CN218154899U - Wearable air conditioning equipment of intelligence based on piezoceramics pump - Google Patents

Wearable air conditioning equipment of intelligence based on piezoceramics pump Download PDF

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Publication number
CN218154899U
CN218154899U CN202222106576.9U CN202222106576U CN218154899U CN 218154899 U CN218154899 U CN 218154899U CN 202222106576 U CN202222106576 U CN 202222106576U CN 218154899 U CN218154899 U CN 218154899U
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heat
air conditioning
control module
pump
air
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吴迪
白连社
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Hefei Equation Interactive Intelligent Technology Co ltd
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Hefei Equation Interactive Intelligent Technology Co ltd
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Abstract

The utility model relates to an air conditioner clothing technical field specifically is a wearable air conditioning equipment of intelligence based on piezoceramics pump, including wearable body, and install in wearable body: the semiconductor heating refrigerator and the piezoelectric ceramic pump are respectively electrically connected with the control module, and the control module is configured to change the current direction of the semiconductor heating refrigerator. The utility model adopts a set of system to realize the refrigeration and heating of the air conditioning suit, and simplifies the structure of the temperature adjusting device; the air-conditioning suit adopts air as a heat-conducting medium, and compared with a liquid heat-conducting medium, the air-conditioning suit has lighter weight and better comfort; the utility model discloses a piezoceramics pump has reduced attemperator's noise at work as fluid drive component, and the structure of piezoceramics pump is compacter, and weight is lighter, has improved the appearance quality and the travelling comfort of air conditioner clothes.

Description

Wearable air conditioning equipment of intelligence based on piezoceramics pump
Technical Field
The utility model relates to an air conditioner clothes technical field specifically is a wearable air conditioning equipment of intelligence based on piezoceramics pump.
Background
In hot summer and cold winter, people engaged in outdoor activities, such as outdoor tourists, express delivery personnel, traffic policemen, other outdoor workers, chefs, operators who open factories and the like, are difficult to enjoy comfortable temperature, and particularly, an air conditioning garment with comfortable cooling and heating is needed.
The existing air-conditioning clothes are various in types, carbon fiber or graphene is generally adopted for heating, compressor refrigeration, semiconductor refrigeration or cold accumulation phase change refrigeration and the like are adopted for refrigeration, and cold air is conveyed to corresponding parts of the clothes through a fan or cooling water through a piston pump, so that the purpose of cooling a body is achieved.
However, the air-conditioning suit in the prior art generally has the following disadvantages:
two sets of devices are adopted for heating and refrigerating, the system is complex, and the air-conditioning suit is heavy.
When water is used for conducting heat, the air conditioning suit is heavy, once a water pipe leaks, the air conditioning suit cannot be used normally.
When air is adopted for heat conduction, cold air is conveyed to corresponding parts inside the clothes through the fan, or the conveying resistance is large, the noise of the fan is large, the clothes are excessively expanded and not attractive, and people can move inconveniently when wearing the clothes.
SUMMERY OF THE UTILITY MODEL
In view of the above shortcomings of the prior art, an object of the present invention is to provide a wearable air conditioning equipment based on piezoelectric ceramic pump with simple structure, light weight and low noise.
In order to achieve the above objects and other related objects, the utility model provides a wearable air conditioning equipment of intelligence based on piezoceramics pump, including wearable body, and install in wearable body:
a semiconductor heating refrigerator, one side of which serves as a cooling or heating surface that is fitted to face a human body in an actually worn state; one side of the semiconductor heating refrigerator, which is opposite to the refrigerating or heating surface, is used as a heat dissipation or cold dissipation surface;
a heat pipe comprising a first section and a second section, the first section being distributed on the cooling or heating surface, the second section being distributed on the wearable body;
the piezoelectric ceramic pump is connected with the heat conduction pipe in series and used for driving the heat conduction medium in the heat conduction pipe to flow from the first section to the second section;
the control module is connected with the semiconductor heating and refrigerating device and the piezoelectric ceramic pump respectively, and the control module is configured to change the current direction of the semiconductor heating and refrigerating device.
In an optional embodiment of the present invention, the working surface of the semiconductor heating and cooling unit is provided with a heat exchanger, the heat exchanger is provided with a heat conducting hole inside, and the heat conducting hole constitutes the first section of the heat conducting pipe.
In an optional embodiment of the present invention, the heat dissipation or cold dissipation surface of the semiconductor heating and cooling device is provided with a heat sink, and the heat sink is attached to the heat dissipation surface.
In an optional embodiment of the present invention, a heat dissipation fan is disposed at the heat sink, and the heat dissipation fan is electrically connected to the control module.
In an optional embodiment of the present invention, the wearable body further comprises a sensor for detecting a temperature and/or a humidity of the wearable body, the sensor is installed on the wearable body, and the sensor is connected to the control module.
In an optional embodiment of the utility model, still include the display module, the display module is assembled and can be revealed under the actual wearing state, the display module with the control module electricity is connected.
In an optional embodiment of the present invention, the heat dissipation device further comprises a housing, the semiconductor heating and cooling device, the control module, and the heat dissipation fan are respectively installed in the housing, and the display module is installed on the surface of the housing.
In an optional embodiment of the present invention, a switch button is disposed on the housing, and the switch button is electrically connected to the control module.
In an optional embodiment of the present invention, the housing is provided with heat dissipation holes.
In an optional embodiment of the present invention, the mobile terminal further comprises a wireless communication module, wherein the wireless communication module is electrically connected to the control module.
In an optional embodiment of the present invention, the power supply module further comprises a power supply module, and the power supply module is electrically connected to the control module.
The technical effects of the utility model reside in that:
the utility model adopts a set of system to realize the refrigeration and heating of the air conditioning suit, and simplifies the structure of the temperature adjusting device;
the air-conditioning suit adopts air as a heat-conducting medium, reduces the requirement on the sealing performance of the system, thereby reducing the manufacturing cost, and compared with a liquid heat-conducting medium, the air-conditioning suit has lighter weight and better comfort;
the utility model adopts the piezoelectric ceramic pump as the fluid driving element, reduces the working noise of the temperature adjusting device, has more compact structure and lighter weight, and improves the appearance quality and comfort of the air conditioning suit;
the heat exchanger can effectively improve the heat exchange efficiency between the heat conduction pipe and the semiconductor heating and refrigerating device;
the sensor can enable the control module to acquire the conditions of temperature, humidity and the like in the wearable body in real time so as to control the working state of the temperature adjusting device according to preset parameters;
the user can acquire the state information of the air-conditioning suit through a mobile terminal such as a mobile phone and the like, and control the air-conditioning suit through the mobile terminal.
Drawings
Fig. 1 is an exploded view of a temperature adjusting device of a smart wearable air conditioning equipment based on a piezoelectric ceramic pump according to an embodiment of the present invention;
fig. 2 is an exploded view of a temperature adjustment device of a smart wearable air conditioning device based on a piezoelectric ceramic pump according to another embodiment of the present invention;
fig. 3 is a perspective view of an intelligent air conditioning coat based on a piezoelectric ceramic pump according to an embodiment of the present invention;
fig. 4 is a perspective view of an intelligent air-conditioning trousers based on a piezoelectric ceramic pump according to an embodiment of the present invention;
fig. 5 is a perspective view of an intelligent air conditioner jumpsuit based on a piezoelectric ceramic pump provided in the embodiment of the present invention;
fig. 6 is a perspective view of an intelligent air-conditioning jacket vest based on a piezoelectric ceramic pump according to an embodiment of the present invention.
The reference numerals in the figures have the meaning: 1. a wearable body; 2. a temperature adjusting device; 21. a semiconductor heating and refrigerating device; 22. heat or cold sinks; 23. a heat radiation fan; 24. a heat exchanger; 3. a control module; 31. a temperature sensor; 32. a temperature and humidity sensor; 33. a switch button; 34. a display module; 35. a WIFI module; 36. a Bluetooth module; 4. a piezoelectric ceramic pump; 5. a heat conducting pipe; 6. and a power supply module.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Referring to fig. 1-6, the following detailed description is made in conjunction with several different embodiments, and it can be understood that the main application scenario of the wearable air conditioning device based on a piezoelectric ceramic pump of the present invention is an air conditioning suit, but the specific form of the wearable air conditioning device is not limited to the several illustrated embodiments, and the present invention is directed to improving the temperature regulating system of the air conditioning suit, and the improved temperature regulating system can be theoretically applied to most wearable devices, for example, the wearable air conditioning device of the present invention can also be a backpack, when the wearable air conditioning device is a backpack, for example, the temperature regulating device can be installed on the surface of the backpack, the heat pipe can be disposed on one side of the backpack, which is attached to the back of the human body, for example, the heat pipe can be disposed on one side of the backpack, which is attached to the backpack, or the heat pipe can be disposed on the backpack, and the specific form of the backpack is not limited, for example, the backpack can be a backpack, a single shoulder bag, an inclined satchel, or the like. The intelligent wearable air conditioner can also be a protective tool, such as a protective sleeve, a waist support or a reflective vest. The temperature adjusting system refers to the combination of a semiconductor heating and refrigerating device 21, a heat conduction pipe 5, a piezoelectric ceramic pump 4 and a control module 3.
Referring to fig. 1-6, a wearable air conditioning device based on a piezoelectric ceramic pump includes a wearable body 1, and a power module 6, a semiconductor heating and cooling unit 21, a heat pipe 5, a piezoelectric ceramic pump 4 and a control module 3 mounted on the wearable body 1, specifically:
referring to fig. 1-6, the power module 6 is used for supplying power to the electrical appliances in the above components, the installation position of the power module 6 is not particularly limited, and in consideration of convenience in charging, for example, the power module 6 may be installed outside the wearable body 1, that is, on a side away from the body surface, and the power module 6 may also be configured to be detachable, for example, by using interfaces such as USB and Type-C to be detachably connected to the control module 3. In one embodiment, the power module is a 36V safe dc power supply.
Referring to fig. 1 and 2, one side of the semiconductor heating and cooling device 21 serves as a cooling or heating surface that is installed to face a human body in a state of being actually worn; one side of the semiconductor heating and refrigerating device 21, which is opposite to the refrigerating or heating surface, is used as a heat dissipation or cold dissipation surface; in the energized state, the semiconductor heating/cooling unit 21 can generate low temperature on one side and high temperature on the other side, and the semiconductor heating/cooling unit 21 can change its operating state by changing the direction of current flow, so that when it is necessary to heat the air-conditioning suit, one side facing the human body can be heated, and when it is necessary to cool the air-conditioning suit, one side facing the human body can be cooled.
Referring to fig. 1-6, the heat conducting pipe 5 includes a first section and a second section, the first section is distributed on the cooling or heating surface, and the second section is distributed on the wearable body 1; it is understood that the first section may be, for example, in contact with the cooling or heating surface of the semiconductor heating refrigerator 21 as much as possible in order to sufficiently exchange heat with the heat conductive pipes 5, and may be, for example, bent in a coil shape, and similarly, the second section may be distributed over as large an area as possible in order to make the heating or cooling effect of the air-conditioning suit more uniform, and may be provided in a coil shape. In a concrete embodiment, heat pipe 5 can be the silicone tube for example to wearable body 1 nimble bending can be followed to heat pipe 5, the utility model discloses an air has reduced the system seal nature requirement as heat-conducting medium, thereby has reduced manufacturing cost, compares in liquid heat-conducting medium, the utility model discloses an air conditioner clothes's weight is lighter, and the travelling comfort is better. It will be appreciated that the material of the heat pipe may be replaced by other flexible materials, such as rubber or plastic pipes. It is understood that, as an extension of this embodiment, at a portion of the wearable body that is not deformed frequently, the heat pipe may be made of a rigid material, for example, the heat pipe may be replaced by a rigid material at the back of the coat, or the heat pipe may be formed by connecting multiple rigid materials through multiple flexible materials.
Referring to fig. 1 and 2, the piezoelectric ceramic pump 4 is connected in series with the heat pipe 5, and is configured to drive the heat-conducting medium in the heat pipe 5 to flow from the first section to the second section; it can be understood that the utility model discloses a piezoceramics pump 4 has reduced attemperator's noise at work as the fluid drive component, and the structure of piezoceramics pump is compacter, and weight is lighter, has improved the appearance quality and the travelling comfort of air conditioner clothes. In a specific embodiment, the input voltage of the piezoelectric ceramic pump 4 is a direct current safe voltage, and the flow rate is greater than 200 ml/min, and it can be understood that the output flow rate of the piezoelectric ceramic pump can be appropriately adjusted according to different application scenarios.
It should be noted that the present invention is not limited to a specific installation position of the piezoelectric ceramic pump 4, for example, in the embodiment shown in fig. 1, the piezoelectric ceramic pump 4 can be guided to the outside of the device casing through the heat conduction pipe 5, and the piezoelectric ceramic pump 4 can be installed at any position of the wearable body 1, or as shown in fig. 2, the piezoelectric ceramic pump 4 can be installed on the cooling or heating surface of the semiconductor heating refrigerator 21 and integrated in the device casing.
Referring to fig. 1 and 2, the power module 6, the semiconductor heating and cooling device 21, and the piezoceramic pump 4 are respectively connected to the control module 3, and the control module 3 is configured to change the direction of the current of the semiconductor heating and cooling device 21. It can be understood that the control module 3 is used for coordinating the working states of all the components, so that the temperature adjusting device can automatically adjust the temperature according to the needs of a user.
Referring to fig. 1 and 2, in an alternative embodiment of the present invention, a heat exchanger 24 is disposed on a cooling or heating surface of the semiconductor heating/cooling device 21, the heat exchanger 24 is attached to the cooling or heating surface, and a heat conducting hole is disposed inside the heat exchanger, and the heat conducting hole constitutes the first section of the heat conducting pipe. It is understood that the arrangement of the first section is not limited to that provided in the embodiment, for example, the first section of the heat conducting pipe 5 may be a single pipe or a pipe integrated with the second section, and the first section is attached to the heat exchanger 24, in this scenario, the heat exchanger 24 is made of a high heat conducting material, such as a copper alloy or an aluminum alloy, the heat exchanger 24 can effectively improve the heat exchange efficiency between the heat conducting pipe 5 and the semiconductor heating and cooling unit 21, and when the first section is a single pipe, for example, a channel for accommodating the heat conducting pipe 5 may be formed in the heat exchanger to increase the heat exchange area between the heat conducting pipe 5 and the heat exchanger 24.
Referring to fig. 1 and 2, in an alternative embodiment of the present invention, a heat sink 22 is disposed on a heat dissipation or cold dissipation surface of the semiconductor heating and cooling device 21, and the heat sink 22 is attached to the heat dissipation or cold dissipation surface, it can be understood that the heat sink 22 is also made of a high thermal conductive material, so as to increase a heat dissipation or cold dissipation area and further improve a heat dissipation effect, for example, a fin array may be formed on a surface of the heat sink 22 to accelerate heat exchange between the heat sink 22 and air.
Referring to fig. 1 and 2, in an optional embodiment of the present invention, a heat dissipation fan 23 is disposed at the heat sink 22, and the heat dissipation fan 23 is electrically connected to the control module 3, so as to further enhance the heat dissipation effect.
Referring to fig. 1-6, in an optional embodiment of the present invention, the wearable body 1 further comprises a sensor for detecting the temperature and/or humidity of the wearable body 1, the sensor is mounted on the wearable body 1, and the sensor is connected to the control module 3; the sensor may be, for example, a temperature sensor 31 or a temperature and humidity sensor 32, and it can be understood that the sensor enables the control module 3 to obtain the temperature, the humidity, and the like in the wearable body 1 in real time, so as to control the operating state of the temperature adjusting device according to preset parameters.
Referring to fig. 1-6, in an alternative embodiment of the present invention, the present invention further comprises a display module 34, the display module 34 is configured to be exposed in an actual wearing state, and the display module 34 is electrically connected to the control module 3; it can be understood that the display module 34 may be used to display information such as temperature and humidity, electric quantity, or working state, in a specific embodiment, the display module 34 may be a display screen or a light strip, for example, the display screen may directly display the above various information, and the light strip may represent different information in different flashing states or colors through a preset code.
Referring to fig. 1 to 6, the semiconductor heating and cooling device 21, the control module 3, and the heat dissipation fan 23 are respectively mounted in the housing 2, and the display module 34 is mounted on the surface of the housing 2. A switch button 33 is arranged on the shell 2, the switch button 33 is electrically connected with the control module 3, and the switch button can be a touch switch or a mechanical switch, for example; the utility model integrates most components in the shell 2, thereby improving the overall appearance quality of the air conditioning suit; the housing 2 may be provided with a heat radiation hole, for example.
Please refer to fig. 1 and 2, in an optional embodiment of the present invention, the present invention further includes a wireless communication module, the wireless communication module is electrically connected to the control module 3, the wireless communication module may be, for example, a WIFI module 35 and/or a bluetooth module 36, it can be understood that, in this embodiment, the user may obtain the status information of the air-conditioning suit through a mobile terminal such as a mobile phone, and control the air-conditioning suit through the mobile terminal.
Fig. 3-6 provide specific examples of several different forms of intelligent wearable air conditioning equipment based on piezoelectric ceramic pump, wherein fig. 3 is an intelligent air conditioning coat based on piezoelectric ceramic pump, fig. 4 is an intelligent air conditioning trousers based on piezoelectric ceramic pump, fig. 5 is an intelligent air conditioning jumpsuit based on piezoelectric ceramic pump, fig. 6 is an intelligent air conditioning jacket vest based on piezoelectric ceramic pump; in the figure, the introduction pipe is shown only in a partial configuration, and the heat transfer pipe 5 may be distributed in a wider area; in each embodiment, the installation positions of the components of the temperature adjusting device are individually designed for different clothes types, and it can be understood that the installation positions are not unique, and in practical application, the positions of the components can be adjusted according to specific use experience.
To sum up, the utility model adopts a set of system to realize the refrigeration and heating of the air conditioning clothes, and simplifies the structure of the temperature adjusting device; the air-conditioning suit adopts air as a heat-conducting medium, reduces the requirement on the sealing property of the system, thereby reducing the manufacturing cost, and compared with a liquid heat-conducting medium, the air-conditioning suit of the utility model has lighter weight and better comfort; the utility model adopts the piezoelectric ceramic pump 4 as the fluid driving element, which reduces the working noise of the temperature adjusting device, and the piezoelectric ceramic pump has more compact structure and lighter weight, thus improving the appearance quality and comfort of the air conditioning clothes; the heat exchanger 24 can effectively improve the heat exchange efficiency between the heat conductive pipes 5 and the semiconductor heating and cooling unit 21; the sensor can enable the control module 3 to acquire the conditions of temperature, humidity and the like in the wearable body 1 in real time so as to control the working state of the temperature adjusting device according to preset parameters; the user can obtain the state information of the air-conditioning suit through a mobile terminal such as a mobile phone and the like, and control the air-conditioning suit through the mobile terminal.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
In the description herein, numerous specific details are provided, such as examples of components and/or methods, to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that an embodiment of the invention can be practiced without one or more of the specific details, or with other apparatus, systems, assemblies, methods, components, materials, parts, and/or the like. In other instances, well-known structures, materials, or operations are not specifically shown or described in detail to avoid obscuring aspects of embodiments of the invention.
Reference throughout this specification to "one embodiment," "an embodiment," or "particular embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention, and not necessarily in all embodiments. Thus, respective appearances of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics of any specific embodiment of the present invention may be combined in any suitable manner with one or more other embodiments. It is to be understood that other variations and modifications of the embodiments of the invention described and illustrated herein are possible in light of the teachings herein and are to be considered as part of the spirit and scope of the present invention.
It will also be appreciated that one or more of the elements shown in the figures can also be implemented in a more separated or integrated manner, or even removed for inoperability in some circumstances or provided for usefulness in accordance with a particular application.
Additionally, any labeled arrows in the drawings/figures should be considered only as exemplary, and not limiting, unless otherwise specifically noted. Further, as used herein, the term "or" is generally intended to mean "and/or" unless otherwise indicated. Combinations of components or steps will also be considered as being noted where terminology is foreseen as rendering the ability to separate or combine is unclear.
As used in the description herein and throughout the claims that follow, "a," "an," and "the" include plural references unless otherwise indicated. Also, as used in the description herein and throughout the claims that follow, unless otherwise indicated, the meaning of "in …" includes "in …" and "on …".
The above description of illustrated embodiments of the invention, including what is described in the abstract, is not intended to be exhaustive or to limit the invention to the precise forms disclosed herein. While specific embodiments of, and examples for, the invention are described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the present invention, as those skilled in the relevant art will recognize and appreciate. As noted, these modifications may be made to the present invention in light of the foregoing description of illustrated embodiments of the invention and are to be included within the spirit and scope of the present invention.
The system and method have been described herein in general terms as providing details to facilitate the understanding of the invention. Furthermore, various specific details have been given to provide a general understanding of the embodiments of the invention. One skilled in the relevant art will recognize, however, that an embodiment of the invention can be practiced without one or more of the specific details, or with other apparatus, systems, assemblies, methods, components, materials, parts, and/or the like. In other instances, well-known structures, materials, and/or operations are not specifically shown or described in detail to avoid obscuring aspects of embodiments of the invention.
Thus, although the present invention has been described herein with reference to particular embodiments thereof, freedom of modification, various changes and substitutions are also within the foregoing disclosure, and it should be understood that in some instances some features of the present invention will be employed without a corresponding use of the other features without departing from the scope and spirit of the present invention as set forth. Accordingly, many modifications may be made to adapt a particular situation or material to the essential scope and spirit of the present invention. It is intended that the invention not be limited to the particular terms used in following claims and/or to the particular embodiment disclosed as the best mode contemplated for carrying out this invention, but that the invention will include any and all embodiments and equivalents falling within the scope of the appended claims. Accordingly, the scope of the invention is to be determined solely by the appended claims.

Claims (11)

1. The utility model provides a wearable air conditioning equipment of intelligence based on piezoceramics pump which characterized in that, includes wearable body, and install in wearable body:
a semiconductor heating refrigerator, one side of which serves as a cooling or heating surface that is fitted to face a human body in an actually worn state; one side of the semiconductor heating refrigerator, which is opposite to the refrigerating or heating surface, is used as a heat dissipation or cold dissipation surface;
a heat pipe comprising a first section and a second section, the first section being distributed on the cooling or heating surface, the second section being distributed on the wearable body;
the piezoelectric ceramic pump is connected with the heat conduction pipe in series and used for driving the heat conduction medium in the heat conduction pipe to flow from the first section to the second section;
the control module is connected with the semiconductor heating and refrigerating device and the piezoelectric ceramic pump respectively, and the control module is configured to change the current direction of the semiconductor heating and refrigerating device.
2. The intelligent wearable air conditioning equipment based on piezoceramic pump according to claim 1, characterized in that the working surface of the semiconductor heating refrigerator is provided with a heat exchanger, and a heat conducting duct is arranged inside the heat exchanger and constitutes the first section of the heat conducting pipe.
3. The intelligent wearable air conditioning equipment based on piezoceramic pump according to claim 1, wherein the heat dissipation or cold dissipation surface of the semiconductor heating refrigerator is provided with a heat radiator, and the heat radiator is attached to the heat dissipation surface.
4. The intelligent wearable air conditioning equipment based on piezoceramic pump according to claim 3, characterized in that a cooling fan is arranged at the heat radiator, and the cooling fan is electrically connected with the control module.
5. The intelligent wearable air conditioning apparatus based on piezoceramic pump according to claim 1, further comprising a sensor for detecting temperature and/or humidity of the wearable body, wherein the sensor is mounted on the wearable body, and wherein the sensor is connected with the control module.
6. The intelligent wearable air conditioning equipment based on piezoceramic pump according to claim 4, further comprising a display module, wherein the display module is assembled and can be exposed in an actual wearing state, and the display module is electrically connected with the control module.
7. The intelligent wearable air conditioning device based on piezoceramic pump according to claim 6, further comprising a housing, wherein the semiconductor heating refrigerator, the control module and the heat dissipation fan are respectively mounted in the housing, and the display module is mounted on the surface of the housing.
8. The intelligent wearable air conditioning equipment based on piezoceramic pump according to claim 7, wherein a switch button is arranged on the shell and electrically connected with the control module.
9. The intelligent wearable air conditioning equipment based on piezoceramic pump of claim 7, wherein the casing is provided with heat dissipation holes.
10. The intelligent wearable air conditioning device based on piezoceramic pump according to claim 1, further comprising a wireless communication module, wherein the wireless communication module is electrically connected with the control module.
11. The intelligent wearable air conditioning apparatus based on piezoceramic pump according to claim 1, further comprising a power module electrically connected with the control module.
CN202222106576.9U 2022-08-11 2022-08-11 Wearable air conditioning equipment of intelligence based on piezoceramics pump Active CN218154899U (en)

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CN202222106576.9U CN218154899U (en) 2022-08-11 2022-08-11 Wearable air conditioning equipment of intelligence based on piezoceramics pump

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CN202222106576.9U CN218154899U (en) 2022-08-11 2022-08-11 Wearable air conditioning equipment of intelligence based on piezoceramics pump

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CN218154899U true CN218154899U (en) 2022-12-27

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