CN218183611U - Electromagnetic interference resistant circuit board - Google Patents
Electromagnetic interference resistant circuit board Download PDFInfo
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- CN218183611U CN218183611U CN202222265996.1U CN202222265996U CN218183611U CN 218183611 U CN218183611 U CN 218183611U CN 202222265996 U CN202222265996 U CN 202222265996U CN 218183611 U CN218183611 U CN 218183611U
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- circuit board
- electromagnetic
- shield cover
- electronic chip
- substrate layer
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Abstract
The utility model discloses an electromagnetic interference resistance's circuit board, including circuit board main part, electromagnetic shield cover, electronic chip, conducting strip and heat radiation structure, circuit board main part upper surface is provided with the electromagnetic shield cover, be provided with the substrate layer among the electromagnetic shield cover inner structure, substrate layer one side is provided with filler material, the filler material opposite side is provided with surface coating, the inside electronic chip that is provided with of electromagnetic shield cover utilizes its material to be beryllium copper through the substrate layer that sets up among the electromagnetic shield cover inner structure, can effectually shield electromagnetic signal, through the filler material of substrate layer one side setting, utilizes filler material's material to be silica gel, and reduction high frequency signal's attenuation that can be by a wide margin, through the surface coating of the setting of the filler material other end, utilizes its material to be direction cloth, and the electromagnetic effect of promotion electromagnetic shield cover that can step forward avoids electronic chip to receive external electromagnetic interference.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to an electromagnetic interference resistance's circuit board.
Background
Along with the requirement of the core voltage of the chip is lower and lower, the voltage of the PCB is required to be reduced, as more and more electronic products enter the daily life of people, the density of artificial electromagnetic energy is higher and higher, so that the electromagnetic environment is worsened increasingly, the measures of the existing circuit board structure in the aspect of dealing with electromagnetic interference are not in place, so that fluctuation is easily generated in the using process, and meanwhile, the heat dissipation measures of the existing circuit board structure are not good, so that the use of the circuit board structure is influenced.
Therefore, the prior art is not sufficient and needs to be improved.
SUMMERY OF THE UTILITY MODEL
To the defect that above-mentioned prior art exists, the utility model aims to provide an electromagnetic interference resistance's circuit board.
In order to achieve the above object, the utility model provides an electromagnetic interference resistance's circuit board, including circuit board main part, electromagnetic shield cover, electronic chip, conducting strip and heat radiation structure, circuit board main part upper surface is provided with the electromagnetic shield cover, be provided with the substrate layer among the electromagnetic shield cover inner structure, substrate layer one side is provided with filler material, the filler material opposite side is provided with surface coating, the inside electronic chip that is provided with of electromagnetic shield cover, circuit board main part lower surface is provided with the conducting strip, conducting strip one side is provided with heat radiation structure, there is main body housing among the heat radiation structure inner structure, the inside small-size motor that is provided with of main body housing, small-size motor is provided with a plurality of, every small-size motor output end fixedly connected with suction fan.
Preferably, the heat conducting sheet is arranged on the lower surface of the electronic chip, and silicone grease is arranged between the heat conducting sheet and the electronic chip.
Preferably, the base material layer is made of beryllium copper, the filling material is made of silica gel, and the surface coating layer is made of conductive cloth.
Preferably, the circuit board main part lower surface is provided with the silica gel fin, the silica gel fin is provided with a plurality of.
Preferably, each of the silicone fins has a thickness of 0.1 to 0.3 mm.
Preferably, the upper surface of the circuit board main body is provided with a groove, and the groove is provided with a plurality of grooves.
Preferably, the lower surface of the base material layer is flush with the upper surface of the circuit board main body.
Preferably, the material of the main body shell is composite resin.
Compared with the prior art, the beneficial effects of the utility model are that:
through the electromagnetic shield cover that sets up, can protect the electromagnetic wave effectively, when using, through the substrate layer that sets up in the electromagnetic shield cover inner structure, utilize its material to be beryllium copper, can effectually shield electromagnetic signal, and simultaneously, filler material through substrate layer one side setting, the material that utilizes filler material is silica gel, the decay of reduction high frequency signal that can be by a wide margin, on the other hand, through the surface coating that the filler material other end set up, utilize its material to be direction cloth, the electromagnetic shielding effect of promotion electromagnetic shield cover that can further, avoid electronic chip to receive external electromagnetic interference.
Through the heat radiation structure who sets up, can dispel the heat effectively to electronic chip, the conducting strip through the setting of electronic chip lower surface, can derive the heat, and simultaneously, utilize the silicone grease that sets up between conducting strip and the electronic chip, can become the flow state when the temperature risees, thereby the heat is better conducted, when using, through the small-size motor operation of the inside setting of heat radiation structure, can drive its output fixed connection's suction formula fan and rotate, utilize the rotation of suction formula fan, can take away the heat of conducting strip, through this kind of mode, can carry out sufficient radiating treatment to electronic chip, and then make the normal use of electronic chip.
Drawings
In order to illustrate the embodiments of the present invention more clearly, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the description below are some embodiments of the present invention, and those skilled in the art can also obtain other drawings without creative efforts.
Fig. 1 is a schematic perspective view of an electromagnetic interference shielding circuit board according to the present invention.
Fig. 2 is a side view of an electromagnetic interference shielding circuit board according to the present invention.
Fig. 3 is a schematic diagram of the internal material of the electromagnetic shielding cover in the electromagnetic interference shielding circuit board according to the present invention.
Fig. 4 is a cross-sectional view of a heat dissipation structure in an electromagnetic interference resistance circuit board according to the present invention.
Description of reference numerals:
1. a circuit board main body; 2. an electromagnetic shield; 201. a substrate layer; 202. a filler material; 203. coating the surface; 3. an electronic chip; 4. a groove; 5. a silica gel heat sink; 6. a heat conductive sheet; 7. a heat dissipation structure; 701. a main body housing; 702. a small-sized motor; 703. a suction fan.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly. It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
The terms "including" and "having," and any variations thereof, in the description and claims of the invention and the above description of the drawings are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order.
Referring to fig. 1-4, an electromagnetic interference resistant circuit board includes a circuit board main body 1, an electromagnetic shielding cover 2, an electronic chip 3, a heat conducting sheet 6 and a heat dissipation structure 7, the electromagnetic shielding cover 2 is disposed on an upper surface of the circuit board main body 1, a substrate layer 201 is disposed in an internal structure of the electromagnetic shielding cover 2, a filler 202 is disposed on one side of the substrate layer 201, a surface coating 203 is disposed on the other side of the filler 202, the electronic chip 3 is disposed in the electromagnetic shielding cover 2, the heat conducting sheet 6 is disposed on a lower surface of the circuit board main body 1, the heat dissipation structure 7 is disposed on one side of the heat conducting sheet 6, a main body housing 701 is disposed in the internal structure of the heat dissipation structure 7, a plurality of small motors 702 are disposed in the main body housing 701, a suction fan 703 is fixedly connected to an output end of each small motor 702, beryllium copper is used as the substrate layer 201 disposed in the internal structure of the electromagnetic shielding cover 2 to effectively shield electromagnetic signals, and silica gel is used as the filler 202 disposed on one side of the substrate layer 201 to substantially reduce attenuation of high frequency signals.
Referring to fig. 2, the heat conductive sheet 6 is disposed on the lower surface of the electronic chip 3, and silicone grease is disposed between the heat conductive sheet 6 and the electronic chip 3, so that the silicone grease becomes a flowing state when the temperature rises, thereby better conducting heat.
Referring to fig. 3, the material of the substrate layer 201 is beryllium copper, the material of the filling material 202 is silica gel, the material of the surface coating 203 is conductive cloth, and the surface coating 203 arranged at the other end of the filling material 202 is used as guide cloth, so that the electromagnetic shielding effect of the electromagnetic shielding case 2 can be further improved, and the electronic chip 3 is prevented from being interfered by external electromagnetic waves.
Referring to fig. 2, the lower surface of the circuit board main body 1 is provided with a plurality of silicone fins 5, so that the circuit board main body 1 can be subjected to better heat dissipation treatment.
Referring to fig. 2, the thickness of each silicone heat sink 5 is 0.1 to 0.3 mm.
Referring to fig. 1, the upper surface of the circuit board body 1 is provided with a groove 4, and the groove 4 is provided with a plurality of grooves.
Referring to fig. 3, the lower surface of the substrate layer 201 is flush with the upper surface of the circuit board main body 1, so that the substrate layer 201 and the circuit board main body 1 can be in direct contact, and the electromagnetic interference prevention effect can be ensured.
Referring to fig. 4, the main body housing 701 is made of composite resin, and the small motor 702 disposed inside the heat dissipation structure 7 is operated to drive the suction fan 703 fixedly connected to the output end of the main body housing to rotate, so that the heat of the heat conductive sheet 6 can be taken away by the rotation of the suction fan 703, and in this way, the electronic chip 3 can be sufficiently heat-dissipated, thereby enabling the electronic chip 3 to be normally used.
When the electromagnetic shielding cover is used, the electronic chip 3 can be effectively protected by the arranged electromagnetic shielding cover 2, when the electromagnetic shielding cover is used, the base material layer 201 arranged in the internal structure of the electromagnetic shielding cover 2 is used, beryllium copper is used as the material of the base material layer, electromagnetic signals can be effectively shielded, meanwhile, the filling material 202 arranged on one side of the base material layer 201 is used as silica gel, the attenuation of high-frequency signals can be greatly reduced, on the other hand, the surface coating 203 arranged on the other end of the filling material 202 is used as guide cloth, the electromagnetic shielding effect of the electromagnetic shielding cover 2 can be further improved, the electronic chip 3 is prevented from being interfered by external electromagnetism, through the arranged heat dissipation structure 7, the electronic chip 3 can be effectively dissipated, the heat conducting sheet 6 arranged on the lower surface of the electronic chip 3 can be used for leading out heat, meanwhile, the silicone grease arranged between the heat conducting sheet 6 and the electronic chip 3 can be changed into a flowing state when the temperature is raised, so that the heat conducting sheet 703 can be fully used for carrying away the heat of the electronic chip 3, and the suction fan 703 can be used for fully treating the heat of the electronic chip 3.
The above description is only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; all the equivalent structures or equivalent flow changes made by using the contents of the specification and the attached drawings of the present invention, or the direct or indirect application in other related technical fields, are included in the patent protection scope of the present invention.
Claims (8)
1. The utility model provides an electromagnetic interference resistance's circuit board, includes circuit board main part, electromagnetic shield cover, electronic chip, conducting strip and heat radiation structure, its characterized in that: the utility model discloses a circuit board, including circuit board main part, circuit board main part upper surface, be provided with the electromagnetic shield cover, be provided with the substrate layer among the electromagnetic shield cover inner structure, substrate layer one side is provided with filler material, the filler material opposite side is provided with surface coating, the inside electronic chip that is provided with of electromagnetic shield cover, circuit board main part lower surface is provided with the conducting strip, conducting strip one side is provided with heat radiation structure, there is main body housing among the heat radiation structure inner structure, the inside small-size motor that is provided with of main body housing, small-size motor is provided with a plurality of, every small-size motor output end fixedly connected with suction fan.
2. An EMI resistant circuit board as recited in claim 1, wherein: the heat conducting sheet is arranged on the lower surface of the electronic chip, and silicone grease is arranged between the heat conducting sheet and the electronic chip.
3. The electromagnetic interference prevention circuit board of claim 1, wherein: the material of the substrate layer is beryllium copper, the material of the filling material is silica gel, and the material of the surface coating is conductive cloth.
4. An EMI resistant circuit board as recited in claim 1, wherein: the circuit board is characterized in that a silica gel radiating fin is arranged on the lower surface of the circuit board main body, and a plurality of silica gel radiating fins are arranged on the silica gel radiating fin.
5. The EMI resistant circuit board of claim 4, wherein: the thickness of each silica gel fin is 0.1 to 0.3 millimeters.
6. An EMI resistant circuit board as recited in claim 1, wherein: the upper surface of the circuit board main body is provided with a groove, and the groove is provided with a plurality of grooves.
7. The electromagnetic interference prevention circuit board of claim 1, wherein: the lower surface of the substrate layer is flush with the upper surface of the circuit board main body.
8. An EMI resistant circuit board as recited in claim 1, wherein: the main body shell is made of composite resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222265996.1U CN218183611U (en) | 2022-08-26 | 2022-08-26 | Electromagnetic interference resistant circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222265996.1U CN218183611U (en) | 2022-08-26 | 2022-08-26 | Electromagnetic interference resistant circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218183611U true CN218183611U (en) | 2022-12-30 |
Family
ID=84620358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222265996.1U Active CN218183611U (en) | 2022-08-26 | 2022-08-26 | Electromagnetic interference resistant circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218183611U (en) |
-
2022
- 2022-08-26 CN CN202222265996.1U patent/CN218183611U/en active Active
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