CN218160328U - Positioning tool for wafer cutting - Google Patents
Positioning tool for wafer cutting Download PDFInfo
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- CN218160328U CN218160328U CN202222312834.9U CN202222312834U CN218160328U CN 218160328 U CN218160328 U CN 218160328U CN 202222312834 U CN202222312834 U CN 202222312834U CN 218160328 U CN218160328 U CN 218160328U
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Abstract
The utility model relates to the technical field of positioning tools, in particular to a positioning tool for wafer cutting, which can be suitable for wafers with different sizes, and reduces the probability that the prior wafer cutting positioning work is not suitable for wafers with other models due to the fixed size of the positioning tool when in use; the location frock includes that two sets of boards, positive and negative tooth lead screw, backup pad, hand wheel, four mounting panels of group, four threaded rods of group and four group's clamp plates of placing, and the backup pad is installed on workstation top right side, and the backup pad right-hand member runs through and is provided with the rotation hole, and two sets of board right-hand members downside of placing all run through and are provided with the rotation hole, and positive and negative tooth lead screw rotates and runs through three groups of rotation holes and rotate with cutting device right-hand member downside and be connected.
Description
Technical Field
The utility model relates to a technical field of location frock especially relates to a location frock for wafer cutting.
Background
Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. In the processing process of the wafer, the wafer needs to be cut through a cutting device, and in order to enable the wafer to be more stable during cutting, a positioning tool needs to be used for fixing the wafer.
When the existing wafer cutting and positioning work is used, the phenomenon that the existing wafer cutting and positioning work cannot be suitable for wafers of other models due to the fact that the size of the positioning tool is fixed easily occurs, and therefore the practicability of the positioning tool for wafer cutting is poor.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a can be applicable to the wafer of different individual sizes, reduced current wafer cutting positioning work when using, appear easily because the fixed probability that leads to not being applicable to the wafer of other models of size of location frock to a location frock for wafer cutting of reinforcing practicality.
The utility model discloses a positioning tool for wafer cutting, which comprises a workbench, four groups of supporting legs and a positioning tool, wherein the four groups of supporting legs are all arranged at the bottom end of the workbench, the positioning tool is arranged at the top end of the workbench, and a cutting device is arranged on the left side of the top end of the workbench;
the location frock includes two sets of boards of placing, positive and negative tooth lead screw, a supporting plate, the hand wheel, four group's mounting panels, four group's threaded rods and four group's clamp plates, the backup pad is installed on workstation top right side, the backup pad right-hand member runs through and is provided with the rotation hole, two sets of board right-hand member downside of placing all runs through and is provided with the rotation hole, positive and negative tooth lead screw rotates and runs through three group's rotation holes and rotate with cutting device right-hand member downside and be connected, both sides all are provided with the slider around every group place the board bottom, both sides all are provided with the spout around the workstation top, two sets of boards of placing all with workstation sliding connection, four group's mounting panels are installed respectively at two sets of backup pads inner upsides, four group's mounting panel tops all run through and are provided with the screw hole, four group's of threaded rods rotate respectively and pass four group's screw holes, four group's clamp plates rotate respectively and install in four group's bottom of threaded rods.
The utility model discloses a location frock for wafer cutting, the bottom of every group supporting leg all is provided with the slipmat.
The utility model discloses a location frock for wafer cutting, the top of every group threaded rod all is provided with rotates the head.
The utility model discloses a location frock for wafer cutting, still including rotating the handle, rotate the handle and install at hand wheel right-hand member upside.
The utility model discloses a location frock for wafer cutting still includes the rubber circle, rubber circle and rotation handle suit.
The utility model discloses a location frock for wafer cutting, every group clamp plate bottom all is provided with the rubber pad.
The utility model discloses a location frock for wafer cutting, the bottom of every group rubber pad all is provided with the friction line.
The utility model discloses a location frock for wafer cutting still includes the light, and the light is installed at cutting device bottom middle part.
Compared with the prior art, the beneficial effects of the utility model are that: the workstation top is provided with rather than rotating two sets of boards of placing of being connected, workstation top right side is provided with the backup pad, positive and negative tooth lead screw passes the backup pad and two sets of boards of placing, two sets of backup pad the inner all is provided with two sets of mounting panels, every threaded rod of group rotates respectively and passes every mounting panel, every threaded rod bottom of group all rotates and is provided with the clamp plate, through rotating positive and negative tooth lead screw threaded connection place the board and will be close to each other, threaded rod on every mounting panel through rotating, the clamp plate that enables the threaded rod bottom presss from both sides tight wafer, current wafer cutting location work when using has been reduced, appear easily because the fixed probability that leads to the wafer that can not be applicable to other models of size of location frock, thereby the reinforcing practicality.
Drawings
FIG. 1 is a schematic view of the present invention;
fig. 2 is a schematic view of a partially enlarged structure of a;
FIG. 3 is a schematic view of the connection structure between the mounting plate and the placing plate of the present invention;
FIG. 4 is a schematic view of the connection structure between the placing plate and the working table of the present invention;
in the drawings, the reference numbers: 1. a work table; 2. supporting legs; 3. a cutting device; 4. placing the plate; 5. a positive and negative tooth lead screw; 6. a support plate; 7. a hand wheel; 8. mounting a plate; 9. a threaded rod; 10. pressing a plate; 11. a slider; 12. a chute; 13. a non-slip mat; 14. rotating the head; 15. rotating the handle; 16. a rubber ring; 17. a rubber pad; 18. an illuminating lamp.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
As shown in fig. 1 to 4, the positioning tool for wafer cutting of the present invention comprises a workbench 1, four groups of supporting legs 2 and a positioning tool, wherein the four groups of supporting legs 2 are all installed at the bottom end of the workbench 1, the positioning tool is installed at the top end of the workbench 1, and a cutting device 3 is arranged on the left side of the top end of the workbench 1;
the positioning tool comprises two groups of placing plates 4, positive and negative threaded rods 5, a supporting plate 6, a hand wheel 7, four groups of mounting plates 8, four groups of threaded rods 9 and four groups of pressing plates 10, the supporting plate 6 is mounted on the right side of the top end of a workbench 1, a rotating hole is formed in the right end of the supporting plate 6 in a penetrating mode, rotating holes are formed in the lower sides of the right ends of the two groups of placing plates 4 in a penetrating mode, the positive and negative threaded rods 5 penetrate through the three groups of rotating holes in a rotating mode and are connected with the lower sides of the right ends of cutting devices 3 in a rotating mode, sliders 11 are arranged on the front side and the rear side of the bottom end of each group of placing plates 4, sliding grooves 12 are formed in the front side and the rear side of the top end of the workbench 1, the two groups of placing plates 4 are connected with the workbench 1 in a sliding mode, the four groups of mounting plates 8 are mounted on the upper sides of the inner ends of the two groups of the supporting plates 6 respectively, threaded rods 8 are provided with threaded holes in a penetrating mode, the four groups of the threaded rods 9 are rotated through the four groups of the threaded rods 9 respectively; the workstation top is provided with rather than rotating two sets of boards of placing of being connected, workstation top right side is provided with the backup pad, positive and negative tooth lead screw passes the backup pad and two sets of boards of placing, two sets of backup pad the inner all is provided with two sets of mounting panels, every threaded rod of group rotates respectively and passes every mounting panel, every threaded rod bottom of group all rotates and is provided with the clamp plate, through rotating positive and negative tooth lead screw threaded connection place the board and will be close to each other, threaded rod on every mounting panel through rotating, the clamp plate that enables the threaded rod bottom presss from both sides tight wafer, current wafer cutting location work when using has been reduced, appear easily because the fixed probability that leads to the wafer that can not be applicable to other models of size of location frock, thereby the reinforcing practicality.
In the positioning tool for wafer cutting of the utility model, the bottom end of each group of supporting legs 2 is provided with a non-slip mat 13; through four sets of slipmats of supporting leg bottom, can reduce the vibrations that the workstation produced in by external impact and the course of working to the practicality has been strengthened.
In the positioning tool for wafer cutting of the utility model, the top end of each group of threaded rods 9 is provided with a rotating head 14; through the rotating head on the top end of the threaded rod, operators can rotate the threaded rod conveniently, and therefore the practicability is enhanced.
The utility model discloses a positioning tool for wafer cutting, which also comprises a rotating handle 15, wherein the rotating handle 15 is arranged on the upper side of the right end of the hand wheel 7; by rotating the handle, the hand wheel can be conveniently rotated by an operator, so that the practicability is enhanced.
The utility model discloses a positioning tool for wafer cutting, which also comprises a rubber ring 16, wherein the rubber ring 16 is sleeved with a rotating handle 15; through rotating the rubber circle on the handle, can reduce the smooth probability of hand appears when operating personnel holds the rotation handle and rotates to the practicality has been strengthened.
In the positioning tool for wafer cutting of the utility model, the bottom end of each group of pressing plates 10 is provided with a rubber pad 17; the rubber pad through the clamp plate bottom can make the clamp plate press the wafer more compactlyr, has reduced the wafer and has taken place the probability of rocking when the cutting to the practicality has been strengthened.
In the positioning tool for wafer cutting of the utility model, the bottom end of each group of rubber pads 17 is provided with friction lines; through the friction lines at the bottom end of the rubber pad, the friction force between the rubber pad and the wafer can be enhanced, and therefore the practicability is enhanced.
The utility model discloses a positioning tool for wafer cutting, which also comprises a lighting lamp 18, wherein the lighting lamp 18 is arranged in the middle of the bottom end of the cutting device 3; through the light on the cutting device, the probability that the operator cannot see the condition on the workbench clearly at night can be reduced, and therefore the practicability is enhanced.
The utility model discloses a location frock for wafer cutting, it is at the during operation, at first hold the rubber circle rotation hand wheel of rotation on hand, the positive and negative tooth lead screw of hand wheel left end will rotate, two sets of boards of placing with positive and negative tooth lead screw threaded connection just slide on the workstation, after adjusting suitable distance, place the wafer on two sets of boards of placing, place the rotation head on two sets of mounting panels on the board through rotating every group, the clamp plate of every group rotation head bottom will fall and will place the wafer on the board fixed, the rubber pad of clamp plate bottom, can make the clamp plate press the wafer tighter, the four slipmats of group of supporting leg bottom, can reduce the workstation by the vibrations that external force striking and course of working produced, cut the light on the device, can reduce the probability that operating personnel looked unclear the condition on the workstation at night.
The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
In the present invention, the terms "first", "second" and "third" do not denote any particular quantity or order, but are merely used to distinguish names.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A positioning tool for wafer cutting comprises a workbench (1), four groups of supporting legs (2) and a positioning tool, wherein the four groups of supporting legs (2) are all arranged at the bottom end of the workbench (1), the positioning tool is arranged at the top end of the workbench (1), and a cutting device (3) is arranged on the left side of the top end of the workbench (1);
the positioning tool is characterized by comprising two sets of placing plates (4), positive and negative tooth lead screws (5), a supporting plate (6), a hand wheel (7), four sets of mounting plates (8), four sets of threaded rods (9) and four sets of pressing plates (10), wherein the supporting plate (6) is installed on the right side of the top end of a workbench (1), the right end of the supporting plate (6) is provided with a rotating hole in a penetrating mode, the lower sides of the right ends of the two sets of placing plates (4) are provided with rotating holes in a penetrating mode, the positive and negative tooth lead screws (5) rotate to penetrate through the three sets of rotating holes and are rotatably connected with the lower sides of the right ends of cutting devices (3), the front side and the rear side of the bottom end of the placing plate (4) are provided with sliding blocks (11), the front side and the rear side of the top end of the workbench (1) are provided with sliding grooves (12), the four sets of placing plates (4) are respectively installed on the upper sides of the inner ends of the two sets of the supporting plates (6), the four sets of mounting plates (8) are provided with threaded rods (9) in a penetrating mode, the four sets of threaded rods (9) respectively, and the four sets of pressing plates (10) are respectively rotatably installed on the bottom ends of the four sets of the threaded rods (9).
2. The positioning tool for wafer cutting as claimed in claim 1, wherein the bottom end of each group of support legs (2) is provided with a non-slip pad (13).
3. The positioning tool for wafer cutting as set forth in claim 2, characterized in that the top end of each set of threaded rods (9) is provided with a rotating head (14).
4. The positioning tool for wafer cutting as claimed in claim 3, further comprising a rotating handle (15), wherein the rotating handle (15) is mounted on the upper side of the right end of the hand wheel (7).
5. The positioning tool for wafer cutting as claimed in claim 4, further comprising a rubber ring (16), wherein the rubber ring (16) is sleeved with the rotating handle (15).
6. The positioning tool for wafer cutting as claimed in claim 5, wherein a rubber pad (17) is arranged at the bottom end of each group of pressing plates (10).
7. The positioning tool for wafer cutting as recited in claim 6, wherein the bottom end of each group of rubber pads (17) is provided with friction lines.
8. The positioning tool for wafer cutting as claimed in claim 7, further comprising an illuminating lamp (18), wherein the illuminating lamp (18) is installed in the middle of the bottom end of the cutting device (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222312834.9U CN218160328U (en) | 2022-08-31 | 2022-08-31 | Positioning tool for wafer cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222312834.9U CN218160328U (en) | 2022-08-31 | 2022-08-31 | Positioning tool for wafer cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218160328U true CN218160328U (en) | 2022-12-27 |
Family
ID=84557917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222312834.9U Active CN218160328U (en) | 2022-08-31 | 2022-08-31 | Positioning tool for wafer cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218160328U (en) |
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2022
- 2022-08-31 CN CN202222312834.9U patent/CN218160328U/en active Active
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