CN218163029U - Multi-layer flexible circuit board - Google Patents
Multi-layer flexible circuit board Download PDFInfo
- Publication number
- CN218163029U CN218163029U CN202221758766.2U CN202221758766U CN218163029U CN 218163029 U CN218163029 U CN 218163029U CN 202221758766 U CN202221758766 U CN 202221758766U CN 218163029 U CN218163029 U CN 218163029U
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- China
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- circuit
- copper foil
- multilayer flexible
- layer
- foil layer
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Abstract
The utility model relates to a multilayer flexible circuit board, including the copper foil layer of multilayer formation circuit, set up the combination glue film that is used for laminating between adjacent two-layer copper foil layer, be formed with a plurality of heat conduction and carminative fretwork holes on the circuit, upper surface and the lower surface of fretwork hole intercommunication circuit. The lines form a grid shape. The utility model discloses a to the fretwork design of circuit, can spread into the temperature into the combination when toasting and glue in and in time discharge moisture to it explodes to open badly to appear the inflation in avoiding the high temperature processing procedure, improves the goods quality.
Description
Technical Field
The utility model relates to a multilayer flexible printed circuit board product.
Background
The FPC multilayer board contains the combination glue, and the combination glue can expand and burst instantly after being subjected to high temperature in certain manufacturing processes, so that the product is poor. In order to reduce the poor expansion and bursting of the combined glue, the product needs to be baked before the thermal process is carried out, and the moisture in the product is removed, so that the product cannot burst after being subjected to high temperature.
However, some products still have poor expansion and bursting after heating due to the special design, such as no vent holes on the product or large copper skin on the outer layer of the product, and the baking temperature can not be transmitted to the inside of the product, and the moisture in the inside of the product can not be exhausted by baking.
Disclosure of Invention
The utility model aims at providing a can toast and get rid of the moisture to can not appear expanding and explode the bad multilayer flexible printed circuit board goods.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a multilayer flexible circuit board, includes the copper foil layer that the multilayer formed the circuit, set up in adjacent two-layer be used for carrying out the combination glue film of laminating between the copper foil layer, be formed with a plurality of fretwork holes that can conduct heat and exhaust on the circuit, the fretwork hole intercommunication the upper surface and the lower surface of circuit.
The aperture of the hollow hole is different according to the position of the hollow hole.
The lines form a grid shape.
And the hollow holes are formed on the circuits of the copper foil layer at least on the outermost layer.
The hollow holes are polygonal.
The hollow holes are arranged in an array or in a staggered manner.
Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages: the utility model discloses a to the fretwork design of circuit, can spread into the temperature into the combination when toasting and glue in and in time discharge moisture to it explodes to open badly to appear the inflation in avoiding the high temperature processing procedure, improves the goods quality.
Drawings
Fig. 1 is a schematic structural diagram of the multi-layer flexible printed circuit of the present invention.
Fig. 2 is a schematic structural diagram of a circuit in a multi-layer flexible printed circuit board according to the present invention.
In the drawings above: 1. a copper foil layer; 2. combining the adhesive layers; 3. and (6) hollowing out the holes.
Detailed Description
The invention will be further described with reference to examples of embodiments shown in the drawings.
The first embodiment is as follows: the multilayer flexible circuit board comprises a plurality of laminated copper foil layers 1 and a plurality of combined glue layers 2, wherein the copper foil layers 1 are used for forming circuits, and the combined glue layers 2 are arranged between the two adjacent copper foil layers 1 and are used for laminating the two copper foil layers 1. As shown in fig. 1, the multilayer wiring board in the present embodiment includes two copper foil layers 1 and a combination adhesive layer 2.
For the copper foil layer 1, a plurality of hollow holes 3 capable of conducting heat and exhausting air are formed on the circuit, and the hollow holes 3 are communicated with the upper surface and the lower surface of the circuit. The aperture of the hollow hole 3 is different according to the position. The hollow hole 3 is polygonal, such as rectangular, hexagonal, etc. The hollow holes 3 may be arranged in an array in rows and columns to make the circuit in a grid shape, as shown in fig. 2, or may be arranged in a staggered manner, so that the circuit is not in a completely closed sheet shape. As for the copper foil layer 1, the above-mentioned hollowed-out hole 3 is formed on the wiring of at least the outermost copper foil layer 1.
When the multilayer flexible circuit board is baked, the baking temperature can be effectively transmitted into the combined glue through the hollow holes 3 to realize exhaust, so that a dehumidification effect is achieved, and the poor expansion and explosion in the subsequent thermal process is effectively prevented.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (6)
1. The utility model provides a multilayer flexible circuit board, includes the multilayer copper foil layer that forms the circuit, sets up in adjacent two-layer be used for carrying out the combination glue film of laminating between the copper foil layer, its characterized in that: the circuit is provided with a plurality of hollow holes capable of conducting heat and exhausting air, and the hollow holes are communicated with the upper surface and the lower surface of the circuit.
2. The multilayer flexible wiring board of claim 1, wherein: the aperture of the hollow hole is different according to the position of the hollow hole.
3. The multilayer flexible wiring board of claim 1, wherein: the lines form a grid shape.
4. The multilayer flexible wiring board of claim 1, wherein: and the hollow holes are formed on the circuits of the copper foil layer at least on the outermost layer.
5. The multilayer flexible wiring board of claim 1, wherein: the hollow holes are polygonal.
6. The multilayer flexible wiring board of claim 1, wherein: the hollow holes are arranged in an array or in a staggered manner.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123342393 | 2021-12-29 | ||
| CN2021233423939 | 2021-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218163029U true CN218163029U (en) | 2022-12-27 |
Family
ID=84592172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221758766.2U Active CN218163029U (en) | 2021-12-29 | 2022-07-08 | Multi-layer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218163029U (en) |
-
2022
- 2022-07-08 CN CN202221758766.2U patent/CN218163029U/en active Active
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