CN218215237U - Paster device is used in semiconductor chip processing - Google Patents
Paster device is used in semiconductor chip processing Download PDFInfo
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- CN218215237U CN218215237U CN202221965044.4U CN202221965044U CN218215237U CN 218215237 U CN218215237 U CN 218215237U CN 202221965044 U CN202221965044 U CN 202221965044U CN 218215237 U CN218215237 U CN 218215237U
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Abstract
The utility model relates to a semiconductor chip processing technology field specifically is a paster device is used in semiconductor chip processing, include: the supporting frame is fixedly connected with the base; the conveying belt is connected with the base; a patch storage slot; the chip mounting mechanism is arranged between the base and the support frame; wherein, the paster mechanism includes: the supporting component is connected with the supporting frame; the adsorption component is arranged between the support component and the base and is connected with the support component; the air guide heating element, the air guide heating element is located adsorption component with between the supporting component, through setting up paster mechanism, supporting component and adsorption component carry out the in-process that removes to the paster, the air guide heating element can heat the paster for the shaping is directly fixed to the conductive paste, has left out the base plate heating step, has improved machining efficiency.
Description
Technical Field
The utility model relates to a semiconductor chip processing technology field specifically is a paster device is used in semiconductor chip processing.
Background
The Integrated Circuit (IC) industry is a high-speed growth point of current global economic development, wherein the progress of semiconductor manufacturing processes and the rapid growth of market demand for tiny chips make the I/O density of chips higher and higher, the lead spacing and the pad diameter of the chips continuously decrease, and meanwhile, to improve the production efficiency, the packaging speed is increased year by year, thus placing extremely high requirements on the positioning precision and the running speed of post-packaging equipment, and the chip mounting equipment determines the precision, the efficiency and the stability of the chip mounting process and is a key equipment of the chip packaging process.
Most of the current chip mounting devices generally adopt a chip mounting method of firstly attaching a chip to a packaging substrate through silver paste by chip mounting equipment, then putting the substrate into a heating furnace for heating and heat preservation for a period of time to solidify the silver paste, so that the efficiency is low, and therefore, aiming at the current situation, the chip mounting device for processing the semiconductor chip is urgently needed to be developed so as to overcome the defects in the current practical application.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a paster device is used in semiconductor chip processing to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme:
a chip mounting device for semiconductor chip processing, comprising:
the supporting frame is fixedly connected with the base;
the conveying belt is arranged between the supporting frame and the base, is connected with the base and is used for conveying chips;
the patch storage groove is arranged on the base and used for placing patches;
the chip mounting mechanism is arranged between the base and the support frame and connected with the support frame;
wherein, the paster mechanism includes:
the supporting component is connected with the supporting frame;
the adsorption component is arranged between the support component and the base, is connected with the support component and is used for being matched with the support component to adsorb and fix the chip;
the air guide heating assembly is arranged between the adsorption assembly and the supporting assembly and used for heating the chip.
Compared with the prior art, the beneficial effects of the utility model are that:
when the device moves, supporting component drive adsorption component removes to paster storage tank top, adsorption component adsorbs the paster fixed back, supporting component drive adsorption component removes to the conveyer belt top, to being located chip on the conveyer belt carries out the paster, the paster in-process, air guide heating element carries steam to heat the chip, thereby promote the machining efficiency of chip, this application adopts earlier the chip to adopt paster equipment to pass through silver thick liquid and attaches on an encapsulation base plate for paster device in the prior art, then put into the base plate and heat the paster method that keeps warm for a period of time messenger silver thick liquid solidification in the heating furnace, and is inefficient, through setting up paster mechanism, the in-process that supporting component and adsorption component removed the paster, air guide heating element can heat the paster, make electrically conductive thick liquids directly fixed shaping, need not follow-up heating the higher base plate of coefficient of thermal expansion, thereby can effectively reduce the warpage phenomenon of base plate, the base plate heating step has been left out, and the machining efficiency is improved.
Drawings
Fig. 1 is a schematic structural view of a die bonding apparatus for semiconductor chip processing.
Fig. 2 is a side view of a support box in the die attachment apparatus for semiconductor chip processing.
Fig. 3 is a schematic structural view of an adsorption box in the chip mounting device for semiconductor chip processing.
In the figure: 1-base, 2-conveyor belt, 3-patch storage tank, 4-support frame, 5-support box, 6-threaded rod, 7-driving piece, 8-adsorption box, 9-vacuum pump, 10-suction cup, 11-exhaust pipe, 12-transmission box, 13-piston groove, 14-heater, 15-piston, 16-fixed rod, 17-movable rod, 18-elastic piece, 19-connecting pipe, 20-air duct, 21-air duct, 22-air outlet pipe and 23-telescopic piece.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
Referring to fig. 1, in an embodiment of the present invention, a chip mounting device for processing a semiconductor chip includes: the device comprises a base 1 and a support frame 4, wherein the support frame 4 is fixedly connected with the base 1; the conveyor belt 2 is arranged between the support frame 4 and the base 1, is connected with the base 1 and is used for conveying chips; the patch storage groove 3 is arranged on the base 1 and used for placing patches; the chip mounting mechanism is arranged between the base 1 and the support frame 4 and is connected with the support frame 4; wherein, the paster mechanism includes: the supporting component is connected with the supporting frame 4; the adsorption component is arranged between the support component and the base 1, is connected with the support component and is used for being matched with the support component to adsorb and fix the chip; the air guide heating assembly is arranged between the adsorption assembly and the supporting assembly and used for heating the chip.
In this embodiment, during the device operation, supporting component drive adsorption component removes to 3 tops of paster storage tank, adsorption component adsorbs fixed backs to the paster, supporting component drive adsorption component removes to conveyer belt 2 tops, to being located chip on the conveyer belt 2 carries out the paster, the paster in-process, air guide heating element carries steam to heat the chip, thereby promote the machining efficiency of chip, this application adopts earlier the chip to adopt paster equipment to pass through silver thick liquid an encapsulation base plate for paster device among the prior art, then put into attached in the heating furnace with the base plate and heat the paster method that keeps warm for a period of time messenger silver thick liquid solidification, the inefficiency, through setting up paster mechanism, supporting component and adsorption component carry out the in-process that removes to the paster, air guide heating element can heat the paster, make electrically conductive thick liquids directly fixed shaping, need not follow-up substrate heating to coefficient of thermal expansion is higher, thereby can effectively reduce the warpage phenomenon of base plate, the substrate heating step has been left out, machining efficiency is improved.
In one embodiment of the present invention, the support assembly includes: the driving piece 7 is fixedly connected with the supporting frame 4, and the output end of the driving piece 7 is connected with a threaded rod 6 which is rotatably connected and arranged on the inner side of the supporting frame 4; and the supporting box 5 is in threaded connection with the outer side of the threaded rod 6, is in sliding connection with the wall of the supporting frame 4 and is connected with the adsorption component.
In this embodiment, driving piece 7 fixed connection sets up the 4 outsides of support frame, driving piece 7 is driving motor, 7 output of driving piece and 6 fixed connection of threaded rod, through setting up supporting component, can not only accomplish the support to adsorption component, driving piece 7 can adjust the position of adsorption component moreover to the removal to the paster is accomplished, realizes the automatic paster to the chip.
In one embodiment of the present invention, the adsorption assembly includes: the adsorption box 8 is arranged between the support box 5 and the base 1, and the adsorption box 8 is connected with the support box 5 through a telescopic piece 23; and the vacuum pump 9, the vacuum pump 9 and the adsorption tank 8 are fixedly connected, the input end is connected with the sucker 10, and the output end is connected with the air guide heating component through the exhaust pipe 11 and used for realizing the fixation of the adsorption of the patch.
In this embodiment, extensible member 23 fixed connection sets up supporting box 5 with between the adsorption tank 8, extensible member 23 is electric telescopic handle, vacuum pump 9 fixed connection sets up adsorption tank 8 is inboard, in addition, blast pipe 11 with the inboard transmission case 12 tank wall sliding connection of air guide heating element, the inboard fixed connection of blast pipe 11 is provided with first valve, first valve is the solenoid valve, and through setting up adsorption element, sucking disc 10 cooperation vacuum pump 9 can accomplish the absorption fixed to the paster, and it is inboard that the air absorbed passes through blast pipe 11 entering air guide heating element, and air guide heating element heats the air, and the air after the heating can heat adsorption tank 8 boxes, and the box after exhaust hot gas cooperation heating can accomplish the heating to the paster to omit the base plate heating step, improved machining efficiency
In an embodiment of the present invention, referring to fig. 1, fig. 2 and fig. 3, the air guide heating assembly includes: the transmission case 12 is fixedly connected and arranged on the inner side of the support case 5, and a piston groove 13 connected with the exhaust pipe 11 is arranged on the inner side of the transmission case 12; the heater 14 is fixedly connected and arranged on the inner side of the piston groove 13 and used for heating air; the air guide groove 21 is arranged on the inner side of the adsorption box 8, and the air guide groove 21 is connected with the piston groove 13 through a connecting pipeline; the air outlet pipes 22 are symmetrically arranged at two sides of the sucking disc 10, and are connected with the air guide grooves 21; and the air transmission assembly is arranged on the inner side of the piston groove 13, is connected with the transmission case 12 and is used for driving the air on the inner side of the piston groove 13 to flow.
In this embodiment, the connecting tube includes that fixed connection sets up connecting tube 19 in the transmission case 12 outside, connecting tube 19 other end outside sliding connection is provided with air duct 20, the air duct 20 other end with adsorption tank 8 fixed connection, and with air guide groove 21 recalls, outlet duct 22 is in sucking disc 10 bilateral symmetry sets up, the inboard fixed connection of outlet duct 22 is provided with the second valve, the second valve is the solenoid valve, in addition, heater 14 is in piston groove 12 inboard is cyclic annular distribution, through setting up air guide heating element, can not only accomplish the heating to the air, and the air after the heating can accomplish the heating to adsorption tank 8, and air transmission element drive is located air after the piston groove 12 inboard is heated is followed connecting tube gets into air guide groove 21 inboard to discharge from outlet duct 22, exhaust hot gas matching is accomplished the heating to the chip by adsorption tank 8 after the heating for electrically conductive thick liquids directly fixed shaping, need not follow-up the higher base plate heating of coefficient of thermal expansion, thereby promote machining efficiency.
In one embodiment of the present invention, the gas transmission assembly comprises: the pistons 15 are symmetrically arranged on two sides of the exhaust pipe 11 and are in sliding connection with the piston grooves 13; the fixed rod 16 is fixedly connected with the transmission case 12, and the inner side of the fixed rod 16 is slidably connected with a movable rod 17 connected with the piston 15; and the elastic piece 18 is arranged between the movable rod 17 and the fixed rod 16, and is used for driving the piston 15 to realize the flow of air.
In this embodiment, the elastic member 18 is fixedly connected and disposed between the movable rod 17 and the fixed rod 16, wherein the elastic member 18 is a spring, and by disposing the air transmission assembly, the air output by the adsorption assembly enters the inner side of the piston groove 13 along the exhaust pipe 11, the second valve inside the air outlet pipe 22 is closed, the air is gathered inside the piston groove 13, the piston 15 is pushed to both sides, the elastic member 18 is pressed, when the air is exhausted, the second valve is opened, the first valve is closed, the elastic member 18 drives the piston 15 to move, and further the air inside the piston groove 13 enters the inner side of the air guide groove 21 along the connecting pipe and is exhausted from the air outlet pipe 22.
This paster device is used in semiconductor chip processing, through setting up paster mechanism, supporting component and adsorption component carry out the in-process that removes to the paster, the air guide heating element can heat the paster, make the shaping of conductive paste snap-on, need not follow-up heating the higher base plate of coefficient of thermal expansion, thereby can effectively reduce the warpage phenomenon of base plate, the base plate heating step has been omitted, machining efficiency has been improved, through setting up the air guide heating element, can not only accomplish the heating to the air, and the air after the heating can accomplish the heating to adsorption box 8, the drive of gas transmission subassembly is located the air after 12 inboards of piston groove are heated is followed connecting tube gets into air guide 21 inboardly, and discharge from outlet duct 22, the exhaust heat cooperation is accomplished the heating to the chip by adsorption box 8 after the heating, makes the shaping of conductive paste snap-on.
The above is only the preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.
Claims (5)
1. A chip mounting device for semiconductor chip processing, comprising:
the supporting frame is fixedly connected with the base;
the conveying belt is arranged between the supporting frame and the base, is connected with the base and is used for conveying chips;
the patch storage groove is arranged on the base and used for placing patches;
the paster mechanism is arranged between the base and the support frame and is connected with the support frame;
wherein, the paster mechanism includes:
the supporting component is connected with the supporting frame;
the adsorption component is arranged between the support component and the base, is connected with the support component and is used for being matched with the support component to adsorb and fix the chip;
the air guide heating assembly is arranged between the adsorption assembly and the supporting assembly and used for heating the chip.
2. A die attachment apparatus as defined in claim 1, wherein said support assembly comprises:
the driving piece is fixedly connected with the support frame, and the output end of the driving piece is connected with a threaded rod which is rotatably connected and arranged on the inner side of the support frame;
and the supporting box is in threaded connection with the outer side of the threaded rod, is in sliding connection with the wall of the supporting frame shell, and is connected with the adsorption component.
3. A die attachment apparatus according to claim 2, wherein said suction assembly comprises:
the adsorption box is arranged between the support box and the base and is connected with the support box through a telescopic piece;
the vacuum pump, the vacuum pump with adsorption tank fixed connection, and the input links to each other with the sucking disc, the output pass through the blast pipe with the air guide heating element links to each other for the realization is fixed to the absorption of paster.
4. A die attachment apparatus according to claim 3, wherein said air guide heating element comprises:
the transmission box is fixedly connected and arranged on the inner side of the supporting box, and a piston groove connected with the exhaust pipe is formed in the inner side of the transmission box;
the heater is fixedly connected and arranged on the inner side of the piston groove and used for heating air;
the air guide groove is arranged on the inner side of the adsorption box and is connected with the piston groove through a connecting pipeline;
the air outlet pipes are symmetrically arranged on two sides of the sucker and are connected with the air guide grooves;
and the air transmission assembly is arranged on the inner side of the piston groove, is connected with the transmission case and is used for driving the air on the inner side of the piston groove to flow.
5. A die attachment apparatus as recited in claim 4, wherein said gas delivery assembly comprises:
the pistons are symmetrically arranged on two sides of the exhaust pipe and are in sliding connection with the piston grooves;
the fixed rod is fixedly connected with the transmission case, and the inner side of the fixed rod is slidably connected with a movable rod connected with the piston;
the elastic piece is arranged between the movable rod and the fixed rod and used for driving the piston to realize the flow of air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221965044.4U CN218215237U (en) | 2022-07-28 | 2022-07-28 | Paster device is used in semiconductor chip processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221965044.4U CN218215237U (en) | 2022-07-28 | 2022-07-28 | Paster device is used in semiconductor chip processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218215237U true CN218215237U (en) | 2023-01-03 |
Family
ID=84651420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221965044.4U Active CN218215237U (en) | 2022-07-28 | 2022-07-28 | Paster device is used in semiconductor chip processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218215237U (en) |
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2022
- 2022-07-28 CN CN202221965044.4U patent/CN218215237U/en active Active
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