CN218241590U - Multi-core group ceramic capacitor frame convenient to assemble and multi-core group ceramic capacitor thereof - Google Patents
Multi-core group ceramic capacitor frame convenient to assemble and multi-core group ceramic capacitor thereof Download PDFInfo
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- CN218241590U CN218241590U CN202222088606.8U CN202222088606U CN218241590U CN 218241590 U CN218241590 U CN 218241590U CN 202222088606 U CN202222088606 U CN 202222088606U CN 218241590 U CN218241590 U CN 218241590U
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Abstract
The utility model provides a multicore group porcelain capacitor frame and multicore group porcelain capacitor convenient to assembly, multicore group porcelain capacitor frame for assemble a plurality of capacitive chip, including parallel arrangement's two sheetmetals, the sheetmetal includes the sheetmetal body and sets up the end of drawing forth in sheetmetal body bottom, and the sheetmetal body includes a plurality of through-holes and elastic block. During the use, through the through-hole that forms on the sheetmetal body and set up wobbling elastic block in the through-hole, when the electric capacity chip of assembly is different batches or when different specifications, the elastic block can take place the end that micro-deformation blocked multicore group porcelain dielectric capacitor respectively, ensures electric capacity chip's welding quality to the structural design of this frame is simple, convenient assembling is swift, easily operation, welding uniformity are good, are fit for mass production.
Description
Technical Field
The utility model belongs to ceramic capacitor field is organized to the multicore, concretely relates to ceramic capacitor frame is organized to multicore convenient to assembly and ceramic capacitor is organized to multicore thereof.
Background
In the production process of the ceramic capacitor, a capacitor core needs to be welded with a metal support, but the existing capacitor frame cannot be well adapted to chips with various sizes. The thickness of the solder is about 0.1mm generally when the product is welded, and the length difference of the chips is difficult to compensate. At present, the common processing scheme is to use more solder paste for filling, but the use of the method easily causes poor welding quality, the situations of insufficient soldering and empty soldering occur, or the product has reduced plate bending capability due to excessive solder. And the existing frame structure is complex and difficult to assemble, so that the production efficiency is not high and the mass production is difficult.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming prior art's shortcoming, providing a simple structure, the multicore group porcelain capacitor frame and multicore group porcelain capacitor convenient to assembly that the practicality is strong.
The utility model adopts the following technical scheme:
the utility model provides a multicore group ceramic dielectric capacitor frame convenient to assembly for assemble a plurality of electric capacity chips, including parallel arrangement's two sheetmetals, the sheetmetal includes the sheetmetal body and sets up the end of drawing forth in sheetmetal body bottom, the sheetmetal body includes along a plurality of through-holes of vertical direction interval setting and can swing the elastic block that is used for fixed electric capacity chip in the through-hole of setting, the elastic block is formed with inside bellied joint portion, electric capacity chip card connects between two relative joint portions about.
Furthermore, the elastic block and the metal sheet are integrally formed.
Further, the elastic block is formed on the metal sheet through a stamping process.
Furthermore, the clamping part is semicircular.
Furthermore, the metal sheet is made of iron-nickel alloy.
Furthermore, the through-hole is the quad slit, is provided with two.
Furthermore, the leading-out end is L-shaped.
A multi-core group ceramic capacitor comprises a multi-core group ceramic capacitor frame and a plurality of capacitor chips which are arranged between two metal sheets at intervals from top to bottom.
It can be known from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are: through above-mentioned technical scheme, during the use, through the through-hole that forms on the sheetmetal body and the wobbling elastic block of setting in the through-hole, when the electric capacity chip of assembly is different batches or different specifications, the elastic block can take place to warp a little and block electric capacity chip end respectively, ensures electric capacity chip's welding quality.
Utilize the technical scheme of the utility model, can improve the efficiency of welding capacitor chip at to a great extent, compensate the not enough of traditional capacitor chip welding mode, utilize the elasticity piece on the sheetmetal body, the capacitor chip who is applicable to different length welds, and the structural design of sheetmetal is simple, be convenient for assemble, easily operation, welding uniformity are good, are fit for mass production.
Drawings
FIG. 1: a multi-core group ceramic capacitor frame convenient to assemble and a structural schematic diagram of a multi-core group ceramic capacitor are provided.
FIG. 2: a structure schematic diagram of a multi-core group ceramic capacitor frame convenient for assembly.
FIG. 3: a multi-core group ceramic capacitor frame convenient to assemble and a front view of a multi-core group ceramic capacitor are provided.
In the figure: 1-capacitor frame, 11-metal sheet, 12-metal sheet body, 13-leading-out terminal, 14-through hole, 15-elastic block, 16-clamping part and 2-capacitor chip.
Detailed Description
The present invention is further described below in the following with reference to specific embodiments.
The embodiment provides a multi-core group ceramic capacitor, which comprises a multi-core group ceramic capacitor frame 1 and a plurality of capacitor chips 2 welded in the capacitor frame 1, wherein the capacitor frame 1 comprises two metal sheets 11 arranged in parallel, and the plurality of capacitor chips 2 are arranged between the two metal sheets 11 at intervals from top to bottom.
The two metal sheets 11 are made of iron-nickel alloy and comprise metal sheet bodies 12 and leading-out ends 13 arranged at the bottoms of the metal sheet bodies 12, the leading-out ends 13 at the bottoms of the metal sheet bodies 12 are L-shaped, each metal sheet body 12 comprises two square through holes 14 arranged at intervals in the vertical direction and elastic blocks 15 which can be arranged in the square through holes 14 in a swinging mode and used for fixing the capacitor chips 2; specifically, the elastic block 15 is formed on the metal sheet 11 through a stamping process, and is integrally formed with the metal sheet 11; furthermore, the elastic block 15 is provided with a semicircular clamping part 16 which protrudes inwards, and the capacitor chip 2 is clamped between the two semicircular clamping parts 16 which are opposite to each other at the left and right; during the use, when the capacitor chip 2 of assembly is different batches or when different specifications, through setting up square through hole 14 and the elastic block 15 on sheetmetal body 12, assemble capacitor chip 2 between two sheetmetals 11, elastic block 15 can take place the micro-deformation and block two ends of capacitor chip 2 respectively this moment, is convenient for weld capacitor chip 2 to can ensure capacitor chip 2's welding quality.
To sum up, with the help of the above technical scheme of the utility model, through parallel arrangement's two sheetmetals 11, can fix capacitor chip 2 between two sheetmetals 11 when assembling different batches or the capacitor chip 2 of different specifications, be convenient for weld capacitor chip 2 and two sheetmetals 11's structural design is simple, convenient assembling is swift, easily operation, welding uniformity are good, are fit for mass production.
The above description is only a preferred embodiment of the present invention, and therefore the scope of the present invention should not be limited thereby, and all equivalent changes and modifications made within the scope of the claims and the specification should be considered within the scope of the present invention.
Claims (8)
1. The utility model provides a multicore group ceramic dielectric capacitor frame convenient to assembly for assemble a plurality of electric capacity chips, its characterized in that: the capacitor chip card comprises two metal sheets which are arranged in parallel, wherein each metal sheet comprises a metal sheet body and a leading-out end arranged at the bottom of the metal sheet body, the metal sheet body comprises a plurality of through holes which are arranged at intervals in the vertical direction and an elastic block which can be arranged in the through holes in a swinging mode and used for fixing the capacitor chip, the elastic block is provided with a clamping part protruding inwards, and the capacitor chip card is connected between two clamping parts which are opposite left and right.
2. An easily assembled multi-core ceramic capacitor frame as claimed in claim 1, wherein: the elastic block and the metal sheet are integrally formed.
3. An easily assembled multi-core ceramic capacitor frame as claimed in claim 2, wherein: the elastic block is formed on the metal sheet through a stamping process.
4. A multi-core ceramic capacitor frame for easy assembly as claimed in claim 1, wherein: the clamping part is semicircular.
5. An easily assembled multi-core ceramic capacitor frame as claimed in claim 1, wherein: the metal sheet is made of iron-nickel alloy.
6. A multi-core ceramic capacitor frame for easy assembly as claimed in claim 1, wherein: the through-hole is the quad slit, is provided with two.
7. An easily assembled multi-core ceramic capacitor frame as claimed in claim 1, wherein: the leading-out end is L-shaped.
8. A multi-core group ceramic dielectric capacitor is characterized in that: the capacitor frame of any one of claims 1 to 7 and a plurality of capacitor chips spaced one above the other between the two metal sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222088606.8U CN218241590U (en) | 2022-08-09 | 2022-08-09 | Multi-core group ceramic capacitor frame convenient to assemble and multi-core group ceramic capacitor thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222088606.8U CN218241590U (en) | 2022-08-09 | 2022-08-09 | Multi-core group ceramic capacitor frame convenient to assemble and multi-core group ceramic capacitor thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218241590U true CN218241590U (en) | 2023-01-06 |
Family
ID=84679064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222088606.8U Active CN218241590U (en) | 2022-08-09 | 2022-08-09 | Multi-core group ceramic capacitor frame convenient to assemble and multi-core group ceramic capacitor thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218241590U (en) |
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2022
- 2022-08-09 CN CN202222088606.8U patent/CN218241590U/en active Active
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