CN218170963U - Mirror surface disc for wafer cutting machine - Google Patents
Mirror surface disc for wafer cutting machine Download PDFInfo
- Publication number
- CN218170963U CN218170963U CN202222387281.3U CN202222387281U CN218170963U CN 218170963 U CN218170963 U CN 218170963U CN 202222387281 U CN202222387281 U CN 202222387281U CN 218170963 U CN218170963 U CN 218170963U
- Authority
- CN
- China
- Prior art keywords
- annular
- mirror surface
- wafer
- cutting machine
- wafer cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a mirror surface disc for a wafer cutting machine, which belongs to the technical field of wafer cutting, and comprises a mirror surface disc body, a placing groove arranged at the top end of the mirror surface disc body and an adjusting structure arranged in the placing groove and used for adjusting according to the size of a wafer; the adjustment structure includes: the first annular groove and the second annular groove are both arranged at the bottom end of the inner wall of the placing groove; annular stopper one, annular stopper two, annular stopper one, annular stopper two respectively with ring channel one, two inner wall sliding connection of ring channel, and the telescopic link, the telescopic link is equipped with two sets ofly, two sets of telescopic links fixed mounting respectively in annular stopper one, two bottoms of annular stopper, the utility model discloses a control two sets of telescopic links control the lift of annular stopper one, annular stopper two, adjust and place the area, can adjust according to the size of the wafer of waiting to cut to carry on spacingly to it, subsequent cutting location of being convenient for.
Description
Technical Field
The utility model relates to a wafer cutting technical field specifically is a mirror face dish for wafer cutting machine.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the original material thereof is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After a silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed, and the main processing modes of the wafer are wafer processing and batch processing, namely 1 or more wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more and more advanced, so that new data characteristics appear in wafer processing. After crystalline silicon is processed, in order to make things convenient for the light carving equipment, so have certain specification, generally the very big piece of discoid, the light carving is in batches, after all carving on a big piece, just need a piece to cut off, then continue processing, can use the anchor clamps dish among the wafer cutting process.
The existing patent numbers are: CN202021519703.2 discloses a mirror surface dish for wafer cutting machine, including mirror surface dish body, the circumference side of mirror surface dish body is provided with the arc ear piece of four equal central angles, this internal linear type gas channel hole that is provided with of mirror surface dish, the aperture with gas channel hole intercommunication, the bottom surface of mirror surface dish body is provided with the circular slot, the circular slot communicates with the inlet end in all gas channel holes, the bottom plate face equipartition of circular slot has the aperture.
Above-mentioned simple structure, design benefit, through the arc ear piece that sets up four equal central angles, mirror dish body forms tensile stress, has strengthened the structural stability of mirror dish body, has avoided mirror dish body to lead to the wafer cutting precision to reduce because of deformation, the setting of a plurality of apertures for vacuum adsorption power is more even, and the adsorptivity is better.
But the space of placing the mirror face dish body outer wall of wafer is great, and the size of the wafer of unable cutting as required is spacing to it, and the position is more partially when placing, fixes a position when the cutting of not being convenient for, influences the use.
Therefore, the invention discloses a mirror surface disc for a wafer cutting machine.
SUMMERY OF THE UTILITY MODEL
The present invention has been made in view of the above and/or other problems occurring in the conventional mirror surface plate for a wafer cutting machine.
Therefore, the utility model aims at providing a mirror dish for wafer cutting machine can solve the above-mentioned space that provides the current mirror dish body outer wall of placing the wafer great, and the size of the wafer that can't cut as required is spacing to it, and the position is more inclined to one side when placing, fixes a position when being not convenient for cut, influences the problem of use.
In order to solve the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
a mirror disk for a wafer saw, comprising: the mirror surface disc comprises a mirror surface disc body, a placing groove and an adjusting structure, wherein the placing groove is formed in the top end of the mirror surface disc body, and the adjusting structure is installed in the placing groove and used for adjusting according to the size of a wafer;
the adjustment structure includes:
the first annular groove and the second annular groove are both arranged at the bottom end of the inner wall of the placing groove;
the annular limiting block I and the annular limiting block II are respectively connected with the inner walls of the annular groove I and the annular groove II in a sliding manner, and
the telescopic rods are two groups, and the two groups of telescopic rods are fixedly installed at the bottom ends of the first annular limiting block and the second annular limiting block respectively.
As a preferred scheme of a mirror dish for wafer cutting machine, wherein: place recess inner wall bottom and cut apart into backup pad one, backup pad two, backup pad three by ring channel one, ring channel two, the equal fixedly connected with bracing piece in backup pad one, two bottoms of backup pad, the bottom of bracing piece, telescopic link all with mirror surface dish body inner wall bottom fixed connection.
As a preferred scheme of a mirror dish for wafer cutting machine, wherein: and the first support plate, the second support plate and the third support plate are all connected with adsorption components.
As a preferred scheme of a mirror dish for wafer cutting machine, wherein: the accessory component comprises: and the adsorption holes are provided with three groups which are respectively arranged at the top ends of the first support plate, the second support plate and the third support plate, and the bottom ends of the three groups of adsorption holes are respectively connected with the first annular pipe, the second annular pipe and the third annular pipe through pipelines.
As a preferred scheme of a mirror dish for wafer cutting machine, wherein: the mirror surface dish body one side has seted up the connector, the connector is equipped with three groups, and three groups of connectors are connected with the output of annular pipe one output, two outputs of annular pipe and annular pipe three respectively.
As a preferred scheme for a mirror dish for wafer cutting machine, wherein: and a rubber pad is fixedly arranged on the inner wall of the adsorption hole.
As a preferred scheme for a mirror dish for wafer cutting machine, wherein: the top end of the rubber pad extends out of the top end of the adsorption hole by one millimeter.
Compared with the prior art:
through the lift of controlling two sets of telescopic links control annular stopper one, annular stopper two, adjust and place the area, can adjust according to the size of the wafer that waits to cut to it is spacing, the subsequent cutting location of being convenient for.
Drawings
FIG. 1 is a front view of the present invention;
fig. 2 is an internal bottom view of the present invention;
fig. 3 is a front view of fig. 2 of the present invention;
fig. 4 isbase:Sub>A sectional view of the areabase:Sub>A-base:Sub>A in fig. 3 according to the present invention.
In the figure: the mirror surface disc comprises a mirror surface disc body 1, a connecting opening 2, a placing groove 3, a first supporting plate 4, a second supporting plate 5, a third supporting plate 6, a supporting rod 7, a first annular groove 8, a second annular groove 9, a first annular limiting block 10, a second annular limiting block 11, an adsorption hole 12, a rubber pad 13, a first annular pipe 15, a second annular pipe 16, a third annular pipe 17 and a telescopic rod 18.
Detailed Description
To make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The utility model provides a mirror surface disc for a wafer cutting machine, which has the advantages of convenient use and application range expansion, please refer to fig. 1-4, which comprises a mirror surface disc body 1, a placing groove 3 arranged at the top end of the mirror surface disc body 1 and an adjusting structure arranged in the placing groove 3 and used for adjusting according to the size of a wafer;
the adjustment structure includes: the first annular groove 8 and the second annular groove 9 are formed in the bottom end of the inner wall of the placing groove 3; annular stopper one 10, annular stopper two 11, annular stopper one 10, annular stopper two 11 respectively with ring channel one 8, ring channel two 9 inner wall sliding connection, and telescopic link 18, telescopic link 18 is equipped with two sets ofly, two sets of telescopic link 18 are fixed mounting in annular stopper one 10 respectively, annular stopper two 11 bottoms, place recess 3 inner wall bottom by ring channel one 8, ring channel two 9 is cut apart into backup pad one 4, backup pad two 5, backup pad three 6, backup pad one 4, the equal fixedly connected with bracing piece 7 in backup pad two 5 bottoms, bracing piece 7, the bottom of telescopic link 18 all with mirror surface dish body 1 inner wall bottom fixed connection, backup pad one 4, backup pad two 5, all be connected with the absorption subassembly on the backup pad three 6, through controlling annular stopper one 10, the telescopic link 18 of annular stopper two 11 bottoms is adjusted and is placed the area, be convenient for fix a position the wafer, make things convenient for follow-up cutting.
The adsorption component comprises: adsorb hole 12, adsorb hole 12 and be equipped with three groups, set up respectively in backup pad one 4, the top of backup pad two 5 and backup pad three 6, three groups adsorb 12 bottoms in hole and be connected with annular pipe one 15 respectively through the pipeline, annular pipe two 16, annular pipe three 17, connector 2 has been seted up to 1 one side of mirror dish body, connector 2 is equipped with three groups, three groups of connectors 2 respectively with annular pipe one 15 output, the output of annular pipe two 16 outputs and annular pipe three 17 is connected, the input and the connector 2 of taking out the vacuum pump are connected, transmit suction to adsorbing hole 12 and adsorb the wafer.
A rubber pad 13 is fixedly arranged on the inner wall of the adsorption hole 12, and the top end of the rubber pad 13 extends out of one millimeter of the top end of the adsorption hole 12.
When the device is used specifically, a person skilled in the art places a wafer to be cut in the placing groove 3 formed in the top end of the mirror surface disc body 1, and adjusts the two groups of telescopic rods 18 according to the size of the wafer;
for example: when the size of the wafer is the same as that of the first support plate 4, the telescopic rod 18 at the bottom end of the first annular limiting block 10 is controlled to push the first annular limiting block 10 to ascend to limit the wafer, the adsorption hole 12 formed in the first support plate 4 is connected with the connecting port 2 of the first annular pipe 15 connected with the bottom end and is connected with the input end of the vacuum pump to extract vacuum, the wafer is adsorbed, and meanwhile the air leakage is avoided due to the fact that the raised one-millimeter rubber pad 13 is in contact with the bottom end of the wafer;
when the size of the wafer is the same as that of the combination of the first support plate 4 and the second support plate 5, the telescopic rod 18 at the bottom end of the second annular limiting block 11 is controlled to push the wafer to ascend to limit the wafer, the bottom end of the adsorption hole 12 formed in the first support plate 4 is connected with the first annular pipe 15, the bottom end of the adsorption hole 12 formed in the second support plate 5 is connected with the second annular pipe 16, the output ends of the first annular pipe 15 and the second annular pipe 16 are respectively connected with the two groups of connectors 2, the two groups of connectors 2 are both connected with the input end of a vacuum pump, vacuum pumping is performed, and the wafer is adsorbed;
the cutting tool is convenient to use, can be adjusted according to the size of a wafer to be cut, limits the wafer to be cut and is convenient for subsequent cutting and positioning.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (7)
1. A mirror surface disc for a wafer cutting machine comprises a mirror surface disc body (1) and is characterized by further comprising a placing groove (3) formed in the top end of the mirror surface disc body (1) and an adjusting structure arranged in the placing groove (3) and used for adjusting according to the size of a wafer;
the adjustment structure includes:
the first annular groove (8) and the second annular groove (9) are formed in the bottom end of the inner wall of the placing groove (3);
a first annular limiting block (10) and a second annular limiting block (11), wherein the first annular limiting block (10) and the second annular limiting block (11) are respectively connected with the inner walls of the first annular groove (8) and the second annular groove (9) in a sliding manner, and
the telescopic rods (18) are arranged in two groups, and the two groups of telescopic rods (18) are fixedly installed at the bottom ends of the first annular limiting block (10) and the second annular limiting block (11) respectively.
2. The mirror surface disk for the wafer cutting machine according to claim 1, wherein the bottom end of the inner wall of the placing groove (3) is divided into a first supporting plate (4), a second supporting plate (5) and a third supporting plate (6) by a first annular groove (8) and a second annular groove (9), the bottom ends of the first supporting plate (4) and the second supporting plate (5) are fixedly connected with a supporting rod (7), and the bottom ends of the supporting rod (7) and the telescopic rod (18) are fixedly connected with the bottom end of the inner wall of the mirror surface disk body (1).
3. The mirror surface disk for the wafer cutting machine according to claim 2, wherein the first supporting plate (4), the second supporting plate (5) and the third supporting plate (6) are connected with an adsorbing component.
4. The mirror surface disk for wafer cutting machine according to claim 3, wherein the suction assembly comprises: the adsorption holes (12) are provided with three groups of adsorption holes (12) which are respectively arranged at the top ends of the first support plate (4), the second support plate (5) and the third support plate (6), and the bottom ends of the three groups of adsorption holes (12) are respectively connected with a first annular pipe (15), a second annular pipe (16) and a third annular pipe (17) through pipelines.
5. The mirror panel for the wafer cutting machine according to claim 4, wherein the mirror panel body (1) has three sets of connectors (2) on one side, and the three sets of connectors (2) are respectively connected to the output end of the ring tube I (15), the output end of the ring tube II (16) and the output end of the ring tube III (17).
6. The mirror surface disk for the wafer cutting machine according to claim 4, wherein a rubber pad (13) is fixedly installed on the inner wall of the absorption hole (12).
7. The mirror surface disk for the wafer cutting machine according to claim 6, wherein the top end of the rubber pad (13) extends one millimeter beyond the top end of the suction hole (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222387281.3U CN218170963U (en) | 2022-09-06 | 2022-09-06 | Mirror surface disc for wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222387281.3U CN218170963U (en) | 2022-09-06 | 2022-09-06 | Mirror surface disc for wafer cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218170963U true CN218170963U (en) | 2022-12-30 |
Family
ID=84623463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222387281.3U Active CN218170963U (en) | 2022-09-06 | 2022-09-06 | Mirror surface disc for wafer cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218170963U (en) |
-
2022
- 2022-09-06 CN CN202222387281.3U patent/CN218170963U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201820514A (en) | Wafer transporting apparatus, processing chamber, mechanical arm, semiconductor apparatus, and wafer transporting method | |
| CN218170963U (en) | Mirror surface disc for wafer cutting machine | |
| CN108340080B (en) | Automatic alignment jig | |
| US4773951A (en) | Method of manufacturing wafers of semiconductor material | |
| CN216773213U (en) | Wafer sucking disc of adjustable wafer size | |
| CN116525528A (en) | Clamping calibration device for manufacturing ultrathin wafer carrier substrate and use method | |
| CN209766388U (en) | Mechanical arm for efficient wafer transmission | |
| CN109531844B (en) | Multi-wire cutting device, multi-wire cutting method and application thereof | |
| CN215966980U (en) | Clamping mechanism for wafer slicer | |
| CN213715699U (en) | Ceramic sucker for photoetching machine | |
| CN208385382U (en) | substrate calibration device | |
| CN221201139U (en) | Heat treatment clamp for semiconductor wafer | |
| CN213917735U (en) | Grinding sucking disc of wafer back grinding machine | |
| CN218808992U (en) | Sucking disc is used in wafer processing | |
| CN213829783U (en) | Mirror surface disc for wafer cutting machine | |
| CN220382072U (en) | Wafer taking structure and wafer detecting system | |
| CN221041059U (en) | Flower basket compatible with bearing of multi-size silicon wafers | |
| JP2021077815A (en) | Vacuum processing apparatus | |
| CN219066778U (en) | High-precision silicon wafer carrying disc | |
| CN220052397U (en) | Heterojunction solar cell cutting and positioning device | |
| CN218139107U (en) | Adjustable clamp of wafer cutting machine | |
| CN212735527U (en) | Silicon wafer polishing jig | |
| CN221201130U (en) | Adsorption carrier for wafer heat treatment | |
| CN219626635U (en) | Combined clamp for wafer processing | |
| CN221019229U (en) | Novel bearing device for laser cutting of glass wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |