CN218217795U - Laminated circuit board for elevator and elevator control cabinet thereof - Google Patents

Abstract

The application relates to the technical field of elevator control, in particular to a laminated circuit board for an elevator and an elevator control cabinet thereof. A laminated circuit board for an elevator comprises a first board and a second board, wherein the first board and the second board are oppositely arranged to form an accommodating space for arrangement of electronic elements, the accommodating space is provided with an isolating layer for isolating high voltage and/or electromagnetic interference between the first board and the second board, the isolating layer separates the accommodating space and forms at least two mutually isolated installation areas in the horizontal direction, and mutually interfered electronic elements are respectively arranged in different installation areas separated by the isolating layer. An elevator control cabinet comprises a laminated circuit board for an elevator. The application has the advantages that: the first plate and the second plate can be arranged as close as possible, so that the distance between the first plate and the second plate of the lamination is reduced, and the structural size and the space required by installation of the laminated circuit board for the elevator are reduced.

Description

Laminated circuit board for elevator and elevator control cabinet thereof

Technical Field

The application relates to the technical field of elevator control, in particular to a laminated circuit board for an elevator and an elevator control cabinet thereof.

Background

In the field of elevator control, there is an increasing demand for miniaturization of the size of control cabinets, especially in villa elevators and without machine rooms. Among them, lamination of circuit boards is a conventional method. But the circuit boards often have high voltage of more than 500V; and because of the existence of the switching power supply, can produce very large electromagnetic interference; thereby affecting the transmission of the signal; in view of the above, the circuit board has to be pulled by a large distance when being laminated; the distance is increased, which causes space waste and is not favorable for miniaturization of the control cabinet.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need for a laminated circuit board for an elevator and a control cabinet thereof, which can reduce interference and reduce the distance between the laminated layers.

In order to solve the technical problems, the following technical scheme is provided:

a laminated circuit board for an elevator comprises a first board and a second board, wherein the first board and the second board are oppositely arranged to form an accommodating space for arranging electronic components, the laminated circuit board is characterized in that the accommodating space is provided with an isolating layer for isolating high voltage and/or electromagnetic interference between the first board and the second board, the isolating layer separates the accommodating space and forms at least two mutually isolated installation areas in the horizontal direction, and the electronic components with mutual interference are respectively arranged in different installation areas separated by the isolating layer.

In this application, through setting up the isolation layer, the isolation layer has high pressure and/or electromagnetic interference and cuts off the function to keep apart the accommodation space into two installation regions that keep apart each other, the electronic component that has the interference each other arranges different installation regions respectively, in order to avoid high pressure and/or electromagnetic signal to influence the normal work of other parts. Therefore, the first plate and the second plate can be arranged close to each other as much as possible, so that the distance between the first plate and the second plate of the laminated circuit board for the elevator is reduced, and the structural size and the space required by installation of the laminated circuit board for the elevator are reduced.

In one embodiment, the isolation layer includes at least one of an insulation layer resistant to high voltage and a shielding layer resistant to electromagnetic interference.

In one embodiment, the electronic components interfering with each other include a first electronic component, a second electronic component, and the mounting region includes a first region and a second region, the first electronic component is located in the first region and mounted to the first board, and the second electronic component is located in the second region and mounted to the second board;

the isolation layer comprises a first insulation layer and an electromagnetic shielding layer; the first insulating layer is at least provided into two layers; the isolation layer comprises a first insulating layer and an electromagnetic shielding layer; the first insulating layer is at least provided into two layers; one layer of the first insulating layer is arranged on one surface, facing the second plate, of the first plate and covers the first electronic element, and the other layer of the first insulating layer is arranged on one surface, facing the second plate, of the second plate and covers the second electronic element;

the electromagnetic shielding layer is arranged between the two first insulating layers and is attached to the first insulating layers.

In one embodiment, the electronic element further comprises a third electronic element, and the third electronic element is not interfered with the first electronic element and the second electronic element;

the isolation layer is provided with an exposed area, and the third electronic element is mounted on the first board and/or the second board and can be exposed from the exposed area. The exposed area can be an exposed hole formed on the isolation layer, or a gap structure formed on the edge of the isolation layer.

In one embodiment, the surface area of the first insulating layer is greater than the surface area of the first plate or the second plate.

It will be appreciated that the first insulating layer may be enabled to cover the first plate and/or the second plate entirely to improve the reliability of the insulation between the first plate and the second plate.

In one embodiment, a conductive member is connected to the electromagnetic shielding layer, and one end of the conductive member, which is far away from the electromagnetic shielding layer, is grounded.

It can be understood that the electromagnetic shielding effect can be better realized by arranging the conductive piece and grounding one end of the conductive piece; moreover, after the distance between the first plate and the second plate is reduced, the electromagnetic shielding layer is closer to an interference source; thus, in addition to isolating interference from the first and second plates, external electromagnetic radiation can also be coupled with the third pair.

In one embodiment, the first insulating layer comprises a PC layer or a PET layer;

and/or the electromagnetic shielding layer comprises a copper layer, an aluminum layer or a tin layer.

It can be understood that the PC layer or the PET layer has flame retardant effect and high pressure resistance (the pressure resistance value can reach 2000V), so that multiple functions can be realized; and also has high strength and is not easy to be punctured.

In one embodiment, the electromagnetic shielding layer includes a copper layer, an aluminum layer, or a tin layer.

In one embodiment, the number of the first insulating layers is at least three, and at least one electromagnetic shielding layer is arranged between two adjacent first insulating layers.

It will be appreciated that by providing at least three layers of the first insulating layer, a multi-layer protection can be formed between the first and second sheets to further enhance the insulating effect.

In one embodiment, the electromagnetic shielding layer of each layer is made of different materials.

It can be understood that the electromagnetic shielding layers of each layer are made of different materials, so that interference signals with different frequencies can be shielded, and the shielding effect is further improved.

In one embodiment, a second insulating layer is arranged on one side of the first plate, which is opposite to the second plate; and/or the second insulating layer is arranged on one side surface of the second plate, which is away from the first plate.

It will be appreciated that by providing a second insulating layer, the first and/or second plates may be mounted directly on the structural member, further reducing the space occupied by the present application.

In one embodiment, the first electronic component is offset from the second electronic component in a direction parallel to the first or second board.

It can be understood that the staggered arrangement of the high-low components is realized in the direction perpendicular to the first board or the second board by arranging the first electronic element and the second electronic element in a staggered manner; and the distance between the first and second plates need only be preserved to match the highest electronic component; thus, the laminated circuit board for the elevator can be minimized when the assembling condition is satisfied.

In one embodiment, the laminated circuit board for the elevator further comprises a conductive connecting piece; the conductive connecting piece is used for connecting the first plate with the second plate, penetrates through the first insulating layer and the electromagnetic shielding layer, and is in contact with the electromagnetic shielding layer.

It will be appreciated that the conductive connector is connected to the electromagnetic shielding layer to conduct the electromagnetic signal out of the electromagnetic shielding layer, thereby further enhancing the shielding effect.

The application also provides the following technical scheme:

an elevator control cabinet comprises a laminated circuit board for an elevator.

Compared with the prior art, the laminated circuit board for the elevator is provided with the isolation layer which has the function of isolating high voltage and/or electromagnetic interference, so that the accommodating space is isolated into two mutually isolated installation areas, and mutually interfered electronic elements are respectively arranged in different installation areas, so that the influence of high voltage and/or electromagnetic signals on the normal work of other parts is avoided. Therefore, the first plate and the second plate can be arranged close to each other as much as possible, so that the distance between the first plate and the second plate of the laminated circuit board for the elevator is reduced, and the structural size and the space required by installation of the laminated circuit board for the elevator are reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic perspective view of a laminated circuit board for an elevator according to the present application.

Fig. 2 is a side view of the laminated circuit board for an elevator provided by the present application from a perspective.

Fig. 3 is another perspective side view of the laminated circuit board for an elevator provided by the present application.

Fig. 4 is an exploded view of a laminated circuit board for an elevator according to the present application.

Fig. 5 is an exploded view of another perspective view of the laminated circuit board for an elevator provided by the present application.

Reference numerals: 100. a laminated circuit board for an elevator; 101. an accommodating space; 102. an installation area; 102a, a first area; 102b, a second area; 10. a first plate; 20. a second plate; 30. an isolation layer; 31. a first insulating layer; 32. an electromagnetic shielding layer; 321. a conductive member; 33. exposing the area; 40. an electronic component; 41. a first electronic component; 42. a second electronic element; 43. a third electronic component; 50. a conductive connection member.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms and should not be construed as limited to the embodiments set forth herein.

It will be understood that when an element is referred to as being "secured to" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The use of the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like in the description of the present application is for purposes of illustration only and is not intended to represent the only embodiment.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact via an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the description of this application, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, the present application provides a laminated circuit board 100 for an elevator, which is used for outputting various signals to control the normal operation of the elevator 100.

The laminated circuit board 100 for the elevator comprises a first board 10, a second board 20, and an accommodating space 101 which is oppositely arranged between the first board 10 and the second board 20 and can be used for arranging the electronic element 40, wherein the accommodating space 101 is provided with an isolating layer 30 for isolating high voltage and/or electromagnetic interference between the first board 10 and the second board 20, the isolating layer 30 divides the accommodating space 101 and forms at least two mutually isolated installation areas 102 in the horizontal direction, and mutually interfered electronic elements are respectively arranged in different installation areas 102 which are separated by the isolating layer 30. In this way, the influence of high voltage and/or electromagnetic signals on the normal operation of other components is avoided, and under the arrangement, the first board 10 and the second board 20 can be arranged close to each other as much as possible, so that the distance between the first board 10 and the second board 20 of the laminated layer is reduced, and the structural size and the space required for installation of the laminated circuit board 100 for the elevator are reduced. The isolation layer 30 includes at least one of an insulation layer resistant to high voltage and a shielding layer resistant to electromagnetic interference. That is, when the isolation layer 30 is provided as an insulation layer against high voltage, it can prevent the high voltage of the electronic component 40 from affecting the normal operation of other components; when the isolation layer 30 is configured as a shielding layer against electromagnetic interference, it can prevent electromagnetic signals of the electronic component 40 from affecting normal operations of other components. When the isolation layer 30 is a combination of a high voltage-resistant insulating layer and an electromagnetic interference-resistant shielding layer, it can prevent the high voltage of the electronic component 40 and the electromagnetic signal from affecting the normal operation of other components. In this embodiment, the isolation layer 30 is provided as a combination of an insulating layer resistant to high voltage and a shielding layer resistant to electromagnetic interference.

Specifically, in one embodiment, the electronic components 40 interfering with each other include a first electronic component 41 and a second electronic component 42, the mounting region 102 includes a first region 102a and a second region 102b, the first electronic component 41 is located in the first region 102a and mounted on the first board 10, and the second electronic component 42 is located in the second region 102b and mounted on the second board 20; the isolation layer 30 includes a first insulating layer 31 and an electromagnetic shielding layer 32; the first insulating layer 31 is provided in at least two layers; wherein, one layer of the first insulating layer 31 is disposed on a surface of the first board 10 facing the second board 20 and covers the first electronic element 41; wherein a further layer of a first insulating layer 31 is present on the side of the first plate 10 facing the second plate 20 and covers the second electronic component 42. The electromagnetic shielding layer 32 is disposed between the two first insulating layers 31, and is attached to the first insulating layers 31. In this way, the first insulating layer 31 blocks a high voltage or a component which is easily caused to conduct and exists between the first electronic component 41 and the second electronic component 42 which have interference with each other; the electromagnetic signal between the first board 10 and the second board 20 is shielded by the electromagnetic shielding layer 32, so as to prevent the electromagnetic signal from affecting the normal operation of other components. In this way, the first board 10 and the second board 20 can be disposed as close as possible, and the distance between the first board 10 and the second board 20 of the laminate can be reduced, thereby reducing the size of the laminated circuit board 100 for an elevator and the space required for installation.

As shown in fig. 2 and 3, the first plate 10 has a flat plate shape. The second plate 20 is also flat, and the second plate 20 is disposed in parallel with the first plate 10. Of course, in other embodiments, the shape of the first plate 10 may be determined according to actual circumstances; similarly, the shape of the second plate 20 may be determined according to actual conditions. Therefore, it will not be described herein.

In one embodiment, the first electronic component 41 and the second electronic component 42 are arranged in a staggered manner along a direction parallel to the first board 10 or the second board 20. In this way, in the direction perpendicular to the first board 10 or the second board 20, the staggered arrangement of the high and low components between the first electronic component 41 and the second electronic component 42 can be realized; also, the distance between the first board 10 and the second board 20 only needs to be maintained to match the highest electronic component; in this way, the laminated circuit board 100 for an elevator can be minimized while satisfying the assembly conditions.

Illustratively, as shown in fig. 2, the first electronic component 41 has a height h1 in a direction perpendicular to the first board 10, and the second electronic component 42 has a height h2 in the direction perpendicular to the first board 10. H1 is preset to be larger than h2. At this time, the first electronic component 41 is the highest part, and after it is mounted with the second electronic component 42 being misaligned, the distance between the first board 10 and the second board 20 only needs to be maintained to a height that can fit the first electronic component 41. At the same time, the first insulating layer 31 also covers the first electronic component 41, i.e. the first electronic component 41 is separated from the second board 20 by the first insulating layer 31. That is, in the presence of the first insulating layer 31, the first electronic component 41 abuts on the second board 20 through the first insulating layer 31, thereby achieving seamless lamination between the first board 10 and the second board 20, and superposition in space.

The first electronic component 41 includes, but is not limited to, an inductor, a transformer, and the like. The second electronic component 42 includes, but is not limited to, an inductor, a transformer, and the like. In the present embodiment, the first electronic component 41 includes a relay, an inductor, and the like; the second electronic component 42 includes a relay, a transformer, and the like.

Further, the electronic component 40 further includes a third electronic component 43, the third electronic component 43 is located in the accommodating space 101, and the third electronic component 43 is configured as an interference-free component; the isolation layer 30 has an exposed region 33, and the third electronic component 43 is mounted on the first board 10 and/or the second board 20 and can be exposed from the exposed region 33. At this time, since the third electronic element 43 is a non-interference component, that is, the existence of the third electronic element 43 does not affect the normal operation of other components, the isolation layer 30 does not need to shield the third electronic element 43, and the layout of the isolation layer in the space of the accommodating space 101 may be set according to the actual situation and the requirement of ensuring the minimum distance between the first board 10 and the second board 20.

Specifically, the third electronic element 43 may be configured as a relay, a sensor, or the like. In one embodiment, the surface area of the isolation layer 30 is greater than the surface area of the first plate 10 or the second plate 20. This may enable the insulating layer 30 to entirely cover the first plate 10 and/or the second plate 20 to improve the reliability of insulation and compression resistance between the first plate 10 and the second plate 20.

In an embodiment, the exposed region 33 may be an exposed hole formed on the isolation layer 30, or a notch structure formed on an edge of the isolation layer 30. In the present embodiment, the exposure region 33 is configured as an exposure hole opened on the isolation layer 30.

As shown in fig. 4 or 5, the spacer layer 30 is provided in a folded configuration. The folded isolation layer 30 divides the accommodating space 101 into two installation areas 102 isolated from each other. At the same time, the folded isolation layer 30 may also maximize the space within the mounting area 102, thereby facilitating the mounting of some electronic components that are tall and require isolation, such as transformers and the like.

Specifically, the isolation layer 30 is provided in a zigzag or other desired shape. A part of the isolation layer 30, the first plate 10 and the second plate 20 enclose a first region 102a; a portion of the isolation layer 30 encloses the second area 102b with the first plate 10 and the second plate 20.

In one embodiment, the first insulating layer 31 comprises a PC layer or a PET layer. It can be understood that the PC layer or the PET layer has a flame retardant effect and high pressure resistance (the pressure resistance value can reach 2000V), so that multiple functions can be realized; and also has high strength and is not easy to be punctured. Of course, in other embodiments, the first insulating layer 31 may also be provided as another material layer as long as it has an insulating function.

In an embodiment, in a case where the electronic components between the first board 10 and the second board 20 do not collide, the first insulating layer 31 may be directly attached on the first board 10 and the second board 20 and cover the corresponding electronic components, thereby implementing seamless lamination.

As shown in fig. 2 to 5, the electromagnetic shielding layer 32 includes any one of a copper layer, an aluminum layer, a tin layer, and a steel layer. The electromagnetic shielding layer 32 is disposed in a lattice shape.

In one embodiment, a conductive member 321 is connected to the electromagnetic shielding layer 32, and an end of the conductive member 321 away from the electromagnetic shielding layer 32 is grounded. Thereby better realizing the electromagnetic shielding effect; furthermore, after the distance between the first plate 10 and the second plate 20 is reduced, the electromagnetic shielding layer 32 is closer to the interference source; in this way, in addition to the interference with the first plate 10 and the second plate 20, the electromagnetic radiation to the outside can be reduced.

Conductors 321 may illustratively be metal conductors or may be configured as non-metal conductors. The metal conductive member may be a copper wire, an aluminum wire, or the like. The nonmetal conductive piece can be a graphene conductive piece, a silicon conductive piece and the like. It is not exemplified here as long as electrical conduction can be achieved.

In the present embodiment, the electromagnetic shielding layer 32 is configured as a copper foil or an aluminum foil, so that the electromagnetic shielding layer 32 has better flexibility and ductility.

In one embodiment, the number of the first insulating layers 31 is at least three, and at least one electromagnetic shielding layer 32 is disposed between two adjacent first insulating layers 31. It will be appreciated that by providing at least three layers of the first insulating layer 31, a multi-layer protection can be formed between the first plate 10 and the second plate 20 to further enhance the insulating effect.

Preferably, the material of the electromagnetic shielding layer 32 is different for each layer. It is understood that the electromagnetic shielding layer 32 of each layer is made of different materials, so that various interference signals with different frequencies can be shielded, and the shielding effect is further improved.

For example, one of the electromagnetic shielding layers 32 is provided as a copper layer and the other electromagnetic shielding layer 32 is provided as an aluminum layer. As another example, one of the electromagnetic shielding layers 32 may be provided as a copper layer, another of the electromagnetic shielding layers 32 may be provided as a tin layer, and so forth. The details are not exemplified here.

In an embodiment, a second insulating layer (not shown) is provided on a side of the first plate 10 facing away from the second plate 20; and/or a second insulating layer is arranged on one side of the second plate 20, which faces away from the first plate 10. Thus, the insulation strength between the circuit board and the structural member can be increased, so that the first board 10 and/or the second board 20 can be directly mounted on the structural member to compress the space occupied by the application, i.e., reduce the space occupation rate of the application, and make the application compact. Here, the structural member may be a cabinet body of a control cabinet or a mounting plate in the control cabinet, or the like.

Preferably, the second insulating layer (not shown) may have the same structure as or different structure from the first insulating layer 31. In the present embodiment, the second insulating layer includes a PC layer or a PET layer or the like.

As shown in fig. 2 to 5, the laminated circuit board 100 for an elevator further includes a conductive connecting member 50, wherein the conductive connecting member 50 is used for connecting the first board 10 and the second board 20, penetrates through the first insulating layer 31 and the electromagnetic shielding layer 32, and is in contact with the electromagnetic shielding layer 32. In this way, the presence of the conductive connecting member 50 can connect the electromagnetic shielding layer 32 with the conductive connecting member 50, so as to lead out the electromagnetic signal on the electromagnetic shielding layer 32, thereby further enhancing the shielding effect.

Preferably, the conductive connection member 50 is provided as a metal member, which may be a copper connection post, an aluminum connection post, or the like.

The present application also provides a control cabinet for an elevator, which includes a cabinet body (not shown) in which the laminated circuit board 100 for an elevator is installed.

In one implementation, the cabinet may be a metal cabinet or a plastic cabinet. The end of the conductive member 321 away from the electromagnetic shielding layer 32 is connected to the cabinet, so as to achieve grounding.

All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not to be construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims (10)

1. A laminated circuit board for an elevator comprises a first board and a second board, wherein the first board and the second board are oppositely arranged to form an accommodating space for arranging electronic components, the laminated circuit board is characterized in that the accommodating space is provided with an isolating layer for isolating high voltage and/or electromagnetic interference between the first board and the second board, the isolating layer separates the accommodating space and forms at least two mutually isolated installation areas in the horizontal direction, and the electronic components with mutual interference are respectively arranged in different installation areas separated by the isolating layer.

2. The laminated circuit board for an elevator according to claim 1, wherein the insulation layer comprises at least one of an insulation layer resistant to high voltage and a shielding layer resistant to electromagnetic interference.

3. The laminated circuit board for an elevator according to claim 1, wherein the electronic components interfering with each other include a first electronic component and a second electronic component, and the mounting area includes a first area in which the first electronic component is located and mounted to the first board and a second area in which the second electronic component is located and mounted to the second board;

the isolation layer comprises a first insulating layer and an electromagnetic shielding layer; the first insulating layer is at least provided into two layers; one layer of the first insulating layer is arranged on one surface, facing the second plate, of the first plate and covers the first electronic element, and the other layer of the first insulating layer is arranged on one surface, facing the second plate, of the second plate and covers the second electronic element;

the electromagnetic shielding layer is arranged between the two first insulating layers and is attached to the first insulating layers.

4. The laminated circuit board for an elevator according to claim 3, wherein the electronic component further comprises a third electronic component, and the third electronic component does not interfere with the first electronic component and the second electronic component;

the isolation layer is provided with an exposed area, and the third electronic element is mounted on the first plate and/or the second plate and can be exposed from the exposed area.

5. The laminated circuit board for an elevator according to claim 3, wherein a conductive member is connected to the electromagnetic shielding layer, and an end of the conductive member remote from the electromagnetic shielding layer is grounded.

6. The laminated circuit board for an elevator according to claim 3, wherein the number of the first insulating layers is at least three, and at least one electromagnetic shielding layer is provided between two adjacent first insulating layers.

7. The laminated circuit board for an elevator according to claim 3, wherein a second insulating layer is provided on a side of the first board facing away from the second board;

and/or one side surface of the second plate, which is away from the first plate, is provided with the second insulating layer.

8. The laminated circuit board for an elevator according to claim 3, wherein the first electronic component and the second electronic component are arranged in a staggered manner in a direction parallel to the first board or the second board.

9. The laminated circuit board for an elevator according to claim 3, further comprising a conductive connecting member;

the conductive connecting piece is used for connecting the first plate with the second plate, penetrates through the first insulating layer and the electromagnetic shielding layer, and is in contact with the electromagnetic shielding layer.

10. An elevator control cabinet comprising the laminated circuit board for an elevator according to any one of claims 1 to 8.

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