CN218160334U

CN218160334U - Clamping device for semiconductor packaging convenient to adjust length

Info

Publication number: CN218160334U
Application number: CN202222208455.5U
Authority: CN
Inventors: 张帆
Original assignee: Jiangsu Poppula Semiconductor Co ltd
Current assignee: Jiangsu Poppula Semiconductor Co ltd
Priority date: 2022-08-22
Filing date: 2022-08-22
Publication date: 2022-12-27
Anticipated expiration: 2032-08-22

Abstract

The application discloses clamping device for semiconductor package convenient to adjust length belongs to semiconductor package technical field. The lower extreme of holding rod is provided with the regulating plate, the lower extreme of regulating plate is provided with two sets of relatively movable's splint, the inboard of holding rod is provided with the button, the lower extreme of button is provided with two sets of stay cords, and is two sets of the stay cord respectively with two sets of splint fixed connection, press accessible during the button the stay cord stimulates respectively two sets of splint press from both sides tightly to the inboard, the inside piston cavity that is provided with in both sides of splint, all be provided with in the piston cavity and add the length piece, it will manually add the length piece and pull out to unanimous with semiconductor package shell length to make the stability reinforcing at the tight in-process of clamp. The clamping device for semiconductor packaging convenient to adjust length achieves the effect of clamping adjustment.

Description

Clamping device for semiconductor packaging convenient to adjust length

Technical Field

The application relates to the technical field of semiconductor packaging, in particular to a clamping device for semiconductor packaging, which is convenient for adjusting length.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous wafer process is cut into small chips through a scribing process, then the cut chips are pasted on small islands of corresponding substrate (lead frame) frames through glue, bonding pads of the chips are connected to corresponding pins of the substrate through superfine metal wires or conductive resin, and a required circuit is formed; then, the independent wafer is packaged and protected by the plastic shell, and in the manual packaging process, the wafer is mostly clamped and placed by tweezers, the clamping contact area is small, and the wafer is easy to drop to damage the semiconductor, so that the problem needs to be solved by providing a clamping device for semiconductor packaging, which is convenient for adjusting the length.

Disclosure of Invention

Based on the above problems in the prior art, the embodiments of the present application are directed to: the clamping device for the semiconductor package is convenient to adjust the length, and achieves the effect of clamping adjustment.

The technical scheme adopted by the application for solving the technical problem is as follows: the utility model provides a clamping device for semiconductor package convenient to adjust length, includes the holding rod, the lower extreme of holding rod is provided with the regulating plate, the lower extreme of regulating plate is provided with two sets of relative movement's splint, the inboard of holding rod is provided with the button, the lower extreme of button is provided with two sets of stay cords, and is two sets of the stay cord respectively with two sets of splint fixed connection presses accessible during the button the stay cord stimulates respectively two sets of splint are tight to the inboard clamp, the inside piston cavity that is provided with in both sides of splint, all be provided with in the piston cavity and add the extension piece, it is manual with add the extension piece pull out to unanimous with semiconductor package shell length to make the stability reinforcing at the tight in-process of clamp, avoid the too narrow semiconductor package shell that leads to the clamping part to drop and cause the damage to the semiconductor.

The beneficial effect of this application is: the utility model provides a pair of clamping device for semiconductor package convenient to adjust length through the cooperation that is provided with regulating plate and extension piece, can reach the length at convenient regulation semiconductor centre gripping position to adapt to not unidimensional semiconductor package shell, guarantee the stability of centre gripping.

In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail below with reference to the drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.

In the drawings:

fig. 1 is a general schematic view of a clamping device for semiconductor packaging for facilitating length adjustment in the present application;

FIG. 2 is an overall cross-sectional view of FIG. 1;

FIG. 3 is a schematic cross-sectional view of the pressing shaft of FIG. 1;

wherein, in the figures, the various reference numbers:

1. a holding rod; 2. an adjusting knob; 3. pressing the piston; 4. pressing the shaft; 5. a rack; 6. pulling a rope; 7. an adjusting plate; 8. a drum; 9. a splint; 10. lengthening the block; 11. a support spring; 12. a clamping cavity; 13. a pressing cavity; 14. a return spring; 15. an extrusion chamber; 16. and extruding the block.

Detailed Description

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances for describing embodiments of the invention described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

As shown in fig. 1-3, the present application provides a clamping device for semiconductor packaging, which is convenient for adjusting length, and comprises a holding rod 1, wherein two sets of racks 5 are slidably connected to the inner side of the holding rod 1, the lower ends of the two sets of racks 5 are rotatably connected to an adjusting plate 7, two sets of clamping cavities 12 are arranged on the inner side of the lower end of the adjusting plate 7, supporting springs 11 are arranged on the inner sides of the two sets of clamping cavities 12, one ends of the two sets of supporting springs 11 are fixedly connected with a clamping plate 9, the clamping plate 9 is movably connected with the clamping cavities 12, a pressing shaft 4 is fixedly installed on the inner side of the holding rod 1, an extruding cavity 15 is arranged on the inner side of the pressing shaft 4, an extruding block 16 is movably connected to the inner side of the extruding cavity 15, two sets of pulling ropes 6 are fixedly connected to the lower ends of the two sets of pulling ropes 6, respectively, a pressing cavity 13 is arranged on the inner side of the pressing shaft 4, a pressing piston 3 is movably connected to the inner side of the pressing cavity 13, return springs 14 are installed on the inner side of the pressing cavity 13, piston cavities are internally provided with piston cavities, lengthening blocks 10 are movably connected to the piston cavities, two sets of the piston cavities are movably connected to the upper side bearings 8 of the adjusting plate 7, and the pulling ropes 6 are connected to the roller 9;

the pressing piston 3 is pressed down manually, the left end of the pressing piston 3 causes pressure to the extrusion block 16 to move towards the left side, the extrusion block 16 moves to drive the pull rope 6 to enter the extrusion cavity 15, so that the clamping plate 9 connected with the lower end of the pull rope 6 overcomes the elastic force of the supporting spring 11 to move towards the middle to complete clamping, the lengthening blocks 10 on the two sides of the clamping plate 9 can be stretched outwards from the inner side of the clamping plate 9 manually, and the clamping length is increased so as to be suitable for semiconductor packaging shells with different sizes;

when the pressing piston 3 is released, the pressing piston 3 is reset by the elastic force of the reset spring 14, the extrusion block 16 loses the extrusion force of the pressing piston 3, and the pressing piston is moved to the initial position by the pulling force of the clamping plate 9 on the pull rope 6;

stay cord 6 is connected with two sets of splint 9 respectively through the middle part of two sets of cylinders 8 for accessible cylinder 8 reduces frictional force when stay cord 6 reciprocates, avoids 6 wearing and tearing of stay cord, increases life.

The inner side bearing of the holding rod 1 is connected with an adjusting button 2, the middle part of the adjusting button 2 is provided with a latch, and the latch is meshed with the two groups of racks 5;

through manual rotation adjusting knob 2, thereby make it drive two sets of racks 5 through latch and 5 meshes of rack and remove to opposite direction to make the angle of connecting at the axis direction of adjusting plate 7 and the holding rod 1 of rack 5 lower extreme change, adjust the angle of centre gripping with this, adapt to different installation environment.

One end of the rack 5 is provided with a convex block, the inner side of the holding rod 1 is provided with two groups of grooves, and the convex block is connected with the grooves in a matching way;

through the lug on the rack 5 and the recess cooperation of holding rod 1 inboard to reciprocate to rack 5 and play the effect of direction, improve angle modulation's stability.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

For ease of description, spatially relative terms such as "above … …", "above … …", "above … … upper surface", "above", etc. may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the description of the present invention, it is to be understood that the directions or positional relationships indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the directions or positional relationships shown in the drawings, and are for convenience of description and simplicity of description only, and in the case of not making a reverse description, these directional terms do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A clamping device for semiconductor package convenient to adjust length which characterized in that: including holding rod (1), the lower extreme of holding rod (1) is provided with regulating plate (7), the lower extreme of regulating plate (7) is provided with two sets of relatively movable's splint (9), the inboard of holding rod (1) is provided with the button, the lower extreme of button is provided with two sets of stay cord (6), and is two sets of stay cord (6) are respectively with two sets of splint (9) fixed connection presses accessible during the button stay cord (6) stimulate respectively two sets of splint (9) are pressed from both sides tightly to the inboard, the inside piston cavity that is provided with in both sides of splint (9), all be provided with in the piston cavity and add long piece (10).

2. A clamping device for a semiconductor package for facilitating length adjustment according to claim 1, wherein: the inboard of regulating plate (7) is provided with two sets of centre gripping chambeies (12), the inboard in centre gripping chamber (12) is provided with supporting spring (11), splint (9) set up in centre gripping chamber (12).

3. A clamping device for a semiconductor package for facilitating length adjustment according to claim 1, wherein: the inboard of holding rod (1) is provided with angle adjusting part, angle adjusting part includes adjusting knob (2), adjusting knob (2) with holding rod (1) swing joint, the middle part outside of adjusting knob (2) is provided with the latch, the inboard of holding rod (1) is provided with two sets of racks (5), the latch with rack (5) mesh mutually, the lower extreme of rack (5) with regulating plate (7) swing joint.

4. A semiconductor package clamping device with adjustable length as claimed in claim 3, wherein: one end of the rack (5) is provided with a convex block, two groups of grooves are arranged on the inner side of the holding rod (1), and the convex block is connected with the grooves in a matched mode.

5. A clamping device for a semiconductor package for facilitating length adjustment according to claim 1, wherein: the upper side of the adjusting plate (7) is provided with two groups of rollers (8), and the pull rope (6) passes through the surfaces of the rollers (8) and is fixed with the clamping plate (9).