CN218203118U - Electroplating device - Google Patents
Electroplating device Download PDFInfo
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- CN218203118U CN218203118U CN202222472033.9U CN202222472033U CN218203118U CN 218203118 U CN218203118 U CN 218203118U CN 202222472033 U CN202222472033 U CN 202222472033U CN 218203118 U CN218203118 U CN 218203118U
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Abstract
The utility model belongs to the technical field of electroplate, a electroplate device is disclosed. Comprises an electroplating bath; a plurality of anode plates are respectively arranged on two surfaces inside the electroplating bath; a U-shaped anode rod is arranged above the top of the electroplating bath; the anode plates are connected with the anode rods through the conductive positioning pins; the anode rod is connected with the anode of the rectifier through an anode wire; the tops of the two sides of the electroplating bath are respectively provided with a bracket; the two supports are provided with swing shafts, and the tail ends of one ends of the swing shafts are connected with the servo motor through connecting rods, bearings B and a speed reducer; a hanging rod is arranged below the swing shaft and is connected with the plating pocket through hooks at two ends; a plurality of medium conductive balls are arranged in the plating pocket, the cathode of the rectifier is connected with the cathode conductive balls through a cathode lead, the cathode conductive balls are arranged at the bottom of the cathode lead, and the cathode conductive balls are embedded into the plurality of medium conductive balls. The electroplating device has the advantages of production cost reduction, batch production and good practicability.
Description
Technical Field
The utility model belongs to the technical field of electroplate, the utility model relates to an electroplate device.
Background
The electroplating mode of the MLCC process adopts barrel plating. The cathode device is mostly a horizontal roller or an inclined roller. The disadvantages are as follows:
1. the cost of the drum is high, and the cost of the cathode conducting device and the drum is high. Each set of cathode conducting device comprises: the set of the roller and the cathode conductive rod is about 1000 yuan.
2. The drum device is heavy by about 2-3kg, and the long-term operation of an operator wastes time and labor.
3. The cathode conductive part of the roller is complex in connection, not easy to clean, not easy to generate poor conductivity and the like. Hidden quality hidden troubles exist in the production process of the roller. Mass quality problems can occur.
4. The cylinder is made of nylon and PP (polypropylene) and is easy to clamp materials at internal edges and corners.
5. The roller design needs to be provided with an automatic electroplating line, is suitable for batch production of a product, and is poor in practicability when procedures are switched back and forth for small-batch and diversified products.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides an electroplating device which reduces the production cost, can be produced in batches and has good practicability. And (4) replacing a roller with a plating pocket, and loading the conductive steel balls and the products to be processed. The cathode conductive ball and the cathode wire are connected together. The cathode line is connected to the cathode of the rectifier. The cathode conduction of the electroplating is completed. And then the plating pocket is hung on the hanger rod to realize the stirring of the products in the plating pocket.
The above object of the present invention is achieved by the following technical solutions:
an electroplating apparatus includes an electroplating bath; a plurality of anode plates are respectively arranged on two surfaces inside the electroplating bath; a U-shaped anode rod is arranged above the top of the electroplating bath; the anode plates are connected with the anode rods through the conductive positioning pins; a cathode wire fixing sleeve is also arranged at the top of one side surface of the electroplating bath, and the anode rod is connected with the anode of the rectifier through an anode wire; the tops of the two sides of the electroplating bath are respectively provided with a bracket; the two supports are provided with swing shafts, two ends of each swing shaft are respectively connected with the two supports through a bearing A and a bearing bracket, and the tail end of one end of each swing shaft is connected with a servo motor through a connecting rod, a bearing B and a speed reducer; the swing shaft is driven by the servo motor and the connecting rod to swing and rotate; a suspender is arranged below the swing shaft, and the suspender and the swing shaft are vertically arranged in the horizontal direction and are fixedly connected; a plating pocket is arranged below the suspender, hooks are arranged at two ends of the suspender, and the suspender is connected with the plating pocket through the hooks at the two ends; a plurality of medium conductive balls are arranged in the plating pocket, the cathode of the rectifier is connected with the cathode conductive balls through a cathode lead, the bottom of the cathode lead is provided with the cathode conductive balls, and the cathode conductive balls are embedded in the plurality of medium conductive balls; the product to be electroplated is placed at the medium conductive ball, and the cathode lead is L-shaped after being fixed by the cathode wire fixing sleeve; the connecting section of the cathode lead and the cathode conductive ball is a vertical section; the cathode lead and the cathode conductive ball need to be vertically arranged in the plating pocket.
The two supports are also fixedly connected with supporting plates, and the rectifier is arranged on the supporting plates.
Furthermore, one of the supports is externally connected with a fixing frame, and the servo motor is arranged on the fixing frame.
Furthermore, the plating pocket is in a net pocket shape. Material nylon screen cloth, mesh number: 200 meshes, and is made into a net bag type by PVC binding ropes. A rectangular 1.0 x 1.2 cloth was used.
Furthermore, the cathode conductive ball is made of copper and is connected with the cathode lead in a welding mode. The medium conductive ball is preferably a 0.7mm and tinned steel ball; the anode rod is made of titanium-clad copper.
Furthermore, the rectifier is not limited to a specific type, and can realize the working function, and preferably a TBFBZ-100A/10V high-frequency switching power supply or a TBFBZ-50A/15V high-frequency switching power supply.
Further, the cathode lead is a 16A, 6-core copper lead and is coated with rubber at the periphery of copper. The cathode lead is a hard lead.
Furthermore, in practical use, the cathode conductive ball needs to be buried in the dielectric conductive ball.
Compared with the prior art, the utility model beneficial effect be:
1. the cost is low, and the cost of one set of cathode plating pocket and cathode conducting rod is about 30 yuan.
2. The pocket plating is made of nylon gauze (200 meshes), and the pocket plating is made of 1.2 x 1.0 m materials and is shaped like a pocket. The total weight does not exceed 300g. Light and small, easy to operate by operators and strong in operability.
3. The cathode conducting device is simple and convenient to replace and check. Problems can be found in time, and unqualified products can be identified in time. The scrapping of batch can not be caused.
4. The nylon gauze is smooth in material, free of dead angles and not easy to clamp materials.
5. The method is suitable for processing diversified and small-batch products. Batch processing can also be considered.
Drawings
The invention will be further described with reference to the following figures and examples:
FIG. 1 is an exploded view of the electroplating apparatus of the present invention.
Fig. 2 is a SEM contrast of tin layer crystallization in the experiment of the present invention.
FIG. 3 is a schematic structural view of the electroplating apparatus of the present invention.
In the figure: 1. the device comprises a plating bath, 2 parts of a cathode wire fixing sleeve, 3 parts of an anode rod, 4 parts of an anode plate, 5 parts of a conductive positioning pin, 6 parts of a plating pocket, 7 parts of a cathode conductive ball, 8 parts of a cathode lead, 9 parts of a bracket, 10 parts of a bearing bracket, 11 parts of a bearing A,12 parts of a supporting plate, 13 parts of a rectifier, 14 parts of a suspender, 15 parts of a swing shaft, 16 parts of a connecting rod, 17 parts of a servo motor and 18 parts of a bearing B.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments, but the scope of the present invention is not limited thereto. Unless otherwise stated, the experimental methods adopted by the utility model are all conventional methods, and experimental devices, materials, reagents and the like can be obtained from commercial sources.
Example 1
An electroplating apparatus, as shown in fig. 1 and 3, includes an electroplating tank 1; a plurality of anode plates 4 are respectively arranged on two surfaces inside the electroplating bath 1; a U-shaped anode rod 3 is arranged above the top of the electroplating bath 1; the anode plates 4 are connected with the anode rods 3 through the conductive positioning pins 5; a cathode wire fixing sleeve 2 is also arranged at the top of one side surface of the electroplating bath 1, and an anode rod 3 is connected with the anode of a rectifier 13 through an anode wire; the tops of two sides of the electroplating bath 1 are respectively provided with a bracket 9; the two supports 9 are provided with swing shafts 15, two ends of each swing shaft 15 are respectively connected with the two supports 9 through bearings A11 and bearing brackets 10, and the tail end of one end of each swing shaft 15 is connected with a servo motor 17 through a connecting rod 16, a bearing B18 and a speed reducer; the swing shaft 15 is driven by a servo motor 17 and a connecting rod 16 to swing and rotate; a suspension rod 14 is arranged below the swing shaft 15, and the suspension rod 14 and the swing shaft 15 are vertically arranged in the horizontal direction and fixedly connected; a plating pocket 6 is arranged below the suspender 14, hooks are arranged at two ends of the suspender 14, and the suspender 14 is connected with the plating pocket 6 through the hooks at the two ends; a plurality of medium conductive balls are arranged in the plating pocket 6, the cathode of the rectifier 13 is connected with the cathode conductive ball 7 through a cathode lead 8, the bottom of the cathode lead 8 is provided with the cathode conductive ball 7, and the cathode conductive ball 7 is embedded in the plurality of medium conductive balls; the product to be electroplated is placed at the medium conductive ball, and the cathode lead 8 is L-shaped after being fixed by the cathode lead fixing sleeve 2; the connecting section of the cathode lead 8 and the cathode conductive ball 7 is a vertical section; the cathode lead 8 and the cathode conductive ball 7 need to be vertically placed in the plating pocket 6.
The two brackets 9 are also fixedly connected with a supporting plate 12, and a rectifier 13 is arranged on the supporting plate 12.
One of the brackets 9 is externally connected with a fixed frame, and the servo motor 17 is arranged on the fixed frame.
The plating pocket 6 is in a net pocket type. Material nylon screen cloth, mesh number: 200 meshes, and is made into a net bag type by PVC binding ropes. Rectangular 1.0 x 1.2 cloth was used.
The cathode conductive ball 7 is made of copper and is connected with the cathode lead 8 in a welding mode. The medium conductive ball is preferably a 0.7mm and tinned steel ball; the anode rod is made of titanium-clad copper.
The rectifier 13 is not limited to a specific type, and can realize the working function, preferably a TBFBZ-100A/10V high-frequency switch power supply or a TBFBZ-50A/15V high-frequency switch power supply.
The cathode lead 8 is a 16A, 6-core copper lead and is rubber-covered on the copper periphery. The cathode lead is a hard lead.
In practical use, the cathode conductive ball 7 is buried in the dielectric conductive ball.
DOE test of plating parameters:
aiming at key parameters of pocket plating and electroplating: a rocking frequency; the mesh number of the plating pocket; the DOE test was performed on the number and size of the conductive balls.
1. Swing frequency test of electroplating plating pocket
Designing a test scheme:
products with different sizes are taken, 3 different swing frequencies and the same electroplating parameters are adopted respectively, the appearance of the R arc of the product is observed, and the appearance, the electroplating speed and the electroplating uniformity (COV) of the product are compared. The results are shown in table 1 below.
TABLE 1 table of swing frequency test results of electroplated plating pocket
Evaluation criteria: the appearance is qualified, and the R arc has no ceramic leakage. The electroplating speed is high; the plating uniformity (COV) is less than 10%. Therefore, as can be seen from the experimental data in Table 1, the plating conditions are optimal when the swing frequency is 25 times/min.
2. Number of plated pockets test
Adopting nylon nets with different meshes 90;120 of a solvent; 200 the permeability and the service life of the plating solution were confirmed.
2.1 Permeability detection
And (4) preparing the plating bags with the same size, taking 10 liters of liquid medicine, pouring the liquid medicine into the plating bags, and confirming the passing time. Three times of treatment are carried out respectively. The results are shown in Table 2.
TABLE 2 detection result table of permeability of plated pocket
As can be seen from the results in Table 2, there was no difference in permeability.
2.2 Life test
And respectively counting the service life of the plating pockets with different meshes. The standard is as follows: plating the wrinkles of the pocket, and beginning to clamp the sheet.
The method comprises the following steps: counting from the use of the plating pocket to the use times when the service life is reached. The results are shown in Table 3.
TABLE 3 result table of the service life of the plating pocket
Evaluation criteria: the permeability is good, and the service life is long; from the results of Table 3, the relative service life of the 200 mesh plating pocket was long.
3. Conductive Medium ball determination test (0402 product as an example)
Selecting steel balls with different sizes and the same weight. Mixing with the product. The product quantity is based on 100000. The temperature of the bath solution is 50 ℃, and the weight of the steel ball is 1500g; the results are shown in Table 4 below.
TABLE 4 electroplating effect table under different steel ball conditions
Evaluation criteria: COV is less than 10%; the electroplating speed is high, and the quantity of double sheets after tinning is small; crystallization by SEM: 3-10um; available from the data of table 4 and fig. 2; the electroplating rate of the 0.7mm conductive steel ball limited in the scheme 2 is high, the COV is qualified, and the SEM crystal size is qualified. The quantity of double tablets is minimum; is the most preferred condition.
The embodiments described above are only preferred embodiments of the present invention, and are not all possible embodiments of the present invention. Any obvious modifications to the above would be obvious to those of ordinary skill in the art, but would not bring the invention so modified beyond the spirit and scope of the present invention.
Claims (5)
1. An electroplating device is characterized by comprising an electroplating bath (1); a plurality of anode plates (4) are respectively arranged on two surfaces inside the electroplating bath (1); a U-shaped anode rod (3) is arranged above the top of the electroplating bath (1); the anode plates (4) are connected with the anode rods (3) through the conductive positioning pins (5); a cathode wire fixing sleeve (2) is further arranged at the top of one side surface of the electroplating bath (1), and the anode rod (3) is connected with the anode of the rectifier (13) through an anode wire; the tops of two sides of the electroplating bath (1) are respectively provided with a bracket (9); swing shafts (15) are arranged on the two supports (9), two ends of each swing shaft (15) are connected with the two supports (9) through bearings A (11) and bearing brackets (10), and the tail end of one end of each swing shaft (15) is connected with a servo motor (17) through a connecting rod (16), a bearing B (18) and a speed reducer; the swing shaft (15) is driven by a servo motor (17) and a connecting rod (16) to swing and rotate; a suspender (14) is arranged below the swing shaft (15), and the suspender (14) and the swing shaft (15) are vertically arranged in the horizontal direction and fixedly connected; a plating pocket (6) is arranged below the suspender (14), hooks are arranged at two ends of the suspender (14), and the suspender (14) is connected with the plating pocket (6) through the hooks at the two ends; a plurality of medium conductive balls are arranged in the plating pocket (6), the cathode of the rectifier (13) is connected with the cathode conductive balls (7) through cathode wires (8), the cathode conductive balls (7) are arranged at the bottom of the cathode wires (8), and the cathode conductive balls (7) are embedded into the plurality of medium conductive balls.
2. An electroplating apparatus according to claim 1, wherein the two supports (9) are further fixedly connected with a carrier plate (12), and the commutator (13) is arranged on the carrier plate (12).
3. An electroplating apparatus according to claim 2, wherein one of the supports (9) is externally connected with a fixing frame, and the servo motor (17) is arranged on the fixing frame.
4. A plating apparatus according to claim 3, wherein said plating pocket (6) is in the shape of a net pocket.
5. An electroplating apparatus according to claim 4, wherein the cathode conductive ball (7) is made of copper and is connected with the cathode lead (8) by welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222472033.9U CN218203118U (en) | 2022-09-19 | 2022-09-19 | Electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222472033.9U CN218203118U (en) | 2022-09-19 | 2022-09-19 | Electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218203118U true CN218203118U (en) | 2023-01-03 |
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ID=84636404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222472033.9U Active CN218203118U (en) | 2022-09-19 | 2022-09-19 | Electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218203118U (en) |
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2022
- 2022-09-19 CN CN202222472033.9U patent/CN218203118U/en active Active
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