CN218158120U

CN218158120U - PCB for testing SMD quartz crystal oscillator chip parameters

Info

Publication number: CN218158120U
Application number: CN202123403465.6U
Authority: CN
Inventors: 卞玉; 高志祥; 李坡; 沈锦雷
Original assignee: Nanjing China Electronics Panda Crystal Technology Corp
Current assignee: Nanjing China Electronics Panda Crystal Technology Corp
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-12-27
Anticipated expiration: 2031-12-31

Abstract

The utility model relates to a PCB board for testing SMD quartz crystal oscillator chip parameters, which comprises a printed board, a printed circuit, a bonding pad, a board power input interface, a board grounding interface and a signal output interface; the bonding pad comprises a testing base bonding pad, a probe bonding pad, a resonator crystal bonding pad, a dial switch bonding pad, an adjustable resistance bonding pad and a current probe bonding pad, wherein the testing base bonding pad corresponds to a welding leg of a testing base, the resonator crystal bonding pad corresponds to a welding leg of a resonator crystal, and the dial switch bonding pad corresponds to a welding leg of a dial switch. The PCB board of the utility model reduces the test work which needs two testers to be matched to one tester, eliminates the slippage phenomenon in the traditional test process and reduces the time consumed by the test; meanwhile, the accuracy of the test parameter values is improved; the method not only improves the efficiency of testing SMD quartz crystal oscillator chip parameters, reduces the cost, but also ensures the accuracy and reliability of the testing values.

Description

PCB for testing SMD quartz crystal oscillator chip parameters

Technical Field

The utility model relates to a PCB board for testing SMD quartz crystal oscillator chip parameter belongs to quartz crystal electronic components and makes technical field.

Background

With the 5G and everything interconnection period, the requirements of frequency components become higher and higher. The quartz crystal is a frequency component manufactured by utilizing the piezoelectric effect of the quartz crystal wafer, and provides stable circuit frequency for an electronic circuit. Quartz crystals are mainly classified into crystal resonators and crystal oscillators, among which the quartz crystal oscillators are commonly called crystal oscillators. The crystal oscillator is an oscillator with high precision and high stability, and is widely applied to various fields of communication, automobiles, computers, televisions, security protection and the like. The crystal oscillator mainly comprises a base, a quartz wafer, a chip and a cover plate. The frequency accuracy and stability of the crystal oscillator are partially dependent on the accuracy and stability of the chip, and a common chip can be packaged into hundreds of transistors, and the damage of any crystal can affect the quality of the crystal oscillator product, so that the performance parameters of the chip tested before the crystal oscillator is processed in batches are very important.

The two parameters of the negative resistance of the chip and the excitation power of the chip are more important in testing the performance parameters of the chip, and the traditional process for testing the negative resistance and the excitation power of one chip comprises the following steps: firstly, bonding a chip into a base to form a test base; secondly, connecting the resonator crystal and an adjustable resistor in series; thirdly, a tester A uses a hand to contact the serial connection body of the second step with two side electrodes of the test base, the other hand contacts a signal probe of the oscilloscope with the output end of the test base, and a tester B rotates the adjustable resistor and observes the waveform output of the oscilloscope until the oscilloscope stops rotating the adjustable resistor when no waveform is displayed; fourthly, measuring the resistance value of the adjustable resistor by using a universal meter, and calculating the negative resistance of the chip according to the resistance value of the measured value resonator; fifthly, disconnecting the resonator and the adjustable resistor, and connecting the resonator crystal with the current probe in series; sixthly, contacting the serial connection body in the fifth step with two side electrodes of the test base; and seventhly, reading the current value displayed on the oscilloscope, and calculating the excitation power of the chip according to the read current value. The conventional testing process is completed through the seven steps and can be completed by two testers in a matched mode, the time for testing the negative resistance and the excitation power of one chip is about 1 hour, wherein about 40 minutes of time is consumed in the third step and the sixth step, and the main reason is that the two steps need to manually contact the serial body and the probe of the oscilloscope with the testing base, and the situation of slippage often occurs in the contact process, so that the numerical value of the testing parameter is inaccurate and needs to be tested again. It follows that this testing process is not only inefficient but also prone to inaccurate data.

SUMMERY OF THE UTILITY MODEL

The utility model provides a PCB board for testing SMD quartz crystal oscillator chip parameter, its purpose aims at solving the inefficiency that the negative resistance of the traditional test chip that proposes in the above-mentioned background art and the excitation power of chip appear and obtain the problem of unsafe data easily.

The technical solution of the utility model:

a PCB board for testing SMD quartz crystal oscillator chip parameters comprises a printed board 100, a printed circuit 200, a bonding pad 300, a PCB board power input interface 10, a PCB board grounding interface 20 and a signal output interface 30; the printed board 100, the printed circuit 200, the PCB power input interface 10, the PCB ground interface 20, and the signal output interface 30 are disposed on the pad 300, the pad 300 includes a test base pad 40, a probe pad 50, a resonator crystal pad 60, a dial switch pad 70, an adjustable resistance pad 80, and a current probe pad 90, the test base pad 40 corresponds to a solder leg of a test base, the resonator crystal pad 60 corresponds to a solder leg of a resonator crystal, and the dial switch pad 70 corresponds to a solder leg of a dial switch.

The number of the test base bonding pads is 4, the number of the test base bonding pads is 401, 402, 403 and 404, and the distance between the four test base bonding pads corresponds to the distance between the four welding feet of the test base.

The number of the probe bonding pads is four, namely 501 probe bonding pads, 502 probe bonding pads, 503 probe bonding pads and 504 probe bonding pads, the same A probe is welded on the 501 probe bonding pads and the 502 probe bonding pads, and the same B probe is welded on the 503 probe bonding pads and the 504 probe bonding pads.

The number of the resonator crystal bonding pads is four, 601, 602, 603 and 604, and the distance between the four resonator crystal bonding pads corresponds to the distance between the four welding feet of the resonator crystal.

The number of the dial switch bonding pads is four, namely 701, 702, 703 and 704, the distance between the four dial switch bonding pads corresponds to the distance between the four welding feet of the two-bit dial switch, and the 701 dial switch bonding pads are connected with the 702 dial switch bonding pads through a printed circuit 200.

The power input pin of the test base corresponds to the pad of the 402 test base and is conducted with the power input interface of the PCB through a printed circuit, and the signal output pin of the test base is welded with the pad of the 401 test base and is conducted with the signal output interface through the printed circuit; and the grounding pin of the test base is welded with the pad of the 403 test base and is conducted with the grounding interface of the PCB through the printed circuit.

Two output pins of the resonator crystal are respectively welded with a 602 resonator crystal bonding pad and a 603 resonator crystal bonding pad, the 602 resonator crystal bonding pad output pin of the resonator crystal is connected with a side electrode of the test base through a B probe, and the 603 resonator crystal bonding pad output pin of the resonator crystal is connected with an ON pin of the dial switch.

Two ON pins ON the dial switch are welded with a 701 dial switch bonding pad and a 702 dial switch bonding pad, at the moment, one 701 switch controls the conduction of the bonding pad and the 703 dial switch bonding pad, and the other switch controls the conduction of the 702 dial switch bonding pad and the 704 dial switch bonding pad.

The adjustable resistor is welded at the adjustable resistor bonding pad, the current probe is welded at the current probe bonding pad, the negative pole of the power supply is welded with the PCB grounding interface, the positive pole of the power supply is welded with the PCB power supply input interface, and the signal probe of the oscilloscope is inserted at the signal output interface.

The utility model has the advantages that: the PCB board of the utility model can reduce the testing work which needs two testers to be matched to one tester, and eliminate the slippage phenomenon in the traditional testing process, thus reducing the time consumed by the test from 1 hour consumed by two testers to 30 minutes consumed by one tester; meanwhile, the times of repeated tests caused by slippage are reduced, and the accuracy of the test parameter values is improved. Use the utility model discloses a PCB board has not only improved test SMD quartz crystal oscillator chip parameter's efficiency of software testing, the cost is reduced, has still guaranteed test numerical value's accuracy and reliability.

Drawings

Fig. 1 is a schematic view of a PCB board of the present invention;

FIG. 2 is a schematic diagram of the PCB printed circuit and the bonding pad of the present invention;

in fig. 1: 10 is a power input interface of the PCB; 20 is a PCB ground interface; 30 is a signal output interface; 401. 402, 403, 404 are test pad pads, respectively; 501. 502, 503, 504 are probe pads, respectively; 601. 602, 603, 604 are resonator crystal pads, respectively; 701. 702, 703, 704 are dial switch pads, respectively; 80 is an adjustable resistance pad; 90 is a current probe pad; the black connecting line is a printed circuit;

in fig. 2: 100 is a printed board, 200 is a printed wiring, and 300 is a pad.

Detailed Description

A PCB board for testing SMD quartz crystal oscillator chip parameters comprises a printed board 100, a printed circuit 200 and a bonding pad 300, wherein the printed circuit 200 is manufactured according to certain requirements; the printed circuit 200 and the pad 300 are manufactured as follows:

comprises a PCB power input interface 10; a PCB ground interface 20; a signal output interface 30;

test pad pads

401, 402, 403, 404;

probe pads

501, 502, 503, 504;

resonator crystal pads

601, 602, 603, 604; a dial switch pad; 80 are

adjustable resistance pads

701, 702, 703, 704; a current probe pad 90; the black connection line is the printed wiring 200.

The distance between the four

test pad pads

401, 402, 403, 404 corresponds to the four leg distance of the test pad, the

test pads

401, 402, 403, 404 together forming the location 40 of the test pad.

The same probe a is soldered to

probe pads

501 and 502, and the same probe B is soldered to probe pads 503 and 504.

The distance between the four

resonator crystal pads

601, 602, 603, 604 corresponds to the distance between the four legs of the resonator crystal, and the

resonator crystal pads

601, 602, 603, 604 together form the location 60 of the resonator crystal.

The distances between the four

dial switch pads

701, 702, 703, 704 correspond to the distances between the four solder feet of the two-bit dial switch, and the

dial switch pads

701, 702, 703, 704 together form the position 70 of the dial switch, wherein the dial switch pad 701 is connected with the dial switch pad 702 through the printed circuit 200.

The technical solution of the present invention will be further explained with reference to the accompanying drawings.

Referring to fig. 1-2, a test base is soldered to a test base position 40, a power input pin of the test base is soldered to a pad 402, and the test base is conducted to a power input interface 10 of a PCB through a printed circuit; the signal output pin of the test base is welded with the bonding pad 401 and is conducted with the signal output interface 30 through a printed circuit; the grounding pin of the test base is welded with the pad 403 and is conducted with the PCB grounding interface 20 through a printed circuit;

referring to fig. 1-2, a probe a is welded on a pad 501 and a pad 502, and the tip of the probe a is in good contact with a side electrode a of the test base; welding a probe B on the bonding pad 503 and the bonding pad 504, wherein the tip of the probe B is well contacted with the side electrode B of the test base;

referring to fig. 1-2, the resonator crystal is soldered to test base site 60 with the two output pins of the resonator crystal soldered to

pads

602 and 603, respectively. The bonding pad 602 is conducted with the bonding pad 504 through a printed circuit, namely, the 602 output pin of the resonator crystal is connected with the side electrode B of the test base through the probe B; the bonding pad 603 is conducted with the bonding pad 702 through a printed circuit, namely the 603 output pin of the resonator crystal is connected with the ON pin of the dial switch;

referring to fig. 1-2, a two-bit dial switch is welded at a position 70 of the dial switch, two ON pins ON the dial switch are welded with

pads

701 and 702, at this time, switch 1 controls the conduction between pad 701 and pad 703, and switch 2 controls the conduction between pad 702 and pad 704;

referring to fig. 1-2, the adjustable resistor is welded at a welding pad 80, the current probe is welded at a welding pad 90, the negative electrode of the power supply is welded with the PCB ground interface 20, the positive electrode of the power supply is welded with the PCB power supply input interface 10, and the signal probe of the oscilloscope is inserted at the signal output interface 30;

referring to fig. 1-2, switch 1 of the dial switch is dialed to the direction of the bonding pad 703, and switch 2 is dialed to the direction of the bonding pad 704, at this time, the dial switch is in an off state, and the resonator crystal is not connected to the circuit; turning on a power switch, wherein the oscilloscope is not displayed at the moment, and the state is an untested state;

referring to fig. 1-2, the switch 1 of the dial switch is dialed to the pad 701 direction, the switch 2 is dialed to the pad 704 direction, at this time, the switch 1 of the dial switch is turned on, the switch 2 is turned off, and the resonator crystal is connected into the circuit through the dial switch 1, that is, the resonator crystal is connected in series with the adjustable resistor at the adjustable resistor pad 80; turning on a power switch, wherein the current is displayed by the oscilloscope in a waveform mode, the waveform display changes when the adjustable resistor (the resistance value is adjusted from small to large) at the position of the bonding pad 80 is rotated, and the adjustable resistor stops rotating until the oscilloscope is not displayed in the waveform mode; turning off a power switch, measuring the resistance value of the adjustable resistor by using a universal meter, and calculating the negative resistance of the chip according to the resistance value of the measured value resonator;

referring to fig. 1-2, switch 1 of the dial switch is dialed to the direction of pad 703, switch 2 is dialed to the direction of pad 702, at this time, switch 1 of the dial switch is turned off, switch 2 is turned on, the resonator crystal is connected into the circuit through dial switch 2, that is, the resonator crystal is connected in series with the current probe at current probe pad 90; turning on a power switch, and reading the current value displayed on the oscilloscope; and turning off the power switch, and calculating the excitation power of the chip according to the read current value.

The PCB board of the utility model can reduce the test work which needs two testers to be matched to one tester, and eliminate the slippage phenomenon in the traditional test process, thus reducing the time consumed by the test from 1 hour consumed by two people to 30 minutes consumed by one person; meanwhile, the times of repeated tests caused by slippage are reduced, and the accuracy of the test parameter values is improved; therefore, use the utility model discloses a PCB board has not only improved the efficiency of software testing SMD quartz crystal oscillator chip parameter, the cost is reduced, has still guaranteed test numerical value's accuracy and reliability.

Claims

1. A PCB board for testing SMD quartz crystal oscillator chip parameters is characterized by comprising a printed board (100), a printed circuit (200), a bonding pad (300), a PCB board power input interface (10), a PCB board grounding interface (20) and a signal output interface (30); the printed circuit board (100), the printed circuit (200), the PCB power input interface (10), the PCB grounding interface (20) and the signal output interface (30) are arranged on a pad (300), the pad (300) comprises a testing base pad (40), a probe pad (50), a resonator crystal pad (60), a dial switch pad (70), an adjustable resistance pad (80) and a current probe pad (90), the testing base pad (40) corresponds to a welding leg of a testing base, the resonator crystal pad (60) corresponds to a welding leg of a resonator crystal, and the dial switch pad (70) corresponds to a welding leg of a dial switch.

2. The PCB for testing SMD quartz crystal oscillator chip parameters according to claim 1, characterized in that said test base pads are 4, respectively a first test base pad (401), a second test base pad (402), a third test base pad (403) and a fourth test base pad (404), the distance between said four test base pads corresponding to the four leg distance of said test base.

3. The PCB board for testing the parameters of the SMD quartz crystal oscillator chip as claimed in claim 1, wherein said probe pads are four, respectively a first probe pad (501), a second probe pad (502), a third probe pad (503) and a fourth probe pad (504), the same A probe is welded on the first probe pad (501) and the first probe pad (502), and the same B probe is welded on the third probe pad (503) and the fourth probe pad (504).

4. A PCB board for testing SMD quartz crystal die parameters according to claim 1, c h a r a c t e r i z e d in that there are four resonator crystal pads, a first resonator crystal pad (601), a second resonator crystal pad (602), a third resonator crystal pad (603) and a fourth resonator crystal pad (604), respectively, the distance between the first resonator crystal pad (601), the second resonator crystal pad (602), the third resonator crystal pad (603) and the fourth resonator crystal pad (604) corresponding to the four leg distance of the resonator crystal.

5. The PCB board for testing SMD quartz crystal oscillator chip parameters according to claim 1, characterized in that said dial switch pads are four, respectively a first dial switch pad (701), a second dial switch pad (702), a third dial switch pad (703) and a fourth dial switch pad (704), the distance between said four dial switch pads corresponds to the distance between four pads of a two-bit dial switch, wherein said first dial switch pad (701) and said second resonator crystal pad (702) are connected by means of printed wiring 200.

6. The PCB for testing the parameters of the SMD quartz crystal oscillator chip as claimed in claim 2, wherein the power input pin of said testing base corresponds to the pad (402) of the second testing base and is connected to the power input interface of the PCB through a printed circuit, and the first signal output pin of the testing base is soldered to the pad (401) of the testing base and is connected to the signal output interface through a printed circuit; and the grounding pin of the test base is welded with a pad of a third (403) test base and is conducted with the PCB grounding interface through a printed circuit.

7. The PCB board for testing the parameters of the SMD quartz crystal oscillator chip as claimed in claim 4, wherein two output pins of said resonator crystal are respectively welded with resonator crystal bonding pads (602, 603), the output pin of the resonator crystal bonding pad (602) of the resonator crystal is connected with the side electrode of the test base through a B probe, and the output pin of the resonator crystal bonding pad (603) of the resonator crystal is connected with the ON pin of the dial switch.

8. The PCB for testing SMD quartz crystal oscillator chip parameters according to claim 5, characterized in that two ON pins ON said dial switch are welded to dial switch pads (701, 702), when one switch controls the conduction of pad (701) and pad (703) and the other switch controls the conduction of pad (702) and pad (704).

9. The PCB for testing the parameters of the SMD quartz crystal oscillator chip as claimed in claim 1, wherein the adjustable resistor is welded at an adjustable resistor pad, the current probe is welded at a current probe pad, the negative pole of the power supply is welded with a PCB ground interface, the positive pole of the power supply is welded with a PCB power supply input interface, and the signal probe of the oscilloscope is inserted at a signal output interface.