CN218192132U - Precision mold for electronic product - Google Patents
Precision mold for electronic product Download PDFInfo
- Publication number
- CN218192132U CN218192132U CN202222512876.7U CN202222512876U CN218192132U CN 218192132 U CN218192132 U CN 218192132U CN 202222512876 U CN202222512876 U CN 202222512876U CN 218192132 U CN218192132 U CN 218192132U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- fixedly connected
- magnetic sheet
- mould
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a mould equipment technical field, concretely relates to accurate mould for electronic product, including last mould and lower mould, lower mould bottom fixed connection magnetic sheet one, magnetic sheet two is connected to a magnetic sheet bottom surface magnetism, two bottom fixed connection heat dissipation cover pads of magnetic sheet, heat dissipation cover pad top surface fixed connection magnetic sheet two is provided with the semiconductor refrigeration piece in the heat dissipation cover pad, and heat dissipation cover pads left and right sides fixed connection fixed plate, fixed plate opposite side fixed connection elastic block, fixed connection connecting block in the middle of the elastic block, the pivot is connected to the connecting block other end, pivot other end swing joint commentaries on classics board. The utility model discloses a fill up fixed mounting with the heat dissipation cover on the mould base for semiconductor refrigeration piece refrigeration end pastes the lower mould in the heat dissipation cover fills up, realizes the cooling to lower mould and mould, avoids the long-time cooling of mould to lead to the mould to easily appear deformation in the cooling process, and help improves shaping product quality, improves production efficiency.
Description
Technical Field
The utility model relates to a mould equipment technical field, concretely relates to accurate mould for electronic product.
Background
With the rapid development of socioeconomic and science and technology in China, the technology in the aspect of electronic products is more and more scientific and technological, and evolves first, people tend to the direction of the requirements of multiple functions, centralized performance and convenience in carrying, so that the shape development trend of electronic products is smaller and smaller, and more precise and integrated, and therefore, each important electronic element in the electronic products is also developed towards the direction of thinness, smallness and lightness.
The electronic product is the most common article in life, the electronic product is usually processed by a die in the production and manufacturing process, but some special electronic products can be completed by stamping for many times, the existing device is troublesome in template replacement, wastes time and labor, prolongs the production time of the electronic product, reduces the production efficiency and is troublesome in daily maintenance; the existing mould is not completely made in the aspect of heat dissipation, and the mould has no self-contained heat dissipation function, so that the mould is easy to generate high-temperature deformation in high-temperature work, a product is deformed and damaged, and unnecessary loss is brought.
The Chinese patent discloses a precision mold for electronic products (No. CN 213915763U), and the patent technology solves the problems of troublesome mold plate and time and labor waste of the existing device. However, it is not considered that the mold is difficult to be rapidly cooled after being molded, so that the mold is easy to deform in the cooling process, and the quality of a molded product is reduced. Accordingly, those skilled in the art have provided a precision mold for electronic products to solve the problems set forth in the background art.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a:
a precision mold for electronic products comprises an upper mold and a lower mold, wherein electric push rods are arranged on two sides of the upper mold, the bottom of each electric push rod is fixedly connected with a base, the bottom of the lower mold is fixedly connected with a first magnetic sheet, the first magnetic sheet is in a shape of a Chinese character kou, the first magnetic sheet is magnetically connected with a second magnetic sheet, the second magnetic sheet is in a shape of a Chinese character kou, the top of the first magnetic sheet is magnetically attracted with a first magnetic sheet, the bottom of the second magnetic sheet is fixedly connected with a radiating sleeve pad, the bottom of the radiating sleeve pad is provided with a radiating fin, the left and right sides of the radiating sleeve pad are fixedly connected with a fixed plate, the front side of the radiating sleeve pad is provided with a fixed pipe, the top of the radiating fin is fixedly connected with a radiating sleeve pad, the bottom of the semiconductor cooling fin is provided with a radiating end, one end of the connecting wire penetrates through the fixed pipe to connect with a power supply, the connecting wire penetrates through one end of the fixed pipe to be provided with a power supply controller, the top of the radiating fin is fixedly connected with a radiating sleeve pad, the bottom of the radiating fin is provided with a fan, the top of the other end of the rotating shaft is connected with a rotating shaft, and the rotating shaft is connected with a rotating block, one end of the rotating shaft, and the rotating shaft is connected with the rotating block, and the rotating shaft, and the rotating block, a bolt is arranged in the mounting hole, one end of the bolt is fixedly connected with the base, and the other end of the bolt is fixedly connected with the rotating plate.
Preferably: the top surface of the upper die is provided with an operation panel, and one side of the operation panel is fixedly connected with the upper die.
Preferably: the top end of the electric push rod is fixedly connected with the upper die.
Preferably: the base is fixedly connected to the two sides of the bottom surface of the lower die, the positioning pin is arranged on the top surface of the lower die, and the bottom end of the positioning pin is connected with the lower die.
Preferably: and the top surface of the magnetic sheet is fixedly connected with the lower die.
Preferably: one end of the fixing pipe is in through connection with the heat dissipation sleeve gasket, and the connecting wire is sleeved in the fixing pipe.
Preferably: one end of the connecting wire is connected with the semiconductor refrigerating sheet, and the two sides of the power controller are connected with the connecting wire in a penetrating mode.
The utility model discloses a technological effect and advantage:
the utility model discloses a magnetic sheet one, the heat dissipation cover pad sets up magnetic sheet two, fixed block, elastic block, changes the board, the rotatable commentaries on classics board of pivot uses the bolt to fix the heat dissipation cover pad on mould base for lower mould is pasted to semiconductor refrigeration piece refrigerating end in the heat dissipation cover pad, realizes the cooling to lower mould and mould, avoids the long-time cooling of mould to lead to the mould to easily appear deformation in the cooling process, and help improves shaping product quality, improves production efficiency.
Drawings
Fig. 1 is a schematic front view of a precision mold for an electronic product according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a precision mold for electronic products in a top view according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a side view of a heat dissipation sleeve pad in a precision mold for an electronic product according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a heat dissipation sleeve gasket in a precision mold for electronic products, according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a side view of a heat dissipation sleeve pad in a precision mold for an electronic product according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of details of a fixing block in a precision mold for an electronic product according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a connecting line detail in a precision mold for an electronic product according to an embodiment of the present application.
In the figure:
1. an upper die; 101. a lower die; 102. an operation panel; 103. an electric push rod; 104. a base; 105. positioning pins; 106. a power supply controller; 107. a heat dissipation sleeve pad; 108. a fan; 109. a connecting wire; 110. a fixing plate; 111. a first magnetic sheet; 112. a second magnetic sheet; 113. a semiconductor refrigeration sheet; 114. rotating the plate; 115. a heat sink; 116. a bolt; 117. an elastic block; 118. connecting blocks; 119. a rotating shaft; 120. mounting holes; 121. and fixing the tube.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Example 1
Referring to fig. 1 to 7, in this embodiment, a precision mold for electronic products is provided, which includes an upper mold 1 and a lower mold 101, wherein electric push rods 103 are disposed on two sides of the upper mold 1, a bottom end of the electric push rods 103 is fixedly connected to a base 104, a bottom end of the lower mold 101 is fixedly connected to a first magnetic sheet 111, the first magnetic sheet 111 is in a square shape, the bottom surface of the first magnetic sheet 111 is magnetically connected to a second magnetic sheet 112, the second magnetic sheet 112 is in a same shape as the first magnetic sheet 111, the top surface of the second magnetic sheet 112 is magnetically attracted to the first magnetic sheet 111, the bottom end of the second magnetic sheet 112 is fixedly connected to a heat dissipation sleeve cushion 107, the top surface of the heat dissipation sleeve cushion 107 is fixedly connected to the second magnetic sheet 112, a cooling semiconductor plate 113 is disposed in the heat dissipation sleeve cushion 107, a cooling fin 115 is disposed on the bottom surface of the heat dissipation sleeve cushion 107, fixing plates 110 are fixedly connected to the left and right sides of the heat dissipation sleeve cushion 107, a fixing tube 121 is disposed on the front side of the heat dissipation sleeve cushion 107, the top end of the semiconductor cooling plate 113 is provided with a cooling end, the bottom of the semiconductor refrigerating plate 113 is a heat dissipating end, the bottom of the semiconductor refrigerating plate 113 is fixedly connected with a heat dissipating sleeve gasket 107, the front side of the semiconductor refrigerating plate 113 is provided with a connecting wire 109, one end of the connecting wire 109 penetrates through a fixing tube 121 to be connected with a power supply controller 106, one end of the connecting wire 109 penetrating through the fixing tube 121 is provided with a power supply controller 106, the top surface of the heat dissipating sleeve gasket 107 is fixedly connected with the heat dissipating sleeve gasket 107, the bottom end of the heat dissipating fin 115 is provided with a fan 108, the top end of the fan 108 is connected with the heat dissipating fin 115, the other end of the fan 108 is connected with the power supply controller 106 through an electric wire, one side of the fixing plate 110 is fixedly connected with the heat dissipating sleeve gasket 107, the other side of the fixing plate 110 is fixedly connected with an elastic block 117, the elastic block 117 has rebound resilience, one side of the fixing plate 110 is fixedly connected with the fixing plate 110, the other end of the elastic block 117 elastically extrudes the base 104, a connecting block 118 is fixedly connected with an elastic block 117 in the middle of the elastic block 117, pivot 119 is connected to the connecting block 118 other end, connecting block 118 is connected to pivot 119 one end, and pivot 119 other end swing joint changes board 114, change board 114 top surface and connect pivot 119 on one side, change board 114 top surface another side and be provided with mounting hole 120, mounting hole 120 through connection changes board 114, is provided with bolt 116 in the mounting hole 120, bolt 116 one end fixed connection base 104, bolt 116 other end fixed connection changes board 114.
An operation panel 102 is arranged on the top surface of the upper die 1, and one side of the operation panel 102 is fixedly connected with the upper die 1. The top end of the electric push rod 103 is fixedly connected with the upper die 1. The equal fixed connection base 104 in lower mould 101 bottom surface both sides, lower mould 101 top surface are provided with locating pin 105, lower mould 101 is connected to locating pin 105 bottom. The top surface of the first magnetic sheet 111 is fixedly connected with the lower die 101. One end of the fixing tube 121 is connected to the heat dissipation sleeve gasket 107 in a penetrating manner, and a connecting wire 109 is sleeved in the fixing tube 121. One end of the connecting wire 109 is connected with the semiconductor refrigerating sheet 113, and two sides of the power controller 106 are connected with the connecting wire 109 in a penetrating mode.
The working principle of the utility model is, before using this precision mold for electronic product, at first with 113 refrigeration ends of semiconductor refrigeration piece install up in heat dissipation sleeve gasket 107, then aim at magnetic sheet 111 with magnetic sheet two 112, extrude heat dissipation sleeve gasket 107 both sides elastic block 117 simultaneously, fill in heat dissipation sleeve gasket 107 between the base 104, rotate commentaries on classics board 114 through pivot 119, make commentaries on classics board 114 be located base 104 below, then aim at the mounting hole 120 on the commentaries on classics board 114 with bolt 116 with changeing board 114 and base 104 fixed, during the use, before the die sinking, through electrical source controller 106 start-up power, 113 works of semiconductor refrigeration piece, fan 108 begins work simultaneously, 113 refrigeration ends of semiconductor refrigeration piece refrigerate through lower mould 101, go up 1 conduction and dispel the heat to the mould, fan 108 rotates the windage and accelerates the heat dissipation to the semiconductor radiating end.
It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art and related fields without creative efforts shall fall within the protection scope of the present disclosure. The structures, devices, and methods of operation of the present invention, not specifically described and illustrated, are generally practiced by those of ordinary skill in the art without specific recitation or limitation.
Claims (7)
1. A precision die for electronic products comprises an upper die (1) and a lower die (101), and is characterized in that electric push rods (103) are arranged on two sides of the upper die (1), the bottom end of each electric push rod (103) is fixedly connected with a base (104), the bottom end of the lower die (101) is fixedly connected with a first magnetic sheet (111), the first magnetic sheet (111) is in a square shape, the bottom surface of the first magnetic sheet (111) is magnetically connected with a second magnetic sheet (112), the second magnetic sheet (112) and the first magnetic sheet (111) are in the same shape and different in polarity, the top surface of the second magnetic sheet (112) is magnetically attracted to the first magnetic sheet (111), and the bottom end of the second magnetic sheet (112) is fixedly connected with a heat dissipation sleeve pad (107);
the top surface of the heat dissipation sleeve gasket (107) is fixedly connected with a second magnetic sheet (112), a semiconductor refrigerating sheet (113) is arranged in the heat dissipation sleeve gasket (107), a heat dissipation sheet (115) is arranged on the bottom surface of the heat dissipation sleeve gasket (107), the left side and the right side of the heat dissipation sleeve gasket (107) are fixedly connected with a fixing plate (110), and a fixing pipe (121) is arranged on the front side of the heat dissipation sleeve gasket (107);
the semiconductor refrigeration device is characterized in that the top end of the semiconductor refrigeration piece (113) is provided with a refrigeration end, the bottom end of the semiconductor refrigeration piece (113) is provided with a heat dissipation end, the bottom end of the semiconductor refrigeration piece (113) is fixedly connected with a heat dissipation sleeve gasket (107), the front side of the semiconductor refrigeration piece (113) is provided with a connecting wire (109), one end of the connecting wire (109) penetrates through the fixed tube (121) to be connected with a power supply, and one end of the connecting wire (109) penetrating through the fixed tube (121) is provided with a power supply controller (106);
the top surface of the radiating fin (115) is fixedly connected with a radiating sleeve pad (107), the bottom end of the radiating fin (115) is provided with a fan (108), the top end of the fan (108) is connected with the radiating fin (115), and the other end of the fan (108) is connected with a power supply controller (106) through a wire;
one side of the fixing plate (110) is fixedly connected with the heat dissipation sleeve gasket (107), the other side of the fixing plate (110) is fixedly connected with the elastic block (117), the elastic block (117) has resilience, one side of the elastic block (117) is fixedly connected with the fixing plate (110), the other end of the elastic block (117) elastically extrudes the base (104), the middle of the elastic block (117) is fixedly connected with the connecting block (118), one end of the connecting block (118) is fixedly connected with the elastic block (117), and the other end of the connecting block (118) is connected with the rotating shaft (119);
connecting block (118) is connected to pivot (119) one end, and pivot (119) other end swing joint changes board (114), change board (114) top surface and connect pivot (119) on one side, change board (114) top surface another side and be provided with mounting hole (120), mounting hole (120) through connection changes board (114), is provided with bolt (116) in mounting hole (120), bolt (116) one end fixed connection base (104), bolt (116) other end fixed connection changes board (114).
2. The precision mold for electronic products according to claim 1, wherein an operation panel (102) is disposed on a top surface of the upper mold (1), and one side of the operation panel (102) is fixedly connected to the upper mold (1).
3. The precision mold for electronic products as claimed in claim 1, wherein the top end of the electric push rod (103) is fixedly connected to the upper mold (1).
4. The precision mold for electronic products as claimed in claim 1, wherein the bottom surface of the lower mold (101) is fixedly connected to the base (104) at both sides, the top surface of the lower mold (101) is provided with a positioning pin (105), and the bottom end of the positioning pin (105) is connected to the lower mold (101).
5. The precision mold for electronic products as claimed in claim 1, wherein the first magnetic sheet (111) is fixedly connected to the lower mold (101) at its top surface.
6. The precision mold for electronic products according to claim 1, wherein one end of the fixing tube (121) is connected to the heat dissipation sleeve gasket (107) in a penetrating manner, and the connecting wire (109) is sleeved in the fixing tube (121).
7. The precision mold for electronic products as claimed in claim 1, wherein one end of the connecting wire (109) is connected to the semiconductor cooling plate (113), and both sides of the power controller (106) are connected to the connecting wire (109) in a penetrating manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222512876.7U CN218192132U (en) | 2022-09-22 | 2022-09-22 | Precision mold for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222512876.7U CN218192132U (en) | 2022-09-22 | 2022-09-22 | Precision mold for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218192132U true CN218192132U (en) | 2023-01-03 |
Family
ID=84636299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222512876.7U Active CN218192132U (en) | 2022-09-22 | 2022-09-22 | Precision mold for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218192132U (en) |
-
2022
- 2022-09-22 CN CN202222512876.7U patent/CN218192132U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN218192132U (en) | Precision mold for electronic product | |
| CN111729951A (en) | Bending device is used in production of U-shaped curb plate | |
| CN217512654U (en) | Hydraulic punching machine | |
| CN216609298U (en) | Circuit board drilling device | |
| CN215872421U (en) | Radiating fin with adjustable length | |
| CN210651925U (en) | Die structure with graphite jig heating improvement | |
| CN212551394U (en) | Heat conduction pipe rolling device | |
| CN212064714U (en) | Radiating fin convenient to mount | |
| CN214478383U (en) | Novel electric brush mould | |
| CN209787717U (en) | Heat dissipation device of electrical control device | |
| CN202125895U (en) | Heat sink of PCB plate for LED light source | |
| CN221209612U (en) | Aluminium alloy casting leveling die | |
| CN214726772U (en) | Mould capable of adjusting size of circular amorphous magnetic powder core and easy to demould, disassemble and clean | |
| CN217617338U (en) | Radiator support fast assembly tool | |
| CN215279451U (en) | Frame type female die straddle type insert fine blanking radiator die | |
| CN216635558U (en) | Wheel die with front die and rear die matched with inclined top to form annular inverted buckle | |
| CN218109000U (en) | Electrode plate stamping forming equipment | |
| CN219165043U (en) | Partition cooling fin | |
| CN211017060U (en) | Integrated circuit board convenient to dismantle and overhaul | |
| CN221020637U (en) | Metal nameplate processing tool | |
| CN219876327U (en) | PCB shaping jig | |
| CN211981696U (en) | Device for putting magnet of micro direct current motor into large shell | |
| CN218799343U (en) | Punching equipment for machining die guide pillar | |
| CN217196709U (en) | Screw rod forming die of high-performance fluid mixing equipment | |
| CN215729640U (en) | Heat radiator for big data server uses |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |