CN218183846U

CN218183846U - IGBT cooling device

Info

Publication number: CN218183846U
Application number: CN202222623931.XU
Authority: CN
Inventors: 陈亮; 徐龙; 韩晓伟; 王超
Original assignee: Honeycomb Drive System Jiangsu Co Ltd
Current assignee: Honeycomb Drive System Jiangsu Co Ltd
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2022-12-30
Anticipated expiration: 2032-09-30

Abstract

The utility model discloses a cooling device of IGBT, include: the device main part is equipped with runner, inlet and liquid outlet in the device main part, and inlet and liquid outlet intercommunication runner, runner have the first direction of carrying the coolant liquid, and the portion of scratching the flow on the inside wall that is located the first direction both sides of runner is used for hindering the coolant liquid to flow. The utility model discloses IGBT's cooling device, through scratching the flow portion on the inside wall that is located first direction both sides at the runner, can strengthen the velocity of flow and the heat convection coefficient of coolant liquid when flowing through in the middle of the runner, improve the holistic heat-sinking capability of device, promote cooling radiating effect.

Description

IGBT cooling device

Technical Field

The utility model belongs to the technical field of the IGBT cooling technique and specifically relates to a cooling device of IGBT is related to.

Background

With the development of the new energy automobile industry, the power output performance of the whole automobile is continuously improved, the power density of an electric drive system is continuously improved, and the requirement on the heat dissipation capacity of a heat dissipation system is increasingly strict. Meanwhile, the design of the heat dissipation performance of the motor controller is always used as an important design core of the new energy automobile. The proper design of the radiator fins can increase the heat flow and the surface heat exchange coefficient of the radiator and is an optimized scheme for solving the economic problem. Therefore, the research and design of the heat dissipation performance of the motor controller play a critical role in the overall reliability of the new energy automobile.

The IGBT module is used as an important high-voltage switch device in the motor controller, and a chip in the IGBT module generates extra large heating loss in the turn-off and turn-on processes and needs to be effectively radiated through a water channel. The water channel heat dissipation design is not good, the performance and the durability and the reliability of the whole electric control are influenced, and the risk of pipe explosion is serious. Therefore, the water channel heat dissipation capacity of the IGBT is improved, the running environment and stability of the electric drive system are improved, and the reliability of the whole vehicle is improved.

In the related art, a water channel right below the IGBT is designed to be square, the side wall surface of the water channel is a plane, the distribution of flow velocity in the water channel is uneven, the heat cannot be effectively dissipated to a high-temperature area in the middle of the IGBT, and the heat dissipation capacity and the effect are poor.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the utility model is to provide a cooling device of IGBT, the cooling device of IGBT can strengthen the velocity of flow and the heat convection coefficient of coolant liquid when flowing through in the middle of the runner, improves the holistic heat-sinking capability of device, promotes cooling radiating effect.

According to the utility model discloses IGBT's cooling device, include: the device main part, be equipped with runner, inlet and liquid outlet in the device main part, the inlet with the liquid outlet intercommunication the runner, the runner has the first direction of carrying the coolant liquid, the position in of runner scratches the flow portion on the inside wall of first direction both sides, scratches the flow portion and is used for hindering the coolant liquid flows.

According to the utility model discloses IGBT's cooling device, through scratching the flow portion on the inside wall that is located the first direction both sides at the runner, can strengthen the velocity of flow and the heat convection coefficient of coolant liquid when flowing through in the middle of the runner, improve the holistic heat-sinking capability of device, promote cooling radiating effect, greatly reduced IGBT chip's temperature is favorable to improving electric drive system operational environment and stability to and promote whole car reliability.

In some embodiments, the deflection portion includes a plurality of protrusions, and the plurality of protrusions are spaced apart along the first direction.

In some embodiments, the protrusion is configured as a circular arc.

In some embodiments, any two adjacent protrusions are connected by a circular arc transition.

In some embodiments, each of the protrusions is integrally formed with an inner sidewall of the flow channel.

In some embodiments, the flow path comprises: a first portion disposed proximate the liquid outlet; the second part is close to the liquid inlet, a groove is formed in the second part, and one end of the groove extends to the liquid inlet.

In some embodiments, the groove comprises: the first groove is arranged close to the liquid inlet; the second groove is communicated with the first groove, the second groove is provided with a width direction perpendicular to the first direction, and the size of the second groove in the width direction is gradually reduced along the first direction.

In some embodiments, a dimension of the first groove in the width direction and a dimension of the flow passage in the width direction are equal.

In some embodiments, two groove walls of the second groove lying in the first direction are configured as straight faces.

In some embodiments, a dimension of the first portion in the first direction is smaller than a dimension of the second portion in the first direction, and another end of the groove extends to an intersection of the first portion and the second portion.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a cooling device used with an IGBT according to an embodiment of the present invention;

FIG. 2 is a schematic view of a part of a cooling apparatus according to an embodiment of the present invention;

FIG. 3 isbase:Sub>A schematic view of FIG. 1 taken along line A-A;

fig. 4 is a partial structural schematic view of fig. 3.

Reference numerals are as follows:

100. a cooling device; 10. a device main body; 101. a flow channel; 1011. a first portion; 1012. a second portion; 102. a flow scratching portion; 1021. a convex portion; 103. a groove; 1031. a first groove; 1032. a second groove;

210. an IGBT substrate; 220. IGBT heat dissipation needle.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely for the convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In addition, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature for distinguishing between descriptive features, non-sequential, and non-trivial.

In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to 4, a cooling device 100 of an IGBT according to an embodiment of the present invention is described below.

As shown in fig. 1 and 2, a cooling device 100 for an IGBT according to an embodiment of the present invention includes a device main body 10.

The device main body 10 is provided with a flow channel 101, a liquid inlet (not shown) and a liquid outlet (not shown), the liquid inlet and the liquid outlet are communicated with the flow channel 101, the flow channel 101 has a first direction for conveying cooling liquid, the flow deflecting portion 102 is arranged on the inner side wall of the flow channel 101, which is located on two sides of the first direction, and the flow deflecting portion 102 is used for obstructing the flow of the cooling liquid.

The "first direction" may be specifically set according to the circumstances, for example, the first direction may refer to a direction from right to left in fig. 1, correspondingly, the flow deflecting portions 102 may be disposed on the front and rear inner side walls of the flow channel 101, and the flow deflecting portions 102 may increase the flow resistance when the coolant flows through the front and rear sides of the flow channel 101. When the IGBT cools and radiates, the IGBT substrate 210 and the IGBT radiating pin 220 are placed in the flow channel 101, and when the coolant flows through the flow channel 101, the coolant flows at the flow rates on the two sides of the flow channel 101 under the action of the flexible flow portion 102, so that the flow rate and the convective heat transfer coefficient in the middle of the flow channel 101 can be enhanced, and a better cooling effect is brought to the IGBT.

According to the utility model discloses IGBT's cooling device 100, through scratching flow portion 102 on the inside wall that is located the first direction both sides at runner 101, can strengthen the velocity of flow and the heat convection coefficient of cooling liquid flow through in the middle of runner 101, improve the holistic heat-sinking capability of device, promote cooling radiating effect, greatly reduced IGBT base plate 200's temperature is favorable to improving electric drive system operational environment and stability to and promote whole car reliability.

In some embodiments, as shown in fig. 2, the deflection portion 102 includes a plurality of protrusions 1021, and the plurality of protrusions 1021 are spaced apart along the first direction. Similarly, the first direction is taken as a direction from right to left as an example, when the cooling liquid flows through the front side and the rear side of the flow channel 101, the cooling liquid is blocked when meeting the rightmost convex part 1021, the flow velocity is reduced, and then the cooling liquid is blocked again when passing through the second convex part 1021 on the right side, and so on \8230, and after the cooling liquid is blocked by the plurality of convex parts 1021, the flow velocity on the front side and the rear side of the flow channel 101 is obviously reduced, so that the flow velocity and the convection heat exchange coefficient in the middle of the flow channel 101 are enhanced.

In some embodiments, as shown in fig. 2, the projection 1021 is configured as a circular arc. The circular arc convex part 1021 can play a role in increasing the flow resistance of the cooling liquid, and meanwhile, the flow resistance is not too large, so that the cooling effect on two sides of the flow channel 101 is ensured. Secondly, the distance between the convex part 1021 and the IGBT heat dissipation needle 220 can be conveniently controlled by the circular arc-shaped convex part 1021, and the distance between the convex part 1021 and the IGBT heat dissipation needle 220 is reduced, so that the flow velocity distribution in the flow channel 101 is uniform, and the flow velocity in the middle can be indirectly improved.

In some embodiments, as shown in fig. 2, any two adjacent convex portions 1021 are connected by a circular arc transition. The two convex parts 1021 are connected through arc transition, so that the cooling liquid can smoothly flow from the previous convex part 1021 to the next convex part 1021, and the cooling liquid is prevented from being incapable of flowing between the two convex parts 1021.

In some embodiments, each protrusion 1021 is integrally formed with the inner sidewall of the flow channel 101. In this way, the convex part 1021 and the flow channel 101 can be connected more reliably, and the situation of loosening or falling-off can not occur. For example, the device body 10 may be an injection molded part, and the convex part 1021 and the device body 10 may be integrally injection molded at the injection molding stage.

In some embodiments, as shown in fig. 2 and 3, the flow channel 101 includes a first portion 1011 and a second portion 1012, the first portion 1011 being disposed adjacent to the liquid outlet; second portion 1012 is arranged close to the inlet, with groove 103 being provided in second portion 1012, one end of groove 103 extending to the inlet. The groove 103 and the first part 1011 can form a step, so that the temperature distribution and the flow rate of the cooling liquid can be changed, the flow rate below the IGBT heat dissipation pin 220 can be increased through the groove 103, meanwhile, a part of the cooling liquid with low temperature can flow to a region with higher temperature on the IGBT substrate 210 through the groove 103, the temperature difference between the IGBT substrate 210 and the cooling liquid is indirectly increased, and the heat exchange amount is increased. In addition, the flow resistance of the cooling liquid in the groove 103 is relatively low, and the flow rate is relatively high, while the flow resistance of the first portion 1011 is relatively high and the flow rate is relatively low because the groove 103 is not provided. When the cooling liquid flows to the step formed between the groove 103 and the first portion 1011, the turbulence effect at the position can be increased under the influence of the step, the heat dissipation in the area is accelerated, and the heat convection effect is further improved.

In some embodiments, as shown in FIG. 2, the recess 103 comprises a first recess 1031 and a second recess 1032, the first recess 1031 being arranged proximate to the liquid inlet; the second recesses 1032 communicate with the first recesses 1031, the second recesses 1032 having a width direction perpendicular to the first direction, and the dimension of the second recesses 1032 in the width direction gradually decreasing along the first direction. Because the middle temperature of the IGBT substrate 210 is high, and the temperatures of the upper side and the lower side are lower, the second groove 1032 is designed to be gradually reduced along the first direction in the size in the width direction, so that the gaps between the upper side and the lower side of the IGBT substrate 210 and the flow channel 101 can be kept, the flow resistance in the middle of the flow channel 101 is reduced, the cooling liquid with low temperature is brought to the middle of the flow channel 101 as much as possible, the high-temperature area in the middle of the IGBT substrate 210 is cooled as much as possible, and the temperature difference and the heat exchange amount are indirectly increased.

In some embodiments, as shown in fig. 2, the dimension of the first recess 1031 in the width direction is equal to the dimension of the flow channel 101 in the width direction. In this way, the cooling liquid can enter the first recess 1031 while entering the flow channel 101, and the cooling liquid can rapidly flow to the high temperature region of the IGBT substrate 210.

In some embodiments, as shown in fig. 2, two groove walls of the second groove 1032 located in the first direction are configured as straight surfaces. That is, the second groove 1032 is V-shaped, which can reduce the flow resistance in the middle of the flow channel 101, and at the same time, can keep the flow resistance of the front and rear side walls, thereby facilitating the flow guidance of the cooling liquid, and bringing the cooling liquid with low temperature to the middle of the high temperature region of the IGBT substrate 210 as much as possible.

In some embodiments, the dimension of first portion 1011 in the first direction is less than the dimension of second portion 1012 in the first direction, and the other end of groove 103 extends to the intersection of first portion 1011 and second portion 1012. It will be appreciated that the recess 103 occupies a relatively large area on the flow channel 101, which improves the cooling effect on the IGBT.

A specific embodiment of the IGBT cooling device 100 according to the present invention will be described below with reference to the drawings.

As shown in fig. 1 to 4, the cooling device 100 for an IGBT includes a device body 10.

The flow deflecting portion 102 includes a plurality of convex portions 1021, and the plurality of convex portions 1021 are spaced apart in the first direction.

The convex portion 1021 is configured as a circular arc.

Any two adjacent convex parts 1021 are in arc transition connection.

Each protrusion 1021 is integrally formed with the inner sidewall of the flow channel 101.

The flow channel 101 comprises a first portion 1011 and a second portion 1012, the first portion 1011 being arranged adjacent to the liquid outlet; second portion 1012 is arranged adjacent to the inlet, and second portion 1012 is provided with a groove 103, one end of groove 103 extending to the inlet.

The recess 103 comprises a first recess 1031 and a second recess 1032, the first recess 1031 being arranged adjacent to the liquid inlet; the second recesses 1032 communicate with the first recesses 1031, the second recesses 1032 have a width direction perpendicular to the first direction, and the dimension of the second recesses 1032 in the width direction gradually decreases in the first direction.

The dimension of the first recess 1031 in the width direction is equal to the dimension of the flow path 101 in the width direction.

Two groove walls of the second groove 1032 located in the first direction are configured as straight surfaces.

In the description herein, references to the description of the terms "some embodiments," "optionally," "further," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A cooling device for an IGBT, comprising:

device main part (10), be equipped with runner (101), inlet and liquid outlet on device main part (10), the inlet with the liquid outlet intercommunication runner (101), runner (101) have the first direction of carrying the coolant liquid, be located of runner (101) the inside wall of first direction both sides is gone up and is scrambled flow portion (102), it is used for hindering to scramble flow portion (102) the coolant liquid flows.

2. The IGBT cooling device according to claim 1, wherein the deflection portion (102) includes a plurality of projections (1021), and the plurality of projections (1021) are arranged at intervals in the first direction.

3. The IGBT cooling device according to claim 2, wherein the convex portion (1021) is configured in a circular arc shape.

4. The IGBT cooling device according to claim 3, wherein any two adjacent protrusions (1021) are connected by a circular arc transition.

5. The IGBT cooling device according to claim 2, wherein each of the projections (1021) is formed integrally with an inner side wall of the flow passage (101).

6. The cooling device for an IGBT according to claim 1, wherein the flow channel (101) comprises:

a first portion (1011), said first portion (1011) being disposed proximate to said liquid outlet;

a second portion (1012), the second portion (1012) being arranged close to the liquid inlet, a groove (103) being arranged on the second portion (1012), one end of the groove (103) extending to the liquid inlet.

7. The IGBT cooling device according to claim 6, wherein the grooves (103) comprise:

a first recess (1031), the first recess (1031) being disposed proximate to the liquid inlet;

a second groove (1032), the second groove (1032) communicating with the first groove (1031), the second groove (1032) having a width direction perpendicular to the first direction, the dimension of the second groove (1032) in the width direction gradually decreasing along the first direction.

8. The cooling arrangement of the IGBT according to claim 7, wherein the dimension of the first recess (1031) in the width direction and the dimension of the flow channel (101) in the width direction are equal.

9. The cooling arrangement of the IGBT according to claim 7, characterized in that the two slot walls of the second slot (1032) in the first direction are configured as straight faces.

10. The cooling arrangement for an IGBT according to claim 6, characterized in that the dimension of the first portion (1011) in the first direction is smaller than the dimension of the second portion (1012) in the first direction, the other end of the recess (103) extending to the intersection of the first portion (1011) and the second portion (1012).