CN218181445U

CN218181445U - 2U server case

Info

Publication number: CN218181445U
Application number: CN202222142116.1U
Authority: CN
Inventors: 聂爱君
Original assignee: Dongguan Chuyu Computer Technology Co ltd
Current assignee: Dongguan Chuyu Computer Technology Co ltd
Priority date: 2022-08-15
Filing date: 2022-08-15
Publication date: 2022-12-30
Anticipated expiration: 2032-08-15

Abstract

The utility model provides a 2U server machine case, include: the main board module is arranged at the bottom layer of the case body, and the arrangement position of the main board module corresponds to the arrangement position of an interface module of a rear panel of the case body; the PCIE module is arranged on the rear panel of the case main body through the rear wall die casting and is arranged above the interface module of the case main body; the power module is arranged at the bottom of one side of the case body close to the rear panel. The utility model has the advantages of reasonable design and high-efficient to can also pass through the design of back wall die casting further improves the compatible design of product. The utility model discloses can satisfy the assembly convenience degree and the nimble application degree of 2U server simultaneously, provide more favorable basis for the renewal of generation and the later maintenance of product.

Description

2U server case

Technical Field

The utility model relates to a server machine case especially relates to a 2U server machine case.

Background

The 2U server is widely used in a rack-type mounted server rack, the size of the server is a fixed standard, and especially the limitation of the width size is more strict. Therefore, how to improve the structural optimization design degree of the server chassis in a limited size, further accommodating more PCIE and/or hard disks, how to improve the compatibility design thereof, and also being beneficial to the assembly of the server, undoubtedly can provide a more favorable basis for the update and the later maintenance of products.

Disclosure of Invention

The utility model aims to solve the technical problem that a need provide one kind and can hold more PCIE and/or hard disk to can improve the 2U server machine case of the compatible design of product, and then aim at satisfying 2U server's assembly convenience degree and nimble application degree simultaneously, provide more favorable basis for the renewal and later maintenance of product.

To this end, the utility model provides a 2U server machine case, include: the main board module is arranged at the bottom layer of the case body, and the arrangement position of the main board module corresponds to the arrangement position of an interface module of a rear panel of the case body; the PCIE module is arranged on the rear panel of the case main body through the rear wall die casting and is arranged above the interface module of the case main body; the power module is arranged at the bottom of one side of the case main body close to the rear panel.

The utility model discloses a further improvement lies in, machine case main part is including lower floor's main part and the upper main part of integration, the width of lower floor's main part is less than the width of upper main part.

The utility model discloses a further improvement lies in, the width of lower floor's main part is 433 to 434mm, the width of upper main part is 444 to 445mm.

The utility model discloses a further improvement lies in, back wall die casting includes first installation window, first installation window set up in chassis main body's interface module top, two sets of PCIE module that pile up the setting detachable set up in among the first installation window, each group piles up the PCIE module that sets up and includes three PCIE module.

The utility model discloses a further improvement lies in, back wall die casting still includes second installation window, second installation window set up in power module's top, four PCIE modules or four hard disk modules can dismantle set up in among the second installation window.

The utility model discloses a further improvement lies in, power module includes two power module that set up side by side, and each power module's top sets up one the second installation window, each pile up among the second installation window and be provided with two PCIE modules or two hard disk modules.

The utility model discloses a further improvement lies in, the distance that the horizontal center pin of three PCIE module in the first installation window and chassis main body bottom is 30 respectively to 31mm, 51 respectively to 52mm and 71 respectively to 72mm in proper order; the distances between the transverse central axes of the two PCIE modules in the second mounting window and the bottom of the case main body are respectively 54 to 55mm and 73 to 74mm in sequence; the distances between the transverse central axes of the two hard disk modules in the second mounting window and the bottom of the case main body are respectively 53-54mm and 71-72mm in sequence.

The utility model discloses a further improvement lies in, still includes leading hard disk module and radiator fan module, leading hard disk module set up in chassis main body is close to the one end of front panel, the radiator fan module set up in between leading hard disk module and the mainboard module.

The utility model discloses a further improvement lies in, hard disk module array set up in case main body is close to the one end of front panel, the position of radiator fan module with the position of hard disk module is corresponding.

The utility model discloses a further improvement lies in, still includes the wind scooper of integration, the wind scooper set up in the top of mainboard module.

Compared with the prior art, the beneficial effects of the utility model reside in that: the mainboard module is arranged at the bottom layer of the case main body, and the arrangement position of the mainboard module corresponds to the arrangement position of the interface module of the rear panel of the case main body; the PCIE module is arranged on the rear panel of the case main body through the rear wall die casting and is arranged above the interface module of the case main body, so that the rationality of the overall structural design and the layout of the product is improved, and the performance is high; and the 2U server chassis can further improve the compatibility design of products through the design of the rear wall die casting. The utility model discloses can satisfy 2U server's assembly convenience degree and nimble application degree simultaneously, provide more favorable basis for the renewal of product and later maintenance.

Drawings

Fig. 1 is a schematic structural diagram of a main case body according to an embodiment of the present invention;

fig. 2 is a schematic top view of an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a rear panel according to an embodiment of the present invention;

fig. 4 is a schematic top view of another embodiment of the present invention;

fig. 5 is a schematic structural view of a rear panel according to another embodiment of the present invention;

fig. 6 is a schematic structural diagram of a front panel according to an embodiment of the present invention;

fig. 7 is a schematic perspective view of an embodiment of the present invention.

Detailed Description

Preferred embodiments of the present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1 to 7, the present embodiment provides a 2U server chassis, including: the chassis comprises a chassis main body 1, a mainboard module 2, a rear wall die casting 3, a PCIE module 4 and a power module 5, wherein the mainboard module 2 is arranged at the bottom layer of the chassis main body 1, and the arrangement position of the mainboard module 2 corresponds to the arrangement position of an interface module 103 of a rear panel of the chassis main body 1; the PCIE module 4 is arranged on the rear panel of the case body 1 through the rear wall die casting 3 and is arranged above the interface module 103 of the case body 1; the power module 5 is arranged at the bottom of one side of the case body 1 close to the rear panel. Namely the internal structure of the chassis body 1 is divided into four layers from the bottom, one layer at the bottom is used for setting the motherboard module 2, and the three layers above are used for setting the PCIE module 4, so that the overall structure design is more reasonable and efficient, the heat dissipation performance is good, and meanwhile, more spaces are reserved for the PCIE module 4, and six full-height and full-length PCIE modules 4 can be arranged above the interface module 103.

As shown in fig. 1, the chassis main body 1 of the present embodiment preferably includes a lower main body 101 and an upper main body 102 which are integrated, and a width of the lower main body 101 is smaller than a width of the upper main body 102; the power module 5 is disposed on one side of the lower main body 101 close to the rear panel. More specifically, in the present embodiment, the width of the lower layer main body 101 of the case main body 1 is 433 to 434mm, and the width of the upper layer main body 102 is 444 to 445mm. More preferably, the width of the lower body 101 of the main cabinet 1 is 433.4mm, and the width of the upper body 102 is 444.4mm, so that a reasonable width difference exists between the upper layer and the lower layer of the main cabinet 1; the present embodiment further preferably includes a chassis guide rail, which is not drawn in the present embodiment, the structure of the chassis guide rail is not limited, the chassis guide rail is disposed on the outer side of the lower main body 101, so that the 2U server chassis is conveniently assembled into a rack-type server rack, and the assembly is simple and efficient, and the use is convenient.

As shown in fig. 1 and 7, in this embodiment, the rear wall die casting 3 includes a first installation window 301, the first installation window 301 is a die-casting installation window of the PCIE module 4, the first installation window 301 is disposed above the interface module 103 of the chassis body 1, two sets of PCIE modules 4 stacked in a stacked manner are detachably disposed in the first installation window 301, and each set of PCIE module 4 stacked in a stacked manner includes three PCIE modules 4, so that, in two first installation windows 301, the space above the interface module 103 can be efficiently utilized to dispose six PCIE modules 4.

As shown in fig. 1 and 7, in this embodiment, the rear wall die casting 3 further includes a second installation window 302, the second installation window 302 is a die-casting installation window that is common to the PCIE module 4 and the hard disk module 6, the second installation window 302 is disposed above the power module 5, and four PCIE modules 4 or four hard disk modules 6 are detachably disposed in the second installation window 302, more specifically, in this embodiment, the power module 5 includes two power modules disposed side by side, one second installation window 302 is disposed above each power module, and two PCIE modules 4 or two hard disk modules 6 are stacked in each second installation window 302. Therefore, in the present embodiment, four PCIE modules 4 can be disposed by efficiently utilizing the space above the power module 5, as shown in fig. 3; or four hard disk modules 6 are arranged in the space above the power module 5, as shown in fig. 5. Therefore, the rear panel of this embodiment can be compatible with ten PCIE modules 4, or the design of six PCIE modules 4 and four hard disk modules 6, and is strong in compatibility and high in flexibility.

It is worth mentioning that, as shown in fig. 1 and fig. 3, distances between horizontal central axes of three PCIE modules 4 in the first mounting window 301 and the bottom of the chassis main body 1 in this embodiment are respectively 30 to 31mm, 51 to 52mm, and 71 to 72mm in sequence; more preferably, the distances are 30.93mm, 51.25mm and 71.57mm, respectively, in this order. In this embodiment, the distances between the transverse central axes of the two PCIE modules 4 in the second mounting window 302 and the bottom of the chassis main body 1 are 54 to 55mm and 73 to 74mm, respectively; more preferably, the distances are 54.5mm and 73.65mm, respectively. As shown in fig. 1 and fig. 5, in this embodiment, distances between the horizontal central axes of the two hard disk modules 6 in the second mounting window 302 and the bottom of the chassis main body 1 are respectively 53 to 54mm and 71 to 72mm in sequence, and more preferably, the distances are respectively 53.6mm and 71.1mm in sequence. Such design of this embodiment, can be in the limited space and the height limit within range of 2U server machine case six full-height full-length PCIE modules 4 of the top overall arrangement of interface module 103 to four PCIE modules 4 or four hard disk modules 6 can be arranged in the top of power module 5, have broken through the interval design of current 2U server machine case, and this embodiment overall structure design and overall arrangement are reasonable and high-efficient.

As shown in fig. 6 and 7, the present embodiment further includes a front hard disk module 7 and a heat dissipation fan module 8, where the front hard disk module 7 is disposed at an end of the chassis body 1 close to the front panel, and the heat dissipation fan module 8 is disposed between the front hard disk module 7 and the motherboard module 2. This embodiment hard disk module 6 array set up in case body 1 is close to the one end of front panel, can set up totally twelve hard disk module 6, hard disk module 6's both sides are case body 1's hangers 10, still be provided with interface unit 11 on the hangers 10, be convenient for realize case body 1's interface connection function, convenient to use and be convenient for maintain. In this embodiment, the position of the cooling fan module 8 corresponds to the position of the hard disk module 6, which is convenient for effective cooling of the product. More preferably, the present embodiment further includes an integrated air guiding cover 9, and the air guiding cover 9 is disposed above the motherboard module 2, so as to further improve the heat dissipation efficiency.

As shown in fig. 2 and fig. 4, the motherboard module 2 of this embodiment includes a first CPU module 201, a second CPU module 202, and a memory module 203, the first CPU module 201 and the second CPU module 202 are symmetrically disposed at one end of the motherboard module 2 close to the front panel of the chassis main body 1, and the memory module 203 is disposed at two sides of the first CPU module 201 and the second CPU module 202, so as to meet the high performance design requirement of the 2U server chassis, facilitate the connection between the motherboard module 2 and other modules, and improve the assembly efficiency of the product.

In summary, in this embodiment, the motherboard module 2 is disposed at the bottom layer of the chassis main body 1, and the disposition position of the motherboard module 2 corresponds to the disposition position of the interface module 103 on the rear panel of the chassis main body 1; the PCIE module 4 is arranged on the rear panel of the chassis main body 1 through the rear wall die casting 3 and is arranged above the interface module 103 of the chassis main body 1, so that the reasonability of the overall structural design and the layout of a product is improved, and the performance is high; and the 2U server chassis can further improve the compatible design of products through the design of the rear wall die casting 3. The embodiment can simultaneously meet the assembly convenience degree and the flexible application degree of the 2U server, and provides a more favorable foundation for updating and post-maintenance of products.

The above-mentioned embodiments are the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention includes and is not limited to the above-mentioned embodiments, and all equivalent changes made according to the shape and structure of the present invention are within the protection scope of the present invention.

Claims

1. A2U server chassis, comprising: the main board module is arranged at the bottom layer of the case body, and the arrangement position of the main board module corresponds to the arrangement position of an interface module of a rear panel of the case body; the PCIE module is arranged on the rear panel of the case main body through the rear wall die casting and is arranged above the interface module of the case main body; the power module is arranged at the bottom of one side of the case body close to the rear panel.

2. The 2U server chassis of claim 1, wherein the chassis body comprises a lower body and an upper body that are unitary, the lower body having a width that is less than a width of the upper body.

3. The 2U server case of claim 2, wherein the width of the lower main body is 433 to 434mm, and the width of the upper main body is 444 to 445mm.

4. The 2U server chassis of any one of claims 1 to 3, wherein the rear wall die casting includes a first mounting window, the first mounting window is disposed above the interface module of the chassis body, two sets of stacked PCIE modules are detachably disposed in the first mounting window, and each set of stacked PCIE modules includes three PCIE modules.

5. The 2U server chassis of claim 4, wherein the rear wall die casting further comprises a second mounting window disposed above the power module, and wherein four PCIE modules or four hard disk modules are detachably disposed in the second mounting window.

6. The 2U server chassis of claim 5, wherein the power modules include two power modules arranged side by side, one second mounting window is disposed above each power module, and two PCIE modules or two hard disk modules are stacked in each second mounting window.

7. The 2U server case of claim 6, wherein distances between a transverse central axis of the three PCIE modules in the first mounting window and the bottom of the case body are respectively 30 to 31mm, 51 to 52mm and 71 to 72mm in sequence; the distances between the transverse central axes of the two PCIE modules in the second mounting window and the bottom of the case main body are respectively 54 to 55mm and 73 to 74mm in sequence; the distances between the transverse central axes of the two hard disk modules in the second mounting window and the bottom of the case main body are respectively 53-54mm and 71-72mm in sequence.

8. The 2U server case according to any one of claims 1 to 3, further comprising a front hard disk module and a heat dissipation fan module, wherein the front hard disk module is disposed at an end of the case body close to the front panel, and the heat dissipation fan module is disposed between the front hard disk module and the motherboard module.

9. The 2U server case of claim 8, wherein the hard disk modules are arranged in an array at an end of the case body near the front panel, and the positions of the heat dissipation fan modules correspond to the positions of the hard disk modules.

10. The 2U server chassis of claim 8, further comprising an integrated wind scooper disposed above the motherboard module.