CN218160327U

CN218160327U - Automatic positioning device for wafer

Info

Publication number: CN218160327U
Application number: CN202221630943.9U
Authority: CN
Inventors: 刘全益; 胡敬祥
Original assignee: Shenzhen Mengqi Semiconductor Equipment Co ltd
Current assignee: Shenzhen Mengqi Semiconductor Equipment Co ltd
Priority date: 2022-06-28
Filing date: 2022-06-28
Publication date: 2022-12-27
Anticipated expiration: 2032-06-28

Abstract

The utility model relates to an automatic wafer positioning device, which comprises a bearing disc, a first fixed disc and a rotary disc which are coaxially arranged from top to bottom in sequence, a slide rail which is evenly distributed on the rotary disc in a windmill shape, a positioning pin which is connected on the slide rail in a sliding way, a first inductor and a second inductor which are arranged along the radial direction of the bearing disc, and a sucker which is arranged in the central area of the bearing disc; the locating pin upwards extends and runs through first fixed plate and bear the dish respectively and protrusion in bear the dish and set up, bear the dish and radially set up and supply the spout that the locating pin removed. The automatic wafer positioning device realizes clamping of the edges of wafers with different sizes and ensures accurate alignment of the center of the wafer and the center of the bearing plate, thereby ensuring accurate positioning of the center of the wafer; the wafer is driven to rotate by the sucking disc after being sucked by the sucking disc, and the gaps of the wafer are ensured to face the same direction by being matched with the first sensor or the second sensor.

Description

Automatic positioning device for wafer

Technical Field

The utility model relates to a wafer positioning technology field especially relates to a wafer automatic positioning device.

Background

The positioning device is one of the devices commonly used in wafer processing and manufacturing, and is used for accurately positioning a wafer at a pre-processing position, so as to avoid the phenomena of centrifugal flyer or clamping fracture caused by eccentricity and ensure the reliability and stability of the manufacturing process. However, most of the conventional positioning apparatuses are only suitable for positioning a wafer of a certain size. Along with the diversification of the wafer size, the use limitation of the existing positioning device is increased, the repeated utilization rate is reduced, different positioning devices are required to be purchased according to different wafer sizes, and the production cost is increased. Therefore, it is important to provide a wafer positioning apparatus that is compatible with wafers of different sizes and can accurately position wafers of different sizes.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the above problem, provide a can compatible not unidimensional wafer and can be to the wafer positioner of the accurate location of the wafer of unidimensional.

In order to solve the technical problem, the utility model discloses a technical scheme, as follows:

an automatic wafer positioning device comprises a bearing disc, a first fixed disc and a rotary disc which are coaxially arranged from top to bottom in sequence, sliding rails which are uniformly distributed on the rotary disc in a windmill shape, positioning pins which are connected on the sliding rails in a sliding mode, a first inductor and a second inductor which are arranged along the radial direction of the bearing disc, and a sucker which is arranged in the central area of the bearing disc; the locating pin upwards extends and runs through first fixed disk and bear the dish respectively and protrusion in bear the dish setting, bear the dish and radially set up and supply the spout that the locating pin removed.

Preferably, the automatic wafer positioning device further comprises a first driving assembly connected with the turntable; the first driving assembly comprises a first driving piece, a first driving wheel arranged at the rotating end of the first driving piece, and a first driven wheel connected with the first driving wheel in a matched mode, and the first driven wheel is connected with the turntable.

Preferably, a second fixed disc which is coaxial with the rotary disc is arranged below the rotary disc; the rotating end of the first driving piece penetrates through the second fixed disc, and the first driving wheel and the first driven wheel are arranged between the second fixed disc and the rotary disc.

Preferably, the second fixed disc is provided with a connecting column for supporting the first fixed disc, and the rotary disc is arranged in a space surrounded by the first fixed disc, the second fixed disc and the connecting column.

Preferably, the first drive member is a servo motor.

Preferably, the wafer automatic positioning device further comprises a second driving assembly connected with the sucker; the second driving assembly comprises a second driving piece, a second driving wheel connected with the rotating end of the second driving piece, a second driven wheel, a second transmission piece connected with the second driving wheel and the second driven wheel, and a hollow shaft connected with the second driven wheel; the hollow shaft vertically penetrates through the centers of the second fixed disc, the first driven wheel, the rotary disc and the first fixed disc respectively, and the upper end of the hollow shaft is connected with the sucking disc.

Preferably, a gas pipe is arranged in the hollow shaft, one end of the gas pipe is connected with the suction cup, and the other end of the gas pipe is connected with the negative pressure device.

Preferably, the automatic wafer positioning device further comprises a housing provided with an accommodating cavity, and the inner wall of the housing is connected with at least the edge of the first fixed plate; the first driving piece and the second driving assembly are arranged in a space defined by the shell and the second fixed plate.

Preferably, the number of the sliding grooves and the number of the positioning pins are equal to the number of the sliding rails; the sliding grooves are symmetrically arranged on two sides of the diameter formed by connecting the first inductor and the second inductor.

Preferably, a position of the first fixing disc corresponding to the sliding groove is provided with a limiting groove, and the shape of the limiting groove is matched with that of the sliding groove.

The beneficial effects of the utility model include at least:

the automatic positioning device for the wafer of the utility model rotates forwards or backwards through the driving turntable, drives the positioning pin connected with the slide rail arranged on the turntable to slide along the slide rail, and simultaneously, the positioning pin performs synchronous reciprocating movement along the radial direction of the bearing disc under the guiding of the slide groove, thereby realizing the clamping of the edges of wafers with different sizes and ensuring the accurate alignment of the center of the wafer and the center of the bearing disc, and further ensuring the accurate positioning of the center of the wafer; the wafer is driven to rotate by the sucking disc after being sucked by the sucking disc, and the gaps of the wafer are ensured to face the same direction by being matched with the first sensor or the second sensor.

Drawings

Fig. 1 is a schematic view of an automatic wafer positioning device according to the present invention;

fig. 2 is a schematic view of the internal structure of the automatic wafer positioning device of the present invention;

fig. 3 is a schematic structural view of an internal portion of the automatic wafer positioning device of the present invention;

FIG. 4 is a schematic view of a carrier tray;

FIG. 5 is a schematic view of a first fixed platen;

FIG. 6 is a schematic view of the connection of the turntable and the positioning pin;

fig. 7 is a schematic view of the wafer automatic positioning device according to the present invention.

Wherein, 1 is a bearing plate, 101 is a sliding groove, 102 is a first inductor, 103 is a second inductor, 2 is a first fixed plate, 201 is a limiting groove, 3 is a rotating disc, 31 is a sliding rail, 4 is a positioning pin, 5 is a sucker, 6 is a first driving component, 601 is a first driving piece, 602 is a first driving wheel, 603 is a first driven wheel, 7 is a second fixed plate, 8 is a connecting column, 9 is a second driving component, 901 is a second driving piece, 902 is a second driving wheel, 903 is a second driven wheel, 904 is a second transmission piece, 905 is a hollow shaft, 10 is an air pipe, 11 is a shell, and 12 is a wafer.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

The description in this application as relating to "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated.

Example 1

As shown in fig. 1-4 and 6, the automatic wafer positioning device includes a carrier plate 1, a first stator plate 2, and a turntable 3 coaxially disposed from top to bottom, a sliding rail 31 uniformly distributed on the turntable 3 in a windmill shape, that is, the sliding rail 31 is uniformly distributed on the turntable 3 in a windmill shape with the center of the turntable 3 as a base point, a positioning pin 4 slidably connected to the sliding rail 31, a first sensor 102 and a second sensor 103 disposed along the radial direction of the carrier plate 1 and used for detecting wafer gaps of different sizes, the sliding groove 101 and the first sensor 102 and the second sensor 103 are mutually avoided and do not interfere with each other, and a suction cup 5 disposed in the central region of the carrier plate 1 and used for absorbing a wafer, a mounting hole is disposed in the central region of the carrier plate 1, and the upper surface of the suction cup 5 is flush with the upper surface of the carrier plate 1; the lower part of locating pin 4 be equipped with in the connecting portion that slide rail 31 cooperation is connected, locating pin 4 upwards extends to run through respectively first fixed disk 2 with bear set 1 and protrusion in bear set 1 setting, bear set 1 and radially seted up the confession spout 101 that locating pin 4 removed, spout 101 by bear the middle part of set 1 and extend to bear the border of set 1. Be equipped with on carousel 3 and be used for setting up slide rail 31's mounting groove, the mounting groove also plays limiting displacement to locating pin 4, has prevented locating pin 4 by the mounting groove slides and deviates from. The sucking disc 5 is provided with a vent hole. It should be noted that, in the present invention, the upper direction refers to a direction close to the wafer, and the lower direction refers to a direction away from the wafer. Preferably, the first sensor 102 is used for detecting the gap of the smaller-sized wafer, and the second sensor 103 is used for detecting the gap of the larger-sized wafer; the first inductor 102 comprises two first induction parts arranged in a row, the second inductor 103 comprises two second induction parts arranged in a row, and the distance between the two first induction parts is smaller than the distance between the two second inductors due to the fact that the sizes of gaps adapting to wafers with different sizes are different.

As shown in fig. 2 and 3, the automatic wafer positioning device further includes a first driving assembly 6 connected to the turntable 3 and configured to drive the turntable 3 to rotate; the first driving assembly 6 includes a first driving member 601, a first driving wheel 602 disposed at a rotation end of the first driving member 601, and a first driven wheel 603 connected to the first driving wheel 602 in a matching manner, and the first driven wheel 603 is connected to the turntable 3.

A second fixed disc 7 which is coaxial with the rotary disc 3 is arranged below the rotary disc 3; the rotating end of the first driving member 601 penetrates through the second fixed plate 7, and the first driving wheel 602 and the first driven wheel 603 are disposed between the second fixed plate 7 and the turntable 3. Preferably, the first driving wheel 602 is a gear, and the first driven wheel 603 is a gear plate in meshed connection with the first driving wheel 602. First action wheel 602 with first from gear structure that the meshing is connected is chooseed for use to driving wheel 603, has guaranteed the stability of first drive assembly 6 operation, has further guaranteed the stability of locating pin 4 operation, has guaranteed the stability of automatic positioning device's operation.

The second fixed disc 7 is provided with a connecting column 8 for supporting the first fixed disc 2, and the rotary disc 3 is arranged in a space surrounded by the first fixed disc 2, the second fixed disc 7 and the connecting column 8.

Preferably, in the embodiment of the present invention, the first driving member 601 is a servo motor. The servo motor has a function of returning to an original point, can set the steering direction and the torque of the servo motor by generating a pulse command and a control signal, and further enables the positioning pin 4 to move away from or close to the center of the bearing disc 1 along the radial direction of the bearing disc 1 after the first driving wheel 602 and the first driven wheel 603 which are connected with the servo motor are driven by transmission. An original point switch is arranged on the second fixed disc 7, and a positioning block matched with the original point switch is arranged on the rotary disc 3.

Referring to fig. 2 again, the wafer automatic positioning apparatus further includes a second driving assembly 9 connected to the chuck 5 and configured to drive the chuck 5 to rotate; the second driving assembly 9 comprises a second driving member 901, a second driving wheel 902 connected with a rotating end of the second driving member 901, a second driven wheel 903, a second transmission member 904 connecting the second driving wheel 902 and the second driven wheel 903, and a hollow shaft 905 connected with the second driven wheel 903; the hollow shaft 905 vertically penetrates through the centers of the second fixed plate 7, the first driven wheel 603, the rotary disc 3 and the first fixed plate 2 respectively, and the upper end of the hollow shaft 905 is connected with the suction disc 5. The central areas of the bearing plate 1, the first fixed plate 2, the rotating plate 3 and the second fixed plate 7 are provided with mounting holes for the hollow shaft 905 to pass through. The second driving part 901 rotates to drive the second driving wheel 902 to rotate, so as to drive the second driven wheel 903 connected with the second driving wheel 902 through the second transmission part 904 to rotate, and further drive the hollow shaft 905 connected with the second driven wheel 903 to rotate, so as to drive the suction cup 5 connected to the upper end of the hollow shaft 905 to rotate, so that the wafer placed on the suction cup 5 rotates; after the first sensor 102 or the second sensor 103 senses the wafer gap, the chuck 5 stops rotating, and the adjustment of the gap direction of the wafer is completed.

Preferably, the second driving wheel 902 and the second driven wheel 903 are both wheel shafts, and the second transmission member 904 is a transmission belt. Alternatively, in order to ensure the stability of the hollow shaft 905, the lower portion of the hollow shaft 905 is supported by a support member, one end of which is connected to the lower portion of the hollow shaft 905, and the other end of which is connected to the second fixed plate 7 or to the inner wall of the housing 11. The utility model discloses in right support piece's structure does not do specifically and restricts, as long as it is right hollow shaft 905 plays firm support and does not interfere hollow shaft 905 or other part operation can.

An air pipe 10 is arranged in the hollow shaft 905, one end of the air pipe 10 is connected with the suction cup 5, and the other end of the air pipe is connected with the negative pressure device. The negative pressure device guides air through the air conveying pipe 10, and the wafer is adsorbed on the sucker 5, so that the wafer is conveniently driven to rotate along with the sucker 5.

The number of the sliding grooves 101 and the number of the positioning pins 4 are equal to the number of the sliding rails 31, and the number of the sliding grooves 101 is 4-6; the sliding grooves 101 are symmetrically arranged on two sides of the diameter formed by connecting the first inductor 102 and the second inductor 103. In other embodiments, alternatively, the number of the chutes 101 may be other than 4-6, and the chutes 101 may not be distributed with a symmetrical line of the diameter formed by connecting the first inductor 102 and the second inductor 103, so that the wafer edge can be accurately and stably clamped without interfering with the position arrangement of the first inductor 102 and the second inductor 103.

Fig. 5 is a schematic view of the first fixed plate, and as shown in fig. 5, a position of the first fixed plate 2 corresponding to the sliding groove 101 is provided with a limiting groove 201, and the limiting groove 201 fits the sliding groove 101 in shape. Namely, the diameter of the first fixed plate 2 is larger than that of the bearing plate 1, one end of the limiting groove 201 is aligned with the inner end of the sliding groove 101, and the other end of the limiting groove is aligned with the edge of the bearing plate 1. The number of the limiting grooves 201 is equal to the number of the sliding grooves 101. The movement limit points of the positioning pin 4 are two ends of the limit groove 201 respectively.

Referring to fig. 2 again, the automatic wafer positioning device further includes a housing 11 having an accommodating cavity, and an inner wall of the housing 11 is connected to at least an edge of the first fixing plate 2; namely, the diameter of the first fixed disk 2 is larger than or equal to that of the second fixed disk 7; when the diameter of the first fixed disc 2 is equal to that of the second fixed disc 7, the inner wall of the shell 11 is connected with the edges of the first fixed disc 2 and the second fixed disc 7; when the diameter of the first fixed disc 2 is larger than that of the second fixed disc 7, the inner wall of the shell 11 is only connected with the edge of the first fixed disc 2. Preferably, the housing 11 is a cylinder having a receiving cavity. The first driving member 601 and the second driving assembly 9 are disposed in a space enclosed by the housing 11 and the second fixed plate 7.

Fig. 7 is a schematic view of the wafer automatic positioning device of the present invention in use, as shown in fig. 7, when in use, the first driving member 601 rotates forward or backward to drive the first driving wheel 602 to rotate reciprocally, so as to drive the first driven wheel 603 connected to the first driving wheel 602 to rotate reciprocally, and further to drive the turntable 3 to rotate reciprocally, so that the positioning pin 4 slides reciprocally on the slide rail 31; the positioning pin 4 performs reciprocating movement in the radial direction along the bearing disc 1 under the guiding action of the sliding groove 101 and the limiting groove 201, so that the positioning pin 4 can position two kinds of wafers with different sizes. When the positioning pin 4 is close to the center of the bearing disc 1, a wafer with a smaller size can be positioned; when the positioning pins 4 are far away from the center of the carrier tray 1, a wafer with a larger size can be positioned. Preferably, the automatic wafer positioning device of the present invention can be used for positioning 4 inches and 6 inches of wafers. Similarly, the automatic wafer positioning device can also be used for positioning wafers with sizes of 6 inches and 8 inches, or 8 inches and 10 inches, or 10 inches and 12 inches. Of course, in other embodiments, the automatic wafer positioning device of the present invention can be used to position two other wafers with different sizes.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only represent preferred embodiments of the present invention, and the description thereof is more specific and detailed, but should not be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An automatic wafer positioning device is characterized in that: the device comprises a bearing disc, a first fixed disc and a rotary disc which are coaxially arranged from top to bottom in sequence, sliding rails which are uniformly distributed on the rotary disc in a windmill shape, positioning pins which are connected on the sliding rails in a sliding manner, a first inductor and a second inductor which are arranged along the radial direction of the bearing disc, and a sucker which is arranged in the central area of the bearing disc; the locating pin upwards extends and runs through first fixed disk and bear the dish respectively and protrusion in bear the dish setting, bear the dish and radially set up and supply the spout that the locating pin removed.

2. The wafer automatic positioning device of claim 1, characterized in that: the automatic wafer positioning device also comprises a first driving assembly connected with the turntable; the first driving assembly comprises a first driving piece, a first driving wheel arranged at the rotating end of the first driving piece, and a first driven wheel connected with the first driving wheel in a matched mode, and the first driven wheel is connected with the turntable.

3. The wafer automatic positioning device of claim 2, wherein: a second fixed disc which is coaxial with the rotary disc is arranged below the rotary disc; the rotating end of the first driving piece penetrates through the second fixed disc, and the first driving wheel and the first driven wheel are arranged between the second fixed disc and the rotary disc.

4. The wafer automatic positioning device of claim 3, characterized in that: the second fixed disc is provided with a connecting column for supporting the first fixed disc, and the rotary disc is arranged in a space surrounded by the first fixed disc, the second fixed disc and the connecting column.

5. The wafer automatic positioning device of claim 2, wherein: the first driving piece is a servo motor.

6. The wafer automatic positioning device of claim 3, wherein: the automatic wafer positioning device also comprises a second driving assembly connected with the sucker; the second driving assembly comprises a second driving piece, a second driving wheel connected with the rotating end of the second driving piece, a second driven wheel, a second transmission piece connected with the second driving wheel and the second driven wheel, and a hollow shaft connected with the second driven wheel; the hollow shaft vertically penetrates through the centers of the second fixed disc, the first driven wheel, the rotary disc and the first fixed disc respectively, and the upper end of the hollow shaft is connected with the sucking disc.

7. The wafer automatic positioning device of claim 6, wherein: and a gas pipe is arranged in the hollow shaft, one end of the gas pipe is connected with the sucking disc, and the other end of the gas pipe is connected with the negative pressure device.

8. The wafer automatic positioning device of claim 7, wherein: the automatic wafer positioning device also comprises a shell provided with an accommodating cavity, and the inner wall of the shell is at least connected with the edge of the first fixed disc; the first driving piece and the second driving assembly are arranged in a space defined by the shell and the second fixed plate.

9. The wafer automatic positioning device of claim 1, wherein: the number of the sliding grooves and the number of the positioning pins are equal to the number of the sliding rails; the sliding grooves are symmetrically arranged on two sides of the diameter formed by connecting the first inductor and the second inductor.

10. The wafer automatic positioning device of claim 1, wherein: and a limiting groove is arranged at the position of the first fixed disc corresponding to the sliding groove, and the shape of the limiting groove is matched with that of the sliding groove.