CN218218102U

CN218218102U - Radiator for power electronics

Info

Publication number: CN218218102U
Application number: CN202222153847.6U
Authority: CN
Inventors: 李影
Original assignee: Xinxin Energy Technology Development Tianjin Co ltd
Current assignee: Xinxin Energy Technology Development Tianjin Co ltd
Priority date: 2022-08-16
Filing date: 2022-08-16
Publication date: 2023-01-03
Anticipated expiration: 2032-08-16

Abstract

The utility model discloses a radiator for power electronics, the power electronic box comprises a box body I, the below of box I is connected with box two, box one inside is provided with heat dissipation mechanism, box two inside is provided with refrigerating mechanism, box two left sides have seted up recess one, the inside of recess is inlayed and is had the condenser, box one's right side is seted up recess two, the inside of recess two is inlayed and is had the exhaust fan, the electronic plate is installed in the left side of exhaust fan, install central processing unit on the electronic plate, heat dissipation mechanism is installed to central processing unit's top, fan two is installed in the left side of electronic plate, and then the gas of low temperature low pressure flows into box one, and then the last high temperature fin of heat dissipation mechanism, copper pipe and copper carry out the temperature exchange with low temperature air, make the central processing unit temperature of connecting on the copper descend, even consequently at hot weather, also can realize the reduction of central processing unit temperature, make the speed of equipment operation faster.

Description

Radiator for power electronics

Technical Field

The utility model relates to a radiator technical field, concretely relates to radiator for power electronics.

Background

The air-cooled heat dissipation mechanism has the advantages of simplicity, reliability, low price and the like, and is widely applied to the field of power electronic heat dissipation. But with the rapid development of industries such as big data, internet of things and the like, the power consumption of hardware integrated circuits is getting bigger and bigger, the heat productivity and the heat flux density are also getting bigger and bigger, the heat dissipation capability of traditional air-cooled heat dissipation mechanisms such as heat pipe heat dissipation mechanisms and temperature equalization plates is getting harder to meet the demands, especially in hot summer, the high temperature of air cannot meet the good heat dissipation of fans to heat pipe heat dissipation mechanisms and temperature equalization plates, and meanwhile, when fixing a heat dissipation device on a central processing unit in the existing equipment, a fixing device needs to be installed, and a bolt thread needs to be installed for fixing, so that the operation is inconvenient, and a screw is easy to screw.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above technical problem, an object of the present invention is to provide a heat sink for power electronics, which solves the problems in the background.

The purpose of the utility model can be realized by the following technical scheme:

a radiator for power electronics comprises a first box body, a second box body is connected below the first box body, a heat dissipation mechanism is arranged inside the first box body, a refrigeration mechanism is arranged inside the second box body, a first groove is formed in the left side of the second box body, a condenser is embedded in the first groove, a first fan, a compressor and a liquid storage device are sequentially arranged on the left side of the condenser, a second groove is formed in the right side of the first box body, an exhaust fan is embedded in the second groove, an electronic board is installed on the left side of the exhaust fan, a central processing unit is installed on the electronic board, fixing blocks are installed on two sides of the central processing unit, the heat dissipation mechanism is installed above the central processing unit, a second fan is installed on the left side of the electronic board, and an evaporator is connected on the left side of the second fan, the left side of evaporimeter is connected with the drain pipe, the drain pipe is provided with the outlet, air intake and air exit, the outlet of drain pipe runs through one side of box one, air intake connection is in the left side of evaporimeter, refrigerating mechanism includes the compressor, the exit end of compressor is connected with pipeline one end, the entrance point of condenser is connected to the other end of pipeline one, the one end of the exit end connecting tube two of condenser, the other end of pipeline two runs through box one bottom and connects the entrance point of evaporimeter, the one end that pipeline two are close to the evaporimeter is provided with the flow controller, the one end of the exit end connecting tube three of evaporimeter, the other end of pipeline three runs through box one bottom and connects the entrance point of reservoir, the entrance point of compressor is connected to the exit end of reservoir.

As a further aspect of the present invention: the heat dissipation mechanism comprises a copper plate, a heat dissipation copper pipe and fins, wherein cooling liquid is filled in the heat dissipation copper pipe, the inner surface of the copper pipe is provided with a powder sintering wall, the copper plate is connected below the heat dissipation copper pipe, and the fins are connected above the copper pipe.

As a further aspect of the present invention: the two sides of the exhaust fan, the first fan and the second fan are all provided with a screen plate.

As a further aspect of the present invention: the right side of the first box body is provided with a first box door, and the right side of the first box body is provided with a second box door.

As a further aspect of the present invention: the inner pipeline of the throttler is arranged to be a thin pipe smaller than the second pipeline.

As a further aspect of the present invention: the fixed block includes spring and telescopic link, and the one end and the spring one end of telescopic link are connected, and the other end of telescopic link runs through fixed block one side.

As a further aspect of the present invention: the liquid in the liquid storage device is Freon.

The utility model has the advantages that: through setting up refrigeration mechanism, through the compressor to the gas compression of high temperature low pressure, then the high temperature high pressure gas after the compression flows into the condenser from the pipeline one, through the inside liquid cooling of fan a pair of condenser, make the low temperature high pressure gas flow into the flow controller on the pipeline two after the cooling, the gas that goes out the tubule from the flow controller inside becomes low temperature low pressure gas, then low temperature low pressure gas flows into the evaporimeter from the pipeline two, and then low temperature low pressure gas flows into box one, and then high temperature fin, copper pipe and copper on the heat dissipation mechanism carry out temperature exchange with low temperature air, make the central processing unit temperature of connecting on the copper descend, even in hot weather, also can realize the reduction of central processing unit temperature, make the speed of equipment operation faster.

Through promoting the telescopic link on the fixed block, place heat dissipation mechanism and go, then telescopic link on the fixed block passes through the inside spring and resumes, then promotes the telescopic link, and then fixes heat dissipation mechanism, is favorable to heat dissipation mechanism convenient to install and dismantles, makes assembly staff efficiency accelerate, consuming time and wasting power.

Drawings

The present invention will be further described with reference to the accompanying drawings.

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an enlarged schematic view of the area A of FIG. 1;

fig. 3 is a schematic sectional view of the reservoir according to the present invention;

fig. 4 is an enlarged schematic view of the region B of fig. 1.

In the figure: 1. a first box body; 2. a second box body; 3. a condenser; 4. a compressor; 5. a reservoir; 6. an exhaust fan; 7. a fixed block; 8. a heat dissipation mechanism; 9. a second fan; 10. an evaporator; 11. a first pipeline; 12. a water discharge port; 13. an air inlet; 14. an air outlet; 15. a second pipeline; 16. a restrictor; 17. a third pipeline; 18. and a first fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

As shown in figures 1-4, a radiator for power electronics comprises a first box body 1, a second box body 2 is connected below the first box body 1, a heat dissipation mechanism 8 is arranged inside the first box body 1, a refrigeration mechanism is arranged inside the second box body 2, a first groove is formed in the left side of the second box body 2, a condenser 3 is embedded inside the first groove, a first fan 18, a compressor 4 and a liquid storage device 5 are sequentially arranged on the left side of the condenser 3, a second groove is formed in the right side of the first box body 1, an exhaust fan 6 is embedded inside the second groove, an electronic board is arranged on the left side of the exhaust fan 6, a central processing unit is arranged on the electronic board, fixed blocks 7 are arranged on two sides of the central processing unit, the heat dissipation mechanism 8 is arranged above the central processing unit, a second fan 9 is arranged on the left side of the electronic board, and an evaporator 10 is connected on the left side of the second fan 9, the left side of evaporimeter 10 is connected with the drain pipe, the drain pipe is provided with outlet 12, air intake 13 and air exit 14, the outlet 12 of drain pipe runs through one side of box 1, air intake 13 is connected in the left side of evaporimeter 10, refrigerating mechanism includes compressor 4, the exit end of compressor 4 is connected with the one end of pipeline 11, the entrance point of condenser 3 is connected to the other end of pipeline 11, the one end of second 15 of outlet end connecting tube way of condenser 3, the other end of pipeline two 15 runs through box 1 bottom and connects the entrance point of evaporimeter 10, the one end that pipeline two 15 is close to evaporimeter 10 is provided with flow controller 16, the one end of three 17 of outlet end connecting tube way of evaporimeter 10, the other end of three 17 runs through box 1 bottom and connects the entrance point of reservoir 5, the entrance point of compressor 4 is connected to the exit end of reservoir 5.

The heat dissipation mechanism 8 comprises a copper plate, a heat dissipation copper pipe and fins, cooling liquid is filled in the heat dissipation copper pipe, a first box door is installed on the right side of a second box body 2, a second box door is installed on the right side of the first box body 1, the inner surface of the copper pipe is set to be a powder sintering wall, the copper plate is connected below the heat dissipation copper pipe, the fins are connected above the copper pipe, the exhaust fan 6, the mesh plates are installed on two sides of the first box body 18 and the second box body 9, when the temperature of the central processing unit is too high, the heat of the central processing unit can be absorbed by the low-temperature copper plate to achieve temperature balance, the temperature flows to the low-temperature copper pipe and the low-temperature fins connected to the copper plate to achieve temperature balance, at the moment, the heat absorbed by the condensing agent in the copper pipe becomes gaseous state and rises to the top of the copper pipe, the gaseous state exhaust fan 6 can be changed into liquid state to be slowly reserved from the powder sintering wall in the copper pipe when the low temperature is exchanged with the copper pipe, then, the temperature is reduced to the bottom of the copper pipe, the exhaust fan 6, the fan 18 and the fan 9, the mesh plates are installed on two sides of the first box body 18 and the second box body 9, dust can be prevented, when the cooling mechanism and the cooling mechanism is closed, the cooling air can be discharged from the inside of the first box door, and the outside, the first box body, the first box door, the first box body, the heat dissipation mechanism can be prevented, and the heat dissipation mechanism, and the outside, and the heat can be prevented, and the outside of the first box body can be discharged when the first box body, and the first box body can be prevented, and the outside.

The inner pipeline of the throttleer 16 is set to be a thin pipe smaller than the second pipeline, high-temperature and low-pressure gas is compressed through the compressor 4, then the compressed high-temperature and high-pressure gas flows into the condenser 3 from the first pipeline 11, liquid in the condenser 3 is cooled through the first fan 18, the cooled low-temperature and high-pressure gas flows into the throttleer 16 on the second pipeline 15, the gas coming out of the thin pipe in the throttleer 16 becomes low-temperature and low-pressure gas, then the low-temperature and low-pressure gas flows into the evaporator 10 from the second pipeline 15, and further heat in the low-temperature and low-pressure gas absorption box body 1 becomes low-temperature and low-pressure gas, so that the key effect of reducing the pressure of the gas is achieved.

7 springs of fixed block and telescopic link, the one end and the spring one end of telescopic link are connected, the other end of telescopic link runs through 7 one sides of fixed block, through promoting the telescopic link on the fixed block 7, place heat dissipation mechanism 8 and go, then telescopic link on the fixed block 7 resumes through inside spring, then promote the telescopic link, and then it is fixed to heat dissipation mechanism 8, be favorable to heat dissipation mechanism 8 to be convenient for the installation dismantlement, make assembly staff efficiency accelerate, labour saving and time saving.

The first pipeline 11, the second pipeline 15, the copper plate, the copper pipe, the fins, the evaporator 10 and the condenser 3 are made of copper materials, the copper materials are good in heat conductivity, heat absorption is fast, heat dissipation is fast, and if some systems need to absorb or dissipate a large amount of heat in use, good heat dissipation of a central processing unit is facilitated.

The liquid in the liquid storage device 5 is set to be freon, the freon is gas or liquid generally at normal temperature, and the freon is transparent, low in dielectric constant, high in critical temperature and easy to liquefy, is favorable for being used for the refrigerating mechanism, and enables the refrigerating efficiency to be higher.

The utility model discloses a theory of operation: the high-temperature low-pressure gas is compressed by the compressor 4, the compressed high-temperature high-pressure gas flows into the condenser 3 from the first pipeline 11, the liquid in the condenser 3 is cooled by the first fan 18, the cooled low-temperature high-pressure gas flows into the throttler 16 on the second pipeline 15, the gas coming out of the narrow tube in the throttler 16 is changed into low-temperature low-pressure gas, the low-temperature low-pressure gas flows into the evaporator 10 from the second pipeline 15, the low-temperature low-pressure gas absorbs the heat in the first box 1 and is changed into low-temperature low-pressure gas, the low-temperature low-pressure gas and the low-temperature low-pressure liquid flow into the liquid storage agent from the third pipeline 17, the low-temperature low-pressure liquid is stored in the liquid storage device 5, the low-temperature low-pressure gas flows into the compressor 4 from the pipeline in the liquid storage device 5, the heat dissipation mechanism 8 is placed by pushing the telescopic rod on the fixing block 7, and then the telescopic rod on the fixing block 7 is restored by the internal spring, then the telescopic rod is pushed, and then the heat dissipation mechanism 8 is fixed, when the temperature of the central processing unit is overhigh, the heat of the central processing unit can be absorbed by the low-temperature copper plate so as to reach the temperature balance, then the temperature flows to the low-temperature copper pipe and the low-temperature fins connected on the copper plate so as to reach the temperature balance, at the moment, the condensing agent in the copper pipe absorbs the heat and turns into gas state to rise to the top of the copper pipe, the gas state condensing agent turns into liquid state when meeting the low-temperature fins and slowly stays from the powder sintering wall in the copper pipe, then the gas state exchanges temperature with the copper pipe so as to reduce the temperature to flow to the bottom of the copper pipe, the exhaust fan 6, the first fan 18 and the second fan 9 are provided with the screen plates on both sides, when the cooling mechanism and the heat dissipation mechanism 8 work, the first box door and the second box door are closed so as to prevent the inside cold air from dissipating out, and the cold air from the exhaust outlet 14 and the heat dissipated by the heat dissipation mechanism 8 reach the temperature balance, and then exhaust fan 6 discharges the inside high-temperature gas outside box 1, can prevent outside dust from getting into inside when chamber door one and chamber door two are closed simultaneously, makes inside clean and tidy.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Although an embodiment of the present invention has been described in detail, the description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. The utility model provides a radiator for power electronics, includes box (1), its characterized in that, the below of box (1) is connected with box two (2), box (1) inside is provided with heat dissipation mechanism (8), box two (2) inside is provided with refrigerating mechanism, box two (2) left side is seted up recess one, recess one inside is inlayed and is had condenser (3), the left side that is located condenser (3) has set gradually fan one (18), compressor (4) and reservoir (5), recess two has been seted up on the right side of box (1), the inside of recess two is inlayed and is had exhaust fan (6), the electronic plate is installed in the left side of exhaust fan (6), install central processing unit on the electronic plate, the both sides of central processing unit are provided with fixed block (7), heat dissipation mechanism (8) is installed to the top of central processing unit, fan two (9) are installed in the left side of electronic plate, the left side of fan two (9) is connected with evaporimeter (10), the left side of evaporimeter (10) is connected with the drain pipe, the drain pipe is provided with air intake (12), drain outlet (13) and exhaust outlet (14) are connected in the left side of box (1), evaporimeter (10), refrigerating mechanism includes compressor (4), the exit end of compressor (4) is connected with the one end of pipeline (11), the entrance point of condenser (3) is connected to the other end of pipeline (11), the one end of the exit end connecting tube two (15) of condenser (3), the other end of pipeline two (15) runs through box (1) bottom and connects the entrance point of evaporimeter (10), the one end that pipeline two (15) are close evaporimeter (10) is provided with flow controller (16), the one end of the exit end connecting tube three (17) of evaporimeter (10), the other end of pipeline three (17) runs through box (1) bottom and connects the entrance point of reservoir (5), the entrance point of compressor (4) is connected to the exit end of reservoir (5).

2. The heat radiator for power electronics according to claim 1, wherein the heat radiating mechanism (8) is located above the central processing unit, the heat radiating mechanism (8) comprises a copper plate, a heat radiating copper pipe and fins, the heat radiating copper pipe is filled with cooling liquid, the inner surface of the copper pipe is provided with a powder sintering wall, the copper plate is connected below the heat radiating copper pipe, and the fins are connected above the copper pipe.

3. The heat sink for power electronics as claimed in claim 1, wherein screens are mounted on both sides of the exhaust fan (6), the first fan (18) and the second fan (9).

4. The heat radiator for power electronics as claimed in claim 1, wherein a first box door is installed on the right side of the second box body (2), and a second box door is installed on the right side of the first box body (1).

5. A heat sink for power electronics according to claim 1, characterised in that the inner pipe of the flow restrictor (16) is provided as a thin tube smaller than the second pipe.

6. The heat sink for power electronics as claimed in claim 1, wherein the fixed block (7) comprises a spring and a telescopic rod, one end of the telescopic rod is connected with one end of the spring, and the other end of the telescopic rod penetrates through one side of the fixed block (7).

7. The heat sink for power electronics as claimed in claim 1, wherein the first pipe (11), the second pipe (15), the copper plate, the copper pipe, the fins, the evaporator (10) and the condenser (3) are made of copper materials.

8. A heat sink for power electronics according to claim 1, characterised in that the liquid inside the reservoir (5) is freon.