CN218160759U - High out-of-band rejection separating dielectric filter - Google Patents
High out-of-band rejection separating dielectric filter Download PDFInfo
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- CN218160759U CN218160759U CN202222764145.1U CN202222764145U CN218160759U CN 218160759 U CN218160759 U CN 218160759U CN 202222764145 U CN202222764145 U CN 202222764145U CN 218160759 U CN218160759 U CN 218160759U
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Abstract
The utility model relates to a high out-of-band rejection separating dielectric filter, which comprises a ceramic capacitor plate, wherein a plurality of dielectric resonators are sequentially arranged below the ceramic capacitor plate along the length direction of the ceramic capacitor plate; the bottom surface of the ceramic capacitor plate is provided with a bottom surface metal electrode plate corresponding to each dielectric resonator, and each dielectric resonator is connected with the corresponding bottom surface metal electrode plate through a connecting pin; two input and output electrodes are arranged on the top surface of the ceramic capacitor plate, and transmission zero points with specified frequency are formed between two dielectric resonators located below the input and output electrodes and adjacent dielectric resonators. The utility model discloses in, through the transmission zero point that forms appointed frequency between input/output syntonizer and adjacent transmission syntonizer, transmission zero point has appeared in the outband that makes wave filter high frequency part, can reduce disconnect-type dielectric filter's order to reduce syntonizer quantity, and reduce filter volume and loss, promote the application effect.
Description
Technical Field
The utility model belongs to the technical field of dielectric filter, a disconnect-type dielectric filter of high outband suppression is related to.
Background
The dielectric filter adopts an electronic ceramic material as a medium and is formed into a multi-stage resonant cavity to realize the frequency selection function. The high dielectric constant of the ceramic material can greatly reduce the size of the filter and realize the application of miniaturization and integration. The separated dielectric filter is one of dielectric filters, and each resonator of the separated dielectric filter is independent in structure, and the arrangement structure of the resonators is not easy to realize transmission zero, so that the number of resonators with more out-of-band rejection requirements is increased. It is therefore desirable to provide a split dielectric filter structure that can generate out-of-band transmission zeros, thereby enabling the split dielectric filter to achieve high out-of-band rejection with a reduced number of resonators.
SUMMERY OF THE UTILITY MODEL
To the not enough of above-mentioned prior art, the utility model aims to solve the technical problem that: a high out-of-band rejection split dielectric filter suitable for high harmonic rejection demand scenarios is provided.
In order to achieve the above purpose, the utility model provides a following technical scheme:
a high out-of-band rejection separating dielectric filter comprises a ceramic capacitor sheet, wherein a plurality of dielectric resonators are sequentially arranged below the ceramic capacitor sheet along the length direction of the ceramic capacitor sheet, and a gap is reserved between every two adjacent dielectric resonators; the ceramic capacitor plate is provided with a top surface and a bottom surface opposite to the top surface, the bottom surface of the ceramic capacitor plate is provided with a bottom surface metal electrode plate corresponding to each dielectric resonator respectively, the bottom surface metal electrode plate is used for realizing the capacitive coupling of the adjacent dielectric resonators, and each dielectric resonator is connected with the corresponding bottom surface metal electrode plate through a connecting pin; the top surface of the ceramic capacitor plate is provided with two input and output electrodes which are respectively positioned above the bottom metal electrode plates on two sides; two dielectric resonators positioned below the input and output electrodes are input and output resonators, the other dielectric resonators are transmission resonators, and transmission zeros with specified frequency are formed between the input and output resonators and the adjacent transmission resonators.
Further, the dielectric resonator comprises a square dielectric body, the upper end face of the dielectric body is an open-circuit face, the lower end face and four side faces of the dielectric body are covered with a metalized layer, a resonant through hole penetrating through the upper end face and the lower end face of the dielectric body is formed in the dielectric body, and the hole wall of the resonant through hole is covered with the metalized layer.
Furthermore, the dielectric body is a ceramic dielectric body made of solid high-dielectric-constant ceramic materials.
Further, the connecting needle is a cylinder made of a metal material.
Furthermore, the upper end face of the connecting needle is fixedly connected with the lower end face of the bottom metal electrode plate, and the lower end of the connecting needle extends into the resonance through hole of the dielectric resonator and is connected with the metallization layer covered on the hole wall of the resonance through hole.
Furthermore, the side surface of the dielectric body of the input-output resonator facing the adjacent dielectric resonator is an inductive coupling surface, a windowing region is arranged on the inductive coupling surface, and the windowing region is not covered with a metallization layer; the windowing region is used for realizing inductive coupling between the input and output resonators and the adjacent dielectric resonators.
Furthermore, the windowing region is square.
Further, the windowing region is located at the bottom of the inductive coupling surface.
Further, a gap between the bottom metal electrode plate corresponding to the input/output resonator and the bottom metal electrode plate corresponding to the adjacent transmission resonator is larger than a gap between the bottom metal electrode plates corresponding to the adjacent two transmission resonators.
Furthermore, four dielectric resonators are sequentially arranged below the ceramic capacitor piece along the length direction of the ceramic capacitor piece.
The utility model discloses in, form a resonant circuit jointly through capacitive coupling and inductive coupling between input/output syntonizer and adjacent transmission syntonizer to form the transmission zero point of assigned frequency, thereby made the outband of wave filter high frequency part transmission zero point have appeared, its high-end outband is restrained and can promote more than 20dB or 20dB. The number of orders of the separated dielectric filter can be effectively reduced by increasing the transmission zero point to promote out-of-band rejection, so that the number of resonators is reduced, the size and the loss of the filter are reduced, and the application effect is improved. The device has the advantages of miniaturization, good temperature characteristic, good harmonic suppression characteristic, good power resistance, low cost, high manufacturing consistency and the like.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic structural diagram of a preferred embodiment of a high out-of-band rejection split dielectric filter according to the present invention.
Fig. 2 is a front view of fig. 1.
Fig. 3 is a schematic structural view of a ceramic capacitor plate.
Fig. 4 is a schematic structural diagram of an input-output resonator.
Fig. 5 is a schematic structural view of a transmission resonator.
Figure 6 is a diagram of the electric field profile of the resonator.
Fig. 7 is a magnetic field profile of the resonator.
Fig. 8 is a graph showing a simulation of the performance of a dielectric filter designed in the prior art in which transmission zeros are not formed out of band in the high frequency part.
Fig. 9 is a graph showing a simulation of the performance of the dielectric filter of the present embodiment.
The meaning of the reference symbols in the drawings is:
ceramic capacitor chip-100; top-101; a bottom surface-102; a first input-output electrode-111; a second input-output electrode-112; a first bottom metal electrode pad-121; a second bottom metal electrode pad-122; a third bottom metal electrode sheet-123; a fourth bottom metal electrode pad-124;
a connecting needle-200;
a dielectric body-300; a resonant via-301; open road surface-302; side-303; an inductive coupling surface-304; windowed region-305; a first dielectric resonator-310; a second dielectric resonator-320; a third dielectric resonator-330; a fourth dielectric resonator-340.
Detailed Description
Embodiments of the invention are described below by way of specific examples, the illustrations provided in the following examples are merely schematic representations of the basic idea of the invention, and features from the following examples and examples may be combined with one another without conflict.
As shown in fig. 1 and fig. 2, a preferred embodiment of the separated dielectric filter with high out-of-band rejection of the present invention includes a ceramic capacitor plate 100, a plurality of dielectric resonators are sequentially disposed below the ceramic capacitor plate 100 along the length direction of the ceramic capacitor plate 100, and a gap is left between adjacent dielectric resonators. The ceramic capacitor plate 100 has a top surface 101 and a bottom surface 102 opposite to the top surface 101, the bottom surface 102 of the ceramic capacitor plate 100 is provided with a bottom metal electrode plate corresponding to each dielectric resonator, and the bottom metal electrode plates are used for realizing capacitive coupling of adjacent dielectric resonators; each dielectric resonator is connected with the corresponding bottom metal electrode plate through a connecting pin 200. The top surface 101 of the ceramic capacitor plate 100 is provided with two input and output electrodes, and the two input and output electrodes are respectively located above the bottom metal electrode plates on the two sides. One of the input and output electrodes is the input end of the filter, and the other input and output electrode is the output end of the filter. Two dielectric resonators positioned below the input and output electrodes are input and output resonators, the other dielectric resonators are transmission resonators, and transmission zeros with specified frequency are formed between the input and output resonators and the adjacent transmission resonators.
The present embodiment will be described by taking four dielectric resonators as an example, and as shown in fig. 1 and 2, a first dielectric resonator 310, a second dielectric resonator 320, a third dielectric resonator 330 and a fourth dielectric resonator 340 are sequentially provided below the ceramic capacitor chip 100 in the longitudinal direction of the ceramic capacitor chip 100. As shown in fig. 3, the bottom surface 102 of the ceramic capacitor chip 100 is provided with a first bottom metal electrode pad 121 above the first dielectric resonator 310, a second bottom metal electrode pad 122 above the second dielectric resonator 320, a third bottom metal electrode pad 123 above the third dielectric resonator 330, and a fourth bottom metal electrode pad 124 above the fourth dielectric resonator 340. In order to adjust the capacitive coupling between the adjacent dielectric resonators so as to form a transmission zero between the first dielectric resonator 310 and the second dielectric resonator 320, and so as to form a transmission zero between the third dielectric resonator 330 and the fourth dielectric resonator 340. The gap between the first bottom metal electrode pad 121 and the second bottom metal electrode pad 122, and the gap between the third bottom metal electrode pad 123 and the fourth bottom metal electrode pad 124 are both larger than the gap between the second bottom metal electrode pad 122 and the third bottom metal electrode pad 123.
The first dielectric resonator 310 is connected to the first bottom metal electrode pad 121 through a connection pin 200, the second dielectric resonator 320 is connected to the second bottom metal electrode pad 122 through a connection pin 200, the third dielectric resonator 330 is connected to the third bottom metal electrode pad 123 through a connection pin 200, and the fourth dielectric resonator 340 is connected to the fourth bottom metal electrode pad 124 through a connection pin 200. A first input/output electrode 111 is disposed on the top surface 101 of the ceramic capacitor plate 100 above the first bottom metal electrode pad 121, and a second input/output electrode 112 is disposed on the top surface of the fourth bottom metal electrode pad 124. The first dielectric resonator 310 located below the first input-output electrode 111 and the fourth dielectric resonator 340 located below the second input-output electrode 112 are input-output resonators; the second dielectric resonator 320 and the third dielectric resonator 330 are transmission resonators.
As shown in fig. 4 and 5, each of the first dielectric resonator 310, the second dielectric resonator 320, the third dielectric resonator 330 and the fourth dielectric resonator 340 includes a square dielectric body 300, and the dielectric body 300 is a ceramic dielectric body made of a solid high-permittivity ceramic material. The upper end surfaces of the dielectric body 300 are all open-road surfaces 302, the lower end surface and four side surfaces 303 of the dielectric body 300 are covered with metalized layers, the dielectric body 300 is provided with a resonant through hole 301 penetrating through the upper end surface and the lower end surface of the dielectric body, and the hole wall of the resonant through hole 301 is covered with the metalized layers. The connection pin 200 is preferably a cylinder made of a metal material, the upper end surface of the connection pin 200 is fixedly connected with the lower end surface of the corresponding bottom metal electrode plate, and the lower end of the connection pin 200 extends into the corresponding resonance through hole 301 of the dielectric resonator and is connected with the metallization layer covered on the hole wall of the resonance through hole 301.
The side 303 of the dielectric body 300 of the first dielectric resonator 310 and the fourth dielectric resonator 340 (i.e. the input/output resonator) facing the adjacent dielectric resonator is an inductive coupling surface 304, and the inductive coupling surface 304 is provided with a windowing region 305. Taking the first dielectric resonator 310 as an example, please refer to fig. 4, wherein a side 303 of the dielectric body 300 of the first dielectric resonator 310 facing the second dielectric resonator 320 is an inductive coupling surface 304, and the inductive coupling surface 304 is provided with a windowing region 305; the windowed area 305 is generally square, and the windowed area 305 is located at the bottom of the inductive coupling surface 304. The lower end face of the dielectric body 300 and the three side faces 303 except the inductive coupling face 304 of the first dielectric resonator 310 are all covered with a metallization layer, and after the inductive coupling face 304 is covered with the metallization layer, the metallization layer of the windowing region 305 is removed, so that a gap which is not covered with the metallization layer is formed in the windowing region 305. The structure of the fourth dielectric resonator 340 is the same as that of the first dielectric resonator 310, except that the orientation of the inductive coupling surface 304 is different; the side 303 of the dielectric body 300 of the fourth dielectric resonator 340 facing the third dielectric resonator 330 is an inductive coupling surface 304.
With continued reference to fig. 5, the lower end surface and four side surfaces 303 of the dielectric body 300 of the second dielectric resonator 320 and the third dielectric resonator 330 (i.e., the transmission resonator) are entirely covered with a metallization layer, and the windowing region 305 is not formed.
By breaking the metallization layer in the windowed area 305 of the designated side 303 of the input-output resonator (i.e. the first dielectric resonator 310 and the fourth dielectric resonator 340 and the inductive coupling surface 304), the electric and magnetic fields can transfer energy to the next resonator through the ceramic material and the windowed area 305 of the inductive coupling surface 304 due to the high dielectric constant of the ceramic material, thereby achieving inductive coupling between the input-output resonator and the adjacent dielectric resonator.
Because the adjacent dielectric resonators are also capacitively coupled through the bottom metal electrode plate, inductive coupling is also achieved between the first dielectric resonator 310 and the second dielectric resonator 320 and between the third dielectric resonator 330 and the fourth dielectric resonator 340 through the windowed area 305; by obtaining strong capacitive and inductive coupling between the first dielectric resonator 310 and the second dielectric resonator 320 and between the third dielectric resonator 330 and the fourth dielectric resonator 340, as shown in fig. 6, the electric field energy of each resonator (including the input resonator, the output resonator, and the intermediate resonator) is mainly concentrated at the open-top end thereof; as shown in fig. 7, the magnetic field energy of the resonator is mainly concentrated at its bottom (i.e., a portion adjacent to the bottom surface). The electric field energy corresponds to a capacitor C1 in the circuit, the magnetic field energy corresponds to an inductor L1 in the circuit, and when the electric field and the magnetic field are transmitted between the two resonators at the same time, the total energy transmitted is the absolute value of the difference between the two resonators (namely | C1-L1 |). However, the two are in parallel relation, and according to the resonant frequency calculation formula of the parallel circuit:
F＝2π/(LC)e 0.5
at this time, L1 and C1 may form a resonant circuit together, and form a transmission zero at a specified frequency, thereby achieving an effect of increasing out-of-band rejection.
The position of the transmission zero point is related to the amount of capacitive coupling and inductive coupling, and the gap between the adjacent bottom metal electrode sheets may be set according to the position of the transmission zero point, as well as the shape and area of the windowing region 305.
As shown in fig. 8, a simulation curve of a dielectric filter with a center frequency of 2.4GHz and a bandwidth of 20MHz actually designed by the prior art is shown, and no transmission zero is formed outside the band of the high frequency part. As shown in fig. 9, a simulation curve of a dielectric filter with a center frequency of 2.4GHz and a bandwidth of 20MHz actually designed by using the structure of this embodiment is shown in fig. 9, which shows that a transmission zero is generated at 2.53GHz, and the out-of-band rejection at 2.5GHz is improved by 20dB compared with the conventional structure of fig. 8.
In the embodiment, transmission zero points are generated between the first dielectric resonator 310 and the second dielectric resonator 320 and between the third dielectric resonator 330 and the fourth dielectric resonator 340, so that the transmission zero points appear outside the band of the high-frequency part of the filter, and the high-end out-of-band rejection can be improved by 20dB or more than 20dB. The order of the separated dielectric filter can be effectively reduced by increasing the transmission zero point to promote out-of-band rejection, so that the number of resonators is reduced, the size and the loss of the filter are reduced, and the application effect is improved.
Finally, the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions, and all of them should be covered by the scope of the claims of the present invention.
Claims (10)
1. A high out-of-band rejection split dielectric filter, comprising: the ceramic capacitor comprises a ceramic capacitor piece, wherein a plurality of dielectric resonators are sequentially arranged below the ceramic capacitor piece along the length direction of the ceramic capacitor piece, and a gap is reserved between every two adjacent dielectric resonators; the ceramic capacitor plate is provided with a top surface and a bottom surface opposite to the top surface, the bottom surface of the ceramic capacitor plate is provided with a bottom surface metal electrode plate corresponding to each dielectric resonator respectively, the bottom surface metal electrode plate is used for realizing the capacitive coupling of the adjacent dielectric resonators, and each dielectric resonator is connected with the corresponding bottom surface metal electrode plate through a connecting pin; the top surface of the ceramic capacitor plate is provided with two input and output electrodes which are respectively positioned above the bottom metal electrode plates on two sides; two dielectric resonators located below the input and output electrodes are input and output resonators, the other dielectric resonators are transmission resonators, and transmission zeros of a designated frequency are formed between the input and output resonators and the adjacent transmission resonators.
2. The split dielectric filter with high out-of-band rejection of claim 1, wherein: the dielectric resonator comprises a square dielectric body, the upper end face of the dielectric body is an open-circuit face, the lower end face and the four side faces of the dielectric body are covered with a metalized layer, a resonant through hole penetrating through the upper end face and the lower end face of the dielectric body is formed in the dielectric body, and the wall of the resonant through hole is covered with the metalized layer.
3. The split dielectric filter with high out-of-band rejection of claim 2, wherein: the dielectric body is a ceramic dielectric body made of solid high-dielectric-constant ceramic materials.
4. The split dielectric filter with high out-of-band rejection of claim 2, wherein: the connecting needle is a cylinder made of metal materials.
5. The split dielectric filter with high out-of-band rejection of claim 4, wherein: the upper end face of the connecting needle is fixedly connected with the lower end face of the bottom metal electrode plate, and the lower end of the connecting needle extends into the resonance through hole of the dielectric resonator and is connected with the metallization layer covered on the hole wall of the resonance through hole.
6. The split dielectric filter with high out-of-band rejection of claim 2, wherein: the side surface of the medium body of the input and output resonator facing to the adjacent medium resonator is an inductive coupling surface, a windowing region is arranged on the inductive coupling surface, and the windowing region is not covered with a metallization layer; the windowing region is used for realizing inductive coupling between the input and output resonators and the adjacent dielectric resonators.
7. The split dielectric filter with high out-of-band rejection of claim 6, wherein: the windowing area is square.
8. The split dielectric filter with high out-of-band rejection of claim 6, wherein: the windowing region is located at the bottom of the inductive coupling surface.
9. The split dielectric filter with high out-of-band rejection of claim 1, wherein: and the gap between the bottom metal electrode plate corresponding to the input and output resonator and the bottom metal electrode plate corresponding to the adjacent transmission resonator is larger than the gap between the bottom metal electrode plates corresponding to the two adjacent transmission resonators.
10. The split dielectric filter with high out-of-band rejection as claimed in any one of claims 1 to 9, wherein: four dielectric resonators are sequentially arranged below the ceramic capacitor piece along the length direction of the ceramic capacitor piece.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222764145.1U CN218160759U (en) | 2022-10-20 | 2022-10-20 | High out-of-band rejection separating dielectric filter |
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| CN202222764145.1U CN218160759U (en) | 2022-10-20 | 2022-10-20 | High out-of-band rejection separating dielectric filter |
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