption zone, a negative pressure cavity is arranged in the adsorption zone, a negative pressure source is arranged in the negative pressure cavity, negative pressure generated by the negative pressure source is absorbed on the wafer 9 through a negative pressure hole arranged in the adsorption zone, and the lifting support column 61 is connected with the pad pasting platform 2 in a sealing sliding mode.

The middle area of the adsorption area where the lifting support columns 61 are located does not have an adsorption function, no sliding exists between the lifting support columns 61 and the film sticking platform 2, and the number of the lifting support columns 61 is preferably 4;

the lifting plate 62 is connected to the bottom of the lifting column 2, and the lifting plate 62 is lifted by the lifting cylinder 63. The suction part 711 of the transfer robot 71 is U-shaped, and the lifting column 61 does not limit the suction part. Transfer manipulator 71, lift pillar 61 and pad pasting platform 2 have constituted wafer transfer device, and transfer manipulator 71 has negative pressure adsorption apparatus and constructs, adsorbs wafer 9, and negative pressure adsorption apparatus constructs including the inside absorption portion that is the cavity, and absorption portion is inside to produce the negative pressure through the negative pressure source to adsorb wafer 9 through the aperture on absorption portion surface. The suction part 711 may be U-shaped, and the lifting column 61 does not limit the suction part. The suction part 711 may be a suction cup.

Suction portion 711 absorbs wafer 9 from the feed bin by using negative pressure, and transports to the lifting support 62 top under the effect of multifunctional manipulator, and after lifting support 62 rose, place wafer 9 at lifting support 62, and then under the effect of lift cylinder 63, place wafer 9 on pad pasting platform 2, and adsorb wafer 9 by using negative pressure, and after the pad pasting was accomplished, under the effect of lift cylinder 63, lifting support 62 rose, and transfer manipulator 71 picks up wafer 9, and puts back in the feed bin. Adopt wafer transfer device can avoid causing the damage to wafer 9 at the in-process of transporting.

A wafer film coating method comprises the following steps:

the method comprises the following steps: the wafer 9 in the bin 8 is taken out by the transferring mechanical arm 71 in the multifunctional mechanical arm 7, the wafer 9 is placed on the film adhering platform 2 under the action of the wafer bearing mechanism 6, and the film adhering platform 2 adsorbs the wafer 9.

Step two: the BG film 10 is conveyed to the upper part of the wafer 9 through a composite film releasing system, and the BG film 10 is attached to the surface of the wafer 9 under the action of a pressing module 31.

Step three: the wafer 9 is positioned by a visual positioning device in the multifunction robot 7, and the BG film 10 is cut by rotating the cutting member 5.

Step four: after the BG film 10 is cut, the wafer 9 with the film attached thereto is transferred to the transfer robot 71 by the wafer receiving mechanism 6, and then the wafer 9 with the film attached thereto is transferred to the magazine 8.

Step five: the cut BG film 10 is recovered by a waste material recovery system.

In the first step, the wafer receiving mechanism 6 receives the wafer 9, and includes receiving the wafer 9 through the liftable supporting post 61, lowering the liftable supporting post 61 below the film deposition stage after receiving the wafer 9, and sucking the wafer 9 by the negative pressure generated on the film deposition stage 2.

In the second step, the composite film releasing system conveys the composite film from the film releasing air expansion axial film sticking platform through the film releasing driven roller system, the composite film is divided into a protective film and a BG film 10 before entering the film sticking platform 2, and the protective film is recovered through the protective film collecting system; the BG film 10 is transported over the film application platform.

The end part of the film releasing air expansion shaft is fixedly provided with a film releasing electromagnetic brake, the film releasing electromagnetic brake is electrically connected with the tension control roller, and the tension control roller detects the tension of the film belt and feeds the tension back to the film releasing electromagnetic brake to keep the composite film tensioned all the time; set up between putting membrane driven roll system and put membrane buffer memory roller, put membrane buffer memory roller and contact with the complex film through self gravity.

In the second step, the pressing module 3 is matched with the fixed angle module 4 when the BG film 10 is attached to the surface of the wafer 9; when the BG membrane 10 is close to the film sticking platform 2, the pressing roller 33 in the pressing module 3 can move along the moving direction of the membrane under the action of the pressing moving servo module 31, the position of the fixed angle roller 42 in the fixed angle module 4 can also change, and the angle between the BG membrane 10 between the pressing roller 33 and the fixed angle roller 42 and the horizontal plane of the film sticking platform 2 is unchanged.

In the third step, the rotary cutting part 5 comprises a rotary cutting seat 53 fixed on the multifunctional manipulator 7, a rotary driving motor 54 is fixed on the rotary cutting seat 3, an output shaft of the rotary driving motor 54 is connected with a rotary arm 55, one end of the rotary arm 55 is provided with a circular cutting knife assembly 51, and the other end of the rotary arm 55 is provided with a balance assembly 52; when the ring cutter assembly 51 performs cutting, a ring cutting groove needs to be formed on a corresponding working surface.

The excess material collecting system comprises an excess material collecting air expansion shaft, an excess material collecting driving roller, an excess material collecting roller system and an excess material collecting caching roller, the cut BG film 10 is conveyed to the excess material collecting caching roller by the excess material collecting roller system,

the end part of the excess material collecting air expansion shaft is fixedly provided with an excess material collecting electromagnetic brake, the excess material collecting electromagnetic brake is electrically connected with the excess material collecting tension control roller, the excess material collecting tension control roller detects the tension of the film belt and feeds the tension back to the excess material collecting electromagnetic brake, and the cut BG film 10 is kept tensioned all the time; and a surplus material receiving buffer roller is arranged between the surplus material receiving driven roller systems and is contacted with the cut BG film 10 through self gravity.

In the fifth step, the cut BG film 10 penetrates through a gap between two locking plates of the locking device, and is then recovered by a surplus material system after being cut; the cut BG film 10 is fixed by controlling the opening and closing between the two locking plates. Specifically, the lower locking plate is fixed on the longitudinal plate 11, and the upper locking plate controls the lifting of the upper locking plate through the locking cylinder, so as to control the closing of the two locking plates.

Through the matching between the pressing die assembly 3 and the fixed angle assembly 4, the BG film 10 is controlled to be in a flat state before film sticking, the angle between the BG film 10 and a film sticking platform between the pressing die roller 33 and the fixed angle roller 42 is kept unchanged, the pressing die roller 33 can completely exhaust air below the BG film 10, and wrinkles are avoided; when the BG film 10 is cut, the ring-cutting knife assembly 51 for hot cutting is adopted, so that the BG film 10 can be cut by a heated blade, and the BG film 10 is prevented from being wrinkled by the ring-cutting knife 515 in the cutting process. By adopting the matching between the lifting support column 61 and the transferring manipulator 71, the damage to the wafer 9 in the transferring process can be avoided. The cooperation between cutting ring assembly 51 and balancing assembly 52 allows cutting ring 515 to be in a balanced position during film cutting. The cooperation between the tension spring 513 and the angle adjusting bolt 514 enables the angle of the ring-cutting knife 515 to be adjusted, so that damage to the knife head part of the ring-cutting knife 515 can be avoided during film cutting.

The technical means disclosed by the scheme of the present invention is not limited to the technical means disclosed by the above embodiments, but also includes the technical scheme formed by the arbitrary combination of the above technical features. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also considered as the protection scope of the present invention.

Claims

1. A hot cutting knife is characterized by comprising a ring cutting knife component fixed at one end of a rotatable rotating arm, wherein the ring cutting knife component comprises a cutting knife holder fixed on the rotating arm and a knife holder rotationally arranged on the cutting knife holder, a heating device is fixed on the knife holder, and the heating device heats a ring cutting knife on the knife holder.

2. The hot cutting knife according to claim 1, wherein the heating means comprises, in order along the length direction of the rotary arm, a heat insulating plate fixed to the knife holder, an electric heating plate, and a PTC heater, with the ring cutter fixed between the heat insulating plate and the PTC heater; the electric heating plate is heated by electric wires.

3. A hot knife according to claim 2, in which the electrical wires are provided in series with a resistor.

4. A hot knife according to claim 3, in which the resistor is of the type Pt100.

5. A hot knife according to claim 2 in which the PTC heater is secured to the plate by fixing bolts and clamps the knife.