CN114871072A - Novel semiconductor dispensing processing method - Google Patents
Novel semiconductor dispensing processing method Download PDFInfo
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- CN114871072A CN114871072A CN202210681434.7A CN202210681434A CN114871072A CN 114871072 A CN114871072 A CN 114871072A CN 202210681434 A CN202210681434 A CN 202210681434A CN 114871072 A CN114871072 A CN 114871072A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 106
- 238000003672 processing method Methods 0.000 title claims description 10
- 239000003292 glue Substances 0.000 claims abstract description 31
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 238000012545 processing Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 6
- 238000005070 sampling Methods 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005452 bending Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 206010040007 Sense of oppression Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a novel semiconductor dispensing processing technique, which relates to the technical field of semiconductor dispensing processing and comprises the following steps: step one, glue is added into a glue dispensing device, and a semiconductor needing glue dispensing processing is placed on a glue dispensing machine; secondly, rapidly positioning the semiconductor through positioning and clamping of relevant components of the glue dispenser; thirdly, dispensing the semiconductor through the movement adjustment of the dispensing device to obtain a finished product; and step four, sampling and detecting the semiconductor finished products subjected to the spot gluing, and after the semiconductor finished products are detected to be qualified, intensively storing the semiconductor finished products in a dustless warehouse. According to the invention, through the mutual cooperation of the relevant components of the dispensing machine base, the sliding guide rail frame, the dispensing mechanism, the positioning mechanism and the like, the problem that when the dispensing machine is used for dispensing the semiconductor, the semiconductor is abraded due to overlarge pressure when the dispensing machine is used for fixing the semiconductor, and the dispensing efficiency and the production quality of the semiconductor are influenced is solved.
Description
Technical Field
The invention relates to the technical field of semiconductor dispensing processing, in particular to a novel semiconductor dispensing processing process method.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, the importance of the semiconductor is very huge from the viewpoint of science and technology or economic development, and the glue dispensing processing by using a glue dispenser is an important step in the production and preparation process of the semiconductor, which is directly related to the use effect of the whole semiconductor.
Disclosure of Invention
The invention provides a novel semiconductor dispensing processing method, which aims to solve the problems that when a dispensing machine is used for dispensing and fixing a semiconductor, the pressure is too high, the semiconductor is abraded, and the dispensing efficiency and the production quality of the semiconductor are influenced.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
in a first aspect, a novel semiconductor dispensing processing method comprises the following steps:
step one, glue is added into a glue dispensing device, and a semiconductor needing glue dispensing processing is placed on a glue dispensing machine;
secondly, rapidly positioning the semiconductor through positioning and clamping of relevant components of the glue dispenser;
thirdly, dispensing the semiconductor through the movement adjustment of the dispensing device to obtain a finished product;
and step four, sampling and detecting the semiconductor finished products subjected to the spot gluing, and after the semiconductor finished products are detected to be qualified, intensively storing the semiconductor finished products in a dustless warehouse.
In a second aspect, a semiconductor dispenser comprises a dispenser base and a control device, wherein a dispensing mechanism is arranged above the dispenser base, the back of the control device is fixedly connected with the front of the base of the glue dispenser, the back of the glue dispensing mechanism is movably connected with a sliding guide rail frame, the bottom end of the inner side of the sliding guide rail frame is connected with the two sides of the dispenser base in a sliding way, the upper surface of the dispenser base is fixedly provided with a positioning mechanism, a positioning transverse plate is fixedly arranged at one end of the upper surface of the dispenser base far away from the control device, through the mutual matching of relevant components of the dispensing machine base, the sliding guide rail frame, the dispensing mechanism, the positioning mechanism and other mechanisms, when the dispensing machine is used for dispensing the semiconductor, when the adhesive is fixed, the pressure is too large, the semiconductor is abraded, and the adhesive dispensing efficiency and the production quality of the semiconductor are affected.
The technical scheme of the invention is further improved as follows: the positioning mechanism comprises a fixed plate, a hydraulic telescopic device and a movable plate, the bottom surface of the fixed plate is fixedly connected with the upper surface of the base of the glue dispensing machine, one end of the hydraulic telescopic device is fixedly connected with the inner side surface of the fixed plate, the other end of the hydraulic telescopic device is fixedly connected with the outer side surface of the movable plate, and the bottom surface of the movable plate is connected with the upper surface of the base of the glue dispensing machine in a sliding mode.
The technical scheme of the invention is further improved as follows: the top fixed mounting of fly leaf has the motor, the output of motor extends to the inside and the fixedly connected with threaded rod of fly leaf, the bottom surface of threaded rod is connected with the inner wall rotation of fly leaf, the interior side surface sliding connection of fly leaf has the locating splint, the surface of threaded rod cup joints with the inner wall screw thread of locating splint, utilizes hydraulic telescoping device and fly leaf cooperation, transversely spacing to the semiconductor, recycles motor and threaded rod combined action, drives the locating splint and removes, fixes a position the semiconductor.
The technical scheme of the invention is further improved as follows: the bottom surface fixedly connected with soft cover shell of location splint, the outer fixed surface of soft cover shell installs the partial pressure subassembly, the equidistant evenly distributed of partial pressure subassembly is on the surface of soft cover shell, by mutually supporting of soft cover shell and partial pressure subassembly, guarantees the safety of semiconductor when by the centre gripping location.
The technical scheme of the invention is further improved as follows: the internal surface middle part fixed mounting of soft cover shell has the anti-pressure bag, the top fixedly connected with of anti-pressure bag props the pressure arc board, prop the top of pressing the arc board and the bottom surface fixed connection of location splint, just prop the both ends of pressing the arc board and the internal surface fixed connection of soft cover shell, prop fixedly connected with elasticity bent plate on the surface of pressing the arc board, the top of elasticity bent plate and the bottom surface fixed connection of location splint, just the elasticity bent plate sets up about the central line symmetry of soft cover shell, and through the pressure when partial pressure subassembly and soft cover shell and semiconductor contact, oppression soft cover shell produces deformation, cooperates soft cover shell again to resist the pressure bag and prop the pressure arc board and oppress, produces the displacement, utilizes the elasticity of elasticity bent plate and resistance to compression bag for partial pressure subassembly, soft cover shell and semiconductor closely laminate.
The technical scheme of the invention is further improved as follows: the partial pressure subassembly is including rubber sleeve and soft separation blade, the top of rubber sleeve and the outer fixed surface of soft cover shell are connected, the outside surface of soft separation blade is connected with the internal surface fixed of rubber sleeve, the inner chamber top fixed mounting of rubber sleeve has spacing sleeve, the inboard surface and the outer fixed surface of spacing sleeve of soft separation blade are connected, just soft separation blade evenly distributed is on spacing sleeve's surface.
The technical scheme of the invention is further improved as follows: swing joint has the ejector pin on the inner wall of spacing sleeve, the bottom surface fixedly connected with elasticity inner prop of ejector pin, the top fixedly connected with elasticity strip of ejector pin, the top of elasticity strip and spacing telescopic inner chamber top fixed connection, when utilizing rubber sleeve and elasticity inner prop contact semiconductor, with the flexible contact that the semiconductor produced, with pressure dispersion, avoid single-point pressure too big, cause the damage to the semiconductor.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the technical progress that:
1. the invention provides a novel semiconductor dispensing processing method, which solves the problems that when a dispensing machine is used for dispensing a semiconductor and is fixed, the semiconductor is abraded due to overlarge pressure, and the dispensing efficiency and the production quality of the semiconductor are influenced by the mutual matching of related components of a dispensing machine base, a sliding guide rail frame, a dispensing mechanism, a positioning mechanism and the like.
2. The invention provides a novel semiconductor dispensing processing technique, in the device, a hydraulic telescopic device is matched with a movable plate to transversely limit a semiconductor, a motor and a threaded rod are used for acting together to drive a positioning clamp plate to move to position the semiconductor, and a soft casing and a pressure division assembly are matched with each other to ensure the safety of the semiconductor when being clamped and positioned, thereby improving the production quality during the production of the semiconductor.
3. The invention provides a novel semiconductor dispensing processing method, which is characterized in that a pressure dividing assembly and a soft casing are pressed to deform by the pressure generated when the pressure dividing assembly and the soft casing are contacted with a semiconductor, the soft casing is matched with the soft casing to resist a pressure bag and a pressure supporting arc plate to press so as to generate displacement, and the pressure dividing assembly, the soft casing and the semiconductor are tightly attached by utilizing the elasticity of an elastic bending plate and a pressure resisting bag, so that the stability of the semiconductor in positioning is improved.
4. The invention provides a novel semiconductor dispensing processing method, which utilizes the flexible contact generated by a rubber sleeve and an elastic inner column when the rubber sleeve and the elastic inner column contact a semiconductor to disperse pressure and avoid overlarge single-point pressure, and then utilizes a soft baffle plate to disperse pressure, and utilizes the elastic inner column and an ejector rod to extrude an elastic strip to ensure that the pressure borne by the surface of the semiconductor is dispersed by multiple points when a pressure dividing component contacts the semiconductor, thereby ensuring the utilization efficiency and the use safety of the device.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a dispenser of the present invention;
FIG. 3 is a schematic perspective view of a positioning mechanism of the dispenser of the present invention;
FIG. 4 is a cross-sectional view of a clamping plate structure of the dispenser of the present invention;
FIG. 5 is a schematic perspective view of a pressure-dividing assembly of the dispenser of the present invention;
fig. 6 is a schematic structural cross-sectional view of a pressure dividing assembly of the dispenser of the present invention.
In the figure: 1. a dispenser base; 2. a control device; 3. a sliding guide rail bracket; 4. a glue dispensing mechanism; 5. a positioning mechanism; 51. a fixing plate; 52. a hydraulic telescopic device; 53. a movable plate; 54. a motor; 55. a threaded rod; 56. positioning the clamping plate; a1, soft cover; a2, elastic bending plate; a3, supporting and pressing an arc plate; a4, a compression resistant bag; a5, a voltage dividing component; a51, rubber sleeve; a52, soft baffle plate; a53, elastic inner column; a54, a mandril; a55, elastic strip.
Detailed Description
The present invention will be described in further detail with reference to the following examples:
example 1
As shown in fig. 1, the present invention provides a novel semiconductor dispensing processing method, which comprises the following steps:
step one, glue is added into a glue dispensing device, and a semiconductor needing glue dispensing processing is placed on a glue dispensing machine;
secondly, rapidly positioning the semiconductor through positioning and clamping of relevant components of the glue dispenser;
thirdly, dispensing the semiconductor through the movement adjustment of the dispensing device to obtain a finished product;
and step four, sampling and detecting the semiconductor finished products subjected to the spot gluing, and after the semiconductor finished products are detected to be qualified, intensively storing the semiconductor finished products in a dustless warehouse.
Example 2
As shown in fig. 1-6, on the basis of embodiment 1, the present invention further provides a semiconductor dispenser, which includes a dispenser base 1 and a control device 2, a dispensing mechanism 4 is disposed above the dispenser base 1, the back of the control device 2 is fixedly connected to the front of the dispenser base 1, the back of the dispensing mechanism 4 is movably connected to a sliding guide rail frame 3, the inner bottom end of the sliding guide rail frame 3 is slidably connected to both sides of the dispenser base 1, a positioning mechanism 5 is fixedly mounted on the upper surface of the dispenser base 1, a positioning transverse plate is fixedly mounted on the upper surface of the dispenser base 1 far from the control device 2, the positioning mechanism 5 includes a fixed plate 51, a hydraulic telescopic device 52 and a movable plate 53, the bottom of the fixed plate 51 is fixedly connected to the upper surface of the dispenser base 1, one end of the hydraulic telescopic device 52 is fixedly connected to the inner surface of the fixed plate 51, the other end of the hydraulic telescopic device 52 is fixedly connected with the outer side surface of the movable plate 53, the bottom surface of the movable plate 53 is connected with the upper surface of the dispenser base 1 in a sliding manner, a motor 54 is fixedly mounted at the top of the movable plate 53, the output end of the motor 54 extends to the inside of the movable plate 53 and is fixedly connected with a threaded rod 55, the bottom surface of the threaded rod 55 is connected with the inner wall of the movable plate 53 in a rotating manner, a positioning clamp plate 56 is connected with the inner side surface of the movable plate 53 in a sliding manner, the outer surface of the threaded rod 55 is sleeved with the inner wall of the positioning clamp plate 56 in a threaded manner, the movable plate 53 is driven to move by the stretching of the hydraulic telescopic device 52, the semiconductor is transversely limited, the threaded rod 55 is driven to rotate by the output shaft of the motor 54, the positioning clamp plate 56 moves downwards, the semiconductor is positioned, and the stability during the production of the semiconductor is improved.
Example 3
As shown in fig. 1 to 6, on the basis of the embodiments 1 and 2, the present invention provides a technical solution: preferably, a soft sleeve a1 is fixedly connected to a bottom surface of the positioning splint 56, a pressure dividing assembly a5 is fixedly installed on an outer surface of the soft sleeve a1, the pressure dividing assemblies a5 are uniformly distributed on an outer surface of the soft sleeve a1 at equal intervals, a pressure resisting bag a4 is fixedly installed at a middle portion of an inner surface of the soft sleeve a1, a pressure supporting arc plate a3 is fixedly connected to a top portion of the pressure resisting bag a4, a top portion of the pressure supporting arc plate a3 is fixedly connected to a bottom surface of the positioning splint 56, both ends of the pressure supporting arc plate a3 are fixedly connected to an inner surface of the soft sleeve a1, an elastic bending plate a2 is fixedly connected to an outer surface of the pressure supporting arc plate a3, a top portion of the elastic bending plate a2 is fixedly connected to a bottom surface of the positioning splint 56, and the elastic bending plate a 5953 is symmetrically arranged about a center line of the soft sleeve a1, the pressure dividing assembly a5 and the soft sleeve a1 are used for pressing the soft sleeve a4 and the pressure resisting bag 3646, the displacement is generated, and the elasticity of the elastic bending plate a2 and the pressure-resistant bag a4 is utilized to enable the partial pressure component a5 and the soft casing a1 to be tightly attached to the semiconductor, so that the stability of the semiconductor in positioning is improved.
It should be mentioned that the voltage dividing assembly a5 includes a rubber sleeve a51 and a soft baffle a52, the top of the rubber sleeve a51 is fixedly connected with the outer surface of the soft casing a1, the outer surface of the soft baffle a52 is fixedly connected with the inner surface of the rubber sleeve a51, the top of the inner cavity of the rubber sleeve a51 is fixedly provided with a limiting sleeve, the inner surface of the soft baffle a52 is fixedly connected with the outer surface of the limiting sleeve, the soft baffle a52 is uniformly distributed on the outer surface of the limiting sleeve, the inner wall of the limiting sleeve is movably connected with a top rod a54, the bottom of the top rod a54 is fixedly connected with an elastic inner column a53, the top of the top rod a54 is fixedly connected with an elastic strip a55, the top of the elastic strip a55 is fixedly connected with the top of the inner cavity of the limiting sleeve, when the rubber sleeve a51 and the elastic inner column a53 contact with the semiconductor, the pressure is dispersed by flexible contact with the semiconductor, thereby avoiding the over-large single-point pressure, and then the soft baffle a52 is matched to disperse the pressure, the elastic bar a55 is pressed by the elastic inner column a53 and the top rod a54, so that the pressure applied on the surface of the semiconductor is dispersed by multiple points when the partial pressure component a5 is in contact with the semiconductor.
The working principle of the novel semiconductor dispensing processing method is described in detail below.
As shown in fig. 1-6, during the dispensing process of the semiconductor, glue is injected into the dispensing device, the semiconductor to be dispensed is placed on the base 1 of the dispensing machine, the hydraulic stretching device 52 is activated by the control device 2, the movable plate 53 is driven by the stretching of the hydraulic stretching device 52 to move, the semiconductor is laterally limited, the threaded rod 55 is driven by the output shaft of the motor 54 to rotate, the positioning clamp plate 56 moves downward to position the semiconductor, the soft sleeve a1 is pressed to deform by the pressure generated when the pressure dividing assembly a5 and the soft sleeve a1 contact the semiconductor, the soft sleeve a1 is pressed to generate displacement by cooperating with the soft sleeve a1 to resist the pressure bag a4 and the pressure supporting arc plate a3, and the elasticity of the elastic bending plate a2 and the pressure supporting arc plate a4 is used to make the pressure dividing assembly a5 and the soft sleeve a1 tightly contact the semiconductor, when the rubber sleeve a51 and the elastic inner column a53 are in contact with a semiconductor, the rubber sleeve a51 and the elastic inner column a53 are in flexible contact with the semiconductor, pressure is dispersed, single-point pressure is prevented from being too high, then the soft baffle a52 is matched to disperse the pressure, the elastic inner column a53 and the ejector rod a54 extrude the elastic strip a55, when the pressure dividing assembly a5 is in contact with the semiconductor, the pressure borne by the surface of the semiconductor is dispersed by multiple points, then the semiconductor is subjected to glue dispensing through movement adjustment of a glue dispensing device, finished products are obtained, sampling detection is carried out on the semiconductor finished products subjected to glue dispensing, and after the detection is qualified, the semiconductor finished products are concentrated and stored in a dustless warehouse.
The present invention has been described in general terms in the foregoing, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto based on the present invention. Therefore, modifications or improvements are within the scope of the invention without departing from the spirit of the inventive concept.
Claims (8)
1. A novel semiconductor dispensing processing technique is characterized in that: the method comprises the following steps:
step one, glue is added into a glue dispensing device, and a semiconductor needing glue dispensing processing is placed on a glue dispensing machine;
secondly, rapidly positioning the semiconductor through positioning and clamping of relevant components of the glue dispenser;
thirdly, dispensing the semiconductor through the movement adjustment of the dispensing device to obtain a finished product;
and step four, sampling and detecting the semiconductor finished products subjected to the spot gluing, and after the semiconductor finished products are detected to be qualified, intensively storing the semiconductor finished products in a dustless warehouse.
2. The novel semiconductor dispensing processing method according to claim 1, which provides a semiconductor dispenser, comprising a dispenser base (1) and a control device (2), wherein a dispensing mechanism (4) is arranged above the dispenser base (1), and the dispensing mechanism is characterized in that: the back of controlling means (2) and the positive fixed connection of point gum machine base (1), the back swing joint of point gum machine mechanism (4) has sliding guide frame (3), the inboard bottom of sliding guide frame (3) and the both sides sliding connection of point gum machine base (1), the last fixed surface of point gum machine base (1) installs positioning mechanism (5), the one end fixed mounting that controlling means (2) were kept away from to the upper surface of point gum machine base (1) has the location diaphragm.
3. The semiconductor dispenser according to claim 2, wherein: positioning mechanism (5) are including fixed plate (51), hydraulic telescoping device (52) and fly leaf (53), the bottom surface of fixed plate (51) and the last fixed surface of gluing machine base (1) are connected, the inboard fixed surface of one end and fixed plate (51) of hydraulic telescoping device (52) is connected, the other end of hydraulic telescoping device (52) and the outside fixed surface of fly leaf (53) are connected, the bottom surface of fly leaf (53) and the last surface sliding connection of gluing machine base (1).
4. The semiconductor dispenser according to claim 3, wherein: the top fixed mounting of fly leaf (53) has motor (54), the output of motor (54) extends to inside and fixedly connected with threaded rod (55) of fly leaf (53), the bottom surface of threaded rod (55) is rotated with the inner wall of fly leaf (53) and is connected, the inboard surface sliding connection of fly leaf (53) has locating clamping plate (56), the surface of threaded rod (55) cup joints with the inner wall screw thread of locating clamping plate (56).
5. The semiconductor dispenser according to claim 4, wherein: the bottom surface fixedly connected with soft cover shell (a1) of location splint (56), the outer fixed surface of soft cover shell (a1) installs partial pressure subassembly (a5), equally spaced evenly distributed of partial pressure subassembly (a5) is on the surface of soft cover shell (a 1).
6. The semiconductor dispenser according to claim 5, wherein: the internal surface middle part fixed mounting of soft cover (a1) has anti pressure bag (a4), the top fixedly connected with of anti pressure bag (a4) props and presses arc board (a3), prop the bottom surface fixed connection of the top of pressing arc board (a3) and location splint (56), just prop the both ends of pressing arc board (a3) and the interior fixed surface connection of soft cover (a1), prop fixed connection elasticity bent plate (a2) on pressing arc board (a 3)'s the surface, the top of elasticity bent plate (a2) and the bottom surface fixed connection of location splint (56), just elasticity bent plate (a2) sets up about the central line symmetry of soft cover (a 1).
7. The semiconductor dispenser according to claim 5, wherein: partial pressure subassembly (a5) is including rubber sleeve (a51) and soft separation blade (a52), the top of rubber sleeve (a51) and the outer fixed surface of soft cover shell (a1) are connected, the outside surface of soft separation blade (a52) is connected with the internal surface fixed connection of rubber sleeve (a51), the inner chamber top fixed mounting of rubber sleeve (a51) has limit sleeve, the inside surface of soft separation blade (a52) and limit sleeve's outer fixed surface are connected, just soft separation blade (a52) evenly distributed is on limit sleeve's surface.
8. The semiconductor dispenser according to claim 7, wherein: swing joint has ejector pin (a54) on limiting sleeve's the inner wall, the bottom surface fixed connection of ejector pin (a54) has elasticity inner prop (a53), the top fixedly connected with elastic strip (a55) of ejector pin (a54), the top of elastic strip (a55) and limiting sleeve's inner chamber top fixed connection.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210681434.7A CN114871072A (en) | 2022-06-15 | 2022-06-15 | Novel semiconductor dispensing processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210681434.7A CN114871072A (en) | 2022-06-15 | 2022-06-15 | Novel semiconductor dispensing processing method |
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| CN114871072A true CN114871072A (en) | 2022-08-09 |
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| CN202210681434.7A Pending CN114871072A (en) | 2022-06-15 | 2022-06-15 | Novel semiconductor dispensing processing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115350871A (en) * | 2022-08-31 | 2022-11-18 | 江西瑞晟光电科技有限公司 | Dispensing equipment and dispensing method for COB substrate packaging |
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